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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Configuration
Current
Voltage
Voltage - Isolation
Mounting Type
Package / Case
CIPOS Series
IKCM30F60GAXKMA1
IFPS MODULE 600V 30A 24PWRDIP
Infineon Technologies
2,717
In Stock
1 : $21.08000
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ActiveIGBT3 Phase30 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
CIPOS Series
IGCM04F60GAXKMA1
MODULE IGBT 600V 4A 24PWRDIP
Infineon Technologies
560
In Stock
1 : $10.26000
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ActiveIGBT3 Phase4 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
2,794
In Stock
1 : $12.21000
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ActiveIGBT3 Phase10 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
1,400
In Stock
1 : $12.28000
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ActiveIGBT3 Phase15 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
CIPOS Series
IKCM20L60GDXKMA1
IFPS MODULE 600V 20A 24PWRDIP
Infineon Technologies
551
In Stock
1 : $18.44000
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ActiveIGBT3 Phase20 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
208
In Stock
1 : $233.06000
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-
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ActiveIGBTHalf Bridge450 A750 V2500VrmsChassis MountModule
229
In Stock
1 : $11.30000
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ActiveIGBT3 Phase6 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
CIPOS Series
IKCM10H60GAXKMA1
MODULE IGBT 600V 10A 24PWRDIP
Infineon Technologies
1,666
In Stock
1 : $12.88000
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ActiveIGBT3 Phase10 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
965
In Stock
1 : $12.94000
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ActiveIGBT3 Phase15 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
CIPOS Series
IKCM15L60GDXKMA1
IFPS MODULE 600V 20A 24PWRDIP
Infineon Technologies
282
In Stock
1 : $15.84000
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ActiveIGBT3 Phase20 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
244
In Stock
1 : $16.90000
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ActiveIGBT3 Phase20 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
500
In Stock
1 : $8.08000
Cut Tape (CT)
500 : $5.26176
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveIGBT3 Phase Inverter2 A600 V2000VrmsSurface Mount23-PowerSMD Module
493
In Stock
1 : $8.71000
Cut Tape (CT)
500 : $5.67032
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveIGBT3 Phase Inverter4 A600 V2000VrmsSurface Mount23-PowerSMD Module
240
In Stock
1 : $8.08000
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ActiveIGBT3 Phase Inverter2 A600 V2000VrmsThrough Hole23-DIP Module (0.573", 14.55mm)
SOP23
IM240S6Z1BALMA1
MODULE IGBT 600V 3A 23PWRSMD
Infineon Technologies
236
In Stock
1 : $9.58000
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Last Time BuyIGBT-3 A600 V1900VrmsSurface Mount23-PowerSMD Module, Gull Wing
235
In Stock
1 : $9.58000
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Last Time BuyIGBT-3 A600 V1900VrmsThrough Hole23-DIP Module (0.573", 14.55mm)
IM240M6Y1BAKMA1
IM240M6Y1BAKMA1
IPM MICRO 3PH DRIVER DIP23
Infineon Technologies
226
In Stock
1 : $10.48000
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Last Time Buy-3 Phase Inverter---Through Hole23-DIP Module (0.573", 14.55mm)
CIPOS_Tiny_SIP
IM393X6FPXKLA1
MODULE IGBT 600V 20A 26PWRSIP
Infineon Technologies
525
In Stock
1 : $18.30000
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Last Time BuyIGBT3 Phase Inverter20 A600 V2000VrmsThrough Hole26-PowerSIP Module, 22 Leads, Formed Leads
35
In Stock
1 : $14.48000
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ActiveIGBT3 Phase15 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
IM818LCCXKMA1-VIEW-B
IM818LCCXKMA1
CIPOS MAXI 1200V 15A PG-MDIP-24
Infineon Technologies
81
In Stock
1 : $42.46000
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ActiveIGBT3 Phase Inverter20 A1.2 kV2500VrmsThrough Hole24-PowerDIP Module (1.094", 27.80mm)
0
In Stock
1 : $10.26000
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ActiveIGBT3 Phase4 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
33
In Stock
1 : $13.78000
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ActiveIGBT3 Phase15 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
25
In Stock
1 : $22.24000
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ActiveMOSFET3 Phase Inverter20 A600 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
24-PowerDIP Module
IFCM30T65GDXKMA1
IPM IGBT 650V 30A 24PWRDIP MOD
Infineon Technologies
0
In Stock
1 : $17.12000
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Bulk
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ActiveIGBT2 Phase30 A650 V2000VrmsThrough Hole24-PowerDIP Module (1.028", 26.10mm)
CIPOS_Tiny_DIP
IM393L6EXKLA1
POWER MODULE 600V 15A MDIP30
Infineon Technologies
9
In Stock
1 : $15.64000
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Last Time BuyIGBT3 Phase Inverter15 A600 V2000VrmsThrough Hole35-PowerDIP Module (0.866", 22.00mm), 30 Leads
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of 279

Power Driver Modules


Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.