TS391LT50

DigiKey Part Number
TS391LT50-ND
Manufacturer
Manufacturer Product Number
TS391LT50
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time
3 Weeks
Customer Reference
Detailed Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter
-
Melting Point
281°F (138°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Shipping Info
-
Base Product Number
Environmental & Export Classifications
AttributeDescription
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)Not Applicable
REACH StatusREACH Unaffected
ECCNEAR99
HTSUS3810.10.0000
All prices are in USD
Bulk
QuantityUnit PriceExt Price
1$21.95000$21.95
Manufacturers Standard Package
Additional Resources
AttributeDescription
Standard Package1