Aluminum Alloy Heat Sinks

Results: 756
Manufacturer
Assmann WSW ComponentsBoyd Laconia, LLCCTS Thermal Management ProductsCUI DevicesiWave SystemsMalico Inc.NTE Electronics, IncNTE Electronics, IncOhmiteSeeed Technology Co., LtdTE Connectivity AMP ConnectorsWakefield-Vette
Series
-132133301302303621623AERAPRB60BG
Packaging
BagBoxBulkTray
Product Status
ActiveObsolete
Type
Board LevelBoard Level, VerticalBoard Level, Vertical, ExtrusionTop MountTop Mount, Extrusion
Package Cooled
14-DIP and 16-DIP24-DIP-Aluminum Housed ResistorAssorted (BGA, LGA, CPU, ASIC...)BGABGA, CPU, GPUDO-5, TO-3, TO-48, TO-66, TO-126, TO-127, TO-220FPGANvidia Jetson NanoRaspberry PiSOT-32, TO-220
Attachment Method
2 Clips and PC Pin3 Clips and PC Pin4 Clips and PC Pin-Adhesive (Not Included)AdhesiveBolt On and Board MountsBolt On and PC PinBolt On and Thermal Tape, Adhesive (Included)Bolt OnClip and Board MountsClip and PC Pin
Shape
-CylindricalRectangularRectangular, Angled FinsRectangular, FinsRectangular, Pin FinsSquareSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.276" (7.00mm)0.335" (8.50mm)0.394" (10.00mm)0.472" (12.00mm)0.500" (12.70mm)0.551" (14.00mm)0.591" (15.00mm)0.591" (15.01mm)0.669" (17.00mm)0.700" (17.78mm)0.709" (18.00mm)0.732" (18.60mm)
Width
0.276" (7.00mm)0.335" (8.50mm)0.394" (10.00mm)0.400" (10.16mm)0.472" (12.00mm)0.492" (12.50mm)0.500" (12.70mm)0.504" (12.80mm)0.512" (13.00mm)0.520" (13.21mm)0.551" (14.00mm)0.591" (15.00mm)
Diameter
0.300" (7.62mm) OD0.750" (19.05mm) OD0.875" (22.20mm) OD-
Fin Height
0.079" (2.00mm)0.130" (3.30mm)0.157" (4.00mm)0.169" (4.30mm)0.177" (4.50mm)0.197" (5.00mm)0.211" (5.35mm)0.216" (5.50mm)0.236" (6.00mm)0.250" (6.35mm)0.256" (6.50mm)0.268" (6.81mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C1.93W @ 75°C1.94W @ 75°C1.95W @ 75°C2.0W @ 24°C2.0W @ 26°C2.0W @ 75°C2.1W @ 75°C2.4W @ 75°C2.47W @ 75°C2.5W @ 20°C2.5W @ 30°C
Thermal Resistance @ Forced Air Flow
0.08°C/W @ 500 LFM0.09°C/W @ 500 LFM0.10°C/W @ 500 LFM0.11°C/W @ 500 LFM0.12°C/W @ 500 LFM0.13°C/W @ 500 LFM0.17°C/W @ 500 LFM0.50°C/W @ 500 LFM0.6°C/W @ 600 LFM1.00°C/W @ 300 LFM1.00°C/W @ 400 LFM1.20°C/W @ 200 LFM
Thermal Resistance @ Natural
0.24°C/W0.26°C/W0.28°C/W0.37°C/W0.38°C/W0.44°C/W0.51°C/W0.55°C/W0.59°C/W0.61°C/W0.63°C/W0.67°C/W
Material Finish
-Black AnodizedBlue AnodizedClean FinishedClear, AnodizedDegreasedGold AnodizedHard AnodizedNatural AnodizedTinUnfinished
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
36,175
In Stock
1 : $0.39000
Bulk
-
Bulk
ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Pin Fins0.335" (8.50mm)0.335" (8.50mm)-0.315" (8.00mm)--32.00°C/WAluminum AlloyBlack Anodized
HSE-B2111-038
HSE-B2111-038
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
14,758
In Stock
1 : $0.57000
Box
Box
