MC33887 Datasheet by NXP USA Inc.

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‘/RoHS O O '0 9' freescale“
Document Number: MC33887
Rev. 16.0, 10/2012
Freescale Semiconductor
Technical Data
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2012. All rights reserved.
5.0 A H-Bridge with Load
Current Feedback
ORDERING INFORMATION
Device Temperature
Range (TA)Package
MC33887APVW/R2
-40°C to 125°C
20 HSOP
MC33887PFK/R2 36 PQFN
MC33887PEK/R2 54 SOICW-EP
VW SUFFIX (Pb-FREE)
98ASH70702A
20-PIN HSOP
Bottom View
EK SUFFIX (Pb-FREE)
98ASA10506D
54-PIN SOICW-EP
FK SUFFIX
98ASA10583D
36-PIN PQFN
33887
H-BRIDGE
The 33887 is a monolithic H-Bridge Power IC with a load current
feedback feature making it ideal for closed-loop DC motor control.
The IC incorporates internal control logic, charge pump, gate drive,
and low RDS(ON) MOSFET output circuitry. The 33887 is able to
control inductive loads with continuous DC load currents up to 5.0 A,
and with peak current active limiting between 5.2 A and 7.8 A. Output
loads can be pulse width modulated (PWM-ed) at frequencies up to
10 kHz. The load current feedback feature provides a proportional (1/
375th of the load current) constant-current output suitable for
monitoring by a microcontroller’s A/D input. This feature facilitates
the design of closed-loop torque/speed control as well as open load
detection.
A Fault Status output pin reports undervoltage, short circuit, and
overtemperature conditions. Two independent inputs provide polarity
control of two half-bridge totem-pole outputs. Two disable inputs
force the H-Bridge outputs to tri-state (exhibit high-impedance).
The 33887 is parametrically specified over a temperature range of
-40°C TA 125°C and a voltage range of 5.0 V V+ 28 V.
Operation with voltages up to 40 V with derating of the specifications.
Features
Fully specified operation 5.0 V to 28 V
Limited operation with reduced performance up to 40 V
•120 mΩ RDS(ON) Typical H-Bridge MOSFETs
TTL/CMOS Compatible Inputs
PWM Frequencies up to 10 kHz
Active Current Limiting (Regulation)
Fault Status Reporting
Sleep Mode with Current Draw 50 μA (Inputs Floating or Set
to Match Default Logic States)
33887
CCP
IN1
IN2
D1
EN
FS
MCU
PGND
D2
MOTOR
OUT1
OUT2
AGND
V+
FB
6.0 V
V+
FB
IN
OUT
OUT
OUT
OUT
OUT
A/D
Figure 1. 33887 Simplified Application Diagram
OUT1
OUT2
PGNDAGND
CCP VPWR
EN
IN1
IN2
D1
D2
FS
FB
CHARGE PUMP
CURRENT
LIMIT,
OVERCURRENT
SENSE &
FEEDBACK
CIRCUIT
UNDERVOLTAGE
OVER
CONTROL
LOGIC
TEMPERATURE
GATE
DRIVE
5.0 V
REGULATOR
25 μA
8 μA
(EACH)
Analog Integrated Circuit Device Data
2Freescale Semiconductor
33887
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
Figure 2. 33887 Simplified Internal Block Diagram
/ :J ‘ Functiona‘ Pin DescnghonS sechon. gage 21
Analog Integrated Circuit Device Data
Freescale Semiconductor 3
33887
PIN CONNECTIONS
PIN CONNECTIONS
ENAGND
IN2
D1
CCP
V+
OUT2
OUT2
D2
PGND
PGND
FS
V+
OUT1
OUT1
FB
PGND
PGND
IN1
V+
1
2
3
4
5
6
7
8
9
10
20
19
16
15
14
13
12
11
18
17
Tab
Tab
Figure 3.
Table 1. 33887 HSOP PIN DEFINITIONS
A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21.
Pin Pin Name Formal Name Definition
1AGND Analog Ground Low-current analog signal ground.
2FS Fault Status for H-Bridge Open drain active LOW Fault Status output requiring a pull-up resistor to
5.0 V.
3 IN1 Logic Input Control 1 Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).
4 , 5, 16 V+ Positive Power Supply Positive supply connections
6 , 7 OUT1 H-Bridge Output 1 Output 1 of H-Bridge.
8FB Feedback for H-Bridge Current sensing feedback output providing ground referenced 1/375th
(0.00266) of H-Bridge high-side current.
9 12 PGND Power Ground High-current power ground.
13 D2 Disable 2 Active LOW input used to simultaneously tri-state disable both H-Bridge
outputs. When D2 is Logic LOW, both outputs are tri-stated.
14 , 15 OUT2 H-Bridge Output 2 Output 2 of H-Bridge.
17 CCP Charge Pump Capacitor External reservoir capacitor connection for internal charge pump capacitor.
18 D1 Disable 1 Active HIGH input used to simultaneously tri-state disable both H-Bridge
outputs. When D1 is Logic HIGH, both outputs are tri-stated.
19 IN2 Logic Input Control 2 Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).
20 EN Enable Logic input Enable control of device (i.e., EN logic HIGH = full operation, EN
logic LOW = Sleep Mode).
Tab/Pad Thermal
Interface
Exposed Pad Thermal
Interface
Exposed pad thermal interface for sinking heat from the device.
Note Must be DC-coupled to analog ground and power ground via very low
impedance path to prevent injection of spurious signals into IC substrate.
33887 Pin Connections
JLLLUUJJJ# iiiiiii :WWWWE Functional Pin Descnghons sechon. gage 21
D2
NC
28
27
26
25
24
23
22
21
2
3
4
5
6
7
8
9
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
PGND
PGND
PGND
PGND
PGND
PGND
IN2
D1
EN
V+
V+
NC
AGND
FS
V+
CCP
V+
OUT2
OUT2
NC
OUT2
OUT2
V+
IN1
V+
OUT1
OUT1
NC
OUT1
OUT1
20 FB
19 NC
10
NC
1
NC
Transparent Top View of Package
Analog Integrated Circuit Device Data
4Freescale Semiconductor
33887
PIN CONNECTIONS
Figure 4.
Table 2. PQFN PIN DEFINITIONS
A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21.
Pin Pin Name Formal Name Definition
1, 7, 10, 16,
19, 28, 31
NC No Connect No internal connection to this pin.
2D1 Disable 1 Active HIGH input used to simultaneously tri-state disable both H-Bridge
outputs. When D1 is Logic HIGH, both outputs are tri-stated.
