ESP32-S3-WROOM-1(U) Datasheet

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ESP32S3WROOM1
ESP32S3WROOM1U
Datasheet
2.4 GHz WiFi (802.11 b/g/n) and Bluetooth®5 (LE) module
Built around ESP32S3 series of SoCs, Xtensa®dualcore 32bit LX7 microprocessor
Flash up to 16 MB, PSRAM up to 8 MB
36 GPIOs, rich set of peripherals
Onboard PCB antenna or external antenna connector
ESP32S3WROOM1 ESP32S3WROOM1U
Pre-release v0.5.1
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1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_datasheet_en.pdf
1.1 Features
CPU and OnChip Memory
ESP32-S3 series of SoCs embedded, Xtensa®
dual-core 32-bit LX7 microprocessor, up to 240
MHz
384 KB ROM
512 KB SRAM
16 KB SRAM in RTC
Up to 8 MB PSRAM
WiFi
802.11 b/g/n
Bit rate: 802.11n up to 150 Mbps
A-MPDU and A-MSDU aggregation
0.4 µs guard interval support
Center frequency range of operating channel:
2412 ~2484 MHz
Bluetooth
Bluetooth LE: Bluetooth 5, Bluetooth mesh
2 Mbps PHY
Long range mode
Advertising extensions
Multiple advertisement sets
Channel selection algorithm #2
Peripherals
GPIO, SPI, LCD interface, Camera interface,
UART, I2C, I2S, remote control, pulse counter,
LED PWM, USB 1.1 OTG, USB Serial/JTAG
controller, MCPWM, SDIO host, GDMA, TWAI®
controller (compatible with ISO 11898-1), ADC,
touch sensor, temperature sensor, timers and
watchdogs
Integrated Components on Module
40 MHz crystal oscillator
Up to 16 MB SPI flash
Antenna Options
On-board PCB antenna (ESP32-S3-WROOM-1)
External antenna via a connector
(ESP32-S3-WROOM-1U)
Operating Conditions
Operating voltage/Power supply: 3.0 ~3.6 V
Operating ambient temperature:
85 °C version: –40 ~85 °C
105 °C version: –40 ~105 °C
Dimensions: See Table 1
1.2 Description
ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U are two powerful, generic Wi-Fi + Bluetooth LE MCU
modules that have a rich set of peripherals. They provide acceleration for neural network computing and signal
processing workloads. They are an ideal choice for a wide variety of application scenarios related to AI and
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Artificial Intelligence of Things (AIoT), such as wake word detection, speech commands recognition, face
detection and recognition, smart home, smart appliances, smart control panel, smart speaker, etc.
ESP32-S3-WROOM-1 comes with a PCB antenna. ESP32-S3-WROOM-1U comes with an external antenna
connector. A wide selection of module variants are available for customers as shown in Table 1. All the module
variants operate at –40 ~85 °C ambient temperature, except for ESP32-S3-WROOM-1-H4 and
ESP32-S3-WROOM-1U-H4 that operate at –40 ~105 °C ambient temperature.
Table 1: Ordering Information
Ordering Code Chip Embedded Flash (MB) PSRAM (MB) Dimensions (mm)
ESP32-S3-WROOM-1-N4 ESP32-S3 4 0
18 × 25.5 × 3.1
ESP32-S3-WROOM-1-N8 ESP32-S3 8 0
ESP32-S3-WROOM-1-N16 ESP32-S3 16 0
ESP32-S3-WROOM-1-H4 (105 °C) ESP32-S3 4 0
ESP32-S3-WROOM-1-N4R2 ESP32-S3R2 4 2 (Quad SPI)
ESP32-S3-WROOM-1-N8R2 ESP32-S3R2 8 2 (Quad SPI)
ESP32-S3-WROOM-1-N16R2 ESP32-S3R2 16 2 (Quad SPI)
ESP32-S3-WROOM-1-N4R8 ESP32-S3R8 4 8 (Octal SPI)
ESP32-S3-WROOM-1-N8R8 ESP32-S3R8 8 8 (Octal SPI)
ESP32-S3-WROOM-1-N16R8 ESP32-S3R8 16 8 (Octal SPI)
ESP32-S3-WROOM-1U-N4 ESP32-S3 4 0
18 × 19.2 × 3.2
ESP32-S3-WROOM-1U-N8 ESP32-S3 8 0
ESP32-S3-WROOM-1U-N16 ESP32-S3 16 0
ESP32-S3-WROOM-1U-H4 (105 °C) ESP32-S3 4 0
ESP32-S3-WROOM-1U-N4R2 ESP32-S3R2 4 2 (Quad SPI)
ESP32-S3-WROOM-1U-N8R2 ESP32-S3R2 8 2 (Quad SPI)
ESP32-S3-WROOM-1U-N16R2 ESP32-S3R2 16 2 (Quad SPI)
ESP32-S3-WROOM-1U-N4R8 ESP32-S3R8 4 8 (Octal SPI)
ESP32-S3-WROOM-1U-N8R8 ESP32-S3R8 8 8 (Octal SPI)
ESP32-S3-WROOM-1U-N16R8 ESP32-S3R8 16 8 (Octal SPI)
At the core of the modules is an ESP32-S3 series of SoC *, an Xtensa®32-bit LX7 CPU that operates at up to
240 MHz. You can power off the CPU and make use of the low-power co-processor to constantly monitor the
peripherals for changes or crossing of thresholds.
