ESP32­C3­WROOM­02(U) Datasheet

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ESP32C3WROOM02
ESP32C3WROOM02U
Datasheet
2.4 GHz WiFi (802.11 b/g/n) and Bluetooth®5 module
Built around ESP32C3 series of SoCs, RISCV singlecore microprocessor
4 MB flash
15 GPIOs
Onboard PCB antenna or external antenna connector
ESP32C3WROOM02 ESP32C3WROOM02U
Version1.0
Espressif Systems
Copyright © 2021
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/sites/default/files/documentation/esp32-c3-wroom-02_datasheet_en.pdf
1.1 Features
CPU and OnChip Memory
• ESP32-C3 embedded, 32-bit RISC-V single-core
processor, up to 160 MHz
• 384 KB ROM
• 400 KB SRAM (16 KB for cache)
• 8 KB SRAM in RTC
WiFi
• IEEE 802.11 b/g/n-compliant
• Center frequency range of operating channel:
2412 ~2484 MHz
• Supports 20 MHz, 40 MHz bandwidth in 2.4 GHz
band
• 1T1R mode with data rate up to 150 Mbps
• Wi-Fi Multimedia (WMM)
• TX/RX A-MPDU, TX/RX A-MSDU
• Immediate Block ACK
• Fragmentation and defragmentation
• Transmit opportunity (TXOP)
• Automatic Beacon monitoring (hardware TSF)
• 4 × virtual Wi-Fi interfaces
• Simultaneous support for Infrastructure BSS in
Station mode, SoftAP mode, Station + SoftAP
mode, and promiscuous mode
Note that when ESP32-C3 series scans in Station
mode, the SoftAP channel will change along with
the Station channel
• Antenna diversity
• 802.11mc FTM
Bluetooth®
• Bluetooth LE: Bluetooth 5, Bluetooth mesh
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
• Advertising extensions
• Multiple advertisement sets
• Channel selection algorithm #2
Peripherals
• GPIO, SPI, UART, I2C, I2S, remote control
peripheral, LED PWM controller, general DMA
controller, TWAI®controller (compatible with ISO
11898-1, i.e. CAN Specification 2.0), USB
Serial/JTAG controller, temperature sensor, SAR
ADC
Integrated Components on Module
• 40 MHz crystal oscillator
• 4 MB SPI flash
Antenna Options
• On-board PCB antenna
(ESP32-C3-WROOM-02)
• External antenna via a connector
(ESP32-C3-WROOM-02U)
Operating Conditions
• Operating voltage/Power supply: 3.0 ~3.6 V
• Operating ambient temperature:
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1 Module Overview
–85 °C version module: –40 ~85 °C
–105 °C version module: –40 ~105 °C
Certification
• RF certification: FCC/CE/SRRC
• Green certification: RoHS/REACH
Test
• HTOL/HTSL/uHAST/TCT/ESD/Latch-up
1.2 Description
ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U are two general-purpose Wi-Fi and Bluetooth LE module.
The rich set of peripherals and high performance make the two modules an ideal choice for smart homes,
industrial automation, health care, consumer electronics, etc.
ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U both feature a 4 MB external SPI flash.
ESP32-C3-WROOM-02 comes with a on-board PCB antenna. ESP32-C3-WROOM-02U comes with a
connector for an external antenna. ESP32-C3-WROOM-02 and ESP32-C3-WROOM-02U have two
variants:
• 85 °C version operating at –40 ~85 °C
• 105 °C version operating at –40 ~105 °C
The two variants only differ in ambient operating temperature. In this datasheet unless otherwise stated,
ESP32-C3-WROOM-02 refers to the ESP32-C3-WROOM-02 module in 85 °C and 105 °C versions, and
ESP32-C3-WROOM-02U refers to the ESP32-C3-WROOM-02U module in 85 °C and 105 °C versions.
The ordering information for the two modules is as follows:
Table 1: Ordering Information
Module Chip embedded Flash Module dimensions (mm)
ESP32-C3-WROOM-02 (ANT) ESP32-C3 4 MB 18.0 × 20.0 × 3.2
ESP32-C3-WROOM-02U (CONN) 18.0 × 14.3 × 3.2
At the core of the two modules is ESP32-C3*, which has a 32-bit RISC-V single-core processor.
ESP32-C3 integrates a rich set of peripherals, ranging from UART, I2C, I2S, remote control peripheral, LED PWM
controller, general DMA controller, TWAI®controller, USB Serial/JTAG controller, temperature sensor, and ADC. It
also includes SPI, Dual SPI and Quad SPI interfaces.
Note:
* For more information on ESP32-C3, please refer to ESP32-C3 Series Datasheet.
