VSOP383 Datasheet by Vishay Semiconductor Opto Division

VISHAY. RoHS cawmm moss" FREE QREEN 5.1m 22529 www.vishay.com/doc?99912 \RR@wshay.cum www.mshay.com/doc791000
New VSOP383..
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Rev. 1.0, 17-Dec-15 1Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Preamplifier Circuit for IR Remote Control
(valid July 2016 onwards)
MECHANICAL DATA
Pinning:
1, 4, 5 = N.C., 2 = VS, 3 = OUT, 6, 8 = GND, 7 = IN
FEATURES
Narrow bandpassfilter for all common carrier
frequencies
High immunity against DC light
• Intelligent AGC to suppress disturbance from
fluorescent lamps and CRTs
Low power consumption
Wide supply voltage range
High immunity against ripple on the supply voltage
Output active low
IC manufactured in CMOS technology
Small QFN package with 2 mm width
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
The VSOP383.. is designed for use in an IR receiver
application together with a photo pin diode. It is a
sophisticated receiver concept that is very sensitive to data
signals and compatible with the most common data formats
for IR remote control. On the other hand it is immune to DC
current caused by DC light sources such as tungsten bulbs.
The disturbance signal of fluorescent lamps is suppressed;
there are no unwanted pulses at the output.
BLOCK DIAGRAM (simplified)
Vishay recommends using a photodiode with at least
2.3 mm2 area. The connection between the photodiode and
pin 7 should be kept as short as possible and carefully
shielded to prevent noise coupling.
APPLICATION CIRCUIT
22529
22529
PARTS TABLE
AGC NOISY ENVIRONMENTS AND SHORT BURSTS (AGC3)
Carrier
frequency
36 kHz VSOP38336 (1)
38 kHz VSOP38338 (2)(3)(4)(5)
Package VSOP
Pinning 1, 4, 5 = N.C., 2 = VS, 3 = OUT, 6, 8 = GND, 7 = IN
Dimensions (mm) 2.0 W x 2.0 H x 0.76 D
Mounting SMD
Application Remote control
Best remote control code (1) MCIR (2) Mitsubishi (3) RECS-80 Code (4) r-map (5) XMP-1, XMP-2
+ VS
Output,
to μC
GND
Input, from
photodiode
BiasControlled
gain
amplifier
Automatic
gain
control
Band-
pass-
filter
33 kΩ
Automatic
threshold
control Inte-
grator
21536-2
21537-4
The RC filter is optional to improve the EOS robustness
and the immunity to supply voltage ripple. We recommend
to keep the distance between the photodiode and the input
of the VSOP383.. as short as possible.
Microcontroller
or other logic
to decode the
IR signal
100 Ω
0.22 μF
VS = 2.5 V
to 5.5 V
0 V
VSOP383..
VS
GND
IN OUT
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New VSOP383..
www.vishay.com Vishay Semiconductors
Rev. 1.0, 17-Dec-15 2Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
Fig. 1 - Testsignal
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Supply voltage Pin 2 VS-0.3 to +6 V
Supply current Pin 2 IS3mA
Output voltage Pin 3 VO-0.3 to (VS + 0.3) V
Output sink current Pin 3 IO5mA
Power dissipation Tamb 85 °C Ptot 10 mW
Operating temperature range Tamb -25 to +85 °C
Storage temperature range Tstg -25 to +85 °C
ESD stress, HBM Pin 2, pin 3, MIL-STD-883C VESD 2000 V
Pin 7, MIL-STD-883C VESD 500 V
ESD stress, MM Pin 2, pin 3, MIL-STD-883C VESD 200 V
Pin 7, MIL-STD-883C VESD 100 V
ELECTRICAL CHARACTERISTICS (Tamb = -30 °C to +85 °C)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Supply voltage VS2.5 - 5.5 V
Supply current (pin 2) IIN = 0, VS = 5 V IS0.27 0.35 0.45 mA
Output voltage low (pin 3) IOL = 2 mA VOL - - 100 mV
Output voltage high (pin 3) IOL = 0 VOH VS - 0.25 - - V
Internal pull up resistor
(pin 2, pin 3) RPU -33-kΩ
Max. input DC current VIN > 0 IIN-DCmax. 400 - - μA
Min. signal detection current IIN-DC = 0, fC = fBPF I
IN-min. - 400 800 pA
IIN-DC = 100 μA, fC = fBPF I
IN-min. - 5 10 nA
Output pulse width
IIN-DC = 0, fC = fBPF,
IIN = 0.8 nA to 50 μA,
testsignal see fig. 1, BER 2%
tpo tpi - 6/f0tpi tpi + 6/f0μs
Accuracy of bandpass center
frequency Tamb = + 25 °C fBPF f0 - 4 % f0f0 + 4 % kHz
Bandwidth of bandpassfilter - 3 dB, f0 = 38 kHz B - 3.8 - kHz
burst length tpI
output pulse width tpo
IIN
VOUT
one carrier cycle 1/fC
burst length of input signal tpi
output pulse width tpo
IIN
VOUT
21538
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New VSOP383..
