DS90LV048A Datasheet by Texas Instruments

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS90LV048A
SNLS045C JULY 1999REVISED JULY 2016
DS90LV048A 3-V LVDS Quad CMOS Differential Line Receiver
1
1 Features
1 > 400-Mbps (200-MHz) Switching Rates
Flow-Through Pinout Simplifies PCB Layout
150-ps Channel-to-Channel Skew (Typical)
100-ps Differential Skew (Typical)
2.7-ns Maximum Propagation Delay
3.3-V Power Supply Design
High Impedance LVDS Inputs on Power Down
Low Power Design (40 mW at 3.3-V Static)
Interoperable With Existing 5-V LVDS Drivers
Accepts Small Swing (350 mV Typical) Differential
Signal Levels
Supports Input Failsafe
Open, Short, and Terminated
0 V to 100 mV Threshold Region
Conforms to ANSI/TIA/EIA-644 Standard
Operating Temperature Range: –40°C to +85°C
Available in SOIC and TSSOP Package
2 Applications
Multifunction Printers
LVDS - LVCMOS Translation
3 Description
The DS90LV048A device is a quad CMOS flow-
through differential line receiver designed for
applications requiring ultra-low power dissipation and
high data rates. The device is designed to support
data rates in excess of 400 Mbps (200 MHz) using
Low Voltage Differential Signaling (LVDS)
technology.
The DS90LV048A accepts low voltage (350 mV
typical) differential input signals and translates them
to 3-V CMOS output levels. The receiver supports a
TRI-STATE function that may be used to multiplex
outputs. The receiver also supports open, shorted,
and terminated (100-Ω) input fail-safe. The receiver
output is HIGH for all fail-safe conditions. The
DS90LV048A has a flow-through pinout for easy PCB
layout.
The EN and EN* inputs are ANDed together and
control the TRI-STATE outputs. The enables are
common to all four receivers. The DS90LV048A and
companion LVDS line driver (for example,
DS90LV047A) provide a new alternative to high-
power PECL/ECL devices for high-speed point-to-
point interface applications.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
DS90LV048A SOIC (16) 9.90 mm × 3.91 mm
TSSOP (16) 5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Diagram
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Switching Characteristics.......................................... 5
6.7 Typical Characteristics.............................................. 6
7 Parameter Measurement Information .................. 9
8 Detailed Description............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram....................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
9 Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application ................................................. 12
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 14
12 Device and Documentation Support ................. 15
12.1 Documentation Support ........................................ 15
12.2 Receiving Notification of Documentation Updates 15
12.3 Community Resources.......................................... 15
12.4 Trademarks........................................................... 15
12.5 Electrostatic Discharge Caution............................ 15
12.6 Glossary................................................................ 15
13 Mechanical, Packaging, and Orderable
Information ........................................................... 15
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2013) to Revision C Page
Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section....................................... 1
Changes from Revision A (April 2013) to Revision B Page
Changed layout of National Semiconductor Data Sheet to TI format .................................................................................... 8
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5 Pin Configuration and Functions
D or PW Package
16-Pin SOIC or TSSOP
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
EN 16 I Receiver enable pin: When EN is low, the receiver is disabled. When EN is high and EN* is low
or open, the receiver is enabled. If both EN and EN* are open circuit, then the receiver is
disabled.
EN* 9 I Receiver enable pin: When EN* is high, the receiver is disabled. When EN* is low or open and
EN is high, the receiver is enabled. If both EN and EN* are open circuit, then the receiver is
disabled.