3IN2 Logic Input Control 2 Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).
4EN Enable Logic input Enable control of device (i.e., EN logic HIGH = full operation,
EN logic LOW = Sleep Mode).
5, 6, 12, 13, 34, 35 V+ Positive Power Supply Positive supply connections.
8AGND Analog Ground Low-current analog signal ground.
9FS Fault Status for H-Bridge Open drain active LOW Fault Status output requiring a pull-up resistor to
5.0 V.
11 IN1 Logic Input Control 1 Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).
14, 15, 17, 18 OUT1 H-Bridge Output 1 Output 1 of H-Bridge.
20 FB Feedback for H-Bridge Current feedback output providing ground referenced 1/375th ratio of
H-Bridge high-side current.
21– 26 PGND Power Ground High-current power ground.
27 D2 Disable 2 Active LOW input used to simultaneously tri-state disable both H-Bridge
outputs. When D2 is Logic LOW, both outputs are tri-stated.
29, 30, 32, 33 OUT2 H-Bridge Output 2 Output 2 of H-Bridge.
36 CCP Charge Pump Capacitor External reservoir capacitor connection for internal charge pump
capacitor.
Pad Thermal
Interface
Exposed Pad Thermal
Interface
Exposed pad thermal interface for sinking heat from the device.
Note: Must be DC-coupled to analog ground and power ground via very
low impedance path to prevent injection of spurious signals into IC
substrate.
33887 Pin Connections
Functiona‘ Pin DescnghonS sechon. gage 21
PGND
NC
V+
V+
V+
V+
NC
NC
NC
NC
CCP
D1
IN2
EN
NC
NC
NC
OUT2
OUT2
OUT2
OUT2
NC
NC
D2
PGND
PGND
PGND
PGND
NC
V+
V+
V+
V+
NC
NC
NC
NC
IN1
FS
AGND
NC
NC
NC
NC
OUT1
OUT1
OUT1
OUT1
NC
NC
FB
PGND
PGND
PGND
54
40
.35
34
33
32
31
30
29
28
39
38
37
36
47
46
45
44
43
42
41
51
50
49
48
53
52
1
15
20
21
22
23
24
25
26
27
16
17
18
19
8
9
10
11
12
13
14
4
5
6
7
2
3
Transparent Top View of Package
Analog Integrated Circuit Device Data
Freescale Semiconductor 5
33887
PIN CONNECTIONS
Figure 5. 33887 Pin Connections
Table 3. SOICW-EP PIN DEFINITIONS
A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21.
Pin Pin Name Formal Name Definition
1– 4, 51– 54 PGND Power Ground High-current power ground.
5 7, 9, 14, 19 22,
27 29, 33 36, 41,
46, 48
50
NC No Connect No internal connection to this pin.
8D2 Disable 2 Active LOW input used to simultaneously tri-state disable both H-Bridge
outputs. When D2 is Logic LOW, both outputs are tri-stated.
10 13 OUT2 H-Bridge Output 2 Output 2 of H-Bridge.
15 18, 37 40 V+ Positive Power Supply Positive supply connections.
23 CCP Charge Pump Capacitor External reservoir capacitor connection for internal charge pump
capacitor.
24 D1 Disable 1 Active HIGH input used to simultaneously tri-state disable both H-Bridge
outputs. When D1 is Logic HIGH, both outputs are tri-stated.
25 IN2 Logic Input Control 2 Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).
26 EN Enable Logic input Enable control of device (i.e., EN logic HIGH = full operation,
EN logic LOW = Sleep Mode).
30 AGND Analog Ground Low-current analog signal ground.
31 FS Fault Status for H-Bridge Open drain active LOW Fault Status output requiring a pull-up resistor to
5.0 V.
32 IN1 Logic Input Control 1 Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).
Functional Pin Descnguons sermon, gage 21
Analog Integrated Circuit Device Data
6Freescale Semiconductor
33887
PIN CONNECTIONS
42 45 OUT1 H-Bridge Output 1 Output 1 of H-Bridge.
47 FB Feedback for H-Bridge Current feedback output providing ground referenced 1/375th ratio of
H-Bridge high-side current.
Pad Thermal
Interface
Exposed Pad Thermal
Interface
Exposed pad thermal interface for sinking heat from the device.
Note Must be DC-coupled to analog ground and power ground via very
low impedance path to prevent injection of spurious signals into IC
substrate.
Table 3. SOICW-EP PIN DEFINITIONS
A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21.
Pin Pin Name Formal Name Definition
[3) (A) » ta)
Analog Integrated Circuit Device Data
Freescale Semiconductor 7
33887
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating Symbol Value Unit
ELECTRICAL RATINGS
Supply Voltage (1) V+ -0.3 to 40 V
Input Voltage (2) VIN - 0.3 to 7.0 V
FS Status Output (3) V
FS -0.3 to 7.0 V
Continuous Current (4) IOUT 5.0 A
ESD Voltage (5)
Human Body Model
Machine Model
VESD1
VESD2
± 2000
± 200
V
THERMAL RATINGS
Storage Temperature TSTG - 65 to 150 °C
Operating Temperature (6)
Ambient
Junction
TA
TJ
- 40 to 125
- 40 to 150
°C
Peak Package Reflow Temperature During Reflow (7), (8) TPPRT Note 8. °C
Notes
1 Performance at voltages greater than 28V is degraded.See Electrical Performance Curves on page 18 and 19 for typical performance.
Extended operation at higher voltages has not been fully characterized and may reduce the operational lifetime.
2 Exceeding the input voltage on IN1, IN2, EN, D1, or D2 may cause a malfunction or permanent damage to the device.
3 Exceeding the pull-up resistor voltage on the open Drain FS pin may cause permanent damage to the device.
4 Continuous current capability so long as junction temperature is 150°C.
5 ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
6 The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
nonrepetitive excursions of junction temperature above 150°C can be tolerated as long as duration does not exceed 30 seconds
maximum. (nonrepetitive events are defined as not occurring more than once in 24 hours.)
7 Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
NIH/\l (5D (10) W) (1 D 113D (H
Analog Integrated Circuit Device Data
8Freescale Semiconductor
33887
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS (9), (10), (11), (12)
Junction-to-Board (Bottom Exposed Pad Soldered to Board)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
RθJB
~7.0
~8.0
~9.0
°C/W
Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (13)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
RθJA
~ 41
~ 50
~ 62
°C/W
Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)
(14)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
RθJMA
~ 18
~ 21
~ 23
°C/W
Junction-to-Case (Exposed Pad) (15)
HSOP (6.0 W)
PQFN (4.0 W)
SOICW-EP (2.0 W)
RθJC
~ 0.8
~1.2
~2.0
°C/W
Notes
9 The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.
10 Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual RθJB (junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die
temperature represents ~ 16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the RθJC-total must be
less than 5.0 °C/W for maximum load at 70°C ambient. Module thermal design must be planned accordingly.
