Adapter, Breakout Boards

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Mfr Part #	Quantity Available	Price	Tariff Status	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension
PTS-00099-211 BOB FOR COMMON ESP MCU KIT PTSolns	103 In Stock	1 : $3.92000 Bag	-	BoB	Bag	Active	Connector to Breadboard	2.54mm	40	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	1.254" L x 4.292" W (32.62mm x 109.01mm)
PTS-00137-211 BOB FOR LORA MODULES KIT PTSolns	135 In Stock	1 : $4.12000 Bag	-	BoB	Bag	Active	Connector to Breadboard	2.00mm	16	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	0.781" L x 2.278" W (19.83mm x 57.85mm)
PTS-00028-211 BOB FOR ARDUINO NANO NTEA-MD KIT PTSolns	372 In Stock	1 : $6.71000 Bag	-	BoB	Bag	Active	Connector to Headers	2.54mm	30	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	2.598" L x 1.618" W (66.00mm x 41.10mm)
PTS-00021-211 BOB FOR ARDUINO NANO NTEA-LG KIT PTSolns	295 In Stock	1 : $7.50000 Bag	-	BoB	Bag	Active	Connector to Headers	2.54mm	30	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	3.051" L x 2.039" W (77.5mm x 51.8mm)
PTS-00099-201 BOB FOR COMMON MICROCONTROLLERS PTSolns	58 In Stock	1 : $2.00000 Bag	-	BoB	Bag	Active	Connector to Breadboard	2.54mm	40	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	1.254" L x 4.292" W (32.62mm x 109.01mm)
PTS-00198-211 BOB FOR RPI PICO SERIES PTSolns	82 In Stock	1 : $12.00000 Bag	-	BoB	Bag	Active	Connector to Terminal Block	2.54mm	80	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	2.811" L x 2.661" W (71.40mm x 67.60mm)
PTS-00155-211 BOB FOR COMMON BOARDS KIT PTSolns	50 In Stock	1 : $12.00000 Bag	-	BoB	Bag	Active	Connector to Terminal Block	2.54mm	80	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	2.811" L x 2.823" W (71.40mm x 71.70mm)
PTS-00026-211 BOB FOR ARDUINO NANO NTEA-SM KIT PTSolns	11 In Stock	1 : $6.01000 Bag	-	BoB	Bag	Active	Connector to Headers	2.54mm	30	0.100" (2.54mm)	0.063" (1.60mm)	FR4 Epoxy Glass	1.579" L x 1.307" W (40.1mm x 33.2mm)

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Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.