MF-USMF Series Datasheet by Bourns Inc.

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Features
■ Compliant with AEC-Q200 Rev-C- Stress
Test Qualification for Passive Components
■ Fast tripping resettable circuit protection
■ Surface mount packaging for automated
assembly
■ Small footprint size (1210)
■ RoHS compliant* and halogen free**
■ Agency recognition:
MF-USMF Series - PTC Resettable Fuses
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less;
(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.Specifications are subject to change without notice.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Electrical Characteristics
Model V max.
Volts
I max.
Amps
Ihold Itrip Resistance Max. Time
To Trip
Tripped
Power
Dissipation
Amperes
at 23 °C
Ohms
at 23 °C
Amperes
at 23 °C
Seconds
at 23 °C
Watts
at 23 °C
Hold Trip RMin. R1Max. Typ.
MF-USMF005 30 10 0.05 0.15 2.800 50.000 0.25 1.50 0.6
MF-USMF010 30 10 0.10 0.30 0.800 15.000 0.50 0.60 0.6
MF-USMF020 30 10 0.20 0.40 0.400 5.000 8.00 0.02 0.6
MF-USMF035 6 40 0.35 0.75 0.200 1.300 8.00 0.20 0.6
MF-USMF050 13.2 40 0.50 1.00 0.180 0.900 8.00 0.10 0.6
MF-USMF075 6 40 0.75 1.50 0.070 0.450 8.00 0.10 0.6
MF-USMF110 6 40 1.10 2.20 0.050 0.210 5.00 1.00 0.6
MF-USMF150 6 40 1.50 3.00 0.030 0.110 5.00 5.00 0.6
MF-USMF175 6 40 1.75 3.50 0.020 0.090 8.00 1.00 0.7
MF-USMF175X 6 40 1.75 3.50 0.020 0.090 8.00 1.00 0.7
*RoHS and
AEC-Q200 COMPLIANT
Test Procedures And Requirements For Model MF-LSMF Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. ......................................................... Verify dimensions and materials ........................... Per MF physical description
Resistance ............................................................ In still air @ 23 °C ................................................. Rmin ≤ R ≤ R1max
Time to Trip ........................................................... ......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life ....................................................... Vmax, Imax, 100 cycles ........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours ..................................................... No arcing or burning
Solderability .......................................................... ANSI/J-STD-002 ................................................... 95 % min. coverage
UL File Number ....................................................
No. E174545, or click here
.......................................
2057213, or click here
Environmental Characteristics
Operating Temperature ......................................... -40 °C to +85 °C
Passive Aging ....................................................... +85 °C, 1000 hours ............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times .................................... ±10 % typical resistance change
Solvent Resistance ............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1, ........................... No change
Condition A
Moisture Sensitivity Level (MSL) .......................... Level 1
..................................... Class 6
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov
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Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
MF-USMF Series - PTC Resettable Fuses
Product Dimensions
DIMENSIONS: MM
(INCHES)
Model ABCD
Min. Max. Min. Max. Min. Max. Min.
MF-USMF005 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF010 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF020 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF035 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF050 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF075 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF110 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
MF-USMF150 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
MF-USMF175X 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
MF-USMF175X 3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
Packaging: 3000 pcs. per reel.
Terminal material:
Electroless Ni under immersion Au
Termination pad solderability:
Meets ANSI/J-STD-002 Category 2.
Recommended Storage:
40 °C max./70 % RH max.
A
B
C
Top and Bottom View Side View
D
160–220
300
250
200
150
100
50
0
10–20
Temperature (ϒ
C)
120
Preheating Soldering Cooling
Time (seconds)
Notes:
• MF-USMF models cannot be wave soldered.
•
devices may not meet the performance requirements.
•
• Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse® Polymer PTC Soldering
Recommendation guidelines.
