ulTIMiFlux Thermal Interface Material

Wakefield-Vette features their ulTIMiFlux silicone based thermally conductive gap filler

Image of Wakefield-Vette's ulTIMiFlux Thermal Interface Material Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability, and custom sizes for thermal system needs. Thermal interface materials (TIM) is a secondary material installed between the heat sink and the device which is designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages. Wakefield-Vette's line of thermal gap filling pad is intended to fill a large void between a device and the heat sink. A gap pad is a compressible material most commonly used when there are multiple devices to be contacted to the heat sink, but all the different device heights make it difficult to use a thin material. These materials come in a variety of thicknesses, conductivities, and durometers to meet a wide range of needs.

  • Excellent thermal conductivity
  • Natural tackiness; no need for adhesive
  • Excellent compression characteristics
  • Good wet-out and superb flexibility
  • Excellent converting properties
  • RoHS and HF compliant

ulTIMiFlux Thermal Interface Material

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
THERM PAD 17.78MMX12.7MM ORANGECD-02-05-220THERM PAD 17.78MMX12.7MM ORANGE295 - ImmediateView Details
THERM PAD 25.4MMX25.4MM GRAYPL-05-1-254THERM PAD 25.4MMX25.4MM GRAY109 - ImmediateView Details
THERM PAD 25.4MMX25.4MM GRAYPL-1-1-254THERM PAD 25.4MMX25.4MM GRAY30 - ImmediateView Details
THERM PAD 25.4MMX25.4MM GREENPL-05-3-254-HTHERM PAD 25.4MMX25.4MM GREEN0View Details
THERM PAD 25.4MMX25.4MM GREENPL-05-3-254THERM PAD 25.4MMX25.4MM GREEN212 - ImmediateView Details
Published: 2017-04-05