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Applicatio m Lxght contro Sman butto Sman p‘ug Indoor po strial Auto Industria Mesh n Human ndustr Care ea‘lh by er
1 Module Overview
1.3 Applications
•Smart Home
–Light control
–Smart button
–Smart plug
–Indoor positioning
•Industrial Automation
–Industrial robot
–Mesh network
–Human machine interface (HMI)
–Industrial field bus
•Health Care
–Health monitor
–Baby monitor
•Consumer Electronics
–Smart watch and bracelet
–Over-the-top (OTT) devices
–Wi-Fi and bluetooth speaker
–Logger toys and proximity sensing toys
• Smart Agriculture
–Smart greenhouse
–Smart irrigation
–Agriculture robot
• Retail and Catering
–POS machines
–Service robot
• Audio Device
–Internet music players
–Live streaming devices
–Internet radio players
• Generic Low-power IoT Sensor Hubs
• Generic Low-power IoT Data Loggers
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Contents
Contents
1 Module Overview 2
1.1 Features 2
1.2 Description 3
1.3 Applications 4
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 9
3.3 Strapping Pins 10
4 Electrical Characteristics 12
4.1 Absolute Maximum Ratings 12
4.2 Recommended Operating Conditions 12
4.3 DC Characteristics (3.3 V, 25 °C) 12
4.4 Current Consumption Characteristics 13
4.5 Wi-Fi Radio 14
4.5.1 Wi-Fi RF Standards 14
4.5.2 Wi-Fi RF Transmitter (TX) Specifications 14
4.5.3 Wi-Fi RF Receiver (RX) Specifications 15
4.6 Bluetooth LE Radio 16
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications 16
4.6.2 Bluetooth LE RF Receiver (RX) Specifications 18
5 Module Schematics 21
6 Peripheral Schematics 23
7 Physical Dimensions and PCB Land Pattern 24
7.1 Physical Dimensions 24
7.2 Recommended PCB Land Pattern 25
7.3 Dimensions of External Antenna Connector 27
8 Product Handling 28
8.1 Storage Conditions 28
8.2 Electrostatic Discharge (ESD) 28
8.3 Reflow Profile 28
9 Related Documentation and Resources 29
Revision History 30
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List of Tables
List of Tables
1 Ordering Information 3
2 Pin Definitions 9
3 Strapping Pins 11
4 Parameter Descriptions of Setup and Hold Times for the Strapping Pins 11
5 Absolute Maximum Ratings 12
6 Recommended Operating Conditions 12
7 DC Characteristics (3.3 V, 25 °C) 12
8 Current Consumption Depending on RF Modes 13
9 Current Consumption Depending on Work Modes 13
10 Wi-Fi RF Standards 14
11 TX Power with Spectral Mask and EVM Meeting 802.11 Standards 14
12 TX EVM Test 14
13 RX Sensitivity 15
14 Maximum RX Level 16
15 RX Adjacent Channel Rejection 16
16 Transmitter General Characteristics 16
17 Transmitter Characteristics - Bluetooth LE 1 Mbps 17
18 Transmitter Characteristics - Bluetooth LE 2 Mbps 17
19 Transmitter Characteristics - Bluetooth LE 125 Kbps 17
20 Transmitter Characteristics - Bluetooth LE 500 Kbps 18
21 Receiver Characteristics - Bluetooth LE 1 Mbps 18
22 Receiver Characteristics - Bluetooth LE 2 Mbps 19
23 Receiver Characteristics - Bluetooth LE 125 Kbps 19
24 Receiver Characteristics - Bluetooth LE 500 Kbps 19
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List of Figures
List of Figures
1 ESP32-C3-WROOM-02 Block Diagram 8
2 ESP32-C3-WROOM-02U Block Diagram 8
3 Pin Layout (Top View) 9
4 Setup and Hold Times for the Strapping Pins 11
5 ESP32-C3-WROOM-02 Schematics 21
6 ESP32-C3-WROOM-02U Schematics 22
7 Peripheral Schematics 23
8 ESP32-C3-WROOM-02 Physical Dimensions 24
9 ESP32-C3-WROOM-02U Physical Dimensions 24
10 ESP32-C3-WROOM-02 Recommended PCB Land Pattern 25
11 ESP32-C3-WROOM-02U Recommended PCB Land Pattern 26
12 Dimensions of External Antenna Connector 27
13 Reflow Profile 28
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,_________________‘ _________________a
2 Block Diagram
2 Block Diagram
SPI Flash
ESP32-C3
RF Matching
40 MHz
Crystal
SPICS0
SPICLK
SPID
SPIQ
SPIHD
SPIWP
3V3
VDD_SPI
ESP32-C3-WROOM-02
EN GPIOs
Antenna
Figure 1: ESP32C3WROOM02 Block Diagram
SPI Flash
ESP32-C3
40 MHz
Crystal
SPICS0
SPICLK
SPID
SPIQ
SPIHD
SPIWP
3V3
VDD_SPI
ESP32-C3-WROOM-02U
EN GPIOs
RF Matching
Antenna
Figure 2: ESP32C3WROOM02U Block Diagram
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ESP32-C3-WROOM-02 & WROOM-02U Datasheet v1.0
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 7.1 Physical Dimensions.
1
2
3
4
5
6
7
8
9
3V3
EN
IO4
IO5
IO6
IO7
IO8
IO9
GND
18
17
16
15
14
13
12
11
10
IO0
IO1
IO2
IO3
IO19
IO18
TXD
RXD
IO10
Pin 19
GND
Keepout Zone
GND
GND GND GND
GND
GNDGNDGND
Figure 3: Pin Layout (Top View)
3.2 Pin Description
The module has 19 pins. See pin definitions in Table 2.
For peripheral pin configurations, please refer to ESP32-C3 Series Datasheet.
