Single Diodes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Technology	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Voltage - Forward (Vf) (Max) @ If	Speed	Reverse Recovery Time (trr)	Current - Reverse Leakage @ Vr	Capacitance @ Vr, F	Grade	Qualification	Mounting Type	Package / Case	Supplier Device Package	Operating Temperature - Junction
JANTX1N5811US DIODE GEN PURP 150V 3A B SQ-MELF Microchip Technology	116 In Stock	1 : $8.09000 Bulk	-	Bulk	Active	Standard	150 V	3A	875 mV @ 4 A	Fast Recovery =< 500ns, > 200mA (Io)	30 ns	5 µA @ 150 V	60pF @ 10V, 1MHz	Military	MIL-PRF-19500/477	Surface Mount	SQ-MELF, B	B, SQ-MELF	-65°C ~ 175°C
JANTX1N5711UR-1 DIODE SCHOTTKY 70V 33MA DO213AA Microchip Technology	207 In Stock	1 : $10.99000 Bulk	-	Bulk	Active	Schottky	70 V	33mA	1 V @ 15 mA	Small Signal =< 200mA (Io), Any Speed	-	200 nA @ 100 V	2pF @ 0V, 1MHz	Military	MIL-PRF-19500/444	Surface Mount	DO-213AA	DO-213AA	-65°C ~ 150°C
1N5822US DIODE SCHOTTKY 40V 3A B SQ-MELF Microchip Technology	207 In Stock	1 : $76.31000 Bulk	-	Bulk	Active	Schottky	40 V	3A	500 mV @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	-	100 µA @ 40 V	-	-	-	Surface Mount	SQ-MELF, B	B, SQ-MELF	-65°C ~ 125°C
JANTX1N6638US DIODE GP 125V 300MA B SQ-MELF Microchip Technology	0 In Stock Check Lead Time	113 : $6.21000 Bulk	-	Bulk	Active	Standard	125 V	300mA	1.1 V @ 200 mA	Fast Recovery =< 500ns, > 200mA (Io)	4.5 ns	-	-	Military	MIL-PRF-19500/578	Surface Mount	SQ-MELF, B	B, SQ-MELF	-65°C ~ 175°C
JANTX1N5822 DIODE SCHOTTKY 40V 3A B AXIAL Microchip Technology	0 In Stock Check Lead Time	100 : $74.36000 Bulk	-	Bulk	Active	Schottky	40 V	3A	500 mV @ 3 A	Fast Recovery =< 500ns, > 200mA (Io)	-	100 µA @ 40 V	-	Military	MIL-PRF-19500/620	Through Hole	B, Axial	B, Axial	-65°C ~ 125°C

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Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.