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SA630 Datasheet by NXP USA Inc.

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1. General description
The SA630 is a wideband RF switch fabricated in BiCMOS technology and incorporating
on-chip CMOS/TTL compatible drivers. Its primary function is to switch signals in the
frequency range DC to 1 GHz from one 50 channel to another. The switch is activated
by a CMOS/TTL compatible signal applied to the enable channel 1 pin (ENCH1).
The extremely low current consumption makes the SA630 ideal for portable applications.
The excellent isolation and low loss makes this device a suitable replacement for PIN
diodes.
The SA630 is available in an 8-pin SO (surface-mounted miniature) package.
2. Features and benefits
Wideband (DC to 1 GHz)
Low through loss (1 dB typical at 200 MHz)
Unused input is terminated internally in 50
Excellent overload capability (1 dB gain compression point +18 dBm at 300 MHz)
Low DC power (170 A from 5 V supply)
Fast switching (20 ns typical)
Good isolation (off channel isolation 60 dB at 100 MHz)
Low distortion (IP3 intercept +33 dBm)
Good 50 match (return loss 18 dB at 400 MHz)
Full ESD protection
Bidirectional operation
3. Applications
Digital transceiver front-end switch
Antenna switch
Filter selection
Video switch
FSK transmitter
SA630
Single-Pole Double-Throw (SPDT) switch
Rev. 3 — 23 July 2014 Product data sheet
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 2 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
4. Ordering information
4.1 Ordering options
5. Block diagram
Table 1. Ordering information
Type number Topside
marking Package
Name Description Version
SA630D/01 SA630D SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
Table 2. Ordering options
Type number Orderable
part number Package Packing method Minimum
order
quantity
Temperature
SA630D/01 SA630D/01,112 SO8 Standard marking
*IC’s tube - DSC bulk pack 2000 Tamb = 40 C to +85 C
SA630D/01,118 SO8 Reel 13” Q1/T1
*Standard mark SMD 2500 Tamb = 40 C to +85 C
Fig 1. Block diagram
aaa-013987
output/input
output/input
input/output
ENCH1
jjjj CECE
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 3 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
6. Pinning information
6.1 Pinning
6.2 Pin description
7. Equivalent circuit
Fig 2. Pin configuration for SO8
SA630D/01
V
DD
OUT1
GND AC_GND
INPUT GND
ENCH1 OUT2
aaa-013986
1
2
3
4
6
5
8
7
Table 3. Pin description
Symbol Pin Description
VDD 1 supply voltage
GND 2, 6 ground
INPUT 3 input
ENCH1 4 enable channel 1
OUT2 5 output
AC_GND 7 AC ground
OUT1 8 output
Fig 3. Equivalent circuit
INPUT
ENCH1
(logic 0 level)
1
2
3
4
5
6
7
8OUT1
aaa-013988
CONTROL
LOGIC
VDD
+5 V
20 kΩ
20 kΩ
50 Ω
50 Ω
AC bypass
OUT2
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 4 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
8. Limiting values
[1] Maximum dissipation is determined by the operating ambient temperature and the thermal resistance
Rth(j-a).
9. Recommended operating conditions
10. Thermal characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +5.5 V
P power dissipation Tamb =25C (still air) [1] -780mW
Tj(max) maximum junction
temperature -150C
Pi(max) maximum input power - +20 dBm
Po(max) maximum output power - +20 dBm
Tstg storage temperature 65 +150 C
Table 5. Operating conditions
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 3.0 5.5 V
Tamb ambient temperature operating 40 +85 C
Tjjunction temperature operating 40 +105 C
Table 6. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-a) thermal resistance from junction
to ambient SO8 package 158 C/W
Figure 19
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 5 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
11. Static characteristics
[1] The ENCH1 input must be connected to a valid logic level for proper operation of the SA630.
12. Dynamic characteristics
[1] The placement of the AC bypass capacitor is critical to achieve these specifications. See Section 14 for more details.
Table 7. Static characteristics
VDD =+5V; T
amb =25
C; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IDD supply current 40 170 300 A
Vth threshold voltage TTL/CMOS logic [1] 1.1 1.25 1.4 V
VIH HIGH-level input voltage logic 1 level;
enable channel 1 2.0 - VDD V
VIL LOW-level input voltage logic 0 level;
enable channel 2
0.3 - +0.8 V
IIL(ENCH1) LOW-level input current on pin ENCH1 ENCH1 = 0.4 V 10 +1A
IIH(ENCH1) HIGH-level input current on pin ENCH1 ENCH1 = 2.4 V 10 +1A
Table 8. Dynamic characteristics
All measurements include the effects of the SA630 evaluation board (Figure 19). Measurement system impedance is 50
.