ESP32-S3 integrates a rich set of peripherals including SPI, LCD, Camera interface, UART, I2C, I2S, remote
control, pulse counter, LED PWM, USB Serial/JTAG controller, MCPWM, SDIO host, GDMA, TWAI®controller
(compatible with ISO 11898-1), ADC, touch sensor, temperature sensor, timers and watchdogs, as well as up to
45 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG) interface to enable USB
communication.
Note:
* For more information on ESP32-S3 series of SoCs, please refer to ESP32-S3 Series Datasheet.
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1.3 Applications
Generic Low-power IoT Sensor Hub
Generic Low-power IoT Data Loggers
Cameras for Video Streaming
Over-the-top (OTT) Devices
USB Devices
Speech Recognition
Image Recognition
Mesh Network
Home Automation
Smart Building
Industrial Automation
Smart Agriculture
Audio Applications
Health Care Applications
Wi-Fi-enabled Toys
Wearable Electronics
Retail & Catering Applications
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Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 2
1.3 Applications 4
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 9
3.3 Strapping Pins 11
4 Electrical Characteristics 14
4.1 Absolute Maximum Ratings 14
4.2 Recommended Operating Conditions 14
4.3 DC Characteristics (3.3 V, 25 °C) 14
4.4 Current Consumption Characteristics 15
4.5 Wi-Fi RF Characteristics 15
4.5.1 Wi-Fi RF Standards 15
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 16
4.5.3 Wi-Fi RF Receiver (RX) Specifications 17
4.6 Bluetooth LE Radio 18
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 18
4.6.2 Bluetooth LE RF Receiver (RX) Specifications 20
5 Module Schematics 23
6 Peripheral Schematics 25
7 Physical Dimensions and PCB Land Pattern 26
7.1 Physical Dimensions 26
7.2 Recommended PCB Land Pattern 27
7.3 Dimensions of External Antenna Connector 29
8 Product Handling 30
8.1 Storage Conditions 30
8.2 Electrostatic Discharge (ESD) 30
8.3 Reflow Profile 30
9 Related Documentation and Resources 31
Revision History 32
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List of Tables
List of Tables
1 Ordering Information 3
2 Pin Definitions 10
3 Strapping Pins 12
4 Parameter Descriptions of Setup and Hold Times for the Strapping Pin 13
5 Absolute Maximum Ratings 14
6 Recommended Operating Conditions 14
7 DC Characteristics (3.3 V, 25 °C) 14
8 Current Consumption Depending on RF Modes 15
9 Current Consumption Depending on Work Modes 15
10 Wi-Fi RF Standards 16
11 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 16
12 TX EVM Test 16
13 RX Sensitivity 17
14 Maximum RX Level 17
15 RX Adjacent Channel Rejection 18
16 Bluetooth LE Frequency 18
17 Transmitter Characteristics - Bluetooth LE 1 Mbps 18
18 Transmitter Characteristics - Bluetooth LE 2 Mbps 19
19 Transmitter Characteristics - Bluetooth LE 125 Kbps 19
20 Transmitter Characteristics - Bluetooth LE 500 Kbps 19
21 Receiver Characteristics - Bluetooth LE 1 Mbps 20
22 Receiver Characteristics - Bluetooth LE 2 Mbps 20
23 Receiver Characteristics - Bluetooth LE 125 Kbps 21
24 Receiver Characteristics - Bluetooth LE 500 Kbps 21
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List of Figures
List of Figures
1 ESP32-S3-WROOM-1 Block Diagram 8
2 ESP32-S3-WROOM-1U Block Diagram 8
3 Pin Layout (Top View) 9
4 Setup and Hold Times for the Strapping Pin 13
5 ESP32-S3-WROOM-1 Schematics 23
6 ESP32-S3-WROOM-1U Schematics 24
7 Peripheral Schematics 25
8 ESP32-S3-WROOM-1 Physical Dimensions 26
9 ESP32-S3-WROOM-1U Physical Dimensions 26
10 ESP32-S3-WROOM-1 Recommended PCB Land Pattern 27
11 ESP32-S3-WROOM-1U Recommended PCB Land Pattern 28
12 Dimensions of External Antenna Connector 29
13 Reflow Profile 30
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2 Block Diagram
2 Block Diagram
ESP32-S3
ESP32-S3R2
ESP32-S3R8
RF Matching
40 MHz
Crystal
3V3
ESP32-S3-WROOM-1
EN GPIOs
Antenna
QSPI Flash
SPICS0
SPICLK
SPID
SPIQ
SPIHD
SPIWP
VDD_SPI
PSRAM(opt.)
(QSPI/OSPI)
Figure 1: ESP32S3WROOM1 Block Diagram
ESP32-S3
ESP32-S3R2
ESP32-S3R8
RF Matching
40 MHz
Crystal
3V3
ESP32-S3-WROOM-1U
EN GPIOs
Antenna
QSPI Flash
SPICS0
SPICLK
SPID
SPIQ
SPIHD
SPIWP
VDD_SPI
PSRAM(opt.)
(QSPI/OSPI)
Figure 2: ESP32S3WROOM1U Block Diagram
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
The pin diagram is applicable for ESP32-S3-WROOM-1 and ESP32-S3-WROOM-1U, but the latter has no
keepout zone.
GND
3V3
EN
IO4
IO5
IO6
IO7
IO20
40
39
38
37
36
35
34
33
32
31
30
29
28
27
GND
IO1
IO2
TXD0
RXD0
IO42
IO41
IO40
IO39
IO38
IO37
IO36
IO35
IO0
41
GND
Keepout Zone
GND
GND GND GND
GND
GNDGNDGND
18
19
20
IO10
IO11
IO12
21
22
23
IO13
IO14
IO21
15
16
17
IO3
IO46
IO9
24
25
26
IO47
IO48
IO45
1
2
3
4
5
6
7
8
9
10
11
12
13
14
IO15
IO16
IO17
IO18
IO8
IO19
Figure 3: Pin Layout (Top View)
3.2 Pin Description
The module has 41 pins. See pin definitions in Table 2.