11 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
12 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
13 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
14 Per JEDEC JESD51-6 with the board horizontal.
15 Indicates the maximum thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
MAXIMUM RATINGS (continued)
All voltages are with respect to ground unless otherwise noted.
Rating Symbol Value Unit
Analog Integrated Circuit Device Data
Freescale Semiconductor 9
33887
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. STATIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions 5.0 V V+ 28 V and -40°C TA 125°C unless otherwise noted. Typical values
noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
POWER SUPPLY
Operating Voltage Range (16) V+ 5.0 28 V
Sleep State Supply Current (17)
IOUT = 0 A, VEN = 0 V
IQ (SLEEP)
25 50
μA
Standby Supply Current
IOUT = 0 A, VEN = 5.0 V
IQ (STANDBY)
20
mA
Threshold Supply Voltage
Switch-OFF
Switch-ON
Hysteresis
V+(THRES-OFF)
V+(THRES-ON)
V+(HYS)
4.15
4.5
150
4.4
4.75
4.65
5.0
V
V
mV
CHARGE PUMP
Charge Pump Voltage
V+ = 5.0 V
8.0 V V+ 28 V
VCP - V+
3.35
20
V
CONTROL INPUTS
Input Voltage (IN1, IN2, D1, D2)
Threshold HIGH
Threshold LOW
Hysteresis
VIH
VIL
VHYS
3.5
0.7
1.0
1.4
V
Input Current (IN1, IN2, D1)
VIN - 0.0 V
IINP
- 200 - 80
μA
Input Current (D2, EN)
V
D2 = 5.0 V
IINP
25 100
μA
Notes
16 Specifications are characterized over the range of 5.0 V V+ 28 V. See See Electrical Performance Curves on page 18 and 19 and
the See Functional Description on page 21 for information about operation outside of this range.
17 IQ (sleep) is with sleep mode function enabled.
% arflf
Analog Integrated Circuit Device Data
10 Freescale Semiconductor
33887
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
POWER OUTPUTS (OUT1, OUT2)
Output ON-Resistance (18)
5.0 V V+ 28 V, TJ = 25°C
8.0 V V+ 28 V, TJ = 150°C
5.0 V V+ 8.0 V, TJ = 150°C
RDS(ON)
120
225
300
mΩ
Active Current Limiting Threshold (via Internal Constant OFF-Time
PWM) on Low-Side MOSFETs (19) ILIM 5.2 6.5 7.8 A
High-Side Short Circuit Detection Threshold ISCH 11 – A
Low-Side Short Circuit Detection Threshold ISCL 8.0 – A
Leakage Current (20)
VOUT = V+
VOUT = Ground
IOUT(LEAK)
100
30
200
60
μA
Output MOSFET Body Diode Forward Voltage Drop
IOUT = 3.0 A
VF
2.0
V
Overtemperature Shutdown
Thermal Limit
Hysteresis
TLIM
THYS
175
10
225
30
°C
HIGH-SIDE CURRENT SENSE FEEDBACK
Feedback Current
I OUT = 0 mA
I OUT = 500 mA
I OUT = 1.5 A
I OUT = 3.0 A
I OUT = 6.0 A
I FB
1.07
3.6
7.2
14.4
1.33
4.0
8.0
16
600
1.68
4.62
9.24
18.48
μA
mA
mA
mA
mA
FAULT STATUS (21)
Fault Status Leakage Current (22)
V FS = 5.0 V
I
FS(LEAK)
10
μA
Fault Status SET Voltage (23)
I
FS = 300 μA
V
FS(LOW)
1.0
V
Notes
18 Output-ON resistance as measured from output to V+ and ground.
19 Active current limitation applies only for the low-side MOSFETs.
20 Outputs switched OFF with D1 or D2.
21 Fault Status output is an open Drain output requiring a pull-up resistor to 5.0 V.
22 Fault Status Leakage Current is measured with Fault Status HIGH and not SET.
23 Fault Status Set Voltage is measured with Fault Status LOW and SET with I FS = 300 μA.
Table 4. STATIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions 5.0 V V+ 28 V and -40°C TA 125°C unless otherwise noted. Typical values
noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
POWER SUPPLY
ngure 9 figure 7 figure a
Table 5. DYNAMIC ELECTRICAL CHARACTERISTICS
Characteristics noted under conditions 5.0 V V+ 28 V and -40°C TA 125°C unless otherwise noted. Typical values
noted reflect the approximate parameter mean at TA= 25°C under nominal conditions unless otherwise noted.
Characteristic Symbol Min Typ Max Unit
TIMING CHARACTERISTICS
PWM Frequency (24) f
PWM 10 kHz
Maximum Switching Frequency During Active Current Limiting (25) f
MAX 20 kHz
Output ON Delay (26)
V
t
D (ON)
18
μs
Output OFF Delay (26)
V
t D (OFF)
18
μs
ILIM Output Constant-OFF Time for Low-Side MOSFETs (27), (28) t
A15 20.5 26 μs
ILIM Blanking Time for Low-Side MOSFETs (29), (28) t
B12 16.5 21 μs
Output Rise and Fall Time (30)
IOUT = 3.0 A
t
F, t
R
2.0 5.0 8.0
μs
Disable Delay Time (31) t
D (DISABLE) 8.0 μs
Power-ON Delay Time (32) t POD 1.0 5.0 ms
Wake-Up Delay Time (32) t WUD 1.0 5.0 ms
Output MOSFET Body Diode Reverse Recovery Time (33) t R R 100 ns
Notes
24 The outputs can be PWM-controlled from an external source. This is typically done by holding one input high while applying a PWM
pulse train to the other input. The maximum PWM frequency obtainable is a compromise between switching losses and switching
frequency. See Typical Switching Waveforms, Figures 12 through 19, pp. 1417.
25 The Maximum Switching Frequency during active current limiting is internally implemented. The internal current limit circuitry produces
a constant-OFF-time pulse-width modulation of the output current. The output load’s inductance, capacitance, and resistance
characteristics affect the total switching period (OFF-time + ON-time) and thus the PWM frequency during current limit.
