System On Chip (SoC)

Results: 3
Primary Attributes
Kintex™-7 FPGA, 125K Logic CellsKintex™-7 FPGA, 275K Logic Cells
Package / Case
676-BBGA, FCBGA900-BBGA, FCBGA
Supplier Device Package
676-FCBGA (27x27)900-FCBGA (31x31)
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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Price
Series
Package
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Architecture
Core Processor
Flash Size
RAM Size
Peripherals
Connectivity
Speed
Primary Attributes
Operating Temperature
Package / Case
Supplier Device Package
900-BBGA, FCBGA
XC7Z035-2FFG900I
IC SOC CORTEX-A9 800MHZ 900FCBGA
AMD
4
In Stock
1 : $2,458.75000
Tray
Tray
Active
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 275K Logic Cells
-40°C ~ 100°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
676-FCBGA Series
XC7Z030-L2FBG676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
AMD
0
In Stock
Check Lead Time
1 : $517.40000
Tray
Tray
Active
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 125K Logic Cells
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
676-FCBGA Series
XC7Z030-2FF676I
IC SOC CORTEX-A9 800MHZ 676FCBGA
AMD
0
In Stock
Check Lead Time
200 : $703.30000
Tray
Tray
Active
MCU, FPGA
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
-
256KB
DMA
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
800MHz
Kintex™-7 FPGA, 125K Logic Cells
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
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of 3

System On Chip (SoC)


Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.