For explanations of pin names and function names, as well as configurations of peripheral pins, please refer to
ESP32-S3 Series Datasheet.
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3 Pin Definitions
Table 2: Pin Definitions
Name No. Type aFunction
GND 1 P GND
3V3 2 P Power supply
EN 3 I
High: on, enables the chip.
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO4 4 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5 5 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6 6 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
IO7 7 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO15 8 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 9 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 10 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
IO18 11 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
IO19 13 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 14 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO3 15 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO46 16 I/O/T GPIO46
IO9 17 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
IO10 18 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4,
SUBSPICS0
IO11 19 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5,
SUBSPID
IO12 20 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6,
SUBSPICLK
IO13 21 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7,
SUBSPIQ
IO14 22 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS,
SUBSPIWP
IO21 23 I/O/T RTC_GPIO21, GPIO21
IO47 24 I/O/T SPICLK_P_DIFF,GPIO47, SUBSPICLK_P_DIFF
IO48 25 I/O/T SPICLK_N_DIFF,GPIO48, SUBSPICLK_N_DIFF
IO45 26 I/O/T GPIO45
IO0 27 I/O/T RTC_GPIO0, GPIO0
IO35 b28 I/O/T SPIIO6, GPIO35, FSPID, SUBSPID
IO36 b29 I/O/T SPIIO7, GPIO36, FSPICLK, SUBSPICLK
IO37 b30 I/O/T SPIDQS, GPIO37, FSPIQ, SUBSPIQ
IO38 31 I/O/T GPIO38, FSPIWP, SUBSPIWP
IO39 32 I/O/T MTCK, GPIO39, CLK_OUT3, SUBSPICS1
IO40 33 I/O/T MTDO, GPIO40, CLK_OUT2
IO41 34 I/O/T MTDI, GPIO41, CLK_OUT1
Cont’d on next page
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Table 2 – cont’d from previous page
Name No. Type aFunction
IO42 35 I/O/T MTMS, GPIO42
RXD0 36 I/O/T U0RXD, GPIO44, CLK_OUT2
TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1
IO2 38 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO1 39 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
GND 40 P GND
EPAD 41 P GND
aP: power supply; I: input; O: output; T: high impedance. Pin functions in bold font are the default
pin functions.
bIn module variants that have embedded OSPI PSRAM, i.e., that embed ESP32-S3R8, pins IO35,
IO36, and IO37 connect to the OSPI PSRAM and are not available for other uses.
3.3 Strapping Pins
Note:
The content below is excerpted from Section Strapping Pins in ESP32-S3 Series Datasheet. For the strapping pin map-
ping between the chip and modules, please refer to Chapter 5Module Schematics.
ESP32-S3 has four strapping pins:
• GPIO0
• GPIO45
• GPIO46
• GPIO3
Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.
GPIO0, GPIO45 and GPIO46 are connected to the chip’s internal weak pull-up/pull-down during the chip reset.
Consequently, if they are unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of these strapping pins.
GPIO3 is floating by default. When EFUSE_STRAP_JTAG_SEL is set, the strapping value of GPIO3 determines
the source of the JTAG signal inside the CPU. In this case, the strapping value is controlled by the external circuit
that cannot be in a high impedance state.
When GPIO3 strapping value is 0, the JTAG signal comes from the on-chip JTAG pin.
When GPIO3 strapping value is 1, the JTAG signal comes from the USB Serial/JTAG controller.
When EFUSE_STRAP_JTAG_SEL is 0, the JTAG signal comes from the USB Serial/JTAG controller.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S3.
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3 Pin Definitions
After reset, the strapping pins work as normal-function pins.
Refer to Table 3for a detailed configuration of the strapping pins.
Table 3: Strapping Pins
VDD_SPI Voltage 1
Pin Default 3.3 V 1.8 V
GPIO45 Pull-down 0 1
Booting Mode 2
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO46 Pull-down Don’t care 0
Enabling/Disabling ROM Messages Print During Booting 3 4
Pin Default Enabled Disabled
GPIO46 Pull-down See the fourth note See the fourth note
JTAG Signal Selection
Pin Default EFUSE_STRAP_JTAG_SEL=0 EFUSE_STRAP_JTAG_SEL=1
GPIO3 N/A USB Serial/JTAG
Strapping value:
0: PAD JTAG 5
1: USB Serial/JTAG 5
Note:
1. The functionality of strapping pin GPIO45 to select VDD_SPI voltage may be disabled by setting VDD_SPI_FORCE
eFuse to 1. In such a case the voltage is selected with eFuse bit VDD_SPI_TIEH.
2. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.
3. ROM boot messages can be printed over U0TXD (by default) or GPIO17, depending on the eFuse bit.
4. When both EFUSE_DIS_USB_DEVICE and USB_DIS_USB are 0, ROM boot messages will be printed to the
USB Serial/JTAG controller. Otherwise, the messages will be printed to UART, controlled by GPIO46 and eFuse
UART_PRINT_CONTROL. Specifically, when eFuse UART_PRINT_CONTROL value is:
0, print is normal during boot and not controlled by GPIO46.
1 and GPIO46 is 0, print is normal during boot; but if GPIO46 is 1, print is disabled.
2 and GPIO46 is 0, print is disabled; but if GPIO46 is 1, print is normal.
3, print is disabled and not controlled by GPIO46.