GND 12 Ground pin
RIN+ 2, 3, 6, 7 I Noninverting receiver input pin
RIN1, 4, 5, 8 I Inverting receiver input pin
ROUT 10, 11, 14,
15 OReceiver output pin
VCC 13 Power supply pin, +3.3V ± 0.3V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
See (1)(2)
MIN MAX UNIT
Supply voltage (VCC) –0.3 4 V
Input voltage (RIN+, RIN) –0.3 3.6 V
Enable input voltage (EN, EN*) –0.3 VCC + 0.3 V
Output voltage (ROUT) –0.3 VCC + 0.3 V
Maximum package power dissipation
at +25°C
D0016A package 1025 mW
PW0016A package 866
Derate D0016A
package above +25°C 8.2
mW/°C
Derate PW0016A
package above +25°C 6.9
Lead temperature soldering (4 s) 260 °C
Maximum junction temperature 150 °C
Storage temperature, Tstg –65 150 °C
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(1) ESD Rating:
HBM (1.5 kΩ, 100 pF)
EIAJ (0 Ω, 200 pF)
6.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic discharge(1) Human-body model (HBM) ±10000 V
Machine model ±1200
6.3 Recommended Operating Conditions
MIN NOM MAX UNIT
Supply voltage, VCC 3 3.3 3.6 V
Receiver input voltage GND 3 V
Operating free air temperature, TA40 25 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1)
DS90LV048A
UNITPW (TSSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 110.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47 °C/W
RθJB Junction-to-board thermal resistance 54.7 °C/W
ψJT Junction-to-top characterization parameter 6.1 °C/W
ψJB Junction-to-board characterization parameter 54.2 °C/W
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
(2) All typicals are given for: VCC = 3.3 V, TA= 25°C.
(3) VCC is always higher than RIN+ and RINvoltage. RINand RIN+ are allowed to have a voltage range 0.2 V to VCCVID/2. However, to
be compliant with AC specifications, the common voltage range is 0.1 V to 2.3 V.
(4) The VCMR range is reduced for larger VID. Example: if VID = 400 mV, the VCMR is 0.2 V to 2.2 V. The fail-safe condition with inputs
shorted is not supported over the common-mode range of 0 V to 2.4 V, but is supported only with inputs shorted and no external
common-mode voltage applied. A VID up to VCC – 0 V may be applied to the RIN+/ RINinputs with the Common-Mode voltage set to
VCC/2. Propagation delay and Differential Pulse skew decrease when VID is increased from 200 mV to 400 mV. Skew specifications
apply for 200 mV VID 800 mV over the common-mode range.
(5) Output short-circuit current (IOS) is specified as magnitude only; minus sign indicates direction only. Only one output should be shorted
at a time; do not exceed maximum junction temperature specification.
6.5 Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)
PARAMETER TEST CONDITIONS PIN MIN TYP MAX UNIT
VTH Differential input high threshold VCM = +1.2 V, 0.05 V, 2.95 V(3)
RIN+,
RIN
35 0 mV
VTL Differential input low threshold 100 35 mV
VCMR Common-mode voltage range VID = 200 mV peak to peak?(4) 0.1 2.3 V
IIN Input current
VIN = +2.8 V VCC = 3.6 V or 0 V 10 ±5 10
μAVIN = 0 V 10 ±1 10
VIN = +3.6 V VCC = 0 V –20 ±1 20
VOH Output high voltage
IOH =0.4 mA, VID = +200 mV
ROUT
2.7 3.3
VIOH =0.4 mA, input terminated 2.7 3.3
IOH =0.4 mA, input shorted 2.7 3.3
VOL Output low voltage IOL = 2 mA, VID =200 mV 0.05 0.25 V
IOS Output short-circuit current Enabled, VOUT = 0 V(5) 15 47 100 mA
IOZ Output TRI-STATE current Disabled, VOUT = 0 V or VCC 10 ±1 10 μA
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Electrical Characteristics (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)
PARAMETER TEST CONDITIONS PIN MIN TYP MAX UNIT
VIH Input high voltage
EN,
EN*
2 VCC V
VIL Input low voltage GND 0.8 V
IIInput current VIN = 0 V or VCC, other Input = VCC or GND 10 ±5 10 μA
VCL Input clamp voltage ICL =18 mA 1.5 0.8 V
ICC No load supply current
receivers enabled EN = VCC, inputs open
VCC
9 15 mA
ICCZ No load supply current
receivers disabled EN = GND, inputs open 1 5 mA
(1) All typicals are given for: VCC = 3.3 V, TA= 25°C.
