ulTIMiFlux™ Dielectric Phase-Change Thermal Material

Wakefield-Vette's ulTIMiFlux thermal material utilizes a substrate to act as a thermally conductive carrier

Image of Wakefield-Vette's ulTIMiFlux Dielectric Phase Change Thermal Material Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost, configurability, and custom sizes for thermal system needs. Thermal interface materials (TIM) is a secondary material installed between the heat sink and the device which is designed to improve the thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best-case usages. Wakefield-Vette's line of dielectric phase-change thermal materials are intended to fill voids between a device and the heat sink and utilize a polyimide film to act as a thermally conductive carrier in order to deliver a uniform thickness coating of phase-change thermal compound on both sides.

Through the development of this unique formulation, Wakefield-Vette's phase-change solution offers efficient thermal transfer by phase-changing during normal device operating temperatures while maintaining a uniform bond line thus driving out the air and adjusting for any surface imperfections or flatness conditions that may exist across the interface. This construction is useful in a wide range of electronic cooling applications from transistors, diodes, or any type of heat generating non-isolated power device.

A primary advantage of utilizing a phase-change system is the ability to drive out air from within the interface during initial device cycling causing phase change and surface wetting of the thermal compound coating. The phase-change compound is available in specific die cut patterns for common TO packages and can be placed instantly and be immediately ready for component mounting. Due to its thixotropic formulation design, the compound is held within the interface with no worries of run-out into unwanted areas during normal device/component operation.

Wakefield-Vette's phase-change product is a solvent-free, high-performance dielectric thermal interface material that is designed to provide efficient thermal transfer by providing precision phase-change and a uniform bond line thickness across a device/component mounting interface. The pads are designed as a pre-formed thermally conductive "drop in place" solution that offers excellent thermal transfer characteristics. From an installation perspective, thermal greases are difficult to dispense, often provide inadequate coverage, and lack a uniform thickness across the interface, leaving trapped air leading to poor thermal transfer. They can also leave thermal grease in unwanted areas afterwards requiring clean up.

  • Low thermal impedance
  • Excellent replacement for thermal greases
  • Thixotropic/prevents compound run-out
  • Excellent mechanical and dielectric properties
  • Cost effective "drop in place" solution
  • RoHS and halogen-free compliant

ulTIMiFlux Thermal Material

ImageManufacturer Part NumberDescriptionTypeAvailable QuantityView Details
THERM PAD 24.13MMX19.05MM ORANGECD-02-05-247THERM PAD 24.13MMX19.05MM ORANGEPad, Sheet8386 - ImmediateView Details
THERM PAD 26.67MMX21.59MM ORANGECD-02-05-264THERM PAD 26.67MMX21.59MM ORANGEPad, Sheet10263 - ImmediateView Details
THERM PAD 254MMX196.85MM ORANGECD-02-05-190THERM PAD 254MMX196.85MM ORANGEPad, Sheet53 - ImmediateView Details
THERM PAD 17.78MMX12.7MM ORANGECD-02-05-220THERM PAD 17.78MMX12.7MM ORANGEPad, Sheet295 - ImmediateView Details
THERM PAD TO-126 PAD WITH HOLECD-02-05-126THERM PAD TO-126 PAD WITH HOLEPad, Sheet599 - ImmediateView Details
Updated: 2018-08-23
Published: 2017-06-13