Table 2: Pin Definitions
Name No. Type1Function
3V3 1 P Power supply
EN 2 I
High: on, enables the chip.
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO4 3 I/O/T GPIO4, ADC1_CH4, FSPIHD, MTMS
IO5 4 I/O/T GPIO5, ADC2_CH0, FSPIWP, MTDI
IO6 5 I/O/T GPIO6, FSPICLK, MTCK
Cont’d on next page
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3 Pin Definitions
Table 2 – cont’d from previous page
Name No. Type1Function
IO7 6 I/O/T GPIO7, FSPID, MTDO
IO8 7 I/O/T GPIO8
IO9 8 I/O/T GPIO9
GND 9,19 P Ground
IO10 10 I/O/T GPIO10, FSPICS0
RXD 11 I/O/T GPIO20, U0RXD
TXD 12 I/O/T GPIO21, U0TXD
IO18 13 I/O/T GPIO18, USB_D-
IO19 14 I/O/T GPIO19, USB_D+
IO3 15 I/O/T GPIO3, ADC1_CH3
IO2 16 I/O/T GPIO2, ADC1_CH2, FSPIQ
IO1 17 I/O/T GPIO1, ADC1_CH1, XTAL_32K_N
IO0 18 I/O/T GPIO0, ADC1_CH0, XTAL_32K_P
1P: power supply; I: input; O: output; T: high impedance.
3.3 Strapping Pins
Note:
The content below is excerpted from Section Strapping Pins in ESP32-C3 Series Datasheet. For the strapping pin map-
ping between the chip and modules, please refer to Chapter 5Module Schematics.
ESP32-C3 family has three strapping pins:
• GPIO2
• GPIO8
• GPIO9
Software can read the values of GPIO2, GPIO8 and GPIO9 from GPIO_STRAPPING field in GPIO_STRAP_REG
register. For register description, please refer to Section GPIO Matrix Register Summary in
ESP32-C3 Technical Reference Manual.
During the chip’s system reset, the latches of the strapping pins sample the voltage level as strapping bits of ”0”
or ”1”, and hold these bits until the chip is powered down or shut down.
Types of system reset include:
• power-on reset
• RTC watchdog reset
• brownout reset
• analog super watchdog reset
• crystal clock glitch detection reset
By default, GPIO9 is connected to the internal pull-up resistor. If GPIO9 is not connected or connected to an
external high-impedance circuit, the latched bit value will be ”1”
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3 Pin Definitions
To change the strapping bit values, you can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-C3 family.
After reset, the strapping pins work as normal-function pins.
Table 3lists detailed booting configurations of the strapping pins.
Table 3: Strapping Pins
Booting Mode 1
Pin Default SPI Boot Download Boot
GPIO2 N/A 1 1
GPIO8 N/A Don’t care 1
GPIO9 Internal pull-up 1 0
Enabling/Disabling ROM Code Print During Booting
Pin Default Functionality
GPIO8 N/A
When the value of eFuse field EFUSE_UART_PRINT_CONTROL is
0 (default), print is enabled and not controlled by GPIO8.
1, if GPIO8 is 0, print is enabled; if GPIO8 is 1, it is disabled.
2, if GPIO8 is 0, print is disabled; if GPIO8 is 1, it is enabled.
3, print is disabled and not controlled by GPIO8.
1The strapping combination of GPIO8 = 0 and GPIO9 = 0 is invalid and will trigger unexpected behavior.
Figure 4shows the setup and hold times for the strapping pins before and after the CHIP_EN signal goes high.
Details about the parameters are listed in Table 4.
CHIP_EN
t1
t0
Strapping pin
VIL_nRST
VIH
Figure 4: Setup and Hold Times for the Strapping Pins
Table 4: Parameter Descriptions of Setup and Hold Times for the Strapping Pins
Min
Parameter Description (ms)
t0Setup time before CHIP_EN goes from low to high 0
t1Hold time after CHIP_EN goes high 3
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4 Electrical Characteristics
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These
are stress ratings only and functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated
conditions for extended periods may affect device reliability.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 105 °C
4.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 — — A
TAOperating ambient temperature 85 °C version –40 — 85 °C
105 °C version 105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance — 2 — pF
VIH High-level input voltage 0.75 × VDD1— VDD1
+ 0.3 V
VIL Low-level input voltage –0.3 — 0.25 × VDD1V
IIH High-level input current — — 50 nA
IIL Low-level input current — — 50 nA
VOH 2High-level output voltage 0.8 × VDD1— — V
VOL2Low-level output voltage — — 0.1 × VDD1V
IOH
High-level source current (VDD1
= 3.3 V,
VOH >= 2.64 V, PAD_DRIVER = 3) — 40 — mA
IOL
Low-level sink current (VDD1
= 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3) — 28 — mA
RP U Pull-up resistor — 45 — kΩ
RP D Pull-down resistor — 45 — kΩ
VIH_nRST Chip reset release voltage 0.75 × VDD1— VDD1
+ 0.3 V
Cont’d on next page
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4.4 thh mod
4 Electrical Characteristics
Table 7 – cont’d from previous page
Symbol Parameter Min Typ Max Unit
VIL_nRST Chip reset voltage –0.3 — 0.25 × VDD1V
1VDD is the I/O voltage for a particular power domain of pins.