Symbol Parameter Conditions Min Typ Max Unit
s21, s12 insertion loss (ON channel) DC to 100 MHz - 1 - dB
500MHz -1.4-dB
900 MHz - 2 2.8 dB
s21, s12 isolation (OFF channel)[1] 10 MHz 70 80 - dB
100 MHz - 60 - dB
500 MHz - 50 - dB
900 MHz 24 30 - dB
s11, s22 return loss (ON channel) DC to 400 MHz - 20 - dB
900 MHz - 12 - dB
s11, s22 return loss (OFF channel) DC to 400 MHz - 17 - dB
900 MHz - 13 - dB
td(off) turn-off delay time 50 % TTL to
(90 % to 10 %) RF -20-ns
tf(off) turn-off fall time 90 % to 10 % RF - 5 - ns
tr(on) turn-on rise time 10 % to 90 % RF - 5 - ns
Vtrt(p-p) peak-to-peak transient voltage switching transients - 165 - mV
PL(1dB) output power at 1 dB gain compression DC to 1 GHz - +18 - dBm
IP3 third-order intercept point 100 MHz - +33 - dBm
IP2 second-order intercept point 100 MHz - +52 - dBm
NF noise figure Zo=50
100MHz -1.0-dB
900MHz -2.0-dB
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 6 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
13. Performance curves
Tamb =+25C
Fig 4. Supply current versus VDD and temperature Fig 5. Loss versus frequency and VDD
Tamb =+25CT
amb =+25C; VDD =5V
Fig 6. Loss versus frequency and VDD Fig 7. Loss matching versus frequency;
CH1 versus CH2
VDD =5V T
amb =+25C
Fig 8. Loss versus frequency and temperature Fig 9. Isolation versus frequency and VDD
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SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 7 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
Tamb =+25C; VDD =5V T
amb =+25C
Fig 10. Isolation matching versus frequency;
CH1 versus CH2 Fig 11. Input match ON-channel versus frequency and
VDD
Tamb =+25C; VDD =5V T
amb =+25C
Fig 12. Output match ON-channel versus frequency Fig 13. OFF-channel match versus frequency and VDD
VDD =5V T
amb =+25C
Fig 14. OFF-channel match versus frequency and
temperature Fig 15. PL(1dB) versus frequency and VDD
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SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 8 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
Tamb =+25CT
amb =+25C; Zo=50
Fig 16. Intercept points versus VDD Fig 17. Noise Figure versus frequency and VDD
fi= 100 MHz at 6dBm; V
DD =5V
Fig 18. Switching speed
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ENCH1 (pin 4)
OUT1 (pin 8)
1 V
50 mV 10 nS
aaa-014013
n Figure19 Figure 5 Figure 7 :V‘ 4, . T‘” If" 630C1 7/91
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 9 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
14. Application information
The typical application schematic and printed-circuit board layout of the SA630 evaluation
board is shown in Figure 19. The layout of the board is simple, but a few cautions must be
observed. The input and output traces should be 50 . If a symmetric isolation between
the two channels is desired, then the placement of the AC bypass capacitor is extremely
critical. The trace from AC_GND (pin 7) should be drawn back towards the package and
then be routed downwards. The capacitor should be placed straight down as close to the
device as practical.
For better isolation between the two channels at higher frequencies, it is also advisable to
run the two output/input traces at an angle. This arrangement also minimizes any
inductive coupling between the two traces. The power supply bypass capacitor should be
placed close to the device. Figure 5 shows the frequency response of the SA630. The
loss matching between the two channels is excellent to 1.2 GHz, as shown in Figure 7.
a. Evaluation board schematic
b. SA630 board layout
Fig 19. Evaluation board and layout
aaa-013989
OUT1
0.01 μF
SA630
1
2
3
4
6
5
8
7AC_GND
0.01 μF
GND
OUT2
0.01 μF
V
DD
+5 V
0.1 μF
GND
0.01 μF
INPUT
ENCH1
aaa-013990
n Figure 9 Figure 10 Figure 20 Figure 21 Figure 22 Figure 23
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 10 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
The isolation and matching of the two channels over frequency is shown in Figure 9 and
Figure 10, respectively.
The SA630 is a very versatile part and can be used in many applications. Figure 20 shows
a block diagram of a typical digital RF transceiver front-end. In this application, the SA630
replaces the duplexer, which is typically very bulky and lossy. Due to the low power
consumption of the device, it is ideally suited for handheld applications such as in CT2
cordless telephones. The SA630 can also be used to generate Amplitude Shift Keying
(ASK) or On-Off Keying (OOK) and Frequency Shift Keying (FSK) signals for digital RF
communications systems. Block diagrams for these applications are shown in Figure 21
and Figure 22, respectively.
For applications that require a higher isolation at 1 GHz than obtained from a single
SA630, several SA630s can be cascaded as shown in Figure 23. The cascaded
configuration has a higher loss, but greater than 35 dB of isolation at 1 GHz and greater
than 65 dB at 500 MHz can be obtained from this configuration. By modifying the enable
control, an RF multiplexer/demultiplexer or antenna selector can be constructed. The
simplicity of SA630 coupled with its ease of use and high performance lends itself to many
innovative applications.
