BLM15PyyyySH1D Ref Spec Datasheet by Murata Electronics

SgeC.N0.J ENF243A79103L701 \ as Mad Cmrem 0 (11772117 (mm
Spec.No.JENF243A-9103L-01 P1/9
Reference Only
Chip Ferrite Bead BLM15□□□□□SH1D
Reference Specification [AEC-Q200]
This reference specification applies to Chip Ferrite Bead BLM15_SH series for Automotive Electronics based on AEC-
2.Part Numbering
(ex.) BL M 15 AG 102 S H 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (4)Characteristics (7)Category(for Automotive Electronics)
(2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit
(3)Dimension (L×) (6)Performance (9)Packaging (D:Taping)
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz)(*1)
(refer to below comment)
Rated Current*
DC Resistance
(Ω max.) (*1)
(refer to below
comment) ESD Ran
2 :2kV
5A :8kV
at 85°C at 125°C Initial
Values Values
BLM15AG100SH1D 515 - 1000 0.05 0.10
BLM15AG700SH1D 40100 - 500 0.15 0.20
BLM15AG121SH1D 120±25% - 500 0.25 0.35
BLM15AG221SH1D 220±25% - 300 0.35 0.45
BLM15AG601SH1D 600±25% - 300 0.60 0.70
BLM15AG102SH1D 1000±25% - 200 1.0 1.1
BLM15BB050SH1D 5±25% - 500 0.08 0.15
BLM15BB100SH1D 10±25% - 300 0.10 0.15
BLM15BB220SH1D 22±25% - 300 0.20 0.30
BLM15BB470SH1D 47±25% - 300 0.35 0.45
BLM15BB750SH1D 75±25% - 300 0.40 0.50
BLM15BB121SH1D 120±25% - 300 0.55 0.65
BLM15BB221SH1D 220±25% - 200 0.80 0.90
BLM15BD471SH1D 470±25% - 200 0.60 0.70
BLM15BD601SH1D 600±25% - 200 0.65 0.75
BLM15BD102SH1D 1000±25% - 200 0.90 1.0
BLM15BD182SH1D 1800±25% - 200 1.4 1.5
BLM15PE300SH1D 30±25% 2300 1400 0.035 0.050
BLM15PE600SH1D 60±25% 1800 1100 0.060 0.075
BLM15PE800SH1D 80±25% 1700 1000 0.070 0.085
BLM15PE121SH1D 120±25% 1500 900 0.090 0.105
BLM15PE181SH1D 180±25% 1200 700 0.140 0.155
BLM15PE221SH1D 220±25% 1100 650 0.17 0.19
BLM15PE331SH1D 330±25% 1000 580 0.21 0.23
BLM15PE471SH1D 470±25% 750 450 0.35 0.37
BLM15PE601SH1D 600±25% 700 420 0.40 0.42
* In case of BLM15PE series, as shown in the diagram below, derating is applied to the rated current based on the operating
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
Refe re nce Onl Sgec.N0.JENF243A79103L701 Table A Table B
Spec.No.JENF243A-9103L-01 P2/9
Reference Only
Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
4.Style and Dimensions
Equivalent Circuit
Unit Weight (Typical value)
No marking.
6-1.Electrical Performance
No. Item Specification Test Method
6-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
6-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
6-2.Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High
1000hours at 125 deg C
Set for 24hours
at room temperature,
then measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-55 deg C to +125 deg C
Set for 24hours
at room temperature,
then measured.
Meet Table B after testing.
Table B
5 Destructive
Physical Analysis Per EIA469
No electrical tests No defects
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated current.
Meet Table B after testing.
Resistance element becomes
dominant at high frequencies.
1.0±0.05 0.5±0.05
(in mm)
Appearance No damage
(at 100MHz) Within ±30%
Resistance Meet item 3.
Appearance No damage
(at 100MHz)
Within ±30%
Resistance Meet item 3.
Sgec.No.J ENF243A79103L701 Tab‘e C Tab‘e D
Spec.No.JENF243A-9103L-01 P3/9
Reference Only
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
8 Operational Life Apply 125 deg C 1000hours
Set for 24hours at
room temperature,
then measured
Meet Table B after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions No defects
12 Resistance
to Solvents
Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical Shock
Per MIL-STD-202 Method 213
Condition F:
1500g's(14.7N)/0.5ms/Half sine
Meet Table A after testing.
14 Vibration 5g's(0.049N) for 20 minutes
12cycles each of 3 oritentations
Test from 10-2000Hz.
Meet Table A after testing.
15 Resistance
to Soldering Heat Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating: 150C +/-10 deg C, 60s to 90s
Meet Table C after testing.