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO= 50 Ω, trand tf(0% to 100%) 3 ns for RIN.
(3) tSKD2, channel-to-channel skew is defined as the difference between the propagation delay of one channel and that of the others on the
same chip with any event on the inputs.
(4) tSKD3, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
at the same VCC, and within 5°C of each other within the operating temperature range.
(5) tSKD1 is the magnitude difference in differential propagation delay time between the positive going edge and the negative going edge of
the same channel
(6) tSKD4, part-to-part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |MaxMin| differential
propagation delay.
(7) fMAX generator input conditions: tr= tf< 1 ns (0% to 100%), 50% duty cycle, differential (1.05-V to 1.35-V peak to peak). Output criteria:
60 / 40% duty cycle, VOL (maximum 0.4 V), VOH (minimum 2.7 V), Load = 15 pF (stray plus probes).
6.6 Switching Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)(3)(4)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPHLD Differential propagation delay high to low
CL= 15 pF
VID = 200 mV
(Figure 15 and Figure 16)
1.2 2 2.7 ns
tPLHD Differential propagation delay low to high 1.2 1.9 2.7 ns
tSKD1 Differential pulse skew |tPHLD tPLHD|(5) 0 0.1 0.4 ns
tSKD2 Differential channel-to-channel skew; same
device(3) 0 0.15 0.5 ns
tSKD3 Differential part-to-part skew(4) 1 ns
tSKD4 Differential part-to-part skew(6) 1.5 ns
tTLH Rise time 0.5 1 ns
tTHL Fall time 0.35 1 ns
tPHZ Disable time high to Z RL= 2 k
CL= 15 pF
(Figure 17 and Figure 18)
8 14 ns
tPLZ Disable time low to Z 8 14 ns
tPZH Enable time Z to high 9 14 ns
tPZL Enable time Z to low 9 14 ns
fMAX Maximum operating frequency(7) All channels switching 200 250 MHz
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6.7 Typical Characteristics
Figure 1. Output High Voltage vs Power Supply Voltage Figure 2. Output Low Voltage vs Power Supply Voltage
Figure 3. Output Short-Circuit Current vs Power Supply
Voltage
Figure 4. Output TRI-STATE Current vs Power Supply
Voltage
Figure 5. Differential Transition Voltage vs Power Supply
Voltage Figure 6. Power Supply Current vs Ambient Temperature
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Typical Characteristics (continued)
Figure 7. Differential Propagation Delay vs Power Supply
Voltage
Figure 8. Differential Propagation Delay vs Ambient
Temperature
Figure 9. Differential Propagation Delay vs Differential Input
Voltage Figure 10. Differential Propagation Delay vs Common-Mode
Voltage
Figure 11. Differential Skew vs Power Supply Voltage Figure 12. Differential Skew vs Ambient Temperature
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Typical Characteristics (continued)
Figure 13. Transition Time vs Power Supply Voltage Figure 14. Transition Time vs Ambient Temperature
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7 Parameter Measurement Information
Figure 15. Receiver Propagation Delay and Transition Time Test Circuit
Figure 16. Receiver Propagation Delay and Transition Time Waveforms
CLincludes load and test jig capacitance.
S1= VCC for tPZL and tPLZ measurements.
S1= GND for tPZH and tPHZ measurements.