ActiveBoard LevelTO-220Bolt OnRectangular, Fins0.984" (25.00mm)0.625" (16.00mm)-0.354" (9.00mm)3.8W @ 75°C6.12°C/W @ 200 LFM19.74°C/WAluminum AlloyBlack Anodized
5,345
In Stock
1 : $0.59000
Bulk
-
Bulk
ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Pin Fins0.827" (21.00mm)0.827" (21.00mm)-0.236" (6.00mm)--24.00°C/WAluminum AlloyBlack Anodized
2,786
In Stock
1 : $0.65000
Bulk
-
Bulk
ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Pin Fins0.551" (14.00mm)0.551" (14.00mm)-0.394" (10.00mm)--27.00°C/WAluminum AlloyBlack Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
2,786
In Stock
1 : $0.67000
Box
Box
ActiveTop MountBGAAdhesive (Not Included)Square, Pin Fins0.394" (10.00mm)0.394" (10.00mm)-0.275" (7.00mm)2.0W @ 75°C16.50°C/W @ 200 LFM37.90°C/WAluminum AlloyBlack Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
1,824
In Stock
1 : $0.73000
Box
Box
ActiveTop MountBGAAdhesive (Not Included)Square, Pin Fins0.335" (8.50mm)0.335" (8.50mm)-0.315" (8.00mm)1.9W @ 75°C16.00°C/W @ 200 LFM39.10°C/WAluminum AlloyBlack Anodized
3,017
In Stock
1 : $0.74000
Bulk
-
Bulk
ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Pin Fins0.472" (12.00mm)0.472" (12.00mm)-0.709" (18.00mm)--27.00°C/WAluminum AlloyBlack Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
2,147
In Stock
1 : $0.81000
Box
Box
ActiveTop MountBGAAdhesiveSquare, Pin Fins0.669" (17.00mm)0.669" (17.00mm)-0.236" (6.00mm)2.5W @ 75°C13.10°C/W @ 200 LFM29.73°C/WAluminum AlloyBlack Anodized
HSB24-252510
HSB24-252510
HEAT SINK, BGA,25 X 25 X 10 MM
CUI Devices
1,032
In Stock
1 : $0.81000
Box
Box
ActiveTop MountBGAAdhesiveSquare, Pin Fins0.984" (25.00mm)0.984" (25.00mm)-0.394" (10.00mm)4.14W @ 75°C6.50°C/W @ 200 LFM18.10°C/WAluminum AlloyBlack Anodized
4,762
In Stock
1 : $0.82000
Bulk
-
Bulk
ActiveTop MountAssorted (BGA, LGA, CPU, ASIC...)Thermal Tape, Adhesive (Not Included)Square, Pin Fins1.098" (27.90mm)1.098" (27.90mm)-0.441" (11.20mm)--19.00°C/WAluminum AlloyBlack Anodized
HSE04-251265-1
HSE04-251265-2
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
1,747
In Stock
1 : $0.87000
Bag
Bag
ActiveTop MountTO-218, TO-220Bolt OnRectangular, Fins0.984" (25.00mm)0.472" (12.00mm)-0.256" (6.50mm)2.47W @ 75°C16.60°C/W @ 200 LFM30.38°C/WAluminum AlloyBlack Anodized
V2286B
V2286B
CPU HEATSINK, CROSS CUT, AL6063,
Assmann WSW Components
2,648
In Stock
1 : $0.89000
Bulk
-
Bulk
ActiveTop Mount-Thermal Tape, Adhesive (Not Included)Square, Pin Fins0.551" (14.00mm)0.551" (14.00mm)-0.236" (6.00mm)--32.00°C/WAluminum AlloyBlack Anodized
HSB12-272706
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
CUI Devices
1,293
In Stock
1 : $0.89000
Box
Box
ActiveTop MountBGAAdhesiveSquare, Pin Fins1.063" (27.00mm)1.063" (27.00mm)-0.236" (6.00mm)3.8W @ 75°C7.80°C/W @ 200 LFM19.59°C/WAluminum AlloyBlack Anodized
HSE-BX-02
HSE-B20254-035H
HEAT SINK, EXTRUSION, TO-220,25.