2VOH and VOL are measured using high-impedance load.
4.4 Current Consumption Characteristics
With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section Low Power Management
in ESP32-C3 Series Datasheet.
Table 8: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)
Active (RF working)
TX
802.11b, 1 Mbps, @20.5 dBm 345
802.11g, 54 Mbps, @18 dBm 285
802.11n, HT20, MCS7, @17.5 dBm 280
802.11n, HT40, MCS7, @17 dBm 280
RX 802.11b/g/n, HT20 82
802.11n, HT40 84
1The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient
temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle.
2The current consumption figures for in RX mode are for cases when the peripherals are dis-
abled and the CPU idle.
Table 9: Current Consumption Depending on Work Modes
Work mode Description Typ Unit
Modem-sleep1, 2 The CPU is
powered on3
160 MHz 20 mA
80 MHz 15 mA
Light-sleep — 130 µA
Deep-sleep RTC timer + RTC memory 5 µA
Power off CHIP_EN is set to low level, the chip is powered off 1 µA
1The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and
the cache idle.
2When Wi-Fi is enabled, the chip may switch between Active and Modem-sleep modes. Therefore, current
consumption changes accordingly.
3In practice, software can adjust CPU’s frequency according to CPU load to reduce current consumption.
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4 Electrical Characteristics
4.5 WiFi Radio
4.5.1 WiFi RF Standards
Table 10: WiFi RF Standards
Name Description
Center frequency range of operating channel 12412 ~2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
Data rate 20 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, external antenna connector
1Device should operate in the center frequency range allocated by regional regulatory authorities.
Target center frequency range is configurable by software.
2For the modules that use external antenna connectors, the output impedance is 50 Ω. For other
modules without external antenna connectors, the output impedance is irrelevant.
4.5.2 WiFi RF Transmitter (TX) Specifications
Target TX power is configurable based on device or certification requirements. The default characteristics are
provided in Table 11.
Table 11: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps — 20.5 —
802.11b, 11 Mbps — 20.5 —
802.11g, 6 Mbps — 20.0 —
802.11g, 54 Mbps — 18.0 —
802.11n, HT20, MCS0 — 19.0 —
802.11n, HT20, MCS7 — 17.5 —
802.11n, HT40, MCS0 — 18.5 —
802.11n, HT40, MCS7 — 17.0 —
Table 12: TX EVM Test
Min Typ SL1
Rate (dB) (dB) (dB)
802.11b, 1 Mbps, @20.5 dBm — –24.5 –10
802.11b, 11 Mbps, @20.5 dBm — –25.0 –10
802.11g, 6 Mbps, @20 dBm — –23.0 –5
802.11g, 54 Mbps, @18 dBm — –28.0 –25
802.11n, HT20, MCS0, @19 dBm — –23.5 –5
Cont’d on next page
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4 Electrical Characteristics
Table 12 – cont’d from previous page
Min Typ SL1
Rate (dB) (dB) (dB)
802.11n, HT20, MCS7, @17.5 dBm — –29.5 –27
802.11n, HT40, MCS0, @18.5 dBm — –26.5 –5
802.11n, HT40, MCS7, @17 dBm — –29.5 –27
1SL stands for standard limit value.
4.5.3 WiFi RF Receiver (RX) Specifications
Table 13: RX Sensitivity
Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps — –98.0 —
802.11b, 2 Mbps — –96.0 —
802.11b, 5.5 Mbps — –93.0 —
802.11b, 11 Mbps — –88.6 —
802.11g, 6 Mbps — –93.0 —
802.11g, 9 Mbps — –92.0 —
802.11g, 12 Mbps — –90.8 —
802.11g, 18 Mbps — –88.4 —
802.11g, 24 Mbps — –85.4 —
802.11g, 36 Mbps — –82.0 —
802.11g, 48 Mbps — –78.0 —
802.11g, 54 Mbps — –76.4 —
802.11n, HT20, MCS0 — –93.0 —
802.11n, HT20, MCS1 — –90.8 —
802.11n, HT20, MCS2 — –88.2 —
802.11n, HT20, MCS3 — –84.6 —
802.11n, HT20, MCS4 — –81.4 —
802.11n, HT20, MCS5 — –77.4 —