Figure 17. Receiver TRI-STATE Delay Test Circuit
Figure 18. Receiver TRI-STATE Delay Waveforms
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8 Detailed Description
8.1 Overview
LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as
shown in Figure 19. This configuration provides a clean signaling environment for the fast edge rates of the
drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair
cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic impedance of the media is in the
range of 100 Ω. A termination resistor of 100 Ω(selected to match the media) is located as close to the receiver
input pins as possible. The termination resistor converts the driver output (current mode) into a voltage that is
detected by the receiver. Other configurations are possible such as a multi-receiver configuration, but the effects
of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as ground shifting, noise
margin limits, and total termination loading must be considered.
The DS90LV048A differential line receiver is capable of detecting signals as low as 100 mV, over a ±1-V
common-mode range centered around +1.2 V. This is related to the driver offset voltage which is typically +1.2 V.
The driven signal is centered around this voltage and may shift ±1 V around this center point. The ±1-V shifting
may be the result of a ground potential difference between the ground reference of the driver and the ground
reference of the receiver, the common-mode effects of coupled noise, or a combination of the two. The AC
parameters of both receiver input pins are optimized for a recommended operating input voltage range of 0 V to
+2.4 V (measured from each pin to ground). The device operates for receiver input voltages up to VCC, but
exceeding VCC turns on the ESD protection circuitry, which clamps the bus voltages.
The DS90LV048A has a flow-through pinout that allows for easy PCB layout. The LVDS signals on one side of
the device easily allows for matching electrical lengths of the differential pair trace lines between the driver and
the receiver as well as allowing the trace lines to be close together to couple noise as common-mode. Noise
isolation is achieved with the LVDS signals on one side of the device and the TTL signals on the other side.
8.2 Functional Block Diagram
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8.3 Feature Description
8.3.1 Fail-Safe Feature
The LVDS receiver is a high-gain, high-speed device that amplifies a small differential signal (20 mV) to CMOS
logic levels. Due to the high gain and tight threshold of the receiver, take care to prevent noise from appearing as
a valid signal.
The internal fail-safe circuitry of the receiver is designed to source or sink a small amount of current, providing
fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated or shorted receiver
inputs.
1. Open Input Pins. The DS90LV048A is a quad receiver device, and if an application requires only 1, 2, or 3
receivers, the unused channel(s) inputs must be left OPEN. Do not tie unused receiver inputs to ground or
any other voltages. The input is biased by internal high value pullup and pulldown resistors to set the output
to a HIGH state. This internal circuitry ensures a HIGH, stable output state for open inputs.
2. Terminated Input. If the driver is disconnected (cable unplugged), or if the driver is in a TRI-STATE or
power-off condition, the receiver output is again in a HIGH state, even with the end of cable 100-Ω
termination resistor across the input pins. The unplugged cable can become a floating antenna which can
pick up noise. If the cable picks up more than 10 mV of differential noise, the receiver may see the noise as
a valid signal and switch. To ensure that any noise is seen as common-mode and not differential, a balanced
interconnect should be used. Twisted pair cable offers better balance than flat ribbon cable.
3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0-V
differential input voltage, the receiver output remains in a HIGH state. Shorted input fail-safe is not supported
across the common-mode range of the device (GND to 2.4 V). It is only supported with inputs shorted and no
external common-mode voltage applied.
External lower value pullup and pulldown resistors (for a stronger bias) may be used to boost fail-safe in the
presence of higher noise levels. The pullup and pulldown resistors must be in the 5-kto 15-krange to
minimize loading and waveform distortion to the driver. The common-mode bias point must be set to
approximately 1.2 V (less than 1.75 V) to be compatible with the internal circuitry.
Additional information on fail-safe biasing of LVDS devices may be found in AN-1194 Failsafe Biasing of LVDS
Interfaces (SNLA051).
8.4 Device Functional Modes
Table 1 lists the functional modes of the DS90LV048A.