26 Output Delay is the time duration from the midpoint of the IN1 or IN2 input signal to the 10% or 90% point (dependent on the transition
direction) of the OUT1 or OUT2 signal. If the output is transitioning HIGH-to-LOW, the delay is from the midpoint of the input signal to
the 90% point of the output response signal. If the output is transitioning LOW-to-HIGH, the delay is from the midpoint of the input signal
to the 10% point of the output response signal. See Figure 6, page 12.
27 ILIM Output Constant-OFF Time is the time during which the internal constant-OFF time PWM current regulation circuit has tri-stated
the output bridge.
28 Load currents ramping up to the current regulation threshold become limited at the ILIM value. The short circuit currents possess a di/dt
that ramps up to the ISCH or ISCL threshold during the ILIM blanking time, registering as a short circuit event detection and causing the
shutdown circuitry to force the output into an immediate tri-state latch-OFF. See Figures 10 and 11, page 13. Operation in Current Limit
mode may cause junction temperatures to rise. Junction temperatures above ~160°C will cause the output current limit threshold to
progressively “fold back”, or decrease with temperature, until ~175°C is reached, after which the TLIM thermal latch-OFF will occur.
Permissible operation within this fold-back region is limited to nonrepetitive transient events of duration not to exceed 30 seconds. See
Figure 9, page 12.
29 ILIM Blanking Time is the time during which the current regulation threshold is ignored so that the short-circuit detection threshold
comparators may have time to act.
30 Rise Time is from the 10% to the 90% level and Fall Time is from the 90% to the 10% level of the output signal. See Figure 8, page 12.
31 Disable Delay Time is the time duration from the midpoint of the D (disable) input signal to 10% of the output tri-state response. See
Figure 7, page 12.
32 Parameter has been characterized but not production tested.
33 Parameter is guaranteed by design but not production tested.
Analog Integrated Circuit Device Data
Freescale Semiconductor 11
33887
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
V+ = 14
V+ = 14
V+ = 14 V,
,T 1 "WIN ‘ A «22> E a _. 3.) Em. a> :59 u ,IDON 'R-b S a .3
Analog Integrated Circuit Device Data
12 Freescale Semiconductor
33887
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
TIME
0
5. 0
0
VPWR
tD(O N)
50%
90%
50 %
10%
tD(O FF)
Figure 6. Output Delay Time
℘?ℜ
0 V
5.0 V
Figure 7. Disable Delay Time
tR
0
V
PWR
90%
10%10 %
90 %
tF
Figure 8. Output Switching Time
I
MAX
,OUTPUTCURRENT(A)
6.6
2.5
160 175
Thermal Shutdown
T
J
, JUNCTION TEMPERATURE (oC)
ILIM,
6.5
I
LIM
,
CURRENT (A)
4.0
Operation within this region must be
150
limited to nonrepetitive events
not to exceed 30 seconds
Figure 9. Active Current Limiting Versus Temperature (Typical)
Active
Current
Limiting
>8A
6.5
Short Circuit Detection Threshold
Typical Current Limit Threshold
Hard Short Detection and Latch-OFF
0
IN1 or IN2
IN2 or IN1
IN1 or IN2
IN2 or IN1IN1 IN2
[1]
[0]
[1]
[0]
[1]
[0]
[1]
[0]
Outputs
Tri-Stated
Outputs
Tri-Stated
Outputs Operation
(per Input Control Condition)
Time
SF, LOGIC OUT D2, LOGIC IN D1, LOGIC IN INn, LOGIC IN ILOAD, OUTPUT CURRENT (A)
High Current Load Being Regulated via Constant-OFF-Time PWM
Moderate Current Load
on Low-Side
MOSFET
Analog Integrated Circuit Device Data
Freescale Semiconductor 13
33887
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Figure 10. Operating States
Overcurrent Minimum Threshold
tatb
8.0
TIME
I
LOAD
,OUTPUTCURRENT(A)
Typical PWM Load
Current Limiting
Waveform
Hard Output
Short Latch-OFF
ta= Tristate Output OFF Time
tb= Current Limit Blank Time
6.5
Hard Short Detection
Short Circuit Detect Threshold
ta = Output Constant-OFF Time
tb = Output Blanking Time
ISCL Short Circuit Detection Threshold
IOUT, CURRENT (A)
Typical Current
Limiting Waveform
tb
5.0
ta
8.0
Hard short occurs. Hard short is detected during tb
ILIM Blanking Time
ton
0.0 and output is latched-off.
Figure 11. Example Short Circuit Detection Detail on Low-Side MOSFET
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Analog Integrated Circuit Device Data
14 Freescale Semiconductor
33887
ELECTRICAL CHARACTERISTICS
TYPICAL SWITCHING WAVEFORMS
TYPICAL SWITCHING WAVEFORMS
Important For all plots, the following applies:
•Ch2 = 2.0 A per division
•L
LOAD = 533 μH @ 1.0 kHz
•L
LOAD = 530 μH @ 10.0 kHz
•R
LOAD = 4.0 Ω
V+=24 V fPWM=1.0 kHz Duty Cycle=10%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Figure 12. Output Voltage and Current vs. Input Voltage at V+ = 24 V,
PMW Frequency of 1.0 kHz, and Duty Cycle of 10%
V+=24 V fPWM = 1.0 kHz Duty Cycle = 50%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Figure 13. Output Voltage and Current vs. Input Voltage at V+
= 24 V,
PMW Frequency of 1.0 kHz, and Duty Cycle of 50%
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V+=34 V fPWM=1.0 kHz Duty Cycle=90%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Analog Integrated Circuit Device Data
Freescale Semiconductor 15
33887
ELECTRICAL CHARACTERISTICS
TYPICAL SWITCHING WAVEFORMS
Figure 14. Output Voltage and Current vs. Input Voltage at V+ = 34 V, PMW Frequency of 1.0 kHz,
and Duty Cycle of 90%, Showing Device in Current Limiting Mode
V+=22 V fPWM=1.0 kHz Duty Cycle=90%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Figure 15. Output Voltage and Current vs. Input Voltage at V+ = 22 V,
PMW Frequency of 1.0 kHz, and Duty Cycle of 90%
Tek Run: 250M515 Sample [ T 1+ Chl cha 20.0v 5.00v Tek Run: 250M515 10.0mm M20005 char va Sample [ T 1+ Chl cha 20.0v 5.00v 10.0mm M20005 char va msep 2002 V2:V6:54 msep 2002 mung
V+=24 V fPWM=10 kHz Duty Cycle=50%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Analog Integrated Circuit Device Data
16 Freescale Semiconductor
33887
ELECTRICAL CHARACTERISTICS
TYPICAL SWITCHING WAVEFORMS
