IC Sockets

Results: 7

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Manufacturer

Aries ElectronicsOn Shore Technology Inc.Preci-Dip

Series

11055SA

Packaging

BoxBulkTube

Type

DIP, 0.3" (7.62mm) Row SpacingDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing

Number of Positions or Pins (Grid)

8 (2 x 4)14 (2 x 7)16 (2 x 8)18 (2 x 9)20 (2 x 10)32 (2 x 16)

Contact Finish - Mating

GoldTin

Contact Finish Thickness - Mating

200.0µin (5.08µm)Flash

Features

Closed FrameOpen Frame

Contact Finish Thickness - Post

200.0µin (5.08µm)-

Contact Material - Post

Beryllium CopperBrass

Housing Material

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass FilledPolyphenylene Sulfide (PPS), Glass FilledThermoplastic, Polyester, Glass Filled

Operating Temperature

-55°C ~ 125°C-40°C ~ 105°C-

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature

110-87-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip	24,656 In Stock	1 : $0.51000 Box	110	Box	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SA083000 CONN IC DIP SOCKET 8POS GOLD On Shore Technology Inc.	4,350 In Stock	1 : $0.48000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
SA143000 CONN IC DIP SOCKET 14POS GOLD On Shore Technology Inc.	5,819 In Stock	1 : $0.73000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
SA183000 CONN IC DIP SOCKET 18POS GOLD On Shore Technology Inc.	1,768 In Stock	1 : $0.85000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
110-87-316-41-001101 CONN IC DIP SOCKET 16POS GOLD Preci-Dip	4,933 In Stock	1 : $0.93000 Tube	110	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled	-55°C ~ 125°C
SA203000 CONN IC DIP SOCKET 20POS GOLD On Shore Technology Inc.	2,150 In Stock	1 : $0.94000 Tube	SA	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Thermoplastic, Polyester, Glass Filled	-40°C ~ 105°C
32-6554-10 CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics	485 In Stock	1 : $16.20000 Bulk	55	Bulk	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-

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IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.