Table 1. Truth Table
ENABLES INPUT OUTPUT
EN EN* RIN+ RINROUT
H L or Open
VID 0 V H
VID ≤ −0.1 V L
Full Fail-safe
OPEN/SHORT or
Terminated H
All other combinations of ENABLE inputs X Z
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The DS90LV048A has a flow-through pinout that allows for easy PCB layout. The LVDS signals on one side of
the device easily allows for matching electrical lengths of the differential pair trace lines between the driver and
the receiver as well as allowing the trace lines to be close together to couple noise as common-mode. Noise
isolation is achieved with the LVDS signals on one side of the device and the TTL signals on the other side.
9.2 Typical Application
Figure 19. Balanced System Point-to-Point Application
9.2.1 Design Requirements
When using LVDS devices, it is important to remember to specify controlled impedance PCB traces, cable
assemblies, and connectors. All components of the transmission media must have a matched differential
impedance of about 100 Ω. They must not introduce major impedance discontinuities.
Balanced cables (for example, twisted pair) are usually better than unbalanced cables (ribbon cable) for noise
reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also
tend to pick up electromagnetic radiation as common-mode (not differential mode) noise which is rejected by the
LVDS receiver.
For cable distances < 0.5 M, most cables can be made to work effectively. For distances 0.5 M d10 M,
CAT5 (Category 5) twisted pair cable works well, is readily available, and relatively inexpensive.
9.2.2 Detailed Design Procedure
9.2.2.1 Probing LVDS Transmission Lines
Always use high impedance (> 100k), low capacitance (< 2 pF) scope probes with a wide bandwidth (1 GHz)
scope. Improper probing gives deceiving results.
9.2.2.2 Threshold
The LVDS Standard (ANSI/TIA/EIA-644) specifies a maximum threshold of ±100 mV for the LVDS receiver. The
DS90LV048A supports an enhanced threshold region of 100 mV to 0 V. This is useful for fail-safe biasing. The
threshold region is shown in the Voltage Transfer Curve (VTC) in Figure 20. The typical DS90LV048A LVDS
receiver switches at about 35 mV.
NOTE
With VID = 0 V, the output is in a HIGH state. With an external fail-safe bias of +25 mV
applied, the typical differential noise margin is now the difference from the switch point to
the bias point.
In the following example, this would be 60 mV of Differential Noise Margin (+25 mV (35 mV)). With the
enhanced threshold region of 100 mV to 0 V, this small external fail-safe biasing of +25 mV (with respect to
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Typical Application (continued)
0 V) gives a DNM of a comfortable 60 mV. With the standard threshold region of ±100 mV, the external fail-safe
biasing would need to be +25 mV with respect to +100 mV or +125 mV, giving a DNM of 160 mV which is
stronger fail-safe biasing than is necessary for the DS90LV048A. If more DNM is required, then a stronger fail-
safe bias point can be set by changing resistor values.
Figure 20. VTC of the DS90LV048A LVDS Receiver
9.2.3 Application Curve
Figure 21. Power Supply Current vs Frequency
10 Power Supply Recommendations
Although the DS90LV047A draws very little power while at rest, its overall power consumption increases due to a
dynamic current component. The DS90LV048A power supply connection must take this additional current
consumption into consideration for maximum power requirements.
11 Layout
11.1 Layout Guidelines
Use at least 4 PCB layers (top to bottom): LVDS signals, ground, power, and TTL signals.
Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. Best practice is to
put TTL and LVDS signals on different layers which are isolated by a power/ground plane(s).
Keep drivers and receivers as close to the (LVDS port side) connectors as possible.