Figure 16. Output Voltage and Current vs. Input Voltage at V+ = 24 V,
PMW Frequency of 10 kHz, and Duty Cycle of 50%
V+=24 V fPWM=10 kHz Duty Cycle=90%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Figure 17. Output Voltage and Current vs. Input Voltage at V+ = 24 V,
PMW Frequency of 10 kHz, and Duty Cycle of 90%
Tek Run: SVOOMS/s Salee [ T ] “W WNW w cm 20.0v ch: 5.00v 10.0mm M 10.0}15 cha .r LBV Tek Run: SVOOMS/s Salee [ T ] “WW/WW <>< chl="" 20.0v="" 10.0mm="" m10.0}as="" char="" lbv="" cha="" 5.00v="">
V+=12 V fPWM=20 kHz Duty Cycle=50%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Analog Integrated Circuit Device Data
Freescale Semiconductor 17
33887
ELECTRICAL CHARACTERISTICS
TYPICAL SWITCHING WAVEFORMS
Figure 18. Output Voltage and Current vs. Input Voltage at V+ = 12 V,
PMW Frequency of 20 kHz, and Duty Cycle of 50% for a Purely Resistive Load
V+=12 V fPWM=20 kHz Duty Cycle=90%
Output Voltage
(OUT1)
IOUT
Input Voltage
(IN1)
Figure 19. Output Voltage and Current vs. Input Voltage at V+ = 12 V,
PMW Frequency of 20 kHz, and Duty Cycle of 90% for a Purely Resistive Load
Analog Integrated Circuit Device Data
18 Freescale Semiconductor
33887
ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES
ELECTRICAL PERFORMANCE CURVES
        









9ROWV
2KPV
Figure 20. Typical High-Side RDS(ON) Versus V+
        






2+06
9
3:5
2KPV
9ROWV
Figure 21. Typical Low-Side RDS(ON) Versus V+
        






2+06
9
3:5




0LOOLDPSHUHV
9ROWV
Analog Integrated Circuit Device Data
Freescale Semiconductor 19
33887
ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES
Figure 22. Typical Quiescent Supply Current Versus V+
:T :Lm}
Table 6. Truth Table
The tri-state conditions and the fault status are reset using D1 or D2. The truth table uses the following notations: L = LOW,
H = HIGH, X = HIGH or LOW, and Z = High impedance (all output power transistors are switched off).
Device State
Input Conditions
Fault
Status
Flag
Output States
EN D1 D2 IN1 IN2 FS OUT1 OUT2
Forward H L H H L H H L
Reverse H L H L H H L H
Freewheeling Low H L H L L H L L
Freewheeling High HLHHHHHH
Disable 1 (D1) H H X X X L Z Z
Disable 2 (D2)H X L X X L Z Z
IN1 Disconnected H L H Z X H H X
IN2 Disconnected H L H X Z H X H
D1 Disconnected H Z X X X L Z Z
D2 Disconnected H X Z X X L Z Z
Undervoltage (34) H X X X X L Z Z
Overtemperature (35) H X X X X L Z Z
Short Circuit (35) H X X X X L Z Z
Sleep Mode EN L X X X X H Z Z
EN Disconnected Z X X X X H Z Z
Notes
34 In the case of an undervoltage condition, the outputs tri-state and the fault status is SET logic LOW. Upon undervoltage recovery, fault
status is reset automatically or automatically cleared and the outputs are restored to their original operating condition.
35 When a short circuit or overtemperature condition is detected, the power outputs are tri-state latched-OFF independent of the input
signals and the fault status flag is SET logic LOW.
Analog Integrated Circuit Device Data
20 Freescale Semiconductor
33887
ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES
6 Tth Table nd STATIC ELECTRICAL CHARACTERISTICS 9 Figure 11 fl 6 Tmlh Table E NEO and or or
Analog Integrated Circuit Device Data
Freescale Semiconductor 21
33887
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
Numerous protection and operational features (speed,
torque, direction, dynamic braking, PWM control, and closed-
loop control), in addition to the 5.0 A current capability, make
the 33887 a very attractive, cost-effective solution for
controlling a broad range of small DC motors. In addition, a
pair of 33887 devices can be used to control bipolar stepper
motors. The 33887 can also be used to excite transformer
primary windings with a switched square wave to produce
secondary winding AC currents.
FUNCTIONAL PIN DESCRIPTIONS
POWER GROUND AND ANALOG GROUND
(PGND AND AGND)
Power and analog ground pins should be connected
together with a very low impedance connection.
POSITIVE POWER SUPPLY (V+)
V+ pins are the power supply inputs to the device. All V+
pins must be connected together on the printed circuit board
with as short as possible traces offering as low impedance as
possible between pins.
V+ pins have an undervoltage threshold. If the supply
voltage drops below a V+ undervoltage threshold, the output
power stage switches to a tri-state condition and the fault
status flag is SET and the Fault Status pin voltage switched
to a logic LOW. When the supply voltage returns to a level
that is above the threshold, the power stage automatically
resumes normal operation according to the established
condition of the input pins and the fault status flag is
automatically reset logic HIGH.
As V+ increases in value above 28 V, the charge pump
performance begins to degrade. At +40 V, the charge pump
is effectively non-functional. Operation at this high voltage
level will result in the output FETs not being enhanced when
turned on. This means that the voltage on the output will be
VOUT = (V+) – VGS. This increased voltage drop under load
will produce a higher power dissipation.
FAULT STATUS (FS)
The FS pin is the device fault status output. This output is
an active LOW open drain structure requiring a pull-up
resistor to 5.0 V. Refer to Table 6, Truth Table, page 20.
LOGIC INPUT CONTROL AND DISABLE
(IN1, IN2, D1, AND D2)
These pins are input control pins used to control the
outputs. These pins are 5.0 V CMOS-compatible inputs with
hysteresis. The IN1 and IN2 independently control OUT1 and
OUT2, respectively. D1 and D2 are complementary inputs
used to tri-state disable the H-Bridge outputs.
When either D1 or D2 is SET (D1 = logic HIGH or D2 =
logic LOW) in the disable state, outputs OUT1 and OUT2 are
both tri-state disabled; however, the rest of the circuitry is fully
operational and the supply IQ (standby) current is reduced to a
few milliamperes. Refer to Table 6, Truth Table, and STATIC
ELECTRICAL CHARACTERISTICS table, page 9.
