IC Sockets

Results: 7
Manufacturer
Aries ElectronicsTE Connectivity AMP Connectors
Packaging
-Bulk
Product Status
ActiveObsolete
Type
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.6" (15.24mm) Row SpacingSIP
Number of Positions or Pins (Grid)
8 (2 x 4)18 (2 x 9)20 (1 x 20)20 (2 x 10)28 (2 x 14)
Contact Finish - Mating
GoldTin
Contact Finish Thickness - Mating
20.0µin (0.51µm)200.0µin (5.08µm)
Contact Material - Mating
Beryllium CopperPhosphor Bronze
Mounting Type
Through HoleThrough Hole, Right Angle, Vertical
Features
Carrier, Closed FrameCarrier, Elevated
Contact Finish - Post
GoldTin
Contact Finish Thickness - Post
20.0µin (0.51µm)200.0µin (5.08µm)
Contact Material - Post
Beryllium CopperPhosphor Bronze
Housing Material
Aluminum AlloyPolyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-55°C ~ 105°C-55°C ~ 125°C
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
CONN SOCKET SIP 20POS TIN
20-7800-10
CONN SOCKET SIP 20POS TIN
Aries Electronics
0
In Stock
Check Lead Time
40 : $11.59875
Bulk
Bulk
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Phosphor Bronze
Through Hole
Carrier, Elevated
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
CONN IC DIP SOCKET 20POS GOLD
2-1437542-7
CONN IC DIP SOCKET 20POS GOLD
TE Connectivity AMP Connectors
0
In Stock
Obsolete
-
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
CONN IC DIP SOCKET 8POS GOLD
1-1437542-0
CONN IC DIP SOCKET 8POS GOLD
TE Connectivity AMP Connectors
0
In Stock
Obsolete
-
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
CONN IC DIP SOCKET 8POS GOLD
1-1437542-1
CONN IC DIP SOCKET 8POS GOLD
TE Connectivity AMP Connectors
0
In Stock
Obsolete
-
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
CONN IC DIP SOCKET 20POS GOLD
2-1437542-9
CONN IC DIP SOCKET 20POS GOLD
TE Connectivity AMP Connectors
0
In Stock
Obsolete
-
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
CONN IC DIP SOCKET 28POS GOLD
5-1437542-2
CONN IC DIP SOCKET 28POS GOLD
TE Connectivity AMP Connectors
0
In Stock
Obsolete
-
Obsolete
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
CONN IC DIP SOCKET 18POS GOLD
2-1437542-2
CONN IC DIP SOCKET 18POS GOLD
TE Connectivity AMP Connectors
0
In Stock
Obsolete
-
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
20.0µin (0.51µm)
Beryllium Copper
Aluminum Alloy
-55°C ~ 125°C
Showing
of 7

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.