5. PAD JTAG: JTAG signal comes from the on-chip JTAG pin;
USB Serial/JTAG: JTAG signal comes from the USB Serial/JTAG controller.
Figure 4shows the setup and hold times for the strapping pin before and after the CHIP_PU signal goes high.
Details about the parameters are listed in Table 4.
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3 Pin Definitions
CHIP_PU
tHD
tSU
Strapping pin
VIL_nRST
VIH
Figure 4: Setup and Hold Times for the Strapping Pin
Table 4: Parameter Descriptions of Setup and Hold Times for the Strapping Pin
Parameter Description Min (µs)
tSU Setup time before CHIP_PU goes from low to high 0
tHD Hold time after CHIP_PU goes high 3
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4 Electrical Characteristics
4 Electrical Characteristics
The values presented in this section are preliminary and may change with the final release of this
datasheet.
4.1 Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 A
TAOperating ambient temperature 85 °C version –40 — 85 °C
105 °C version 105
Humidity Humidity condition 85 %RH
4.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance 2 pF
VIH High-level input voltage 0.75 × VDD1— VDD1
+ 0.3 V
VIL Low-level input voltage –0.3 0.25 × VDD1V
IIH High-level input current 50 nA
IIL Low-level input current 50 nA
VOH 2High-level output voltage 0.8 × VDD1— — V
VOL2Low-level output voltage 0.1 × VDD1V
IOH
High-level source current (VDD1
= 3.3 V, VOH >=
2.64 V, PAD_DRIVER = 3) 40 — mA
IOL
Low-level sink current (VDD1= 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3) 28 — mA
Cont’d on next page
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4 Electrical Characteristics
Table 7 – cont’d from previous page
Symbol Parameter Min Typ Max Unit
RP U Internal weak pull-up resistor 45 k
RP D Internal weak pull-down resistor 45 k
VIH_nRST
Chip reset release voltage (EN voltage is within
the specified range) 0.75 × VDD1— VDD1
+ 0.3 V
VIL_nRST
Chip reset voltage (EN voltage is within the
specified range) –0.3 0.25 × VDD1V
1VDD is the I/O voltage for pins of a particular power domain.
2VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics
Owing to the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management
in ESP32-S3 Series Datasheet.
Table 8: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)
Active (RF working)
TX
802.11b, 1 Mbps, @20.5 dBm 330
802.11g, 54 Mbps, @18 dBm 280
802.11n, HT20, MCS7, @17.5 dBm 273
802.11n, HT40, MCS7, @17 dBm 278
RX 802.11b/g/n, HT20 97
802.11n, HT40 100
1The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2The current consumption figures in RX mode are for cases where the peripherals are disabled
and the CPU idle.
Note that the data in Table 9only applies to the module variants that embed ESP32-S3.
Table 9: Current Consumption Depending on Work Modes
Work mode Description Typ Unit
Light-sleep — 240 µA
Deep-sleep RTC memory and RTC peripherals are powered on. 8 µA
Hibernation RTC memory is powered on. RTC peripherals are powered off. 7 µA
Power off CHIP_PU is set to low level. The chip is powered off. 1 µA
4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards
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4 Electrical Characteristics
Table 10: WiFi RF Standards
Name Description
Center frequency range of operating channel 12412 ~2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
Data rate 20 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna via the connector
1Device should operate in the center frequency range allocated by regional regulatory authorities. Target
center frequency range is configurable by software.
2For the modules that use external antennas, the output impedance is 50 . For other modules without
external antennas, the output impedance is irrelevant.
4.5.2 WiFi RF Transmitter (TX) Specifications
Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 11.
Table 11: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps 20.5
802.11b, 11 Mbps 20.5
802.11g, 6 Mbps 20.0
802.11g, 54 Mbps 18.0
802.11n, HT20, MCS0 19.0
802.11n, HT20, MCS7 17.5
802.11n, HT40, MCS0 18.5
802.11n, HT40, MCS7 17.0
Table 12: TX EVM Test
Min Typ SL1
Rate (dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm –24.5 –10
802.11b, 11 Mbps, @20.5 dBm –24.5 –10
802.11g, 6 Mbps, @20 dBm –21.5 –5
802.11g, 54 Mbps, @18 dBm –27.5 –25
802.11n, HT20, MCS0, @19 dBm –22.0 –5
802.11n, HT20, MCS7, @17.5 dBm –29.2 –27
802.11n, HT40, MCS0, @18.5 dBm –22.0 –5
802.11n, HT40, MCS7, @17 dBm –28.0 –27
1SL stands for standard limit value.