H-BRIDGE OUTPUT (OUT1 AND OUT2)
These pins are the outputs of the H-Bridge with integrated
output MOSFET body diodes. The bridge output is controlled
using the IN1, IN2, D1, and D2 inputs. The low-side
MOSFETs have active current limiting above the ILIM
threshold. The outputs also have thermal shutdown (tri-state
latch-OFF) with hysteresis as well as short circuit latch-OFF
protection.
A disable timer (time t
b) USED to detect currents that are
higher than current limit is activated at each output activation
to facilitate hard short detection (see Figure 11, page 13).
Charge Pump Capacitor (CCP)
A filter capacitor (up to 33 nF) can be connected from the
charge pump output pin and PGND. The device can operate
without the external capacitor, although the CCP capacitor
helps to reduce noise and allows the device to perform at
maximum speed, timing, and PWM frequency.
ENABLE (EN)
The EN pin is used to place the device in a sleep mode so
as to consume very low currents. When the EN pin voltage is
a logic LOW state, the device is in the sleep mode. The
device is enabled and fully operational when the EN pin
voltage is logic HIGH. An internal pull-down resistor
maintains the device in sleep mode in the event EN is driven
through a high impedance I/O or an unpowered
microcontroller, or the EN input becomes disconnected.
FEEDBACK FOR H-BRIDGE (FB)
The 33887 has a feedback output (FB) for “real time”
monitoring of H-Bridge high-side current to facilitate closed-
loop operation for motor speed and torque control.
The FB pin provides current sensing feedback of the
H-Bridge high-side drivers. When running in forward or
reverse direction, a ground referenced 1/375th (0.00266) of
load current is output to this pin. Through an external resistor
to ground, the proportional feedback current can be
converted to a proportional voltage equivalent and the
controlling microcontroller can “read” the current proportional
1or
Analog Integrated Circuit Device Data
22 Freescale Semiconductor
33887
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTIONS
voltage with its analog-to-digital converter (ADC). This is
intended to provide the user with motor current feedback for
motor torque control. The resistance range for the linear
operation of the FB pin is 100 < RFB < 200 Ω.
If PWM-ing is implemented using the disable pin inputs
(either D1 or D2), a small filter capacitor (1.0 μF or less) may
be required in parallel with the external resistor to ground for
fast spike suppression.
Figure 2 IN 7 LOW. HIGH.
Analog Integrated Circuit Device Data
Freescale Semiconductor 23
33887
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
The 33887 Simplified Internal Block Diagram shown in
Figure 2, page 2, is a fully protected monolithic H-Bridge with
Enable, Fault Status reporting, and High-Side current sense
feedback to accommodate closed-loop PWM control. For a
DC motor to run, the input conditions need be as follows:
Enable input logic HIGH, D1 input logic LOW, D2 input logic
HIGH, FS flag cleared (logic HIGH), one IN logic LOW and
the other IN logic HIGH (to define output polarity). The 33887
can execute dynamic braking by simultaneously turning on
either both high-side MOSFETs or both low-side MOSFETs
in the output H-Bridge; e.g., IN1 and IN2 logic HIGH or IN1
and IN2 logic LOW.
The 33887 outputs are capable of providing a continuous
DC load current of 5.0 A from a 28 V V+ source. An internal
charge pump supports PWM frequencies to 10 kHz. An
external pull-up resistor is required at the FS pin for fault
status reporting. The 33887 has an analog feedback (current
mirror) output pin (the FB pin) that provides a constant-
current source ratioed to the active high-side MOSFET. This
can be used to provide “real time” monitoring of load current
to facilitate closed-loop operation for motor speed/torque
control.
Two independent inputs (IN1 and IN2) provide control of
the two totem-pole half-bridge outputs. Two disable inputs
(D1 and D2) provide the means to force the H-Bridge outputs
to a high-impedance state (all H-Bridge switches OFF). An
EN pin controls an enable function that allows the 33887 to
be placed in a power-conserving sleep mode.
The 33887 has undervoltage shutdown with automatic
recovery, active current limiting, output short-circuit latch-
OFF, and overtemperature latch-OFF. An undervoltage
shutdown, output short-circuit latch-OFF, or overtemperature
latch-OFF fault condition will cause the outputs to turn OFF
(i.e., become high impedance or tri-stated) and the fault
output flag to be set LOW. Either of the Disable inputs or V+
must be “toggled” to clear the fault flag.
Active current limiting is accomplished by a constant OFF-
time PWM method employing active current limiting threshold
triggering. The active current limiting scheme is unique in that
it incorporates a junction temperature-dependent current limit
threshold. This means the active current limiting threshold is
“ramped down” as the junction temperature increases above
160°C, until at 175°C the current will have been decreased to
about 4.0 A. Above 175°C, the overtemperature shutdown
(latch-OFF) occurs. This combination of features allows the
device to remain in operation for 30 seconds at junction
temperatures above 150°C for nonrepetitive unexpected
loads.
rnuT Figure 9 ompm ON cycle occurs (see Figures 11 and E Q 7 fl
Analog Integrated Circuit Device Data
24 Freescale Semiconductor
33887
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
PROTECTION AND DIAGNOSTIC FEATURES
SHORT CIRCUIT PROTECTION
If an output short circuit condition is detected, the power
outputs tri-state (latch-OFF) independent of the input (IN1
and IN2) states, and the fault status output flag is SET logic
LOW. If the D1 input changes from logic HIGH to logic LOW,
or if the D2 input changes from logic LOW to logic HIGH, the
output bridge will become operational again and the fault
status flag will be reset (cleared) to a logic HIGH state.
The output stage will always switch into the mode defined
by the input pins (IN1, IN2, D1, and D2), provided the device
junction temperature is within the specified operating
temperature range.
ACTIVE CURRENT LIMITING
The maximum current flow under normal operating
conditions is internally limited to ILIM (5.2 A to 7.8 A). When
the maximum current value is reached, the output stages are
tri-stated for a fixed time (t
a) of 20 μs typical. Depending on
the time constant associated with the load characteristics, the
current decreases during the tri-state duration until the next
output ON cycle occurs (see Figures 11 and 14, page 13 and
page 15, respectively).
The current limiting threshold value is dependent upon the
device junction temperature. When -40°C TJ 160°C, ILIM
is between 5.2 A to 7.8 A. When TJ exceeds 160°C, the ILIM
current decreases linearly down to 4.0 A typical at 175°C.