802.11n, HT20, MCS6 — –75.4 —
802.11n, HT20, MCS7 — –74.4 —
802.11n, HT40, MCS0 — –90.0 —
802.11n, HT40, MCS1 — –87.6 —
802.11n, HT40, MCS2 — –84.8 —
802.11n, HT40, MCS3 — –81.8 —
802.11n, HT40, MCS4 — –78.4 —
802.11n, HT40, MCS5 — –74.4 —
802.11n, HT40, MCS6 — –72.6 —
802.11n, HT40, MCS7 — –71.2 —
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4 Electrical Characteristics
Table 14: Maximum RX Level
Min Typ Max
Rate (dBm) (dBm) (dBm)
802.11b, 1 Mbps — 5 —
802.11b, 11 Mbps — 5 —
802.11g, 6 Mbps — 5 —
802.11g, 54 Mbps — 0 —
802.11n, HT20, MCS0 — 5 —
802.11n, HT20, MCS7 — 0 —
802.11n, HT40, MCS0 — 5 —
802.11n, HT40, MCS7 — 0 —
Table 15: RX Adjacent Channel Rejection
Min Typ Max
Rate (dB) (dB) (dB)
802.11b, 1 Mbps — 35 —
802.11b, 11 Mbps — 35 —
802.11g, 6 Mbps — 31 —
802.11g, 54 Mbps — 20 —
802.11n, HT20, MCS0 — 31 —
802.11n, HT20, MCS7 — 16 —
802.11n, HT40, MCS0 — 25 —
802.11n, HT40, MCS7 — 11 —
4.6 Bluetooth LE Radio
4.6.1 Bluetooth LE RF Transmitter (TX) Specifications
Table 16: Transmitter General Characteristics
Parameter Min Typ Max Unit
RF transmit power — 0 — dBm
Gain control step — 3 — dB
RF power control range –27 — 18 dBm
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4 Electrical Characteristics
Table 17: Transmitter Characteristics  Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit
In-band emissions
F = F0 ± 2 MHz — –37.62 — dBm
F = F0 ± 3 MHz — –41.95 — dBm
F = F0 ± > 3 MHz — –44.48 — dBm
Modulation characteristics
∆f1avg — 245.00 — kHz
∆f2max — 208.00 — kHz
∆f2avg/∆f1avg — 0.93 — —
Carrier frequency offset — — –9.00 — kHz
Carrier frequency drift
|f0−fn|n=2,3,4, ..k — 1.17 — kHz
|f1−f0|— 0.30 — kHz
|fn−fn−5|n=6,7,8, ..k — 4.90 — kHz
Table 18: Transmitter Characteristics  Bluetooth LE 2 Mbps
Parameter Description Min Typ Max Unit
In-band emissions
F = F0 ± 4 MHz — –43.55 — dBm
F = F0 ± 5 MHz — –45.26 — dBm
F = F0 ± > 5 MHz — –47.00 — dBm
Modulation characteristics
∆f1avg — 497.00 — kHz
∆f2max — 398.00 — kHz
∆f2avg/∆f1avg — 0.95 — —
Carrier frequency offset — — –9.00 — kHz
Carrier frequency drift
|f0−fn|n=2,3,4, ..k — 0.46 — kHz
|f1−f0|— 0.70 — kHz
|fn−fn−5|n=6,7,8, ..k — 6.80 — kHz
Table 19: Transmitter Characteristics  Bluetooth LE 125 Kbps
Parameter Description Min Typ Max Unit
In-band emissions
F = F0 ± 2 MHz — –37.90 — dBm
F = F0 ± 3 MHz — –41.00 — dBm
F = F0 ± > 3 MHz — –42.50 — dBm
Modulation characteristics
∆f1avg — 252.00 — kHz
∆f1max — 200.00 — kHz
Carrier frequency offset — — –13.70 — kHz
Carrier frequency drift
|f0−fn|n=1,2,3, ..k — 1.52 — kHz
|f0−f3|— 0.65 — kHz
|fn−fn−3|n=7,8,9, ..k — 0.70 — kHz
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4 Electrical Characteristics
Table 20: Transmitter Characteristics  Bluetooth LE 500 Kbps
Parameter Description Min Typ Max Unit
In-band emissions
F = F0 ± 2 MHz — –37.90 — dBm
F = F0 ± 3 MHz — –41.30 — dBm
F = F0 ± > 3 MHz — –42.80 — dBm
Modulation characteristics
∆f2avg — 220.00 — kHz
∆f2max — 205.00 — kHz
Carrier frequency offset — — –11.90 — kHz
Carrier frequency drift
|f0−fn|n=1,2,3, ..k — 1.37 — kHz
|f0−f3|— 1.09 — kHz
|fn−fn−3|n=7,8,9, ..k — 0.51 — kHz
4.6.2 Bluetooth LE RF Receiver (RX) Specifications
Table 21: Receiver Characteristics  Bluetooth LE 1 Mbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER — — –97 — dBm
Maximum received signal @30.8% PER — — 10 — dBm
Co-channel C/I — — 7 — dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz — –4 — dB
F = F0 – 1 MHz — –4 — dB
F = F0 + 2 MHz — –29 — dB
F = F0 – 2 MHz — –31 — dB
F≥F0 + 3 MHz — –33 — dB
F≤F0 – 3 MHz — –35 — dB
F≥F0 + 4 MHz — –35 — dB
F≤F0 – 4 MHz — –37 — dB
Image frequency — — –35 — dB
Adjacent channel to image frequency F = Fimage + 1 MHz — –40 — dB
