SMDLTLFP250T4

DigiKey Part Number
SMDLTLFP250T4-ND
Manufacturer
Manufacturer Product Number
SMDLTLFP250T4
Description
SOLDER PASTE LOW TEMP T4 250G
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 8.8 oz (250g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Digi-Key Storage
Refrigerated
Shipping Info
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Base Product Number
Environmental & Export Classifications
AttributeDescription
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)Not Applicable
REACH StatusREACH Unaffected
ECCNEAR99
HTSUS3810.10.0000
All prices are in USD
Jar
QuantityUnit PriceExt Price
1$83.95000$83.95
Manufacturers Standard Package
Additional Resources
AttributeDescription
Standard Package1