Recommended Pad Layout
2.5 ± 0.1
(.098 ± .004)
2.0 ± 0.1
(.079 ± .004)
1.0 ± 0.05
(.039 ± .002)
1.0 ± 0.05
(.039 ± .002)
Applications
■ Game consoles
■ PC motherboards
■ USB port protection - USB 2.0, 3.0 & OTG
■ HDMI 1.4 Source protection
■ IEEE 1394 ports
■ Mobile phones
■ Digital cameras
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MF-USMF Series - PTC Resettable Fuses
Typical Time to Trip at 23 ˚C
The Time to Trip curves represent typical performance of a device in a simulated application
Thermal Derating Chart - Ihold (Amps)
Model
Ambient Operating Temperature
-40 ˚C -20 ˚C0 ˚C 23 ˚C 40 ˚C 50 ˚C 60 ˚C 70 ˚C 85 ˚C
MF-USMF005 0.08 0.07 0.06 0.05 0.04 0.04 0.03 0.03 0.02
MF-USMF010 0.15 0.13 0.12 0.10 0.09 0.08 0.07 0.06 0.05
MF-USMF020 0.32 0.28 0.24 0.20 0.18 0.16 0.14 0.12 0.10
MF-USMF035 0.51 0.46 0.40 0.34 0.30 0.27 0.24 0.22 0.18
MF-USMF050 0.76 0.66 0.58 0.48 0.42 0.38 0.35 0.29 0.23
MF-USMF075 1.10 0.97 0.86 0.72 0.64 0.58 0.55 0.47 0.39
MF-USMF110 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58
MF-USMF150 2.30 2.02 1.76 1.43 1.24 1.11 1.00 0.85 0.65
MF-USMF175 2.80 2.45 2.10 1.75 1.55 1.45 1.35 1.25 1.10
MF-USMF175X 2.80 2.45 2.10 1.75 1.55 1.45 1.35 1.25 1.10
0.001
0.01
0.1
1
10
100
0.1 110100
Fault Current (Amps)
Time to Trip (Seconds)
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF150
MF-USMF175 & MF-USMF175X
MF-USMF110
MF-USMF075
MF-USMF005
How to Order
MF - USMF 010 X - 2
Multifuse® Product
Designator
Series
USMF = 1210 Surface Mount
Component
Hold Current, Ihold
005-175 (0.05-1.75 Amps)
Multifuse® freeXpansion™ Design
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
Typical Part Marking
Represents total content. Layout may vary.
PART IDENTIFICATION:
MF-USMF005 = 0
MF-USMF010 = 1
MF-USMF020 = 2
MF-USMF035 = 3
MF-USMF050 = 4
MF-USMF075 = 5
MF-USMF110 = 6
MF-USMF150 = 8
MF-USMF175 = 9
MF-USMF175X = 9
BIWEEKLY DATE CODE:
WEEK 1 AND 2 = A
WEEK 51 AND 52 = Z
6
A
UNDERSCORE
SIGNIFIES
HALOGEN FREE
COMPLIANCE
MF-USMF SERIES, REV. R, 11/18
“freeXpansion Design” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
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MF-USMF Series
Tape Dimensions per EIA 481-2
W 8.0 ± 0.3
(0.315 ± 0.012)
P0 4.0 ± 0.1
(0.157 ± 0.004)
P1 4.0 ± 0.1
(0.157 ± 0.004)
P2 2.0 ± 0.05
(0.079 ± 0.002)
A0 2.76 ± 0.10
(0.109 ± 0.004)
B0 3.50 ± 0.10
(0.138 ± 0.004)
B1 max. 4.35
(0.171)
D0 1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
F 3.5 ± 0.05
(0.138 + 0.002)
E1 1.75 ± 0.10
(0.069 ± 0.004)
E2 min. 6.25
(0.246)
T max. 0.6
(0.024)
T1 max. 0.1
(0.004)
K0 1.07 ± 0.10
(0.042 ± 0.004)
Leader min. 390
(15.35)
Trailer min. 160
(6.30)
Reel Dimensions
A max. 185
(7.283)
N min. 50
(1.97)
W1 8.4 + 1.5/ -0.0
(0.331 + 0.059/-0)
W2 max. 14.4
(0.567)
MF-USMF Series Tape and Reel Specifications
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
DIMENSIONS: MM
(INCHES)
B1
N(HUB DIA.)
(MEASURED
AT HUB)
A
T
COVER
TAPE
K0
T1A0
W2
(MEASURED
AT HUB)
W
1
P1
B0
F
D0P2
E2
E1
W
BOURNS‘
3312 - 2 mm SMD Trimming Potentiometer
Application Notice
MFAN 12/18
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Bourns® Multifuse® PPTC Resettable Fuses
• Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s
application, including the PPTC device characteristics stated in the applicable data sheet.
• Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such
maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with
inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated
within the user’s application during the PTC selection and qualification process.
• Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature
conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions
are expected to be repetitive or prolonged.
• In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC
device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to
accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate
clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC
devices if the thermal expansion is inhibited.
• Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may
adversely affect the performance of polymer PTC devices.
• Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating,
potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene,
which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be
thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect
on the device.
• Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data
sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note:
https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf
BOURNS'
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change
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The characteristics and parameters of a Bourns® product set forth in its data sheet are based on laboratory conditions, and
statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical
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