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4.5.3 WiFi RF Receiver (RX) Specifications
Table 13: RX Sensitivity
Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps –98.4
802.11b, 2 Mbps –95.3
802.11b, 5.5 Mbps –92.8
802.11b, 11 Mbps –88.5
802.11g, 6 Mbps –93.0
802.11g, 9 Mbps –92.0
802.11g, 12 Mbps –90.8
802.11g, 18 Mbps –88.5
802.11g, 24 Mbps –85.5
802.11g, 36 Mbps –82.0
802.11g, 48 Mbps –78.0
802.11g, 54 Mbps –76.2
802.11n, HT20, MCS0 –92.6
802.11n, HT20, MCS1 –90.6
802.11n, HT20, MCS2 –88.0
802.11n, HT20, MCS3 –84.8
802.11n, HT20, MCS4 –81.6
802.11n, HT20, MCS5 –77.4
802.11n, HT20, MCS6 –75.2
802.11n, HT20, MCS7 –74.0
802.11n, HT40, MCS0 –90.0
802.11n, HT40, MCS1 –87.6
802.11n, HT40, MCS2 –84.8
802.11n, HT40, MCS3 –81.8
802.11n, HT40, MCS4 –78.4
802.11n, HT40, MCS5 –74.2
802.11n, HT40, MCS6 –72.2
802.11n, HT40, MCS7 –71.0
Table 14: Maximum RX Level
Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps 5
802.11b, 11 Mbps 5
802.11g, 6 Mbps 5
802.11g, 54 Mbps 0
802.11n, HT20, MCS0 5
802.11n, HT20, MCS7 0
Cont’d on next page
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Table 14 – cont’d from previous page
Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11n, HT40, MCS0 5
802.11n, HT40, MCS7 0
Table 15: RX Adjacent Channel Rejection
Min Typ Max
Rate (dB) (dB) (dB)
802.11b, 1 Mbps 35
802.11b, 11 Mbps 35
802.11g, 6 Mbps 31
802.11g, 54 Mbps 14
802.11n, HT20, MCS0 31
802.11n, HT20, MCS7 13
802.11n, HT40, MCS0 19
802.11n, HT40, MCS7 8
4.6 Bluetooth LE Radio
Table 16: Bluetooth LE Frequency
Min Typ Max
Parameter (MHz) (MHz) (MHz)
Center frequency of operating channel 2402 2480
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 17: Transmitter Characteristics  Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit
RF transmit power RF power control range –25.00 0 20.00 dBm
Gain control step 3.00 dB
Carrier frequency offset and drift
Max |fn|n=0,1,2, ..k 15.00 — kHz
Max |f0fn| 3.00 — kHz
Max |fnfn5| 1.80 — kHz
|f1f0| 1.00 — kHz
Modulation characteristics
f1avg 250.00 — kHz
Min f2max (for at least
99.9% of all f2max) 190.00 — kHz
f2avg/f1avg 0.86 — —
In-band spurious emissions
±2 MHz offset –36.20 dBm
±3 MHz offset –41.20 dBm
Cont’d on next page
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Table 17 – cont’d from previous page
Parameter Description Min Typ Max Unit
>±3 MHz offset –44.60 dBm
Table 18: Transmitter Characteristics  Bluetooth LE 2 Mbps
Parameter Description Min Typ Max Unit
RF transmit power RF power control range –25.00 0 20.00 dBm
Gain control step 3.00 dB
Carrier frequency offset and drift
Max |fn|n=0,1,2, ..k 15.00 — kHz
Max |f0fn| 2.50 — kHz
Max |fnfn5| 1.80 — kHz
|f1f0| 1.00 — kHz
Modulation characteristics
f1avg 498.00 — kHz
Min f2max (for at least
99.9% of all f2max) 420.00 — kHz
f2avg/f1avg 0.93 — —
In-band spurious emissions
±2 MHz offset –43.70 dBm
±3 MHz offset –45.80 dBm
>±3 MHz offset –47.00 dBm
Table 19: Transmitter Characteristics  Bluetooth LE 125 Kbps
Parameter Description Min Typ Max Unit
RF transmit power RF power control range –25.00 0 20.00 dBm
Gain control step 3.00 dB
Carrier frequency offset and drift
Max |fn|n=0,1,2, ..k 15.00 — kHz
Max |f0fn| 0.90 — kHz
|fnfn3| 0.40 — kHz
|f0f3| 0.65 — kHz
Modulation characteristics
f1avg 250.00 — kHz
Min f1max (for at least
99.9% of allf2max) 210.00 — kHz
In-band spurious emissions
±2 MHz offset –36.20 dBm
±3 MHz offset –41.20 dBm
>±3 MHz offset –44.60 dBm
Table 20: Transmitter Characteristics  Bluetooth LE 500 Kbps
Parameter Description Min Typ Max Unit
RF transmit power RF power control range –25.00 0 20.00 dBm
Gain control step 3.00 dB
Carrier frequency offset and drift
Max |fn|n=0,1,2, ..k 15.00 — kHz
Max |f0fn| 0.90 — kHz
Cont’d on next page
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4 Electrical Characteristics
Table 20 – cont’d from previous page
Parameter Description Min Typ Max Unit
|fnfn3| 0.46 — kHz
|f0f3| 0.80 — kHz
Modulation characteristics
f2avg 210.00 — kHz
Min f2max (for at least
99.9% of all f2max) 174.00 — kHz
In-band spurious emissions
±2 MHz offset –36.20 dBm
±3 MHz offset –41.20 dBm
>±3 MHz offset –44.60 dBm
4.6.2 Bluetooth LE RF Receiver (RX) Specifications
Table 21: Receiver Characteristics  Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER –97 dBm
Maximum received signal @30.8% PER 5 dBm
Co-channel C/I F = F0 MHz 9 dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz –3 dB
F = F0 – 1 MHz –3 dB
F = F0 + 2 MHz –28 dB
F = F0 – 2 MHz –36 dB
F = F0 + 3 MHz –33 dB
