KAMAYA OHM R—K— Ts_
Table—
Duranon: 10 s :
Immersion time: 2 s :
Drawing No:
FCCR−K−HTS−0001 /5
Title: CHIP FUSES; RECTANGULAR TYPE
FCCR10,16 Page:
4/9
Product specification contained in this specification are subject to change at any time without notice.
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Issue: KAMAYA ELECTRIC CO., LTD. Research & Development Department HOKKAIDO Research center Last update: 2017.1.10
8. Performance
8.1 Unless otherwise specified, the standard range of atmospheric conditions for tests is as follows;
Ambient temperature: 5 °C to 35 °C, Relative humidity: 45 % to 85 %, Air presser: 86 kPa to 106 kPa
If there is any doubt the results, measurements shall be made within the following:
Ambient temperature: 20 °C ± 2 °C, Relative humidity: 60 % to 70 %, Air presser: 86 kPa to 106 kPa
8.2 The performance shall be satisfied in Table−4. Table−4(1)
No. Test items Condition of test Performance requirements
1 Temperature rise The fuse shall be mounted on the test substrate as
shown in Figure−2.
Measurement temp.: 10 °C to 30 °C
Test current: Rated current
The temperature at the hottest point on the surface of
the fuse shall be measured after temperature
equilibrium has been attained.
75
C max.
2 Current carrying capacity The fuse shall be mounted on the test substrate as
shown in Figure−2.
Test current: 110 % of Rated current
Test temp.: 70 °C ± 2 °C
Test period: 1h
Without opening
3
Time / current characteristic
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Test current shall be applied for continuously.
Optional
code Current Pre
arcing
time
AB 200% 5 s max.
4 Terminal bond strength of
the face plating JIS C 60068-2-21 Ue1
The fuse shall be mounted on the test substrate as
shown in Figure−2.
Bending value: 3 mm (Among the fulcrums: 90 mm)
Duration: 10 s ± 1 s
Change of internal resistance:
±10%
No evidence of mechanical
damage.
5 Resistance to soldering
heat Test by a piece.
Temp. of solder bath: 260 °C ± 5 °C
Immersion time: 10 s ± 1 s
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internal
resistance.
Change of internal resistance:
±10%
No evidence of appearance
damage
Reflow soldering
Pre−heating: 150 °C ∼ 180 °C, 120 s max.
Peak: 260
°C
± 5
°C
, 10 s max.
Refrow cycle: 2 times
After immersion into solder, leaving the room temp.
for 1h or more, and then measure the internal
resistance.
6 Solderability JIS C 60068-2-58
Test by a piece
Flux: Rosin−Methanol
Temp. of solder: bath: 235 °C ± 5 °C
Immersion time: 2 s ± 0.5 s
The surface of terminal immersed shall
be min. of 95 % covered with a new
coating of solder.