TLV700xx Datasheet by Texas Instruments

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TLV700xx
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TLV700
SLVSA00E –SEPTEMBER 2009REVISED APRIL 2015
TLV700 200-mA, Low-I
Q
, Low-Dropout Regulator for Portable Devices
1 Features 3 Description
The TLV700 series of low-dropout (LDO) linear
1 Very Low Dropout: regulators are low quiescent current devices with
43 mV at IOUT = 50 mA, VOUT = 2.8 V excellent line and load transient performance. These
85 mV at IOUT = 100 mA, VOUT = 2.8 V LDOs are designed for power-sensitive applications.
A precision bandgap and error amplifier provides
175 mV at IOUT = 200 mA, VOUT = 2.35 V overall 2% accuracy. Low output noise, very high
2% Accuracy power-supply rejection ratio (PSRR), and low dropout
Low IQ: 31 μAvoltage make this series of devices ideal for most
battery-operated handheld equipment. All device
Available in Fixed-Output Voltages from 1.2 V to versions have thermal shutdown and current limit for
4.8 V safety.
High PSRR: 68 dB at 1 kHz Furthermore, these devices are stable with an
Stable With Effective Capacitance of 0.1 μF(1) effective output capacitance of only 0.1 μF. This
Thermal Shutdown and Overcurrent Protection feature enables the use of cost-effective capacitors
Available in 1.5-mm × 1.5-mm SON-6, SOT23-5, that have higher bias voltages and temperature
and SC-70 Packages derating. The devices regulate to specified accuracy
with no output load.
(1) See the Input and Output Capacitor Requirements.
The TLV700 series of LDOs are available in 1.5-mm
2 Applications × 1.5-mm SON-6, SOT-5, and SC70 packages.
Wireless Handsets Device Information(1)
Smart Phones, PDAs PART NUMBER PACKAGE BODY SIZE (NOM)
• ZigBee®Networks SC70 (5) 2.00 mm × 1.25 mm
Bluetooth®Devices TL700xx SOT (5) 2.90 mm × 1.60 mm
Li-Ion Operated Handheld Products WSON (6) 1.50 mm × 1.50 mm
WLAN and Other PC Add-on Cards (1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Circuit
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features.................................................................. 18 Application and Implementation ........................ 13
8.1 Application Information............................................ 13
2 Applications ........................................................... 18.2 Typical Application .................................................. 13
3 Description ............................................................. 19 Power Supply Recommendations...................... 14
4 Revision History..................................................... 210 Layout................................................................... 15
5 Pin Configuration and Functions......................... 410.1 Layout Guidelines ................................................. 15
6 Specifications......................................................... 510.2 Layout Examples................................................... 15
6.1 Absolute Maximum Ratings ...................................... 510.3 Thermal Protection................................................ 15
6.2 ESD Ratings.............................................................. 510.4 Power Dissipation ................................................. 16
6.3 Recommended Operating Conditions....................... 511 Device and Documentation Support ................. 17
6.4 Thermal Information.................................................. 511.1 Device Support .................................................... 17
6.5 Electrical Characteristics........................................... 611.2 Documentation Support ........................................ 17
6.6 Typical Characteristics.............................................. 711.3 Trademarks........................................................... 17
7 Detailed Description............................................ 11 11.4 Electrostatic Discharge Caution............................ 17
7.1 Overview ................................................................. 11 11.5 Glossary................................................................ 17
7.2 Functional Block Diagram....................................... 11 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 11 Information ........................................................... 18
7.4 Device Functional Modes........................................ 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2012) to Revision E Page
Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Deleted Applications bullet for MP3 Players .......................................................................................................................... 1
Changed front-page graphic .................................................................................................................................................. 1
Changed Pin Configuration and Functions section; updated table format ............................................................................ 4
Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement.................... 5
Deleted Dissipation Ratings table .......................................................................................................................................... 5
Changed Thermal Information table; updated thermal resistance values for all packages ................................................... 5
Changes from Revision C (July 2011) to Revision D Page
Updated Figure 5.................................................................................................................................................................... 7
Changes from Revision B (December, 2010) to Revision C Page
Added footnote 2 to Absolute Maximum Ratings table .......................................................................................................... 5
Changed output current limit typical and maximum specifications......................................................................................... 6
Deleted previous Figure 12, Current Limit vs Input Voltage typical characteristic................................................................. 7
Changes from Revision A (April, 2010) to Revision B Page
Removed TLV701xx device references throughout document .............................................................................................. 1
Changed minimum output voltage available from 0.7 V to 1.2 V........................................................................................... 1
Added footnote (1).................................................................................................................................................................. 1
Deleted VOUT < 1 V specification ............................................................................................................................................ 6
Deleted Active pulldown resistance parameter ...................................................................................................................... 6
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Changed Figure 4 title ............................................................................................................................................................ 7
Changed Figure 5 title ............................................................................................................................................................ 7
Removed TLV701xx block diagram...................................................................................................................................... 11
Revised Shutdown section ................................................................................................................................................... 11
Updated Application Information section to reflect minimum output voltage availability of 1.2 V ........................................ 13
Deleted references to TLV701xx throughout Application Information.................................................................................. 13
Changed footnote 2 for Ordering Information table to reflect minimum output voltage of 1.2 V ......................................... 17
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l TEXAS INSTRUMENTS flflfl flflfl
OUT
N/C(1)
IN
GND
EN
1
2
3
5
4
OUT
N/C(1)
IN
GND
EN
1
2
3 4
5
EN
N/C(1)
N/C(1)
6
5
4
IN
GND
OUT
1
2
3
TLV700
SLVSA00E –SEPTEMBER 2009REVISED APRIL 2015
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5 Pin Configuration and Functions
DSE Package DCK Package
6-Pin WSON 5-Pin SC70
Top View Top View
DDC Package
5-Pin SOT
Top View
(1) No connection.
