MC10, MC100E143 Datasheet by onsemi

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© Semiconductor Components Industries, LLC, 2016
July, 2016 Rev. 8
1Publication Order Number:
MC10E143/D
MC10E143, MC100E143
5V ECL 9‐Bit Hold Register
Description
The MC10E/100E143 is a 9-bit holding register, designed with
byte-parity applications in mind. The E143 holds current data or loads
new data, with the nine inputs D0 D8 accepting parallel input data.
The SEL (Select) input pin is used to switch between the two modes
of operation HOLD and LOAD. Input data is accepted by the
registers a set-up time before the positive going edge of CLK1 or
CLK2. A HIGH on the Master Reset pin (MR) asynchronously resets
all the registers to zero.
The 100 Series contains temperature compensation.
Features
700 MHz Min. Operating Frequency
9-Bit for Byte-Parity Applications
Asynchronous Master Reset
Dual Clocks
PECL Mode Operating Range:
VCC= 4.2 V to 5.7 V with VEE= 0 V
NECL Mode Operating Range:
VCC= 0 V with VEE = 4.2 V to 5.7 V
Internal Input 50 kW Pulldown Resistors
ESD Protection:
Human Body Model; > 2 kV
Machine Model; > 200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level: 3 (Pb-Free)
For Additional Information, see Application Note AND8003/D
Flammability Rating: UL 94 V0 @ 0.125 in,
Oxygen Index: 28 to 34
Transistor Count = 484 devices
These Devices are Pb-Free, Halogen Free and are RoHS Compliant
MARKING DIAGRAM*
xxx = 10 or 100
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb-Free Package
PLCC28
FN SUFFIX
CASE 77602
MCxxxE143FNG
AWLYYWW
1
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*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Device Package Shipping
MC10E143FNR2G PLCC28
(Pb-Free)
500/Tape & Reel
MC100E143FNG PLCC28
(Pb-Free)
37 Units/Tube
For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
I_Il_‘l_|l_|l_ll_ll_\ flflflflflflfl \_JLJLI|_I\_I|_JLJ |_l|_l|_l|_||_l|_l|_l www.cnsemi.com
MUX
MUX
MUX
MUX
Figure 2. Logic Diagram
D0
D1
D2
D3
D8
SEL
CLK1
CLK2
MR
Q0
Q1
Q2
Q3
Q8
MUX D
R
D
D
D
D
R
R
R
R
MC10E143, MC100E143
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2
D2D3D4VCCO Q0Q1Q2
VCCO
D5
D6
D7
D8
SEL
MR
CLK1
CLK2
VEE
NC
D0
D1
26
27
28
2
3
4
25 24 23 22 21 20 19
18
17
16
15
14
13
12
115678910
Q8
Q7
Q6
VCC
Q5
VCCO
Q4
Q3
1Pinout: 28-Lead PLCC
(Top View)
* All VCC and VCCO pins are tied together on the die.
Figure 1. 28-Lead Pinout
Warning: All VCC, VCCO, and VEE pins must be externally
connected to Power Supply to guarantee proper operation.
Table 1. PIN DESCRIPTION
PIN FUNCTION
D0 D8
SEL
CLK1, CLK2
MR
Q0 Q8
NC
VCC, VCCO
VEE
ECL Parallel Data Inputs
ECL Mode Select Input
ECL Clock Inputs
ECL Master Reset
ECL Data Outputs
No Connect
Positive Supply*
Negative Supply
*From VCC pin to each VCCO pin is an internal 100 W resistor.
Table 2. FUNCTIONS
SEL Mode
L
H
Load
Hold
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Table 3. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
VCC PECL Mode Power Supply VEE = 0 V 8 V
VEE NECL Mode Power Supply VCC = 0 V 8 V
VIPECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VI VCC
VI VEE
6
6
V
Iout Output Current Continuous
Surge
50
100
mA
TAOperating Temperature Range 0 to +85 °C
Tstg Storage Temperature Range 65 to +150 °C
qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm
500 lfpm
PLCC28 63.5
43.5
°C/W
qJC Thermal Resistance (Junction-to-Case) Standard Board PLCC28 22 to 26 °C/W
VEE PECL Operating Range
NECL Operating Range
4.2 to 5.7
5.7 to 4.2
V
Tsol Wave Solder (Pb-Free) 265 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 4. 10E SERIES PECL DC CHARACTERISTICS (VCCx = 5.0 V; VEE = 0.0 V (Note 1))
Symbol Characteristic
0°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 120 145 120 145 120 145 mA
VOH Output HIGH Voltage (Note 2) 3980 4070 4160 4020 4105 4190 4090 4185 4280 mV
VOL Output LOW Voltage (Note 2) 3050 3210 3370 3050 3210 3370 3050 3227 3405 mV
VIH Input HIGH Voltage 3830 3995 4160 3870 4030 4190 3940 4110 4280 mV
VIL Input LOW Voltage 3050 3285 3520 3050 3285 3520 3050 3302 3555 mV
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.3 0.5 0.25 0.3 0.2 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.06 V.
2. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
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Table 5. 10E SERIES NECL DC CHARACTERISTICS (VCCx = 0.0 V; VEE = 5.0 V (Note 1))
Symbol Characteristic
0°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 120 145 120 145 120 145 mA
VOH Output HIGH Voltage (Note 2) 1020 930 840 980 895 810 910 815 720 mV
VOL Output LOW Voltage (Note 2) 1950 1790 1630 1950 1790 1630 1950 1773 1595 mV
VIH Input HIGH Voltage 1170 1005 840 1130 970 810 1060 890 720 mV
VIL Input LOW Voltage 1950 1715 1480 1950 1715 1480 1950 1698 1445 mV
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.3 0.5 0.065 0.3 0.2 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.06 V.
2. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
Table 6. 100E SERIES PECL DC CHARACTERISTICS (VCCx = 5.0 V; VEE = 0.0 V (Note 1))
Symbol Characteristic
0°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 120 145 120 145 138 165 mA
VOH Output HIGH Voltage (Note 2) 3975 4050 4120 3975 4050 4120 3975 4050 4120 mV
VOL Output LOW Voltage (Note 2) 3190 3295 3380 3190 3255 3380 3190 3260 3380 mV
VIH Input HIGH Voltage 3835 3975 4120 3835 3975 4120 3835 3975 4120 mV
VIL Input LOW Voltage 3190 3355 3525 3190 3355 3525 3190 3355 3525 mV
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.3 0.5 0.25 0.5 0.2 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.8 V.
2. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
Table 7. 100E SERIES NECL DC CHARACTERISTICS (VCCx = 0.0 V; VEE = 5.0 V (Note 1))
Symbol Characteristic
0°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
IEE Power Supply Current 120 145 120 145 138 165 mA
VOH Output HIGH Voltage (Note 2) 1025 950 880 1025 950 880 1025 950 880 mV
VOL Output LOW Voltage (Note 2) 1810 1705 1620 1810 1745 1620 1810 1740 1620 mV
VIH Input HIGH Voltage 1165 1025 880 1165 1025 880 1165 1025 880 mV
VIL Input LOW Voltage 1810 1645 1475 1810 1645 1475 1810 1645 1475 mV
IIH Input HIGH Current 150 150 150 mA
IIL Input LOW Current 0.5 0.3 0.5 0.25 0.5 0.2 mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Input and output parameters vary 1:1 with VCC. VEE can vary 0.46 V / +0.8 V.
2. Outputs are terminated through a 50 W resistor to VCC 2.0 V.
0°C zsrc 55°C Max. smn Frequency 700 900 700 900 700 900 MHz Propagahon De‘ay To Ompul p5 Semp Time as Hold Time as Resel Recovery Time 900 700 900 mm 900 700 p5 Mlmmum Pulse wmm 400 400 400 p5 WxtmnrDewce Skew (Note 2) 75 75 75 p5 Random Clock Me: (HMS) <1 p5="" ruse/fa”="" txmes="" 300="" 525="" 500="" 300="" 525="" 500="" 300="" 525="" 300="" p5="" (see="" application="" note="" andbozozd="">
MC10E143, MC100E143
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5
Table 8. AC CHARACTERISTICS (VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = 5.0 V (Note 1))
Symbol Characteristic
0°C 25°C 85°C
Unit
Min Typ Max Min Typ Max Min Typ Max
fSHIFT Max. Shift Frequency 700 900 700 900 700 900 MHz
tPLHt
PHL
Propagation Delay To Output
Clk
MR
600
600
800
800
1000
1000
600
600
800
800
1000
1000
600
600
800
800
1000
1000
ps
tsSetup Time
D
SEL
50
300
100
150
50
300
100
150
50
300
100
150
ps
thHold Time
D
SEL
300
75
100
150
300
75
100
150
300
75
100
150
ps
tRR Reset Recovery Time 900 700 900 700 900 700 ps
tPW Minimum Pulse Width
Clk, MR
400 400 400 ps
tSKEW Within-Device Skew (Note 2) 75 75 75 ps
tJITTER Random Clock Jitter (RMS) < 1 < 1 < 1 ps
Tr
tf
Rise/Fall Times
(20 - 80%)
300 525 800 300 525 800 300 525 800 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. 10 Series: VEE can vary 0.46 V / +0.06 V.
100 Series: VEE can vary 0.46 V / +0.8 V.
2. Within-device skew is defined as identical transitions on similar paths through a device.
Figure 3. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Zo = 50 W
Zo = 50 W
50 W50 W
VTT
VTT = VCC 2.0 V
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
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MC10E143, MC100E143
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6
PACKAGE DIMENSIONS
28 LEAD PLLC
CASE 77602
ISSUE F
N
M
L
V
WD
D
Y BRK
28 1
VIEW S
S
L-M
S
0.010 (0.250) N S
T
S
L-M
M
0.007 (0.180) N S
T
0.004 (0.100)
G1
GJ
C
Z
R
E
A
SEATING
PLANE
S
L-M
M
0.007 (0.180) N S
T
T
B
S
L-M
S
0.010 (0.250) N S
T
S
L-M
M
0.007 (0.180) N S
T
U
S
L-M
M
0.007 (0.180) N S
T
Z
G1X
VIEW DD
S
L-M
M
0.007 (0.180) N S
T
K1
VIEW S
H
K
FS
L-M
M
0.007 (0.180) N S
T
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.485 0.495 12.32 12.57
B0.485 0.495 12.32 12.57
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.021 0.33 0.53
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 --- 0.51 ---
K0.025 --- 0.64 ---
R0.450 0.456 11.43 11.58
U0.450 0.456 11.43 11.58
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y--- 0.020 --- 0.50
Z2 10 2 10
G1 0.410 0.430 10.42 10.92
K1 0.040 --- 1.02 ---
__ __
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