Table C
17 ESD
Per AEC-Q200-002 ESD Rank: Meet Item 3 (Rating)
Meet Table D after testing.
Table D
18 Solderability
Per J-STD-002 Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Measured : Impedance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Meet Table A after testing.
22 Terminal Strength
Per AEC-Q200-006
Murata deviation request: 5N
No defects
30 Electrical
Per ISO-7637-2 Not Applicable
Appearance No damage
(at 100MHz)
Within ±30%
(BLM15BB/BD: Within ±40%)
Resistance Meet item 3.
Appearance No damage
(at 100MHz)
Within ±30%
Resistance Meet item 3.
SgeC.N0.J ENF243A79103L701 Tuptape % /,/g numberm 7 0000 XXX
Spec.No.JENF243A-9103L-01 P4/9
Reference Only
7.Specification of Packaging
7-1.Appearance and Dimensions (8mm-wide paper tape)
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide, 2mm-pitch continuously and sealed
by top tape and bottom tape.
(2) Sprocket hole:Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.025% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept..
7-2.Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Cover tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
7-3.Taping Condition
(1)Standard quantity per reel
Quantity per 180mm reel 10000 pcs. / reel
(2)There shall be leader-tape(top tape and empty tape) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking(2) , Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(2) ,Quantity, etc)
165 to 180 degree Top tape
Bottom tape Base tape
(in mm)
2.0±0.05 4.0±0.1
Direction of Feed
Sgec.No.JENF243A79103L701 trailer 7 160mm, V leader -o _ , law a 190mm 7 210mm, , +3 ‘\\ pvodudsmlagepan emptympe covertape ‘ i :, wwwape 013.0202 ‘ ,‘ ”mi” directionoffeed 8.43315 14.4 max: t 7 913030 _ v (m mm) ificatfun of Outer Case Case
Spec.No.JENF243A-9103L-01 P5/9
Reference Only
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
186 186 93 5
Above Outer Case size is typical. It is depend on a quantity of an
8. Caution
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may
cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (trains, ships, etc.)
(4)Power plant control equipment (9) Data-processing equipment
(5)Medical equipment (10)Applications of similar complexity and /or reliability
requirements to the applications listed in the above
8-5.Corrosive gas
If exposed to corrosive gases (H2S, SO2, Cl2, NH3, etc.) for a long time, it may lead to quality degradation or open
fault due to corrosion of the product electrodes.
Refe re nce Onl Sgec.No.JENF243A79103L701 200 p
Spec.No.JENF243A-9103L-01 P6/9
Reference Only
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
Standard land dimensions (Reflow soldering)
(in mm)
9-2. Mounting Conditions
Please check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products
may lead to pick up errors, misalignment, or damage to the product.
9-3.Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solde
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is
limited to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3) Soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
Soldering a b c
Reflow 0.4 1.2 0.5
Limit Profile
Standard Profile
60s max.
Chip Ferrite Bead
Solder Resist
SgeC.N0.J ENF243A79103L701 WEE“ 1 10000( )0000{ SHE” W '1 A > D is valid when stress is If a Cutting Disc is used str (a) Mounhng Components Nea When a component is mo during ihe tightening oi the possible. ©n:n->n:n
Spec.No.JENF243A-9103L-01 P7/9
Reference Only
9-4. Soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-5.Solder Volume
Solder shall be used not to be exceeded as shown below.
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-6.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as
possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation
surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as
Upper Limit
Poor example
Good example
Screw Hole Recommended
Refe re nce Onl Sgec.No.JENF243A79103L701
Spec.No.JENF243A-9103L-01 P8/9
Reference Only
9-7.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-8. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and
etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-9. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
9-10. Cleaning
When cleaning this product, observe the following conditions.
Any cleaning may cause deterioration in the quality of the product, so please check the quality of this product
before use.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature
shall be 40°C max.
(2) When ultrasonic cleaning is used, under some cleaning conditions, the substrate could resonate and the
substrate vibrations could result in chip cracks, solder breakage, and other problems. Be sure to always
perform a test cleaning beforehand using an actual cleaning device, and then check the quality of the products.
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner.
When using aqueous agent, rinse the product with deionized water adequately and completely dry it so that no
cleaner is left.
* For other cleaning, please consult our technical department.
9-11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9-12.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Avoid storing the product by itself bare ( directly to air).
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
Refe re nce Onl Sgec.No.JENF243A79103L701 A
Spec.No.JENF243A-9103L-01 P9/9
Reference Only
10 . ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve
our product specifications or transact the approval sheet for product specifications before ordering.