Pin Functions
PIN I/O DESCRIPTION
NAME WSON SC70 SOT
Input pin. A small, 1-μF ceramic capacitor is recommended from this pin to ground
IN 1 1 1 I to assure stability and good transient performance. See Input and Output
Capacitor Requirements for more details.
GND 2 2 2 Ground pin
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V
EN 6 3 3 I puts the regulator into shutdown mode and reduces operating current to 1 μA,
nominal.
NC 4, 5 4 4 No connection. This pin can be tied to ground to improve thermal dissipation.
Regulated output voltage pin. A small, 1-μF ceramic capacitor is needed from this
OUT 3 5 5 O pin to ground to assure stability. See Input and Output Capacitor Requirements for
more details.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating junction temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VIN –0.3 6
Voltage VEN –0.3 6(2) V
VOUT –0.3 6
Maximum output current IOUT Internally limited
Output short-circuit duration Indefinite
Operating junction, TJ–55 150
Temperature °C
Storage, Tstg –55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) VEN absolute maximum rating is VIN + 0.3 V or 6 V, whichever is less.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101, ±500
all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN 2 5.5 V
VOUT 1.2 4.8 V
IOUT 0 200 mA
6.4 Thermal Information
TLV700
THERMAL METRIC(1) DCK [SC70] DDC [SOT] DSE [WSON] UNIT
5 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 307.6 235.9 321.3
RθJC(top) Junction-to-case (top) thermal resistance 79.1 61.9 207.9
RθJB Junction-to-board thermal resistance 93.7 54 281.5 °C/W
ψJT Junction-to-top characterization parameter 1.3 0.8 42.4
ψJB Junction-to-board characterization parameter 92.8 53.4 284.8
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 142.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
At VIN = VOUT(nom) + 0.3 V or 2 V (whichever is greater); IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and TJ= –40°C to +125°C,
unless otherwise noted. Typical values are at TJ= 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2 5.5 V
VOUT DC output accuracy –40°C TJ+125°C –2% 2%
VOUT(nom) + 0.3 V VIN 5.5 V,
ΔVOUT(ΔVIN) Line regulation 1 5 mV
IOUT = 10 mA
ΔVOUT(ΔIOUT) Load regulation 0 mA IOUT 200 mA 1 15 mV
VIN = 0.98 × VOUT(nom), IOUT = 50 mA, 43
VOUT = 2.8 V
VIN = 0.98 × VOUT(nom), IOUT = 100 mA,
VDO Dropout voltage(1) 85 mV
VOUT = 2.8 V
VIN = 0.98 × VOUT(nom), IOUT = 200 mA, 175 250
VOUT = 2.35 V
ICL Output current limit VOUT = 0.9 × VOUT(nom) 220 860 mA
IOUT = 0 mA 31 55
IGND Ground pin current μA
IOUT = 200 mA, VIN = VOUT + 0.5 V 270
VEN 0.4 V, VIN = 2 V 400 nA
ISHDN Ground pin current (shutdown) VEN 0.4 V, 2 V VIN 4.5 V 1 2 μA
VIN = 2.3 V, VOUT = 1.8 V,
PSRR Power-supply rejection ratio 68 dB
IOUT = 10 mA, f = 1 kHz
BW = 100 Hz to 100 kHz,
VnOutput noise voltage 48 μVRMS
VIN = 2.3 V, VOUT = 1.8 V, IOUT = 10 mA
tSTR Start-up time(2) COUT = 1 μF, IOUT = 200 mA 100 μs
VEN(high) Enable pin high (enabled) 0.9 VIN V
VEN(low) Enable pin low (disabled) 0 0.4 V
IEN Enable pin current VIN = VEN = 5.5 V 0.04 0.5 μA
UVLO Undervoltage lockout VIN rising 1.9 V
Shutdown, temperature increasing 160
Tsd Thermal shutdown temperature °C
Reset, temperature decreasing 140
TJOperating junction temperature –40 125 °C
(1) VDO is measured for devices with VOUT(nom) 2.35 V.