11.1.1 Power Decoupling Recommendations
Bypass capacitors must be used on power pins. Use high-frequency ceramic (surface mount is recommended)
0.1-μF and 0.001-μF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the
device supply pin. Additional scattered capacitors over the printed-circuit board improves decoupling. Multiple
vias must be used to connect the decoupling capacitors to the power planes. A 10-μF (35-V) or greater solid
tantalum capacitor must be connected at the power entry point on the printed-circuit board between the supply
and ground.
l TEXAS INSTRUMENTS Mir“ OS
8
7
Decoupling Cap
6
5
4
3
2
1
9
10
11
12
13
14
15
16
VCC
DIN2
DIN1
EN
DIN3
DIN4
EN*
GND
DOUT4-
DOUT4+
DOUT3+
DOUT3-
DOUT2-
DOUT2+
DOUT1+
DOUT1-
DS90LV047A
8
7
6
5
4
3
2
1
9
10
11
12
13
14
15
16
ROUT2
ROUT1
EN
ROUT3
ROUT4
EN*
GND
DS90LV048A
RIN4-
RIN4+
RIN3+
RIN3-
RIN2-
RIN2+
RIN1+
RIN1-
LVCMOS
Inputs
VCC Decoupling Cap
Series Termination (optional)
Series Termination (optional)
LVCMOS
Outputs
Input Termination
(Required)
14
DS90LV048A
SNLS045C JULY 1999REVISED JULY 2016
www.ti.com
Product Folder Links: DS90LV048A
Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated
Layout Guidelines (continued)
11.1.2 Differential Traces
Use controlled impedance traces that match the differential impedance of your transmission medium (that is,
cable) and termination resistor. Run the differential pair trace lines as close together as possible as soon as they
leave the IC (stubs must be < 10 mm long). This helps eliminate reflections and ensure noise is coupled as
common-mode. In fact, we have seen that differential signals which are 1 mm apart radiate far less noise than
traces 3 mm apart because magnetic field cancellation is much better with the closer traces. In addition, noise
induced on the differential lines is much more likely to appear as common-mode which is rejected by the
receiver.
Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase
difference between signals, which destroys the magnetic field cancellation benefits of differential signals and
EMI, results. Remember the velocity of propagation, v = c/Er where c (the speed of light) = 0.2997 mm/ps or
0.0118 in/ps.
Do not rely solely on the autoroute function for differential traces. Carefully review dimensions to match
differential impedance and provide isolation for the differential lines. Minimize the number or vias and other
discontinuities on the line.
Avoid 90° turns (these cause impedance discontinuities). Use arcs or 45° bevels.
Within a pair of traces, the distance between the two traces should be minimized to maintain common-mode
rejection of the receivers. On the printed-circuit board, this distance must remain constant to avoid discontinuities
in differential impedance. Minor violations at connection points are allowable.
11.1.3 Termination
Use a termination resistor that best matches the differential impedance or your transmission line. The resistor
must be between 90 and 130 . Remember that the current mode outputs need the termination resistor to
generate the differential voltage. LVDS does not work without resistor termination. Typically, connecting a single
resistor across the pair at the receiver end will suffice.
Surface mount 1% to 2% resistors are best. PCB stubs, component lead, and the distance from the termination
to the receiver inputs must be minimized. The distance between the termination resistor and the receiver must be
< 10 mm (12 mm maximum).