F = Fimage – 1 MHz — –33 — dB
Out-of-band blocking performance
30 MHz ~2000 MHz — –6 — dBm
2003 MHz ~2399 MHz — –26 — dBm
2484 MHz ~2997 MHz — –25 — dBm
3000 MHz ~12.75 GHz — –5 — dBm
Intermodulation — — –30 — dBm
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4 Electrical Characteristics
Table 22: Receiver Characteristics  Bluetooth LE 2 Mbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER — — –93 — dBm
Maximum received signal @30.8% PER — — 5 — dBm
Co-channel C/I — — 10 — dB
Adjacent channel selectivity C/I
F = F0 + 2 MHz — –8 — dB
F = F0 – 2 MHz — –7 — dB
F = F0 + 4 MHz — –32 — dB
F = F0 – 4 MHz — –34 — dB
F≥F0 + 6 MHz — –39 — dB
F≤F0 – 6 MHz — –39 — dB
Image frequency — — –32 — dB
Adjacent channel to image frequency F = Fimage + 2 MHz — –39 — dB
F = Fimage – 2 MHz(2) — –8 — dB
Out-of-band blocking performance
30 MHz ~2000 MHz — –12 — dBm
2003 MHz ~2399 MHz — –30 — dBm
2484 MHz ~2997 MHz — –28 — dBm
3000 MHz ~12.75 GHz — –6 — dBm
Intermodulation — — –29 — dBm
Table 23: Receiver Characteristics  Bluetooth LE 125 Kbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER — — –105 — dBm
Maximum received signal @30.8% PER — — 10 — dBm
Co-channel C/I — — 2 — dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz — –6 — dB
F = F0 – 1 MHz — –4 — dB
F = F0 + 2 MHz — –33 — dB
F = F0 – 2 MHz — –41 — dB
F≥F0 + 3 MHz — –37 — dB
F≤F0 – 3 MHz — –46 — dB
F≥F0 + 4 MHz — –40 — dB
F≤F0 – 4 MHz — –49 — dB
Image frequency — — –40 — dB
Adjacent channel to image frequency F = Fimage + 1 MHz — –46 — dB
F = Fimage – 1 MHz — –37 — dB
Table 24: Receiver Characteristics  Bluetooth LE 500 Kbps
Parameter Description Min Typ Max Unit
Sensitivity @30.8% PER — — –101 — dBm
Maximum received signal @30.8% PER — — 10 — dBm
Co-channel C/I — — 3 — dB
Cont’d on next page
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4 Electrical Characteristics
Table 24 – cont’d from previous page
Parameter Description Min Typ Max Unit
Adjacent channel selectivity C/I
F = F0 + 1 MHz — –6 — dB
F = F0 – 1 MHz — –7 — dB
F = F0 + 2 MHz — –34 — dB
F = F0 – 2 MHz — –37 — dB
F≥F0 + 3 MHz — –38 — dB
F≤F0 – 3 MHz — –40 — dB
F≥F0 + 4 MHz — –40 — dB
F≤F0 – 4 MHz — –42 — dB
Image frequency — — –40 — dB
Adjacent channel to image frequency F = Fimage + 1 MHz — –45 — dB
F = Fimage – 1 MHz — –38 — dB
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5 Module Schematics Thxs is the reference desxgn of the modu‘e :3 3—° %:;n g; 37 j :1: 37 : “ 5:3; 2’; 37 ‘ 2’; 37 :5 :2: 37 a; 3—” Figure 5: ESPSZ-CS-WROOM-OZ Schematics
5 Module Schematics
5 Module Schematics
This is the reference design of the module.
5
4
3
2
1
Figure 5: ESP32C3WROOM02 Schematics
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vDDa: W ###J;‘ Pan 3—0 3V3 Pm) 37 m ESD E“ pm: 37 :0. END Pan 37 GND 105 D awuwwm P1n,5 :‘7 R1 45w UOYXD 106 UUFXD mm; 3— *5!“ ‘H E Emma 10" P1n,7 37 R16 103 mm! 37 55% “’9 ggfi P1n,9 3—“ cu: m, \ R: W m 5P“: 23 R4 mu SP‘D SP‘“ 22 R5 mu SP‘CLK 3:12; smcsn 7 —m R5 mu SW SPWP w R7 mu 5PM] W w, W A% 7 msm ‘ may 7 WWW cm cu ; W mm 3 IN wr 3§§S 5002: m, m Smcsa ‘ ,3 m, Esme: mm if- T 5pm EL 7 mu m a: am; can u: Figure 6: ESPaZ-CS-WROOM-OZU Schematics
5 Module Schematics
5
5
4
4
3
3
2
2
1
1
D
D
C
C
B
B
A
A
The values of C8, L2 and C9
vary with the actual PCB board.
The values of C1 and C2 vary with
the selection of the crystal.
The value of R1 varies with the actual
PCB board.
Pin.16
IO2
Pin.15
IO3
Pin.2
EN
Pin.3
IO4
Pin.4
IO5
Pin.5
IO6
Pin.6
IO7
Pin.7
IO8
Pin.8
IO9
Pin.9
GND
Pin.11
RXD
Pin.12
TXD
Pin.13
IO18
Pin.1
3V3 Pin.18
IO0
Pin.17
IO1
Pin.14
IO19
Pin.10
IO10
ESP32-C3-WROOM-02U(pin-out)
EPAD
NC: No component.