(2) Start-up time = time from EN assertion to 0.98 × VOUT(nom).
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l TEXAS INSTRUMENTS 2/ // Ill / 130 0mm Currem (mA)
0 30 60 90 120 150 180 210
Output Current (mA)
180
160
140
120
100
80
60
40
20
0
Dropout Voltage (mV)
+125 C
+85 C
+25 C
40 C-
°
°
°
°
0 40 60 100 120 140 180 200
OutputCurrent(mA)
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
OutputVoltage(V)
+125 C
+85 C
+25 C
40 C-
°
°
°
°
20 80 160
250
200
150
100
50
0
DropoutVoltage(mV)
2.25 2.75 3.25 3.75 4.25 4.75
InputVoltage(V)
+125 C
+85 C
+25 C
40 C-
°
°
°
°
I =200mA
OUT
2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6
InputVoltage(V)
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
OutputVoltage(V)
+125 C
+85 C
+25 C
40 C-
°
°
°
°
I =10mA
OUT
2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6
InputVoltage(V)
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
OutputVoltage(V)
+125 C
+85 C
+25 C
40 C-
°
°
°
°
I =200mA
OUT
TLV700
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6.6 Typical Characteristics
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA,
VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ= 25°C.
Figure 1. TLV70018 Line Regulation Figure 2. TLV70018 Line Regulation
Figure 3. TLV70018 Load Regulation Figure 4. Dropout Voltage vs Input Voltage
Figure 5. Dropout Voltage vs Output Current, VOUT = 4.8 V Figure 6. TLV70018 Output Voltage vs Temperature
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2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8
InputVoltage(V)
80
70
60
50
40
30
20
10
0
PSRR(dB)
10kHz
100kHz
1kHz
100
90
80
70
60
50
40
30
20
10
0
PSRR(dB)
10 100 1k 10k 100k 1M 10M
Frequency(Hz)
I =150mA
OUT
I =10mA
OUT
V V =0.5V
IN OUT
-
2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6
InputVoltage(V)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
ShutdownCurrent( A)m
+125 C
+85 C
+25 C
°
°
°
40
35
30
25
20
15
10
5
0
GroundPinCurrent( A)m
-40 -25 -10 520 35 50 65 80 95 110 125
Temperature( C)
°
I =0mA
OUT
2.1 2.6 3.1 3.6 4.1 4.6 5.1 5.6
InputVoltage(V)
50
45
40
35
30
25
20
15
10
5
0
GroundPinCurrent( A)m
+125 C
+85 C
+25 C
40 C-
°
°
°
°
I =0mA
OUT
+125 C
+85 C
+25 C
40 C-
°
°
°
°
300
250
200
150
100
50
0
GroundPinCurrent( A)m
0 20 40 60 80 100 120 140 160 180 200
OutputCurrent(mA)
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Typical Characteristics (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA,
VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ= 25°C.
Figure 8. TLV70018 Ground Pin Current vs Load
Figure 7. TLV70018 Ground Pin Current vs Input Voltage
Figure 9. TLV70018 Ground Pin Current vs Temperature Figure 10. TLV70018 Shutdown Current vs Input Voltage
Figure 11. TLV70018 Power-Supply Ripple Rejection vs Figure 12. TLV70018 Power-Supply Ripple Rejection vs
Frequency Input Voltage
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1V/div
5mV/div
1ms/div
VOUT
SlewRate=1V/ sm
VIN
2.9V
2.3V
I 200mA
OUT =
1V/div
5mV/div
1ms/div
VOUT
VIN 2.7V
2.3V
I 1mA
OUT =
SlewRate=1V/ sm
20mA/div
5mV/div
10 s/divm
VOUT
VIN =2.3V
IOUT
10mA
0mA
t =t =1 s
R F m
50mA/div
20mV/div
10 s/divm
VOUT
VIN =2.3V
IOUT 50mA
0mA
t =t =1 s
R F m
10
1
0.1
0.01
0
OutputSpectralNoiseDensity( V/ )mHz
Ö
10 100 1k 10k 100k 1M 10M
Frequency(Hz)
I =10mA
C =C =1 F
OUT
m
IN OUT
100mA/div
50mV/div
10 s/divm
VOUT
VIN =2.1V
IOUT
200mA
0mA
t =t =1 s
R F m
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Typical Characteristics (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA,
VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ= 25°C.
