SMD291SNL50T6
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SMD291SNL50T6

DigiKey Part Number
315-SMD291SNL50T6-ND
Manufacturer
Manufacturer Product Number
SMD291SNL50T6
Description
SOLDER PASTE IN JAR 50G (T6) SAC
Manufacturer Standard Lead Time
4 Weeks
Detailed Description
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g)
Customer Reference
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Chip Quik Inc.
Series
Package
Bulk
Product Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
422 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
6
Process
Lead Free
Form
Jar, 1.76 oz (50g)
Shelf Life
6 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)
Base Product Number
Environmental & Export Classifications
AttributeDescription
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
REACH StatusREACH Unaffected
ECCNEAR99
HTSUS8311.90.0000
All prices are in USD
Bulk
QuantityUnit PriceExt Price
1$99.95000$99.95
Manufacturers Standard Package
Additional Resources
AttributeDescription
Other Names315-SMD291SNL50T6
Standard Package1