Einctmnic Componcnls
KEIl/IEI'
CHARGED!
Magnification 50X. Conditions:
a) Meihod A, at 235°C. Category 3
Load humidity, 1,000 hours 85"C/BS%RH and rated vohage, Add 100 K ohm resistor,
Measurement a1 24 hours +/*4 hours afier test conclusion.
Low volt humidity. 1.000 hours 850°/35%RH and 1.5 V. Add 100 K ohm resistor.
Measurement a1 24 hours +/*4 hours afier test conclusion.
MlLiSTDiZDZ Method
106
t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hours #74
MlLiSTDiZDZ Method
107
*55"C to +125"C. Note: Number of cycles required 7 300, Maximum transier 1ime 7 20
MlLiSTDiZDZ Method
108/ElAi198
MlLiSTDiZDZ Method
103
5 g for 20 minutes, 12 cycies each of 3 orientations. Note: Use 0"X5“ PCB ,031“ tniok7
secure poims on one long side and 2 secure poims at corners of
mounted wnhin 2" from any secure point, Test from 1072000 Hz,
Resistance to Soldering
Heat
MlLiSTDiZDZ Method
210
MlLiSTDiZDZ Method
211
MlLiSTDiZDZ Method
213
MlLiSTDiZDZ Method
215
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1050_GOLDMAX_X7R • 12/11/2017 14
Radial Leaded Multilayer Ceramic Capacitors
Goldmax, 300 Series, Conformally Coated, X7R Dielectric, 25 – 250 VDC (Commercial Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Solderability J–STD–002
Magnification50X.Conditions:
a)MethodA,at235°C,Category3
TemperatureCycling JESD22MethodJA–104 5cycles(−55°Cto+125°C),measurementat24hours+/−4hoursaftertestconclusion.
BiasedHumidity MIL–STD–202Method
103
Loadhumidity,1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
Lowvolthumidity,1,000hours85C°/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours+/−4hoursaftertestconclusion.
MoistureResistance
t=24hours/cycle.Steps7a&7bnotrequired.Unpowered.Measurementat24hours+/−4
hoursaftertestconclusion.
ThermalShock
−55ºCto+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds.Dwelltime–15minutes.Air–Air.
HighTemperatureLife
MIL–STD–202Method
108/EIA–198
1,000hoursat125°C(85°CforZ5U)with1Xratedvoltageapplied.
Storage Life
125°C,0VDCfor1,000hours.
Vibration MIL–STD–202Method
204
5gfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB.031"thick7
securepointsononelongsideand2securepointsatcornersofoppositesides.Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2000Hz.
Resistance to Soldering
Heat
ConditionB.Nopreheatofsamples.Note:singlewavesolder–procedure2.
TerminalStrength
Conditions A (454g), Condition C (227g)
MechanicalShock
Figure1ofMethod213,ConditionC.
Resistance to Solvents
Addaqueouswashchemical–OKEMCleanorequivalent.
Storage & Handling
Theun-mountedstoragelifeofaleadedceramiccapacitorisdependentuponstorageandatmosphericconditionsas
wellaspackagingmaterials.Whiletheceramicchipsenvelopedundertheepoxycoatingthemselvesarequiterobust
inmostenvironments,solderabilityofthewireleadonthefinalepoxy-coatedproductwillbedegradedbyexposureto
hightemperatures,highhumidity,corrosiveatmospheres,andlongtermstorage.Inaddition,packagingmaterialswillbe
degradedbyhightemperatureandexposuretodirectsunlight–reelsmaysoftenorwarp,andtapepeelforcemayincrease.
KEMETrecommendsstoringtheun-mountedcapacitorsintheiroriginalpackaging,inalocationawayfromdirectsunlight,
andwherethetemperatureandrelativehumiditydonotexceed40degreescentigradeand70%respectively.Foroptimum
solderability,capacitorstockshouldbeusedpromptly,preferablywithin18monthsofreceipt.Forapplicationsrequiring
pre-tinningofcomponents,storagelifemaybeextendedifsolderabilityisverified.Beforecleaning,bondingormoldingthese
devices,itisimportanttoverifythatyourprocessdoesnotaffectproductqualityandperformance.KEMETrecommends
testingandevaluatingtheperformanceofacleaned,bondedormoldedproductpriortoimplementingand/orqualifyingany
oftheseprocesses.