Figure 14. TLV70018 Load Transient Response
Figure 13. TLV70018 Output Spectral Noise Density vs
Output Voltage
Figure 15. TLV70018 Load Transient Response Figure 16. TLV70018 Load Transient Response
Figure 17. TLV70018 Line Transient Response Figure 18. TLV70018 Line Transient Response
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1V/div
10mV/div
1ms/div
VOUT
VIN
5.5V
2.1V
I 200mA
OUT =
SlewRate=1V/ sm
1V/div
200ms/div
VOUT
VIN
I 1mA
OUT =
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Typical Characteristics (continued)
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(nom) + 0.5 V or 2 V, whichever is greater; IOUT = 10 mA,
VEN = VIN, COUT = 1 μF, unless otherwise noted. Typical values are at TJ= 25°C.
Figure 19. TLV70018 Line Transient Response Figure 20. TLV70018 VIN Ramp-Up, Ramp-Down Response
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Thermal
Shutdown
Current
Limit
UVLO
Bandgap
IN
EN
OUT
LOGIC
GND
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7 Detailed Description
7.1 Overview
The TLV700 series of LDO linear regulators are low quiescent current devices with excellent line and load
transient performance. These LDOs are designed for power-sensitive applications. A precision bandgap and
error amplifier provides overall 2% accuracy. Low output noise, very high PSRR, and low dropout voltage make
this series of devices ideal for most battery-operated handheld equipment. All device versions have integrated
thermal shutdown, current limit, and undervoltage lockout (UVLO).
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Internal Current Limit
The TLV700 internal current limit helps to protect the regulator during fault conditions. During current limit, the
output sources a fixed amount of current that is largely independent of the output voltage. In such a case, the
output voltage is not regulated, and is VOUT = ICL × RLOAD. The PMOS pass transistor dissipates (VIN – VOUT) ×
ICL until thermal shutdown is triggered and the device turns off. As the device cools down, it is turned on by the
internal thermal shutdown circuit. If the fault condition continues, the device cycles between current limit and
thermal shutdown. See Thermal Protection for more details.
The PMOS pass element in the TLV700 has a built-in body diode that conducts current when the voltage at OUT
exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is anticipated,
external limiting to 5% of the rated output current is recommended.
7.3.2 Shutdown
The enable pin (EN) is active high. The device is enabled when voltage at EN pin goes above 0.9 V. The device
is turned off when the EN pin is held at less than 0.4 V. When shutdown capability is not required, EN can be
connected to the IN pin.
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Feature Description (continued)
7.3.3 Dropout Voltage
The TLV700 uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout
voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the
RDS(on) of the PMOS pass element. VDO scales approximately with output current because the PMOS device
behaves as a resistor in dropout.
As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout.
This effect is shown in Figure 12 in Typical Characteristics.
7.3.4 Undervoltage Lockout (UVLO)
The TLV700 uses a UVLO circuit to keep the output shut off until internal circuitry is operating properly.
7.4 Device Functional Modes
7.4.1 Normal Operation
The device regulates to the nominal output voltage under the following conditions:
The input voltage is greater than the nominal output voltage added to the dropout voltage.
The output current is less than the current limit.
The input voltage is greater than the UVLO voltage.
7.4.2 Dropout Operation
If the input voltage is lower than the nominal output voltage plus the specified dropout voltage, but all other
conditions are met for normal operation, the device operates in dropout mode. In this condition, the output
voltage is the same the input voltage minus the dropout voltage. The transient performance of the device is
significantly degraded because the pass device is in a triode state and no longer regulates the output voltage of
the LDO. Line or load transients in dropout may result in large output voltage deviations.
Table 1 lists the conditions that lead to the different modes of operation.
Table 1. Device Functional Mode Comparison
PARAMETER
OPERATING MODE VIN IOUT
Normal mode VIN > VOUT(nom) + VDO IOUT < ICL
Dropout mode VIN < VOUT(nom) + VDO IOUT < ICL
Current limit VIN > UVLO IOUT > ICL
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TLV700xx
GND
EN
IN OUT
VIN VOUT
On
Off
CIN COUT
1 F
Ceramic
m
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TLV700 belongs to a new family of next-generation value LDO regulators. These devices consume low
quiescent current and deliver excellent line and load transient performance. These characteristics, combined with
low noise, very good PSRR with little (VIN – VOUT) headroom, make this family of devices ideal for RF portable
applications. This family of regulators offers current limit and thermal protection, and is specified from –40°C to
+125°C.
8.2 Typical Application
Figure 21 shows a typical application circuit.
Figure 21. Typical Application Circuit
8.2.1 Design Requirements
Table 2 lists the design parameters.
Table 2. Design Parameters
PARAMETER DESIGN REQUIREMENT
Input voltage 2.5 V to 3.3 V
Output voltage 1.8 V
Output current 100 mA
8.2.2 Detailed Design Procedure
8.2.2.1 Input and Output Capacitor Requirements
TI recommends using 1-μF X5R- and X7R-type ceramic capacitors because these capacitors have minimal
variation in value and equivalent series resistance (ESR) over temperature.