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Rev. 1.0, 17-Dec-15 3Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (Tamb = 25 °C, VS = 3.3 V, unless otherwise specified)
Fig. 2 - Output Pulse Diagram
Fig. 3 - Sensitivity vs. DC Input Current
Fig. 4 - Bandpassfilter Characteristic
Fig. 5 - Suppression of Ripple on Supply Voltage
Fig. 6 - Sensitivity vs. Temperature
Fig. 7 - Maximum Envelope Duty Cycle
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.1 10 1000 100 000
T
OFF
t
po
Testsignal: t
pi
= 0.6 ms
burst repetition time = 1.2 ms
21539
Output Pulse Width (ms)
I
IN
- Input Current (nA)
0.1
1
10
0.1 1 10 100 1000
21541
IIN-min. - Minimum Detection Current (nA)
DC Input Current (µA)
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
33 35 37 39 41 43
VSOP38338
Frequency (kHz)
I
IN-min.
- Minimum Detection Current (nA)
0
0.5
1
1.5
2
2.5
3
1 10 100 1000
f = 100 Hz
f = 10 kHz
f = fo
21540
IIN-min. - Minimum Detection Current (nA)
ΔVS - AC Ripple on VS (mVPP)
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
- 30 - 10 10 30 50 70 90
I
IN-min.
- Minimum Detection Current (nA)
T
amb
- Ambient Temperature (°C)
21542
Maximum Envelope Duty Cycle
N - Burstlength (Carrier Cycles)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
020406080100
VSOP383..
IIN = 5 nA
— VISHAY. V % :qu WW1 4H?
New VSOP383..
www.vishay.com Vishay Semiconductors
Rev. 1.0, 17-Dec-15 4Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
Proposed hole layout
from component side
(for reference only)
technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.1
Drawing-No.: 6.550-5314.01-4
Issue: 3; 07.12.15
0.76 ± 0.05
0.2 ref.
2
2
0.5 typ. (6 x)
(8 x)
0.25 ± 0.05
(8 x)
0.3 ± 0.1
0.2 min.
0.9 ± 0.15
1.6 ± 0.15
0.25 x 45°
10:1
0.35 (8 x)
(8 x)
0.65
1.3
0.5 (6 x)
1. Coplanarity (0.1 mm)
applies to the exposed
pad as well as the
exposed terminals.
2. Package dimension does not
include mold flash, protrusions,
burrs or metal smearing.
1
Pinning:
1. n.c.
2. VS
3. Out
4. n.c.
5. n.c.
6. GND
7. IN
8. GND
3338
YWW
For example 38 kHz
Marking area
PIN 1 indicator
Chamfered corner
PIN 1 indicator
Exposed pad
0.1
4
85
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New VSOP383..
www.vishay.com Vishay Semiconductors
Rev. 1.0, 17-Dec-15 5Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
Finish soldering within 3 s
Handle products only after the temperature has cooled
off.
VISHAY LEAD (PB)-FREE REFLOW SOLDER PROFILE
0
50
100
150
200
250
300
0 50 100 150 200 250 300
t (s)
T (°C)
255 °C
240 °C
245 °
max. 260 °C
max. 120 s max. 100 s
217 °C
max. 20 s
max. Ramp Up 3 °C/s max. Ramp Down 6 °C/s
max. 2 cycles allowed
19800
VISHAY. AiB 0 3mm ha I 1.75m % 3‘ ; ‘t ,g L5. N t N «5‘3" N 1: a cu .. cu 0:1 mm 3 ~ 3 E .9 A — E g 3. ‘03 B—at * Measured from tenferline of sprotkef hale f0 Eenferlme of pocket \RR@wshay com www.v\shay.com/doc?91000
New VSOP383..
www.vishay.com Vishay Semiconductors
Rev. 1.0, 17-Dec-15 6Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING VERSION VSOP DIMENSIONS in millimeters
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New VSOP383..
www.vishay.com Vishay Semiconductors
Rev. 1.0, 17-Dec-15 7Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
REEL DIMENSIONS in millimeters
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
REEL
REEL SIZE (inch) REEL WIDTH (mm) TRAILER LENGTH (mm) LEADER LENGTH (mm) QANTITY PER REEL
7 8.4 160 400 3000
22610
Reel
Size
Reel Width
VISHAY SEMICONDUCTOR GMBH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITTING ABBREVIATION LENGTH
Item-description - 18
Item-number INO 8
Selection-code SEL 3
LOT-/serial-number BATCH 10
Data-code COD 3 (YWW)
Plant-code PTC 2
Quantity QTY 8
Accepted by ACC -
Packed by PCK -
Mixed code indicator MIXED CODE -
Origin xxxxxxx+ Company logo
LONG BAR CODE TOP TYPE LENGTH
Item-number N 8
Plant-code N 2
Sequence-number X 3
Quantity N 8
Total length - 21
SHORT BAR CODE BOTTOM TYPE LENGTH
Selection-code X 3
Data-code N 3
Batch-number X 10
Filter - 1
Total length - 17
VISHAY. VIMHIH||NHIHIHI‘II‘IIWIIWIWHIHIHIIIHIIIHHIIMHIIIHID “if? MINE|\||WI!|1|I|\|\II|\I\IW\lll‘llfll‘lHWl‘lIIHIIIHIIHIIHIHWII WIN”!\IIIHHIIIHll!IllIIW||1|\|lMME|\|H1\|\\IIMII|\\IIH MHWIIWII "’ \RR@vishay‘com www.vishay.com/aoc791000
New VSOP383..
www.vishay.com Vishay Semiconductors
Rev. 1.0, 17-Dec-15 8Document Number: 82748
For technical questions, contact: IRR@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
16962
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