Above 175°C the device overtemperature circuit detects TLIM
and overtemperature shutdown occurs (see Figure 9,
page 12). This feature allows the device to remain
operational for a longer time but at a regressing output
performance level at junction temperatures above 160°C.
Output Avalanche Protection
An inductive fly-back event, namely when the outputs are
suddenly disabled and V+ is lost, could result in electrical
overstress of the drivers. To prevent this the V+ input to the
33887 should not exceed the maximum rating during a fly-
back condition. This may be done with either a zener clamp
and/or an appropriately valued input capacitor with
sufficiently low ESR.
OVERTEMPERATURE SHUTDOWN AND
HYSTERESIS
If an overtemperature condition occurs, the power outputs
are tri-stated (latched-OFF) and the fault status flag is SET to
logic LOW.
To reset from this condition, D1 must change from logic
HIGH to logic LOW, or D2 must change from logic LOW to
logic HIGH. When reset, the output stage switches ON again,
provided that the junction temperature is now below the
overtemperature threshold limit minus the hysteresis.
Note Resetting from the fault condition will clear the fault
status flag.
fie
Analog Integrated Circuit Device Data
Freescale Semiconductor 25
33887
TYPICAL APPLICATIONS
TYPICAL APPLICATIONS
Figure 23 shows a typical application schematic. For precision high-current applications in harsh, noisy environments, the V+
by-pass capacitor may need to be substantially larger.
+
+
DC
MOTOR
AGND
OUT1
FB
PGND
V+
CCP
OUT2
EN
D2
D1
FS
IN1
IN2
33887
V+
33 nF
1.0 μF100 Ω
FB
IN2
IN1
FS
D1
EN
D2
47 μF
Figure 23. 33887 Typical Application Schematic
e um) Figure
Analog Integrated Circuit Device Data
26 Freescale Semiconductor
33887
PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
The 33887 packages are designed for thermal
performance. The significant feature of these packages is the
exposed pad on which the power die is soldered. When
soldered to a PCB, this pad provides a path for heat flow to
the ambient environment. The more copper area and
thickness on the PCB, the better the power dissipation and
transient behavior will be.
Example Characterization on a double-sided PCB:
bottom side area of copper is 7.8 cm2; top surface is 2.7 cm2
(see Figure ); grid array of 24 vias 0.3 mm in diameter
.
Top Side Bottom Side
Figure 24. PCB Test Layout
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Analog Integrated Circuit Device Data
Freescale Semiconductor 27
33887
PACKAGING
PACKAGING DIMENSIONS
PACKAGING DIMENSIONS
Important For the most current revision of the package, visit www.freescale.com and perform a keyword search on the 98A
drawing number below
VW SUFFIX
20-PIN HSOP
98ASH70702A
ISSUE B
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VW SUFFIX
20-PIN HSOP
98ASH70702A
ISSUE B
Analog Integrated Circuit Device Data
28 Freescale Semiconductor
33887
PACKAGING
PACKAGING DIMENSIONS
Ell PW 1 TNDEX AREA Z 5-6 2x +‘ 3s 283 JUUUTUUUL ‘ _1 J_ T E E 5 z :I \ 7|: 55 :l __’E .IID‘GAJE :I [F I: :I | I: 6 7 I I: 1\ T I EXPOSED METAL PADflfl HH‘HHHH m )‘u DETATL N 32x 8&0 r j E0T®IIEI «32X $955 ”056”). VTEw MiM ©“‘EE;"L*LLE]2§W 7E _, ”r ‘ MECHANICAL OUTLINE | PRTNT VERSTON NOT To SCALE ‘HTLE: POWER QUAD FLAT DOCUMENT N0195ASATDSEBD REV: C NONiLEADED PACKAGE (PWR OFN), CASE NUMBERHSOBrU‘T T4 JUL 2005 36 TERM‘NAL 0‘8 P‘TCH(9X9X2.T) STANDARD JEDEC MOrZSTA AEEEH
FK (Pb-FREE) SUFFIX
36-PIN PQFN
98ASA10583D
ISSUE C
Analog Integrated Circuit Device Data
Freescale Semiconductor 29
33887
PACKAGING
PACKAGING DIMENSIONS
rAuK L 32X 005 J ( > 83M ‘ 4 3 DETA‘L N CORNER CONF‘GURAT‘ON // OJ c 2»; 2.20 2.0 1.95 5-! A ‘ El 4 H H 7 i ,; nlfllfill 7 * g-ggl L \ijm (M) SEAnNc PLANE DETA‘L G vwa ROTATED 90' cw “' ‘ MECHANICAL OUTLINE PR‘NT VERS‘ON NOT TO SCALE WEE: [:0ng QUAD FLAT DOCUMENT NO eaAsAmsasD REV: 12 NONiLEADED PACKAGE (PWR QFN), CASE NUMBER'1503—04 14 JUL 2005 36 TERM‘NAL 0.8 P‘TCH(9X9X2.1) STANDARD: JEDEC MUrZSWA AEEErW
FK (Pb-FREE) SUFFIX
36-PIN PQFN
98ASA10583D
ISSUE C
Analog Integrated Circuit Device Data
30 Freescale Semiconductor
33887
PACKAGING
PACKAGING DIMENSIONS
PTN‘S NUMBER \ PTN T TNDEX 1 27 18V!) '5 3:53 / <0 a="" t="" seattng="" plane="" 54x="" ”‘1="" l-="" ;="" (019)="" k="" plattng="" metal="" 9="" l:="" v="" 25)="" 0="" base="" metal/{kg="" 3:44="" a="" i="" section="" aia="" qf-eeviizle="" ‘enj="" lll="" mrw="" t="" ‘="" mechanical="" outline="" print="" version="" not="" to="" scale="" title:="" 54ld="" son:="" w/b.="" ol="" 65="" pitch="" 4.="" 6="" x="" 4.="" 6="" exposed="" pad,="" caseioutline="" document="" no:="" 95asa10506d="" case="" number:="" 1390702="" rev.="" c="" m="" mar="" 2005="" standard.="" nonijedec="">
EK SUFFIX (PB-FREE)
54-PIN SOICW EXPOSED PAD
98ASA10506D
ISSUE C
Analog Integrated Circuit Device Data
Freescale Semiconductor 31
33887
PACKAGING
PACKAGING DIMENSIONS
rAuK WEW C70 Q inix‘ALE \,E\ 4LL vmn I «E, J' 114‘ ‘ MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE TITLE 54LD SOIC W/B, 0.65 PITCH 4.6 X 4.6 EXPOSED PAD CASEioUTLINE DOCUMENT ND: SEASAlOSOED CASE NUMBER: 1390702 REV: C H MAR 2005 STANDARD: NON—JEDEC
EK SUFFIX (PB-FREE)
54-PIN SOICW EXPOSED PAD
98ASA10506D
ISSUE C
Analog Integrated Circuit Device Data
32 Freescale Semiconductor
33887
PACKAGING
PACKAGING DIMENSIONS
} ] { mmnmmmmmm:
20-PIN
HSOP-EP
33887HSOP
Note For package dimensions, refer to
the 33887 device data sheet.