F = F0 – 3 MHz –35 dB
F>F0 + 3 MHz –31 dB
F>F0 – 3 MHz –38 dB
Image frequency –31 dB
Adjacent channel to image frequency F = Fimage + 1 MHz –39 dB
F = Fimage – 1 MHz –33 dB
Out-of-band blocking performance
30 MHz ~2000 MHz –5 dBm
2003 MHz ~2399 MHz –19 dBm
2484 MHz ~2997 MHz –17 dBm
3000 MHz ~12.75 GHz –5 dBm
Intermodulation –26 — dBm
Table 22: Receiver Characteristics  Bluetooth LE 2 Mbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER –93 dBm
Maximum received signal @30.8% PER 3 dBm
Co-channel C/I F = F0 MHz 11 dB
Adjacent channel selectivity C/I
F = F0 + 2 MHz –7 dB
F = F0 – 2 MHz –6 dB
Cont’d on next page
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Table 22 – cont’d from previous page
Parameter Description Min Typ Max Unit
F = F0 + 4 MHz –29 dB
F = F0 – 4 MHz –35 dB
F = F0 + 6 MHz –39 dB
F = F0 – 6 MHz –39 dB
F>F0 + 6 MHz –42 dB
F>F0 – 6 MHz –42 dB
Image frequency –29 dB
Adjacent channel to image frequency F = Fimage + 2 MHz –39 dB
F = Fimage – 2 MHz –7 dB
Out-of-band blocking performance
30 MHz ~2000 MHz –5 dBm
2003 MHz ~2399 MHz –29 dBm
2484 MHz ~2997 MHz –26 dBm
3000 MHz ~12.75 GHz –5 dBm
Intermodulation –29 — dBm
Table 23: Receiver Characteristics  Bluetooth LE 125 Kbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER –104.5 dBm
Maximum received signal @30.8% PER 5 dBm
Co-channel C/I F = F0 MHz 7 dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz –5 dB
F = F0 – 1 MHz –6 dB
F = F0 + 2 MHz –32 dB
F = F0 – 2 MHz –40 dB
F = F0 + 3 MHz –44 dB
F = F0 – 3 MHz –47 dB
F>F0 + 3 MHz –33 dB
F>F0 – 3 MHz –50 dB
Image frequency –33 dB
Adjacent channel to image frequency F=Fimage + 1 MHz –46 dB
F=Fimage – 1 MHz –44 dB
Table 24: Receiver Characteristics  Bluetooth LE 500 Kbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER –100.5 dBm
Maximum received signal @30.8% PER 5 dBm
Co-channel C/I F = F0 MHz 4 dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz –4 dB
F = F0 – 1 MHz –6 dB
F = F0 + 2 MHz –32 dB
Cont’d on next page
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Table 24 – cont’d from previous page
Parameter Description Min Typ Max Unit
F = F0 – 2 MHz –36 dB
F = F0 + 3 MHz –37 dB
F = F0 – 3 MHz –40 dB
F>F0 + 3 MHz –35 dB
F>F0 – 3 MHz –43 dB
Image frequency –35 dB
Adjacent channel to image frequency F=Fimage + 1 MHz –43 — dB
F=Fimage – 1 MHz –37 dB
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5 Module Schematics This is ihe reference desxgn of the moduie. vDDa: 4mm GPiOoé uufixu 4a; umxu 4mm ' E m m in; man: EM WW sanigggegaassg 7 o##,, ek"uH-, 7 >55” :5 ix 6ND “WES g as g em :3 6123;; Gama an was was WNW s 6:03: ‘37—‘ Gwen P‘ ”(VP 35 Emma 5%“er gwg We m 9 P‘ Rm SPiCLK WW 3: sin a sgm 31 s W PM", R13 M: WM, WJ—5fi H; m max/new w w 22 :5 Zfi 2a E P327 3 , , Eswazrszru em: Gm: Eswazrszka em “Ii—He Figure 5: ESP32-SS-WROOM-1 Schematics
PRELIMINARY
5 Module Schematics
5 Module Schematics
This is the reference design of the module.
Figure 5: ESP32S3WROOM1 Schematics
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Gm: l vooza m, The values of C1 and CA vary with the sale 71 or the crystal, The value at R4 vanes with the actual voma m hm, 5W5 5W5 um R: we unrxu a 5m swam 5er Vans: 5ND Emma E C“ C7 a c» EflfifiEERESQSESQ VDD“ W M W W a m‘ m a, l T I: i a aézww Gin 6RD 6RD 6RD gag-.033 p w E a; w a O‘ ’ i” mesa > 25:23; ——3 N , m cm m2 mm mm m cm 7 W w 5|?on A com Iran WID Gm spfé’lfi‘é :5 5er , 1l—Gwlma Gin em: can WWW Tkifi “1 SM) 33 We ‘5 m mu km H mm The values or (:11, L2 and (:12 5mm 2 New vary wllh the actual PCE board sprwp m R“ 1:“: Wu NC No component am e n 2 mm W ammmnawwov; m cuvuuispl §§§§§§gi§§§§§g F Eooaaewooéom W W ‘ mwn-movmv mm‘ ESPJZS3 ? , was: r" N NM NM Eswzzsaaz our: w ism m. as W §§ § §§§ EES u u u w u u u u w vDoa: Gm: ESPJZ s: meow u EPAD em: rm lo: mm Rxon ran on loan Gm: 41 vuuspr sPlcsa 1 M > m 5 spun 5 I swam cm W spun 5PM: 7 mom 3 stP Internal pulleup resistor (R1) for IOAS rs not populated in the module, as the flash in the module works at 3.3 V by default (output by VDD_SPI) Please make sure lO45 is Figure 6: ESPGZ—SS-WROOM-1 U Schematics not pulled high when the module is powered up by external circurt.
PRELIMINARY
5 Module Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
The values of C11, L2 and C12
vary with the actual PCB board.
The values of C1 and C4 vary with
the selection of the crystal.
The value of R4 varies with the actual
PCB board.
ESP32-S3-WROOM-1U(pin-out)
ESP32-S3R2
ESP32-S3
NC: No component.