However, the TLV700 is designed to be stable with an effective capacitance of 0.1 μF or larger at the output.
Thus, the device is stable with capacitors of other dielectric types as well, as long as the effective capacitance
under operating bias voltage and temperature is greater than 0.1 μF. This effective capacitance refers to the
capacitance that the LDO sees under operating bias voltage and temperature conditions; that is, the capacitance
after taking both bias voltage and temperature derating into consideration. In addition to allowing the use of
cheaper dielectrics, this capability of being stable with 0.1-μF effective capacitance also enables the use of
smaller footprint capacitors that have higher derating in size- and space-constrained applications.
Using a 0.1-μF rated capacitor at the output of the LDO does not ensure stability because the effective
capacitance under the specified operating conditions must not be less than 0.1 μF. Maximum ESR should be
less than 200 mΩ.
Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: TLV700
l TEXAS INSTRUMENTS
50mA/div
20mV/div
10 s/divm
VOUT
VIN =2.3V
IOUT 50mA
0mA
t =t =1 s
R F m
1V/div
5mV/div
1ms/div
VOUT
SlewRate=1V/ sm
VIN
2.9V
2.3V
I 200mA
OUT =
TLV700
SLVSA00E –SEPTEMBER 2009REVISED APRIL 2015
www.ti.com
Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1-μF to 1-
μF, low ESR capacitor across the IN pin and GND in of the regulator. This capacitor counteracts reactive input
sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be
necessary if large, fast rise-time load transients are anticipated, or if the device is not located close to the power
source. If source impedance is more than 2 Ω, a 0.1-μF input capacitor may be necessary to ensure stability.
8.2.2.2 Transient Response
As with any regulator, increasing the size of the output capacitor reduces overshoot and undershoot magnitude
but increases the duration of the transient response.
8.2.3 Application Curves
Figure 23. TLV70018 Line Transient Response
Figure 22. TLV70018 Load Transient Response
9 Power Supply Recommendations
Connect a low output impedance power supply directly to the INPUT pin of the TLV700. Inductive impedances
between the input supply and the INPUT pin can create significant voltage excursions at the INPUT pin during
start-up or load transient events.
14 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: TLV700
l TEXAS INSTRUMENTS
COUT
VOUT
VIN
GND PLANE
CIN
Represents via used for
application specific connections
IN
GND
OUT NC
EN
NC
COUT
VOUT
VIN
GND PLANE
CIN
Represents via used for
application specific connections
IN
GND
EN NC
OUT
TLV700
www.ti.com
SLVSA00E –SEPTEMBER 2009REVISED APRIL 2015
10 Layout
10.1 Layout Guidelines
Input and output capacitors should be placed as close to the device pins as possible. To improve AC
performance such as PSRR, output noise, and transient response, TI recommends designing the printed-circuit-
boards with separate ground planes for VIN and VOUT, with the ground plane connected only at the GND pin of
the device. In addition, the ground connection for the output capacitor should be connected directly to the GND
pin of the device. High ESR capacitors may degrade PSRR performance.
10.2 Layout Examples
Figure 24. Layout Example for the DCK and DDC Package
Figure 25. Layout Example for the DSE Package
10.3 Thermal Protection
Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the
device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage as a
result of overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions.
For good reliability, thermal protection should trigger at least 35°C above the maximum expected ambient
condition of the particular application. This configuration produces a worst-case junction temperature of 125°C at
the highest expected ambient temperature and worst-case load.
Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: TLV700
l TEXAS INSTRUMENTS Pu Vw ’Vour X lam
P =(V V ) I- ´
D IN OUT OUT
TLV700
SLVSA00E –SEPTEMBER 2009REVISED APRIL 2015
www.ti.com
Thermal Protection (continued)
The internal protection circuitry of the TLV700 has been designed to protect against overload conditions. The
protection circuitry was not intended to replace proper heatsinking. Continuously running the TLV700 into thermal
shutdown degrades device reliability.
10.4 Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the PCB layout. The PCB area around the device that is free of other components moves the heat from the
device to the ambient air. Performance data for JEDEC low and high-K boards are given in Thermal Information.
Using heavier copper increases the effectiveness in removing heat from the device. The addition of plated
through-holes to heat-dissipating layers also improves heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of
the output current and the voltage drop across the output pass element, as shown in Equation 1.
(1)
16 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: TLV700
l TEXAS INSTRUMENTS
TLV700
www.ti.com
SLVSA00E –SEPTEMBER 2009REVISED APRIL 2015
11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
11.1.1.1 Evaluation Modules
Three evaluation modules (EVMs) are available to assist in the initial circuit performance evaluation using the
TLV700:
TLV70033EVM-503
TLV70018EVM-503
TLV70028EVM-463
These EVMs can be requested at the Texas Instruments website through the product folders or purchased
directly from the TI eStore.