VW SUFFIX
98ASH70273A
20-PIN HSOP-EP
Analog Integrated Circuit Device Data
Freescale Semiconductor 33
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Introduction
This thermal addendum is provided as a supplement to the MC33887 technical
data sheet. The addendum provides thermal performance information that may
be critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
The MC33887 is offered in a 20 pin HSOP exposed pad, single die package.
There is a single heat source (P), a single junction temperature (TJ), and thermal
resistance (RθJA).
TJ=RθJA .P
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 7. Thermal Performance Comparison
Thermal Resistance [°C/W]
RθJA(1),(2) 20
RθJB (2),(3) 6.0
RθJA (1), (4) 52
RθJC (5) 1.0
NOTES:
1.Per JEDEC JESD51-2 at natural convection, still air condition.
2.2s2p thermal test board per JEDEC JESD51-5 and JESD51-7.
3.Per JEDEC JESD51-8, with the board temperature on the center
trace near the center lead.
4.Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5.Thermal resistance between the die junction and the exposed
pad surface; cold plate attached to the package bottom side,
remaining surfaces insulated
1.0
1.0
0.2
0.2
Soldermast
openings
Thermal vias
connected to top
buried plane
* All measurements
are in millimeters
20 Terminal HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
Figure 25. Thermal Land Pattern for Direct Thermal
Attachment According to JESD51-5
on: 80 3 o‘cron:\o : on: 3$Og~.oypim2(?oio o %?ii233? 1 ncri’ Fi me 26
ENAGND
IN2
D1
CCP
V+
OUT2
OUT2
D2
PGND
PGND
FS
V+
OUT1
OUT1
FB
PGND
PGND
IN1
V+
1
2
3
4
5
6
7
8
9
10
20
19
16
15
14
13
12
11
18
17
Tab
Tab
33887 Pin Connections
20-Pin HSOP-EP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
A
Analog Integrated Circuit Device Data
34 Freescale Semiconductor
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 26. Thermal Test Board
Device on Thermal Test Board
Material: Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Outline: 80 mm x 100 mm board area,
including edge connector for thermal
testing
Area A:Cu heat spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 8. Thermal Resistance Performance
Thermal Resistance Area A (mm2)°C/W
RθJA 0.0 52
300 36
600 32
RθJS 0.0 10
300 7.0
600 6.0
RθJA is the thermal resistance between die junction and
ambient air.
RθJS is the thermal resistance between die junction and the
reference location on the board surface near a center lead of the
package (see Figure 26).
0
10
20
30
40
50
60
Heat spreading area A [mm²]
Thermal Resistance [ºC/W
]
0 300 600
R
θ
JA
x
Analog Integrated Circuit Device Data
Freescale Semiconductor 35
33887
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Figure 27. Device on Thermal Test Board RθJA
0.1
1
10
100
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time[s]
Thermal Resistance [ºC/W]
Figure 28. Transient Thermal Resistance RθJA
Device on Thermal Test Board Area A = 600 (mm2)
Added Thermal Addendum 8. Converted to Freescaie format, Revised PQFN drawing‘ made Updated Ordering information block with new epp information Changed the third paragraph of the introduction on page 1 Figure 20 Figure 21 Figure 22 Removed part numbers MCS3887APVW/R2, MC33887DH/R2, MC33887DWB/R2‘ MCSS887AVW/ Removed the DH suffix information from the Maximum Ratings Table on Page 7
Analog Integrated Circuit Device Data
36 Freescale Semiconductor
33887
REVISION HISTORY
REVISION HISTORY
REVISION DATE DESCRIPTION
10.0 7/2005 Added Thermal Addendum & Converted to Freescale format, Revised PQFN drawing, made
several minor spelling correction. Added 33887A
11.0 11/2006 Updated Ordering information block with new epp information
Changed the supply/ operating voltage from 40 V to 28 V
Updated all package drawings to the current revision
Adjusted to match device performance characteristics
Updated the document to the prevailing Freescale form and style
Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter from
Maximum Ratings on page 7.
Added note (8)
Added MCZ33887EK/R2 to the Ordering Information on Page 1
Removed the 33887A from the data sheet and deleted Product Variation section now that is no
longer needed.
12.0 1/2007 Changed the third paragraph of the introduction on page 1
Altered feature number 1 on page 1
Added feature number 2 on page 1
Changed Maximum Supply Voltage (1) to 0.3 to 40 V
Added note (1)
Changed note (16)
Added a third paragraph to Positive Power Supply (V+) on page 21
•Replaced Figure 20, Figure 21, and Figure 22 with updated information.
13.0 10/2008 Added Part Number MC33887AVW/R2 to Ordering Information Table on page 1.
14.0 3/2011 Removed part numbers MC33887APVW/R2, MC33887DH/R2, MC33887DWB/R2, MC33887AVW/
R2, MC33887PNB/R2 and MCZ33887EK/R2 and replaced with part numbers MC33887APVW/R2,
MC33887PFK/R2 and MC33887PEK/R2 in Ordering Information Table on Page 1.
15.0 9/2011 Removed the DH suffix information from the Maximum Ratings Table on Page 7.
Changed VW Suffix HSOP, SOICW-EP, and PQFN ESD Voltage to ESD Voltage in the Maximum
Ratings Table on Page 7.
Updated Freescale form and style.
16.0 10/2012 Changed “my” to “may” in footnote 29 for Table 5.
freescale"
Document Number: MC33887
Rev. 16.0
10/2012
Information in this document is provided solely to enable system and software
implementers to use Freescale products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits on the
information in this document.
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herein. Freescale makes no warranty, representation, or guarantee regarding the
suitability of its products for any particular purpose, nor does Freescale assume any
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disclaims any and all liability, including without limitation consequential or incidental
damages. “Typical” parameters that may be provided in Freescale data sheets and/or
specifications can and do vary in different applications, and actual performance may
vary over time. All operating parameters, including “typicals,” must be validated for
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