ESP32-S3R8
SPICLK
SPICS0
SPIHD
SPID
SPIWP
SPIQ
SPICS0
LNA_INRF_ANT
GPIO39
GPIO41
GPIO42
U0RXD
GPIO46
GPIO45
U0TXD
SPICLK
GPIO48
SPID
SPIQ
SPIWP
SPIHD
GPIO21
GPIO20
GPIO19
GPIO18
GPIO17
GPIO16
GPIO15
GPIO14
GPIO13
GPIO12
GPIO11
GPIO10
GPIO9
GPIO8
GPIO7
GPIO6
GPIO5
GPIO4
GPIO3
GPIO2
GPIO1
GPIO0
CHIP_PU
GPIO38
GPIO37
GPIO36
GPIO35
GPIO47
GPIO40
CHIP_PU
GPIO4
GPIO5
GPIO6
GPIO7
GPIO15
GPIO16
GPIO17
GPIO18
GPIO3
GPIO46
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO21
GPIO47
GPIO48
GPIO45
GPIO0
GPIO35
GPIO36
GPIO37
GPIO38
GPIO39
GPIO40
GPIO41
GPIO42
U0RXD
U0TXD
GPIO2
GPIO1
GPIO19
GPIO20
GPIO8
VDD_SPI
VDD33
GND
GND GND GND
VDD33
GND GND GND
GNDGND
VDD33
GND
GND
VDD33
GND
VDD33
GNDGND
GND
VDD_SPI
GND
GND
VDD33
GND
GND
GND
GNDGND
Title
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A4
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Title
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Date: Sheet o f
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<02_ESP32-S3-WROOM-1U> V1.2
<ESP32-S3-WROOM-1U>
A4
2 2Tuesday, July 20, 2021
Title
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<02_ESP32-S3-WROOM-1U> V1.2
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C11
TBD
U3 ESP32-S3-WROOM-1U
GND
1
3V3
2
EN
3
IO4
4
IO5
5
IO6
6
IO7
7
IO15
8
IO16
9
IO17
10
IO18
11
IO19
13
IO20
14
IO8
12
GND 40
IO1 39
IO2 38
TXD0 37
RXD0 36
IO42 35
IO41 34
IO40 33
IO39 32
IO38 31
IO37 30
IO36 29
IO35 28
IO0 27
IO46
16
IO9
17
IO10
18
IO11
19
IO12
20
IO13
21
IO14
22
IO21
23
IO47
24
IO48
25
IO3
15
IO45
26
EPAD 41
R16 0
C12
TBD
C13
0.1uF
C4
TBD
C15
0.1uF
R3 499
R13 0
D1
ESD
C14
1uF
U1
VDDA 56
LNA_IN
1
VDD3P3
2
VDD3P3
3
GPIO0
5
GPIO1
6
GPIO2
7
GPIO3
8
GPIO4
9
GPIO5
10
GPIO6
11
GPIO7
12
GPIO10
15
GPIO11
16
GPIO12
17
GPIO13
18
GPIO14
19
XTAL_32K_P
21 VDD3P3_RTC
20
XTAL_32K_N
22
GPIO17
23
GPIO18
24
GPIO19
25
GPIO20
26
VDD_SPI 29
SPIWP 31
SPICS0 32
SPIQ 34
SPID 35
SPICLK 33
SPICLK_N 36
GND 57
SPICLK_P 37
GPIO33 38
GPIO38 43
GPIO46 52
XTAL_N 54
XTAL_P 53
MTMS 48
MTDO 45
U0TXD 49
VDD3P3_CPU 46
CHIP_PU
4
VDDA 55
MTDI 47
GPIO8
13
GPIO9
14
GPIO21
27
SPICS1
28
SPIHD 30
GPIO34 39
GPIO35 40
GPIO36 41
U0RXD 50
GPIO45 51
GPIO37 42
MTCK 44
C9
0.1uF
C3
1uF
R15 0
C6
10uF
L1 0
R1
10K(NC)
U2 FLASH-3V3
VDD 8
GND
4
/CS
1
CLK
6
/HOLD
7/WP 3
DO 2
DI 5
C10
0.1uF
Y1
40MHz(±10ppm)
XIN
1
GND
2XOUT 3
GND 4
L2 TBD
C7
1uF
C1
TBD
ANT1
CONN
1
2
3
R10 0
R4 0
C2
10nF
R14 0
C8
0.1uF
Figure 6: ESP32S3WROOM1U Schematics
Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V by default (output by VDD_SPI). Please make sure IO45 is
not pulled high when the module is powered up by external circuit.
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6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
5
5
4
4
3
3
2
2
1
1
D
D
C
C
B
B
A
A
NC: No component.
X1: ESR = Max. 70 KΩ
EN
IO42 TMS
IO41 TDI
IO37
IO36
IO38
IO40 TDO
IO39 TCK
RXD0
TXD0
IO35
IO48
IO47
IO12
IO13
IO3
IO6
IO7
IO9
IO10
IO11
IO15
IO16
IO14
IO21
IO17
IO18
USB_D-
USB_D+
IO1
IO2
IO45
IO4
IO5
IO0
EN
IO19
IO20
IO46
IO8
GND
GND GND
VDD33 GND GND
GND
GND
GND
VDD33
GNDGND
GND
GND
C3
0.1uF
JP4
Boot Option
1
12
2
SW1
C4 12pF(NC)
U1
ESP32-S3-WROOM-1/ESP32-S3-WROOM-1U
GND
1
3V3
2
EN
3
IO4
4
IO5
5
IO6
6
IO7
7
IO15
8
IO16
9
IO17
10
IO18
11
IO19
13
IO20
14
IO8
12
GND 40
IO1 39
IO2 38
TXD0 37
RXD0 36
IO42 35
IO41 34
IO40 33
IO39 32
IO38 31
IO37 30
IO36 29
IO35 28
IO0 27
IO46
16
IO9
17
IO10
18
IO11
19
IO12
20
IO13
21
IO14
22
IO21
23
IO47
24
IO48
25
IO3
15
IO45
26
EPAD 41
R7 0
R4 0
C2 TBD
X1
32.768KHz(NC)
12
R2 NC
R5 0(NC)
R1 TBD
C5
TBD
R3 0(NC)
JP1
UART
1
1
2
2
3
3
4
4
C1
22uF
C8 0.1uF
R6 0
JP3
USB OTG
11
22
JP2
JTAG
1
1
2
2
3
3
4
4
C7 12pF(NC)
C6
TBD
Figure 7: Peripheral Schematics
Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
To ensure that the power supply to the ESP32-S3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kand
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-S3’s power-up and reset sequence
timing diagram, please refer to Section Power Scheme in ESP32-S3 Series Datasheet.