CUI Devices
1,683
In Stock
1 : $0.95000
Box
Box
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Angled Fins1.000" (25.40mm)1.375" (34.93mm)-0.500" (12.70mm)5.8W @ 75°C3.28°C/W @ 200 LFM12.93°C/WAluminum AlloyBlack Anodized
HSS24-B20-NP
HSS24-B20-NP
HEAT SINK, STAMPING, TO-218/TO-2
CUI Devices
2,893
In Stock
1 : $0.98000
Box
Box
ActiveTop MountTO-218, TO-220Bolt OnRectangular, Fins1.654" (42.00mm)1.496" (38.00mm)-0.984" (25.00mm)7.85W @ 75°C4.30°C/W @ 200 LFM9.56°C/WAluminum AlloyBlack Anodized
HSE-B254-04H
HSE-B254-04H
HEAT SINK, EXTRUSION, TO-220/TO-
CUI Devices
228
In Stock
1 : $1.01000
Box
Box
ActiveBoard Level, VerticalTO-218, TO-220Bolt On and PC PinRectangular, Fins1.000" (25.40mm)0.650" (16.50mm)-0.630" (16.00mm)4.7W @ 75°C4.93°C/W @ 200 LFM15.96°C/WAluminum AlloyBlack Anodized
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,968
In Stock
1 : $1.02000
Box
Box
ActiveTop MountBGAAdhesiveSquare, Pin Fins0.709" (18.00mm)0.709" (18.00mm)-0.394" (10.00mm)3.2W @ 75°C18.80°C/W @ 200 LFM23.68°C/WAluminum AlloyBlack Anodized
HSE-B20X
HSE-B20380-040H
HEAT SINK, EXTRUSION, TO-220, 38
CUI Devices
672
In Stock
1 : $1.02000
Tray
Tray
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Angled Fins1.496" (38.00mm)1.378" (35.00mm)-0.492" (12.50mm)7.4W @ 75°C3.94°C/W @ 200 LFM10.14°C/WAluminum AlloyBlack Anodized
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,695
In Stock
1 : $1.04000
Box
Box
ActiveTop MountBGAAdhesiveSquare, Pin Fins0.906" (23.00mm)0.906" (23.00mm)-0.394" (10.00mm)3.7W @ 75°C6.80°C/W @ 200 LFM20.41°C/WAluminum AlloyBlack Anodized
V2269E1
V2269E1
CPU HEATSINK, CROSS CUT, AL6063,
Assmann WSW Components
215
In Stock
1 : $1.04000
Bulk
-
Bulk
ActiveTop Mount-Thermal Tape, Adhesive (Not Included)Square, Pin Fins0.787" (20.00mm)0.787" (20.00mm)-0.354" (9.00mm)--27.00°C/WAluminum AlloyBlack Anodized
HSE-BX-035H-0x
HSE-B20254-035H-01
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
1,047
In Stock
1 : $1.05000
Box
Box
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Angled Fins1.000" (25.40mm)1.378" (35.00mm)-0.500" (12.70mm)5.2W @ 75°C4.42°C/W @ 200 LFM14.42°C/WAluminum AlloyBlack Anodized
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
1,145
In Stock
1 : $1.08000
Box
Box
ActiveTop MountBGAAdhesiveSquare, Pin Fins0.669" (17.00mm)0.669" (17.00mm)-0.453" (11.50mm)3.1W @ 75°C8.40°C/W @ 200 LFM23.91°C/WAluminum AlloyBlack Anodized
HSE-BX-040H
HSE-B20254-040H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
3,595
In Stock
1 : $1.12000
Bag
Bag
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.000" (25.40mm)1.260" (32.00mm)-0.551" (14.00mm)5.7W @ 75°C7.74°C/W @ 200 LFM13.16°C/WAluminum AlloyBlack Anodized
HSB26-343408
HSB26-343408
HEAT SINK, BGA, 33.5 X 33.5 X 8
CUI Devices
805
In Stock
1 : $1.14000
Box
Box
ActiveTop MountBGAAdhesiveSquare, Pin Fins1.319" (33.50mm)1.319" (33.50mm)-0.315" (8.00mm)4.94W @ 75°C5.30°C/W @ 200 LFM15.19°C/WAluminum AlloyBlack Anodized
HSE-BX-04H-01
HSE-B250-04H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
769
In Stock
1 : $1.17000
Box
Box
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins0.984" (25.00mm)1.378" (35.00mm)-1.000" (25.40mm)8.0W @ 75°C3.26°C/W @ 200 LFM13.60°C/WAluminum AlloyBlack Anodized
Showing
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Aluminum Alloy Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.