Prototype Boards Perforated

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Mfr Part #	Quantity Available	Price	Tariff Status	Series	Package	Product Status	Proto Board Type	Plating	Pitch	Circuit Pattern	Edge Contacts	Hole Diameter	Size / Dimension	Board Thickness
DMB-4769-CB BREADBOARD DIN RAIL MOUNT PTH Bud Industries	88 In Stock	1 : $1.40000 Bulk	-	DMB	Bulk	Active	Breadboard, Din Rail Mount	Plated Through Hole (PTH)	0.100" (2.54mm)	Pad Per Hole (Square)	-	0.051" (1.30mm)	3.42" L x 0.56" W (86.9mm x 14.3mm)	0.063" (1.60mm)
DMB-4771-CB BREADBOARD DIN RAIL MOUNT PTH Bud Industries	35 In Stock 44 Factory	1 : $6.10000 Bulk	-	DMB	Bulk	Active	Breadboard, Din Rail Mount	Plated Through Hole (PTH)	0.100" (2.54mm), 0.200" (5.08mm)	Pad Per Hole (Square)	-	0.051" (1.30mm)	3.42" L x 1.97" W (86.9mm x 50.0mm)	0.063" (1.60mm)
DMB-4773-CB BREADBOARD DIN RAIL MOUNT PTH Bud Industries	16 In Stock 79 Factory	1 : $12.40000 Bulk	-	DMB	Bulk	Active	Breadboard, Din Rail Mount	Plated Through Hole (PTH)	0.100" (2.54mm), 0.200" (5.08mm)	Pad Per Hole (Round)	-	0.051" (1.30mm)	4.05" L x 3.42" W (102.8mm x 86.9mm)	0.063" (1.60mm)
DMB-4774-CB BREADBOARD DIN RAIL MOUNT PTH Bud Industries	11 In Stock 339 Factory	1 : $18.40000 Bulk	-	DMB	Bulk	Active	Breadboard, Din Rail Mount	Plated Through Hole (PTH)	0.100" (2.54mm)	Pad Per Hole (Square)	-	0.051" (1.30mm)	6.15" L x 3.42" W (156.2mm x 86.9mm)	0.063" (1.60mm)
DMB-4772-CB BREADBOARD DIN RAIL MOUNT PTH Bud Industries	0 In Stock Check Lead Time	1 : $7.80000 Bulk	-	DMB	Bulk	Active	Breadboard, Din Rail Mount	Plated Through Hole (PTH)	0.100" (2.54mm), 0.200" (5.08mm)	Pad Per Hole (Square)	-	0.051" (1.30mm)	3.42" L x 2.67" W (86.9mm x 67.8mm)	0.063" (1.60mm)
2906908 BREADBOARD DIN RAIL MOUNT NPTH Phoenix Contact	1 In Stock 1 Factory	1 : $39.48000 Bulk	-	-	Bulk	Active	Breadboard, Din Rail Mount	Non-Plated Through Hole (NPTH)	0.181" (4.60mm), 0.200" (5.00mm)	Pad Per Hole (Round)	-	0.050" (1.20mm), 0.060" (1.40mm)	3.91" L x 3.15" W (99.3mm x 80.0mm)	-

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Products in this category are used as a platform for circuit construction in hobby, experimental, and similar settings where adaptability is desired. Characterized by having a series of holes drilled through their thickness at regular intervals, they may also include a solderable conductive layer around these holes, which may or may not be interconnected, depending on the nature of a specific product. Often used for constructing circuits based on through-hole component packaging, similar products lacking perforation are more commonly used for circuit development using surface mounted components.