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EI- El-
PRELIMINARY
7 Physical Dimensions and PCB Land Pattern
7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
25.5±0.15
1.5
1.27
16.51
40 x 0.9
40 x 0.9
3.1±0.15
Top View Side View Bottom View
18±0.15
15.8
17.6
40 x 0.45 1
1.05
0.8
40 x 0.85
0.5
3.7
3.7
0.9
40 x Ø0.55
6
0.9
Ø0.5
Unit: mm
10.5
10.29
13.97 1.27 2.015
Figure 8: ESP32S3WROOM1 Physical Dimensions
1.5
1.27
16.51
40 x 0.9
Top View Bottom View
18±0.15
40 x 0.45 40 x 0.85
0.5
3.7
3.7
10.29
0.9
10.75
15.65
17.5
0.9
Side View
40 x 0.9
19.2±0.15
40 x Ø0.55
0.8
1.08
1.1 2.46
3
10.5
1.27
3.2±0.15
Unit: mm
13.97 2.015
13.1
Ø0.5
Figure 9: ESP32S3WROOM1U Physical Dimensions
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
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, wmmm M
PRELIMINARY
7 Physical Dimensions and PCB Land Pattern
7.2 Recommended PCB Land Pattern
Antenna Area
1
15 26
40
18
25.5
40 x1.5
40 x0.9
1.5
3.7
0.9
0.9
3.7
7.50
1.27 6
0.5
Unit: mm
Copper
Via for thermal pad
7.49
0.5
0.5
2.015 2.015
1.27
17.5
10.29
16.51
Figure 10: ESP32S3WROOM1 Recommended PCB Land Pattern
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PRELIMINARY
7 Physical Dimensions and PCB Land Pattern
1
15
18
26
1.5
19.2
40 x1.5
1.27
40 x0.9
40
0.5
0.5
3.7
3.7
0.90
0.9
7.5
0.5
Unit: mm
Copper
Via for thermal pad
10.29
1.27
2.015 2.015
17.5
16.51
1.19
Figure 11: ESP32S3WROOM1U Recommended PCB Land Pattern
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PRELIMINARY
7 Physical Dimensions and PCB Land Pattern
7.3 Dimensions of External Antenna Connector
ESP32-S3-WROOM-1U uses the first generation external antenna connector as shown in Figure 12. This
connector is compatible with the following connectors:
U.FL Series connector from Hirose
MHF I connector from I-PEX
AMC connector from Amphenol
Unit: mm
Figure 12: Dimensions of External Antenna Connector
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4,,
PRELIMINARY
8 Product Handling
8 Product Handling
8.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)
Human body model (HBM): ±2000 V
Charged-device model (CDM): ±500 V
8.3 Reflow Profile
Solder the module in a single reflow.
50 150
0
25
1 ~ 3 /s
0
200
250
200
–1 ~ –5 /s
Cooling zone
100
217
50
100 250
Reflow zone
217 60 ~ 90 s
Temperature ()
Preheating zone
150 ~ 200 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /s
Preheating zone — Temp.: 150 ~ 200 Time: 60 ~ 120 s
Reflow zone — Temp.: >217 60 ~ 90 s; Peak Temp.: 235 ~ 250 Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 Ramp-down rate: –1 ~ –5 /s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile
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ate Doc me Do en on 3 \ ce 4 g
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9 Related Documentation and Resources
9 Related Documentation and Resources
Related Documentation
ESP32-S3 Technical Reference Manual Detailed information on how to use the ESP32-S3 memory and peripherals.
ESP32-S3 Series Datasheet Specifications of the ESP32-S3 hardware.
Certificates
http://espressif.com/en/support/documents/certificates
Documentation Updates and Update Notification Subscription
http://espressif.com/en/support/download/documents
Developer Zone
ESP-IDF and other development frameworks on GitHub.
http://github.com/espressif
ESP32 BBS Forum Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
http://esp32.com/
The ESP Journal Best Practices, Articles, and Notes from Espressif folks.
http://medium.com/the-esp-journal
See the tabs SDKs and Demos,Apps,Tools,AT Firmware.
http://espressif.com/en/support/download/sdks-demos
Products
ESP32-S3 Series SoCs Browse through all ESP32-S3 SoCs.
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Contact Us
See the tabs Sales Questions,Technical Enquiries,Circuit Schematic & PCB Design Review,Get Samples
(Online stores), Become Our Supplier,Comments & Suggestions.
http://espressif.com/en/contact-us/sales-questions
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ESP32-S3-WROOM-1 & WROOM-1U Datasheet v0.5.1
PRELIMINARY
Revision History
Revision History
Date Version Release notes
2021-07-19 v0.5.1 Preliminary release, for chip revision 0
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