11.1.1.2 Spice Models
Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of
analog circuits and systems. A SPICE model for the TLV700 is available through the product folders under Tools
& Software.
11.1.2 Device Nomenclature
Table 3. Ordering Information(1)
PRODUCT VOUT (2)
TLV700xx yyyz XX is nominal output voltage (for example, 28 = 2.8 V).
YYY is the package designator.
Zis tape and reel quantity (R = 3000, T = 250).
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2) Output voltages from 1.2 V to 4.8 V in 50-mV increments are available. Contact factory for details and availability.
11.2 Documentation Support
11.2.1 Related Documentation
Using the TLV700xxEVM-463 Evaluation Module,SLUU390
Using the TLV700xxEVM-503 Evaluation Module,SLUU391
11.3 Trademarks
Bluetooth is a registered trademark of Bluetooth SIG.
ZigBee is a registered trademark of the ZigBee Alliance.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2009–2015, Texas Instruments Incorporated Submit Documentation Feedback 17
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l TEXAS INSTRUMENTS
TLV700
SLVSA00E –SEPTEMBER 2009REVISED APRIL 2015
www.ti.com
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
18 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: TLV700
I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV70012DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODT
TLV70012DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODT
TLV70012DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO
TLV70012DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODO
TLV70012DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NH
TLV70012DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NH
TLV70013DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH
TLV70013DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SAH
TLV70015DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODU
TLV70015DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODU
TLV70015DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODP
TLV70015DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODP
TLV70015DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NJ
TLV70015DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NJ
TLV70018DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODV
TLV70018DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODV
TLV70018DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODK
TLV70018DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODK
TLV70018DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NK
TLV70018DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 85 NK
I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV70019DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCJ
TLV70019DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCJ
TLV70022DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCI
TLV70022DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCI
TLV70025DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 QTP
TLV70025DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 QTP
TLV70025DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 DAU
TLV70025DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 DAU
TLV70025DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QY
TLV70025DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 QY
TLV70028DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODW
TLV70028DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODW
TLV70028DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODL
TLV70028DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODL
TLV70028DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NL
TLV70028DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NL
TLV70029DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 QJ
TLV70029DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 QJ
TLV70030DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODR
TLV70030DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODR
TLV70030DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODM
I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TLV70030DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODM
TLV70030DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NP
TLV70030DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NP
TLV70031DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 C4
TLV70031DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 C4
TLV70032DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCH
TLV70032DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCH
TLV70033DCKR ACTIVE SC70 DCK 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODS
TLV70033DCKT ACTIVE SC70 DCK 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 ODS
TLV70033DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODN
TLV70033DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 ODN
TLV70033DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NR
TLV70033DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 NR
TLV70036DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG
TLV70036DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 SCG
TLV70036DSER ACTIVE WSON DSE 6 3000 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 UG
TLV70036DSET ACTIVE WSON DSE 6 250 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 125 UG
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 4
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV700 :
Automotive: TLV700-Q1
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«Pt» Reel Dlameter AD Dimension destgned to accommodate the component wmth at) Dimension destgned to accommodate the component tengtn K0 Dtmenston destgned to accommodate the component thickness 7 w Ovevau with at the earner tape i Pt Pttch between successtve cavtty centers f T Reel Width (wt) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE C) O O D C) O D O iSDrOcketHutes —> User Dtrecllnn 0' Feed \1/ Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV70012DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70012DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70012DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70012DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70012DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70012DDCR SOT-
23-THIN DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70012DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70012DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70012DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70012DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70013DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70013DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70015DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70015DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Mar-2022
Pack Materials-Page 1
l TEXAS INSTRUMENTS
