TS391AX250
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

TS391AX250

Digi-Key Part Number
TS391AX250-ND
Manufacturer
Manufacturer Product Number
TS391AX250
Description
THERMALLY STABLE SOLDER PASTE NO
Manufacturer Standard Lead Time
3 Weeks
Detailed Description
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
Customer Reference
Datasheet Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Chip Quik Inc.
Series
-
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn63Pb37 (63/37)
Diameter
-
Melting Point
361°F (183°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Leaded
Form
Jar, 8.8 oz (250g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
68°F ~ 77°F (20°C ~ 25°C)
Shipping Info
-
Base Product Number
Environmental & Export Classifications
AttributeDescription
RoHS StatusRoHS non-compliant
Moisture Sensitivity Level (MSL)Not Applicable
REACH StatusREACH Affected
ECCNEAR99
HTSUS3810.10.0000
California Prop 65
Warning Information
4 In Stock
All prices are in USD
Bulk
QtyUnit PriceExt Price
1$54.95000$54.95
Manufacturers Standard Package