TS991SNL500T4
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

TS991SNL500T4

Digi-Key Part Number
315-TS991SNL500T4-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
TS991SNL500T4
Supplier
Description
SOLDER PASTE THERMALLY STABLE NC
Manufacturer Standard Lead Time
4 Weeks
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - Jar, 17.64 oz (500g)
Customer Reference
Datasheet Datasheet
Product Attributes
Type
Description
Select
Category
Mfr
Chip Quik Inc.
Series
Package
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Process
Lead Free
Form
Jar, 17.64 oz (500g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Base Product Number
Environmental & Export Classifications
AttributeDescription
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
REACH StatusREACH Unaffected
ECCNEAR99
HTSUS3810.10.0000
All prices are in USD
Bulk
QtyUnit PriceExt Price
1$96.13000$96.13
5$88.33200$441.66
10$83.13600$831.36
25$77.94000$1,948.50
Additional Resources
AttributeDescription
Other Names315-TS991SNL500T4
Standard Package1