11.2 Layout Example
Figure 22. Layout Recommendation
l TEXAS INSTRUMENTS Am
15
DS90LV048A
www.ti.com
SNLS045C JULY 1999REVISED JULY 2016
Product Folder Links: DS90LV048A
Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
LVDS Owner's Manual (SNLA187)
AN-808 Long Transmission Lines and Data Signal Quality (SNLA028)
AN-977 LVDS Signal Quality: Jitter Measurements Using Eye Patterns Test Report #1SNLA166)
AN-971 An Overview of LVDS Technology (SNLA165)
AN-916 A Practical Guide to Cable Selection (SNLA219)
AN-805 Calculating Power Dissipation for Differential Line Drivers (SNOA233)
AN-903 A Comparison of Differential Termination Techniques (SNLA034)
AN-1194 Failsafe Biasing of LVDS Interfaces (SNLA051)
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
TEXAS INSTRUMENTS Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 30-Sep-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS90LV048ATM NRND SOIC D 16 48 Non-RoHS
& Green Call TI Level-1-235C-UNLIM -40 to 85 DS90LV048A
TM
DS90LV048ATM/NOPB ACTIVE SOIC D 16 48 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV048A
TM
DS90LV048ATMTC NRND TSSOP PW 16 92 Non-RoHS
& Green Call TI Level-1-260C-UNLIM -40 to 85 DS90LV
048AT
DS90LV048ATMTC/NOPB ACTIVE TSSOP PW 16 92 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV
048AT
DS90LV048ATMTCX NRND TSSOP PW 16 2500 Non-RoHS
& Green Call TI Level-1-260C-UNLIM -40 to 85 DS90LV
048AT
DS90LV048ATMTCX/NOPB ACTIVE TSSOP PW 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV
048AT
DS90LV048ATMX/NOPB ACTIVE SOIC D 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DS90LV048A
TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 30-Sep-2021
Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«Pi» Reel Diame|er AD Dimension designed to accommodate the componeni width ED Dimension deSigned to eccemmodaie me componeni iengm KO Dlmenslun designed to accommodate the eomponeni thickness 7 w Overeii Widlh loe earner cape i p1 Piich between successive cawiy ceniers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D D SprockeiHules ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS90LV048ATMTCX TSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
DS90LV048ATMTCX/NO
PB TSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
DS90LV048ATMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90LV048ATMTCX TSSOP PW 16 2500 367.0 367.0 35.0
DS90LV048ATMTCX/NOP
BTSSOP PW 16 2500 367.0 367.0 35.0
DS90LV048ATMX/NOPB SOIC D 16 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 2
l TEXAS INSTRUMENTS T - Tube height| L - Tube length l ,g + w-Tuhe _______________ _ ______________ width 47 — B - Alignment groove width
TUBE
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
DS90LV048ATM D SOIC 16 48 495 8 4064 3.05
DS90LV048ATM D SOIC 16 48 495 8 4064 3.05
DS90LV048ATM/NOPB D SOIC 16 48 495 8 4064 3.05
DS90LV048ATMTC PW TSSOP 16 92 495 8 2514.6 4.06
DS90LV048ATMTC PW TSSOP 16 92 495 8 2514.6 4.06
DS90LV048ATMTC/NOPB PW TSSOP 16 92 495 8 2514.6 4.06
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 3
MECHANICAL DATA D ( *"ifi O G if” )LASHC SMALL 0U ¥N¥ 4040047 S/M 06/1‘ NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5> B Th5 drawer ‘5 subje», ,0 change mm: Home, A Body \cngth docs rm mac mod Hoar, p'omswons, (xv gmc bms Mom mm warmers, or gm buns sha‘ nm exceed 3005 (015) eam swce @ Body mm does 101 meme 11mm fish. E Rdererce JEDEC MS 012 mam Ac, nter‘ec: flash sfu‘ not exceed 0017 (043) each swde {if TEXAS INSTRUMENTS www.1i.com
www.ti.com
PACKAGE OUTLINE
C
14X 0.65
2X
4.55
16X 0.30
0.19
TYP
6.6
6.2
1.2 MAX
0.15
0.05
0.25
GAGE PLANE
-80
B
NOTE 4
4.5
4.3
A
NOTE 3
5.1
4.9
0.75
0.50
(0.15) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
1
89
16
0.1 C A B
PIN 1 INDEX AREA
SEE DETAIL A
0.1 C
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
SEATING
PLANE
A 20
DETAIL A
TYPICAL
SCALE 2.500
v¢\‘\‘\‘\+““‘ gimm—LE—urmm M i
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SYMM
SYMM
1
89
16
15.000
METAL
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK DETAILS
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
YL““‘+““‘ fimmamfl J
www.ti.com
EXAMPLE STENCIL DESIGN
16X (1.5)
16X (0.45)
14X (0.65)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max heightPW0016A
SMALL OUTLINE PACKAGE
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
89
16
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