The SA630 switch terminates the OFF channel in 50 . The 50 resistor is internal and
is in series with the external AC bypass capacitor. Matching to impedances other than
50 can be achieved by adding a resistor in series with the AC bypass capacitor (for
example, 25 additional to match to a 75 environment).
Fig 20. A typical TDMA/digital RF transceiver system front-end
Fig 21. Amplitude Shift Keying (ASK)
generator Fig 22. Frequency Shift Keying (FSK)
generator
SA630
5200 602A IF OUT
VCO5200 modulation
aaa-014009
MICRO-
CONTROLLER
KEYPAD
AND
DISPLAY
TX/RX
SA630
aaa-014010
enable
CH1
TTL data
50 Ω
ASK output
oscillator
”Eh $1?
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 11 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
Fig 23. Cascaded configuration
SA630
aaa-014012
enable
IN/OUT
SA630
SA630
OUT1/IN1
OUT2/IN2
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 12 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
15. Package outline
Fig 24. Package outline SOT96-1 (SO8)
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SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 13 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Figure 25 Table 9 10 Figure 25
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 14 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 25) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25.
Table 9. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350
< 2.5 235 220
2.5 220 220
Table 10. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
mammum peak hamperature a MSL hmuh damage \eve\ mmmum peak |amperamra = mwmmum soldenng |emperamre V E L placemem accuracy 1 0.25 Dimensmns m mm
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 15 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering: PCB footprints
MSL: Moisture Sensitivity Level
Fig 25. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
Fig 26. PCB footprint for SOT96-1; reflow soldering
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Dwmenswons in mm occupied area AU m:
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 16 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
18. Abbreviations
Fig 27. PCB footprint for SOT96-1; wave soldering
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Table 11. Abbreviations
Acronym Description
ASK Amplitude Shift Keying
BiCMOS Bipolar Complementary Metal-Oxide Semiconductor
CMOS Complementary Metal-Oxide Semiconductor
ESD ElectroStatic Discharge
FSK Frequency Shift Keying
OOK On-Off Keying
PCB Printed-Circuit Board
PIN Positive-doped/Intrinsic/Negative-doped diode
RF Radio Frequency
SPDT Single-Pole Double-Throw
TTL Transistor-Transistor Logic
d Section 4.1 “Ordering ogiions" d Section 6.2 “Pin description" d Section 10 “Thermal characteristics" d Section 16 “Soldering of SMD gackages" d Section 17 “Soldering: PCB footgrinls" d Section 18 “Abbreviations"
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 17 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
19. Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
SA630 v.3 20140723 Product data sheet - SA630 v.2
Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Type number SA630N is discontinued and removed from this data sheet
Type number SA630D is discontinued and removed from this data sheet
Type number SA630D/01 is added to this data sheet
Added Section 4.1 “Ordering options
Added Section 6.2 “Pin description
Added Section 10 “Thermal characteristics
Deleted (old) “AC ELECTRICAL CHARACTERISTICS - N PACKAGE”
Deleted (old) Figure 4c, “630 N-Package Board Layout”
Deleted (old) Figure 12, “Loss Matching vs. Frequency for N-Package (DIP)”
Deleted (old) Figure 16, “Isolation Matching vs. Frequency for N-Package (DIP)”
Deleted (old) package outline drawing SOT97-1 (DIP8)
Added Section 16 “Soldering of SMD packages
Added Section 17 “Soldering: PCB footprints
Added Section 18 “Abbreviations
SA630 v.2 19971107 Product specification ECN 853-1577 18666 NE/SA630 v.1
NE/SA630 v.1 19911010 Product specification ECN 853-1577 04269 -
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 18 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
20. Legal information
20.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
: hitE:I/www.nxg.com salesaddresses®nx9£0m
SA630 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 3 — 23 July 2014 19 of 20
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors SA630
Single-Pole Double-Throw (SPDT) switch
© NXP Semiconductors N.V. 2014. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 July 2014
Document identifier: SA630
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
22. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Equivalent circuit. . . . . . . . . . . . . . . . . . . . . . . . 3
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
9 Recommended operating conditions. . . . . . . . 4
10 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
12 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
13 Performance curves . . . . . . . . . . . . . . . . . . . . . 6
14 Application information. . . . . . . . . . . . . . . . . . . 9
15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
16 Soldering of SMD packages . . . . . . . . . . . . . . 13
16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 13
16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 13
16.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 13
16.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 14
17 Soldering: PCB footprints. . . . . . . . . . . . . . . . 15
18 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16
19 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
20.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
20.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
21 Contact information. . . . . . . . . . . . . . . . . . . . . 19
22 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

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