GPIO19
CHIP_EN
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
U0RXD
GPIO18
LNA_IN
GPIO9
GPIO10
GPIO0
GPIO1
SPICS0
SPID
SPIQ
SPICLK
SPIWP
SPIHDGPIO2
GPIO3
RF_ANT
U0TXD
GPIO6
GPIO7
GPIO8
GPIO9 U0RXD
GPIO18
SPICLK
SPICS0
SPIHD
CHIP_EN
GPIO19
U0TXD
GPIO10
GPIO4
GPIO5
GPIO0
GPIO1
GPIO3
GPIO2
SPIWP
SPID
SPIQ
GND
VDD33
GND
GND
GNDGND GND
GND GND
GND
VDD33
GND GND
VDD33
VDD_SPI
VDD33
GND
VDD_SPI
VDD33
GND
GND
GND
VDD33
GND
GND GND
GND
Title
Size Page Name R e v
Date: Sheet o f
Confidential and Proprietary
<02_ESP32-C3-WROOM-02U> V1.3
ESP32-C3-WROOM-02U
A4
2 2Thursday, July 22, 2021
Title
Size Page Name R e v
Date: Sheet o f
Confidential and Proprietary
<02_ESP32-C3-WROOM-02U> V1.3
ESP32-C3-WROOM-02U
A4
2 2Thursday, July 22, 2021
Title
Size Page Name R e v
Date: Sheet o f
Confidential and Proprietary
<02_ESP32-C3-WROOM-02U> V1.3
ESP32-C3-WROOM-02U
A4
2 2Thursday, July 22, 2021
C1
TBD
ANT1
CONN
1
2
3
C9
TBD
D1
ESD
U3 FLASH-3V3
/CS
1
DO 2
/WP 3
GND
4
DI 5
CLK
6
/HOLD
7
VCC 8
R4 100
R7 100
R6 100
C12
0.1uF
R1 0
R5 100
C10
0.1uF
C3
1uF
R2 499
R3 100
L1 0
C2
TBD
C8
TBD
C6
0.1uF
L2 TBD
C5
10uF
C4
10nF
C7
NC
C11
1uF
U2 ESP32-C3
LNA_IN
1
VDD3P3
2
VDD3P3
3
XTAL_32K_P
4
XTAL_32K_N
5
GPIO2
6
CHIP_EN
7
MTMS
9
MTDI
10
VDD3P3_RTC
11
MTCK
12
MTDO
13
GPIO8
14
GPIO9
15
GPIO10
16
VDD3P3_CPU 17
VDD_SPI 18
SPIHD 19
SPIWP 20
SPICS0 21
SPICLK 22
SPID 23
SPIQ 24
U0RXD 27
U0TXD 28
XTAL_N 29
XTAL_P 30
GND 33
GPIO3
8
VDDA 32
VDDA 31
GPIO19 26
GPIO18 25
U1
40MHz(±10ppm)
XIN
1
GND
2XOUT 3
GND 4
R8
10K(NC)
Figure 6: ESP32C3WROOM02U Schematics
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'” I 1 2 0 1 TBD R 'Infii TBD
6 Peripheral Schematics
6 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
NC: No component.
IO4
IO5
IO6
IO7
IO1
IO19
IO10
IO2
RXD
IO3
TXD
IO0
IO18
EN
IO9
EN
IO8
TDI
TMS
TCK
TDO USB_D-
USB_D+
GND
GND
GND
GND
GND
GND
VDD33
GNDVDD33
VDD33
VDD33
GND
GNDGND
C4 0.1uF
C2 0.1uF
R1 TBD
R2 0
C712pF(NC)
R6 0
C3 TBD
R9 10K
R5 0(NC)
C812pF(NC)
X1
32.768kHz(NC)
12
JP1
JTAG
11
22
33
44
JP2
Boot Option
11
22
SW1
R4 0
JP3
USB
1
1
2
2
R8 10K
C1 10uF
R7 NC
C6
TBD
C5
TBD
R3 0(NC)
U1
ESP32-C3-WROOM-02/ESP32-C3-WROOM-02U
3V3
1
EN
2
IO4
3
IO5
4
IO6
5
IO7
6
IO8
7
IO9
8
GND
9IO10 10
RXD 11
TXD 12
IO18 13
IO19 14
IO3 15
IO2 16
IO1 17
IO0 18
EPAD 19
JP4
UART
11
22
33
44
Figure 7: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste.
• To ensure that the power supply to the ESP32-C3 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩand
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-C3’s power-up and reset sequence
timing diagram, please refer to Section Power Scheme in ESP32-C3 Series Datasheet.
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El
7 Physical Dimensions and PCB Land Pattern
7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
3.2±0.15
0.8
12.37
15.7
Ø0.5
0.71
1.15
20±0.15
6
18 x 0.9
12
0.9
1.5
Top View Side View Bottom View
18 x 0.85
18 x 0.9
8.04
6.7
2.9
0.7
0.4
2.9
0.7
0.4
18±0.15
18 x 0.45
Unit: mm
18 x Ø0.55
Figure 8: ESP32C3WROOM02 Physical Dimensions
3.2±0.15
0.8
0.78
1.12
14.3±0.15
18 x 0.9
12
0.9
1.5
Top View Side View Bottom View
18 x 0.85
18 x 0.9
8.04
6.7
2.9
0.7
0.4
2.9
0.35
0.4
18±0.15
18 x 0.45
Unit: mm
12.75
15.75
8.85
11.55
2.3
2.75
Ø0.5
18 x Ø0.55
0.35
0.7
Figure 9: ESP32C3WROOM02U Physical Dimensions
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Package Information.