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV70015DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70015DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70015DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70015DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70015DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70015DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70015DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70015DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70018DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70018DCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TLV70018DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70018DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70018DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70018DCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TLV70018DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70018DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70018DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70018DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70018DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70018DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2
TLV70018DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70019DDCR SOT-
23-THIN DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70019DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70022DDCR SOT-
23-THIN DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70022DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70025DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70025DCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TLV70025DCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TLV70025DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70025DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70025DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70025DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Mar-2022
Pack Materials-Page 2
l TEXAS INSTRUMENTS
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV70025DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70025DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70025DSER WSON DSE 6 3000 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2
TLV70025DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70025DSET WSON DSE 6 250 179.0 8.4 1.8 1.8 1.0 4.0 8.0 Q2
TLV70028DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70028DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70028DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70028DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70028DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70028DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70028DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70028DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70028DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70028DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TLV70028DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TLV70028DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70029DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70029DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70030DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70030DCKR SC70 DCK 5 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TLV70030DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70030DCKT SC70 DCK 5 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TLV70030DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70030DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70030DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70030DDCR SOT-
23-THIN DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70030DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70030DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70030DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70030DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70031DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70031DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70032DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70032DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Mar-2022
Pack Materials-Page 3
l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TLV70033DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70033DCKR SC70 DCK 5 3000 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70033DCKT SC70 DCK 5 250 180.0 8.4 2.47 2.3 1.25 4.0 8.0 Q3
TLV70033DCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TLV70033DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70033DDCR SOT-
23-THIN DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70033DDCT SOT-
23-THIN DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TLV70033DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70033DSER WSON DSE 6 3000 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TLV70033DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70033DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70033DSET WSON DSE 6 250 178.0 8.4 1.7 1.7 0.95 4.0 8.0 Q2
TLV70036DDCR SOT-
23-THIN DDC 5 3000 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70036DDCT SOT-
23-THIN DDC 5 250 180.0 8.4 3.1 3.05 1.1 4.0 8.0 Q3
TLV70036DSER WSON DSE 6 3000 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
TLV70036DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Mar-2022
Pack Materials-Page 4
l TEXAS INSTRUMENTS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV70012DCKR SC70 DCK 5 3000 183.0 183.0 20.0
TLV70012DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TLV70012DCKT SC70 DCK 5 250 180.0 180.0 18.0
TLV70012DCKT SC70 DCK 5 250 183.0 183.0 20.0
TLV70012DDCR SOT-23-THIN DDC 5 3000 406.0 348.0 63.0
TLV70012DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70012DDCT SOT-23-THIN DDC 5 250 202.0 201.0 28.0
TLV70012DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70012DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70012DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70013DDCR SOT-23-THIN DDC 5 3000 202.0 201.0 28.0
TLV70013DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70015DCKR SC70 DCK 5 3000 183.0 183.0 20.0
TLV70015DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TLV70015DCKT SC70 DCK 5 250 183.0 183.0 20.0
TLV70015DCKT SC70 DCK 5 250 180.0 180.0 18.0
TLV70015DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70015DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70015DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70015DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70015DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70015DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70018DCKR SC70 DCK 5 3000 183.0 183.0 20.0
TLV70018DCKR SC70 DCK 5 3000 200.0 183.0 25.0
TLV70018DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TLV70018DCKT SC70 DCK 5 250 180.0 180.0 18.0
TLV70018DCKT SC70 DCK 5 250 183.0 183.0 20.0
TLV70018DCKT SC70 DCK 5 250 203.0 203.0 35.0
