
SMD291SNL50T3 | ||
---|---|---|
Digi-Key Part Number | SMD291SNL50T3-ND | |
Manufacturer | ||
Manufacturer Product Number | SMD291SNL50T3 | |
Description | SLDR PASTE NO-CLN SAC305 50G | |
Manufacturer Standard Lead Time | 10 Weeks | |
Detailed Description | Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.76 oz (50g) | |
Customer Reference | ||
Datasheet | Datasheet |
Type | Description | Select All |
---|---|---|
Category | ||
Mfr | Chip Quik Inc. | |
Series | - | |
Package | Jar | |
Product Status | Active | |
Type | Solder Paste | |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | |
Diameter | - | |
Melting Point | 423 ~ 428°F (217 ~ 220°C) | |
Flux Type | No-Clean | |
Wire Gauge | - | |
Mesh Type | 3 | |
Process | Lead Free | |
Form | Jar, 1.76 oz (50g) | |
Shelf Life | 6 Months | |
Shelf Life Start | Date of Manufacture | |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) | |
Digi-Key Storage | Refrigerated | |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | |
Weight | 0.113 lb (51.26 g) | |
Base Product Number |
Resource Type | Link |
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Datasheets | SMD291SNL Datasheet |
MSDS Material Safety Datasheet | SMD291SNL Series SDS |
Featured Product | Solder Paste in 50g Jars |
HTML Datasheet | SMD291SNL Datasheet |
Attribute | Description |
---|---|
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 3810.10.0000 |
Qty | Unit Price | Ext Price |
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1 | $16.95000 | $16.95 |
Attribute | Description |
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Standard Package | 1 |