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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Module/Board Type
Core Processor
Co-Processor
Speed
Flash Size
RAM Size
Connector Type
Size / Dimension
Operating Temperature
100-1470-2
100-1470-2
IC MOD CM-I.MX53 800MHZ 1GB
BECOM Systems GmbH
0
In Stock
Obsolete
Bulk
ObsoleteMPU CoreCM-i.MX53-800MHz2GB (NAND), 4MB (NOR)1GBExpansion 3 x 1003.150" L x 1.770" W (80.00mm x 45.00mm)-40°C ~ 85°C
100-1471-2
100-1471-2
IC MODULE CM-I.MX53 1GHZ 1GB
BECOM Systems GmbH
0
In Stock
Obsolete
Bulk
ObsoleteMPU CoreCM-i.MX53-1GHz2GB (NAND), 4MB (NOR)1GBExpansion 3 x 1003.150" L x 1.770" W (80.00mm x 45.00mm)0°C ~ 70°C
100-1500-1
100-1500-1
IC MODULE I.MX537 800MHZ 1GB
BECOM Systems GmbH
0
In Stock
Obsolete
Bulk
ObsoleteMPU Corei.MX537-800MHz2GB (NAND), 4MB (NOR)1GBQseven Card-Edge 2302.760" L x 2.760" W (70.00mm x 70.00mm)-40°C ~ 85°C
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Microcontrollers, Microprocessor, FPGA Modules


Products in the modular embedded processor family integrate a microcontroller, microprocessor, digital signal processor, FPGA, or other such computational device together with support components such as memory, power management, timing, and other items necessary for their operation. They are suitable and intended for integration into an end product, and offer product developers access to modern computational and interface capabilities without necessity of high speed hardware design experience.