TLV70018DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70018DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70018DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70018DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70018DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70018DSER WSON DSE 6 3000 200.0 183.0 25.0
TLV70018DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70019DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70019DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70022DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70022DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70025DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TLV70025DCKR SC70 DCK 5 3000 200.0 183.0 25.0
TLV70025DCKT SC70 DCK 5 250 203.0 203.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Mar-2022
Pack Materials-Page 5
l TEXAS INSTRUMENTS
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV70025DCKT SC70 DCK 5 250 180.0 180.0 18.0
TLV70025DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70025DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70025DDCT SOT-23-THIN DDC 5 250 195.0 200.0 45.0
TLV70025DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70025DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70025DSER WSON DSE 6 3000 203.0 203.0 35.0
TLV70025DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70025DSET WSON DSE 6 250 203.0 203.0 35.0
TLV70028DCKR SC70 DCK 5 3000 183.0 183.0 20.0
TLV70028DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TLV70028DCKT SC70 DCK 5 250 183.0 183.0 20.0
TLV70028DCKT SC70 DCK 5 250 180.0 180.0 18.0
TLV70028DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70028DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70028DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70028DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70028DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70028DSER WSON DSE 6 3000 205.0 200.0 33.0
TLV70028DSET WSON DSE 6 250 205.0 200.0 33.0
TLV70028DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70029DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70029DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70030DCKR SC70 DCK 5 3000 183.0 183.0 20.0
TLV70030DCKR SC70 DCK 5 3000 200.0 183.0 25.0
TLV70030DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TLV70030DCKT SC70 DCK 5 250 203.0 203.0 35.0
TLV70030DCKT SC70 DCK 5 250 183.0 183.0 20.0
TLV70030DCKT SC70 DCK 5 250 180.0 180.0 18.0
TLV70030DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70030DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70030DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70030DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70030DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70030DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70031DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70031DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70032DDCR SOT-23-THIN DDC 5 3000 202.0 201.0 28.0
TLV70032DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70033DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TLV70033DCKR SC70 DCK 5 3000 183.0 183.0 20.0
TLV70033DCKT SC70 DCK 5 250 183.0 183.0 20.0
TLV70033DCKT SC70 DCK 5 250 180.0 180.0 18.0
TLV70033DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Mar-2022
Pack Materials-Page 6
l TEXAS INSTRUMENTS
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TLV70033DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0
TLV70033DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70033DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70033DSER WSON DSE 6 3000 205.0 200.0 33.0
TLV70033DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70033DSET WSON DSE 6 250 183.0 183.0 20.0
TLV70033DSET WSON DSE 6 250 205.0 200.0 33.0
TLV70036DDCR SOT-23-THIN DDC 5 3000 202.0 201.0 28.0
TLV70036DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0
TLV70036DSER WSON DSE 6 3000 183.0 183.0 20.0
TLV70036DSET WSON DSE 6 250 183.0 183.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Mar-2022
Pack Materials-Page 7
MECHANICAL DATA DDC (R—PDSO—GS) PLASTIC SMALL—OUTLINE PH 1 \ncex Area '.TJO 0,70 "“3 i i ii sq Mn '6 ‘g fTi_ — _T 4—A\ ”c :7 ‘ DOW P p o o £20440} 2/[ 05/05 NO'ES' N hneur dwens'ms are w memeters Tm: druwmg is mm in charge w'hout rat'ce Body mmensms do mm mm mm Cash 0' promswon HHS wmw mm M0495 vc'chcn A5 {5 pm> Cnm> {'3 Ms INSTRUMENTS www.li.com
MECHANICAL DATA DCK (R—PDSO—GS) PLASTIC SMALL—OUTLINE PACKAGE E was 5 47 Fl Fl f f 240 \ ,i, w 1,80 1,10 Pm/ \ ‘ $ ‘ . maexArea Wm H 1* MO Um Gauge Mane Seanng Mane fit Scam Mane gig/Em 409555575/8 U‘ /200/ , m m hmeters NO'FS AH \mec' dwmensiur: Umm> FuHs an JFDFC M07763 vunuhcn AA Tm drawmq \s sumsc: 0 change wmu: nome Body mmensmns do nut mc‘ude mom flcsh m aroms'm Mom Has» and pruvuswon W m exceed 015 :2r m INSrRUMEm-s www.1i.com
LAND PATTERN DATA DC< (="" 7pjsoic5=""> PLASTC SMALL OU’LME Exc'm‘e Boc'd LuyuM stem Openings Based or a stencfl tn'ckndss uf 127mm (005m) /23\\der Musk Cpen'v‘g d d s W \‘ ‘\“=bd Geometry \ v y \ NOTES- A M \meur dimensmns are m miHWete's a. In: druwv‘q is sweat (a chc'vge mud: 'vuhce c Custume's snodd p‘uce d note 01 me mm: buurd (abr'cahun c'awmg nm :0 mm the ce'fle' smder musk denned Dad, n mundmn many is reco'n'nended (Dr uHernme designs EV Laser cumrq opc'mvcs wnn "apczmda wuHs and mo rouncmq corners wm am bcncr dosxc readscv Cdstomcrs shou‘c can thew Guard asse’na‘y me for Ska design recom’nencnhons EXONP‘S s‘ercfl des‘g’v baSeC on a 50% vo‘umemc \Dud su‘der paste M‘cr m H’C’ bk) Var other S‘cncfl rccowmcwdatnrs. ' hams Q‘ INSTRUMENTS www.li.com
MECHANICAL DATA DSE (S—PDSO—N6) PLASTIC SMALL OUTLINE / PW I INDEX AREA 7;; 0,20 ¥EF F I I 0,05 a (A o p N o SEATING FLARE 4207810/A 03/06 NOTES: AII Ihco' cImcns'ons are In mIIrrcIcrs SmuII om‘nc MiLeac (50M package conflquuiIon Ihs package IS IeuciIree A R ’m drowmg 's snbjecI In change Wan ranae c D {I} TEXAS INSrRUMEm-s www.1i.com
www.ti.com
PACKAGE OUTLINE
C
0.05
0.00
5X 0.6
0.4
(0.2) TYP
0.8 MAX
6X 0.3
0.2
0.7
0.5
2X 1
4X 0.5
B1.55
1.45 A
1.55
1.45
WSON - 0.8 mm max heightDSE0006A
PLASTIC SMALL OUTLINE - NO LEAD
4220552/A 04/2021
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
34
6
0.1 C A B
0.05 C
PIN 1 ID
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
SCALE 6.000
www.ti.com
EXAMPLE BOARD LAYOUT
(0.8)
4X 0.5
(1.6)
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
6X (0.25)
(R0.05) TYP
5X (0.7)
WSON - 0.8 mm max heightDSE0006A
PLASTIC SMALL OUTLINE - NO LEAD
4220552/A 04/2021
PKG
1
34
6
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
PADS 1-3
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
PADS 4-6
NON SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(0.8) 5X (0.7)
4X (0.5)
(1.6)
6X (0.25)
(R0.05) TYP
WSON - 0.8 mm max heightDSE0006A
PLASTIC SMALL OUTLINE - NO LEAD
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:40X
PKG
1
34
6
SYMM
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