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7 Physical Dimensions and PCB Land Pattern
7.2 Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
1
9
18
10
Antenna Area
6
20
1.5
18 x 1.5
18 x 0.90.9
0.5
2.9
2.9
0.7
0.7
0.4
6.7
9.96
0.4
18
0.5
17.5
7.1
Figure 10: ESP32C3WROOM02 Recommended PCB Land Pattern
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-77 2 E i i
7 Physical Dimensions and PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
1
9
18
10
14.3
1.5
18 x 1.5
18 x 0.9
0.9
0.5
2.9
2.9
0.7
0.7
0.4
6.7
9.96
0.4
18
0.5
17.5
1.4
Figure 11: ESP32C3WROOM02U Recommended PCB Land Pattern
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L % Q E g $8‘0010‘05 125:0‘15 360:0‘15 2 L0 ] 55 NE T 3 L L AW m M J UTSUtUTUS CAV ND SECTIDN A4: (310) 0851010 2 :5 fl <3 c2="" m="" g="" shell="" 1="" copper="" alloy="" au="" plated="" over="" ni=""><2) contact="" t="" copper="" alloy/au="" plated="" over="" ni="" (d="" houstng="" t="" htght="" temp.="" plasttc="" uleaer/whtte="" ttem="" part="" nameq'ty="" matertal/ftntsh="">
7 Physical Dimensions and PCB Land Pattern
7.3 Dimensions of External Antenna Connector
ESP32-C3-WROOM-02U uses the first generation external antenna connector as shown in Figure 12. This
connector is compatible with the following connectors:
• U.FL Series connector from Hirose
• MHF I connector from I-PEX
• AMC connector from Amphenol
Unit: mm
Figure 12: Dimensions of External Antenna Connector
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4,,
8 Product Handling
8 Product Handling
8.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and /90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
/60%RH. If the above conditions are not met, the module needs to be baked.
8.2 Electrostatic Discharge (ESD)
• Human body model (HBM): 2000 V
• Charged-device model (CDM): 500 V
• Air discharge: 6000 V
• Contact discharge: 4000 V
8.3 Reflow Profile
Solder the module in a single reflow.
50 150
0
25
1 ~ 3 ℃/s
0
200
250
200
–1 ~ –5 ℃/s
Cooling zone
100
217
50
100 250
Reflow zone
217 ℃ 60 ~ 90 s
Temperature (℃)
Preheating zone
150 ~ 200 ℃ 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250 ℃
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile
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elate Document d Do entation 32703 a\ Reference Ma 32703 atash et , Spe ficates //esgr /en/ Egon/d ment [es dUpd es en 0 / e
9 Related Documentation and Resources
9 Related Documentation and Resources
Related Documentation
•ESP32-C3 Technical Reference Manual –Detailed information on how to use the ESP32-C3 memory and peripherals.
•ESP32-C3 Series Datasheet –Specifications of the ESP32-C3 hardware.
•Certificates
http://espressif.com/en/support/documents/certificates
•Documentation Updates and Update Notification Subscription
http://espressif.com/en/support/download/documents
Developer Zone
•ESP-IDF Programming Guide for ESP32-C3 –Extensive documentation for the ESP-IDF development framework.
•ESP-IDF and other development frameworks on GitHub.
http://github.com/espressif
•ESP32 BBS Forum –Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
http://esp32.com/
•The ESP Journal –Best Practices, Articles, and Notes from Espressif folks.
http://medium.com/the-esp-journal
• See the tabs SDKs and Demos,Apps,Tools,AT Firmware.
http://espressif.com/en/support/download/sdks-demos
Products
•ESP32-C3 Series SoCs –Browse through all ESP32-C3 SoCs.
http://espressif.com/en/products/socs?id=ESP32-C3
•ESP32-C3 Series Modules –Browse through all ESP32-C3-based modules.
http://espressif.com/en/products/modules?id=ESP32-C3
•ESP32-C3 Series DevKits –Browse through all ESP32-C3-based devkits.
http://espressif.com/en/products/devkits?id=ESP32-C3
•ESP Product Selector –Find an Espressif hardware product suitable for your needs by comparing or applying filters.
http://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions,Technical Enquiries,Circuit Schematic & PCB Design Review,Get Samples
(Online stores), Become Our Supplier,Comments & Suggestions.
http://espressif.com/en/contact-us/sales-questions
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ESP32-C3-WROOM-02 & WROOM-02U Datasheet v1.0
Revision History
Revision History
Date Version Release notes
2021-08-20 v1.0
• Updated module description on the title page
• Deleted Section ”About This Document”
• Restructured Section 1.1 Features
• Updated Table 12 TX EVM Test
• Updated Table 15 RX Adjacent Channel Rejection
• Updated Chapter 5Module Schematics
• Updated ESP32-C3-WROOM-02U Physical Dimensions
• Added descriptions in Section 7.3 Dimensions of External Antenna Connec-
tor
• Updated Section ”Learning Resources” and renamed to ”Related Docu-
mentation and Resources”
• Replaced ”chip family” with ”chip series” following Espressif’s taxonomy
2021-05-17 v0.7 • Updated Section 3.3 Strapping Pins
• Updated ESP32-C3-WROOM-02U Physical Dimensions
2021-04-16 v0.6 Added information about ESP32-C3-WROOM-02U module
2021-03-05 v0.5 Preliminary release
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