Adapter, Breakout Boards

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension

PC90363-6 SOT-363-6 to DIP with Stencil Precision PCBS	247 Marketplace	1 : $10.27000 Bulk	-	Bulk	Active	SMD to DIP	SOT-363-6	6	0.100" (2.54mm)	0.062" (1.57mm) 1/16"	-	0.400" L x 0.500" W (10.16mm x 12.70mm)
PC9089-3 SOT-89-2 to DIP with Stencil Precision PCBS	243 Marketplace	1 : $10.27000 Bulk	-	Bulk	Active	SMD to DIP	SOT-89	3	0.100" (2.54mm)	0.062" (1.57mm) 1/16"	-	0.400" L x 0.400" W (10.16mm x 10.16mm)
PC8008S127 8 Pin SOIC to DIP with Stencil Precision PCBS	249 Marketplace	1 : $10.47000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	8	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	-	0.500" L x 0.500" W (12.70mm x 12.70mm)
PC8010S100 10 Pin SOIC to DIP with Stencil Precision PCBS	248 Marketplace	1 : $10.47000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	10	0.039" (1.00mm)	0.062" (1.57mm) 1/16"	-	0.600" L x 0.650" W (15.24mm x 16.51mm)
PC8008M65 8 Pin SOIC to DIP with Stencil Precision PCBS	246 Marketplace	1 : $10.47000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	8	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	-	0.500" L x 0.600" W (12.70mm x 15.20mm)
PC606BR40 6 Ball BGA to DIP with Stencil Precision PCBS	245 Marketplace	1 : $11.47000 Bulk	-	Bulk	Active	SMD to DIP	BGA	6	0.016" (0.40mm)	0.062" (1.57mm) 1/16"	-	0.500" L x 0.400" W (12.70mm x 10.16mm)
PC609BL40 9 Ball BGA to DIP with Stencil Precision PCBS	244 Marketplace	1 : $11.47000 Bulk	-	Bulk	Active	SMD to DIP	BGA	9	0.016" (0.40mm)	0.062" (1.57mm) 1/16"	-	0.600" L x 0.400" W (15.24mm x 10.16mm)
PC6025BR40 25 Ball BGA to DIP with Stencil Precision PCBS	240 Marketplace	1 : $11.47000 Bulk	-	Bulk	Active	SMD to DIP	BGA	25	0.016" (0.40mm)	0.062" (1.57mm) 1/16"	-	1.300" L x 0.400" W (33.02mm x 10.16mm)
PC90891-6 SOT-891-6 to DIP with Stencil Precision PCBS	250 Marketplace	1 : $10.27000 Bulk	-	Bulk	Active	SMD to DIP	SOT-891-6	6	0.100" (2.54mm)	0.062" (1.57mm) 1/16"	-	0.400" L x 0.300" W (10.16mm x 7.62mm)
PC90353-5 SOT-353-5 to DIP with Stencil Precision PCBS	250 Marketplace	1 : $10.27000 Bulk	-	Bulk	Active	SMD to DIP	SOT-353-5	5	0.100" (2.54mm)	0.062" (1.57mm) 1/16"	-	0.400" L x 0.500" W (10.16mm x 12.70mm)
PC9023-6 SOT-23-6 to DIP with Stencil Precision PCBS	250 Marketplace	1 : $10.27000 Bulk	-	Bulk	Active	SMD to DIP	SOT-23	6	0.100" (2.54mm)	0.062" (1.57mm) 1/16"	-	0.400" L x 0.500" W (10.16mm x 12.70mm)
PC8016M50 16 Pin SOIC to DIP with Stencil Precision PCBS	250 Marketplace	1 : $10.47000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	16	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	-	0.500" L x 1.000" W (12.70mm x 25.40mm)
PC8018S127 18 Pin SOIC to DIP with Stencil Precision PCBS	250 Marketplace	1 : $10.47000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	18	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	-	1.100" L x 0.700" W (27.94mm x 17.78mm)
PC8012M65 12 Pin SOIC to DIP with Stencil Precision PCBS	250 Marketplace	1 : $10.47000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	12	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	-	0.500" L x 0.800" W (12.70mm x 20.30mm)
PC8010M50 10 Pin SOIC to DIP with Stencil Precision PCBS	250 Marketplace	1 : $10.47000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	10	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	-	0.500" L x 0.700" W (12.70mm x 17.80mm)
PC8028S127 28 Pin SOIC to DIP with Stencil Precision PCBS	250 Marketplace	Active	-	-	Active	SMD to DIP	SOIC	28	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	-	1.600" L x 0.800" W (40.64mm x 20.32mm)
PC604BR50 4 Ball BGA to DIP with Stencil Precision PCBS	250 Marketplace	1 : $11.47000 Bulk	-	Bulk	Active	SMD to DIP	BGA	4	0.014" (0.35mm)	0.062" (1.57mm) 1/16"	-	0.400" L x 0.500" W (10.16mm x 12.70mm)
PC6012PBR40 12 Ball BGA to DIP with Stencil Precision PCBS	250 Marketplace	1 : $11.47000 Bulk	-	Bulk	Active	SMD to DIP	BGA	12	0.016" (0.40mm)	0.062" (1.57mm) 1/16"	-	0.700" L x 0.400" W (17.78mm x 10.16mm)
PC6012FBR40 12 Ball BGA to DIP with Stencil Precision PCBS	250 Marketplace	1 : $11.47000 Bulk	-	Bulk	Active	SMD to DIP	BGA	12	0.016" (0.40mm)	0.062" (1.57mm) 1/16"	-	0.700" L x 0.400" W (17.78mm x 10.16mm)

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Adapter, Breakout Boards

Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.