MPX12 Series Datasheet by Rochester Electronics, LLC

Datasheet Feedback/Errors

o '0 :3' freescale'" semiconductor

MPX12

Rev 11, 07/2009

Freescale Semiconductor

Pressure

10 kPa Uncompensated

Silicon Pressure Sensors

The MPX12 series silicon piezoresistive pressure sensors provide a very

accurate and linear voltage output, directly proportional to the applied

pressure. This standard, low cost, uncompensated sensor permits

manufacturers to design and add their own external temperature

compensating and signal conditioning networks. Compensation techniques

are simplified because of the predictability of Freescale's single element

strain gauge design.

Features

• Low Cost

• Patented Silicon Shear Stress Strain Gauge Design

• Ratiometric to Supply Voltage

• Easy to Use Chip Carrier Package Options

• Gauge Options

• Durable Epoxy Package

ORDERING INFORMATION

Device Name Package

Options Case

No.

# of Ports Pressure Type Device

Marking

None Single Dual Gauge Differential Absolute

Unibody Package (MPX12 Series)

MPX12D Tray 344 • • MPX12D

MPX12DP Tray 344C • • MPX12DP

MPX12GP Tray 344B • • MPX12GP

Small Outline Package (MPXV12 Series)

MPXV12DP Tray 1351 • • MPXV12DP

MPXV12GP Tray 1369 • • MPXV12GP

MPXV12GW6U Rail 1735 • • MPXV12GW

MPXV12GW7U Rail 1560 • • MPXV12GW

MPAK Package (MPXM12 Series)

MPXM12GS Rail 1320A • • MPXM12GS

MPXM12GST1 Tape & Reel 1320A • • MPXM12GS

MPX12

0 to 10 kPa (0 to 1.45 psi)

55 mV Full Scale Span

(Typical)

Series

Application Examples

• Air Movement Control

• Environmental Control Systems

• Level Indicators

• Leak Detection

• Medical Instrumentation

• Industrial Controls

• Pneumatic Control Systems

• Robotics

MPX12

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Pressure

SMALL OUTLINE PACKAGES

MPX12GP

CASE 344B-01

MPX12D

CASE 344-15 MPX12DP

CASE 344C-01

UNIBODY PACKAGES

MPXV12DP

CASE 1351-01 MPXV12GP

CASE 1369-01 MPXV12GW7U

CASE 1560-02

MPXV12GW6U

CASE 1735-02

MPAK PACKAGE

MPXM12GS/GST1

CASE 1320A-02

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Pressure

Operating Characteristics

Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

Characteristic Symbol Min Typ Max Unit

Differential Pressure Range(1)

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

POP 0— 10 kPa

Supply Voltage(2)

2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

VS— 3.0 6.0 Vdc

Supply Current Io—6.0 — mAdc

Full Scale Span(3)

3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

minimum related pressure.

VFSS 45 55 70 mV

Offset(4)

4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.

Voff 020 35 mV

Sensitivity ΔV/ΔP—5.5 —mV/kPa

Linearity — –0.5 — 5.0 %VFSS

Pressure Hysteresis(6) (0 to 10 kPa) — — ±0.1 — %VFSS

Temperature Hysteresis (–40°C to +125°C) — — ±0.5 — %VFSS

Temperature Coefficient of Full Scale Span TCVFSS –0.22 — –0.16 %VFSS/°C

Temperature Coefficient of Offset TCVoff —±15 — μV/°C

Temperature Coefficient of Resistance TCR 0.21 — 0.27 %Zin/°C

Input Impedance Zin 400 — 550 Ω

Output Impedance Zout 750 — 1250 Ω

Response Time(5) (10% to 90%)

5. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to

a specified step change in pressure.

tR—1.0 — ms

Warm-Up Time(6)

6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.

——20—ms

Offset Stability(7)

7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

——±0.5—%V

FSS

MPX12

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Pressure

Maximum Ratings

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Uncompensated Pressure Sensor Schematic

Voltage Output versus Applied Differential Pressure

The output voltage of the differential or gauge sensor

increases with increasing pressure applied to the pressure

side (P1) relative to the vacuum side (P2). Similarly, output

voltage increases as increasing vacuum is applied to the

vacuum side (P2) relative to the pressure side (P1).

Table 2. Maximum Ratings(1)

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Rating Symbol Value Unit

Maximum Pressure (P1 > P2) PMAX 75 kPa

Burst Pressure (P1 > P2) PBURST 100 kPa

Storage Temperature TSTG –40 to +125 °C

Operating Temperature TA–40 to +125 °C

GND

+VOUT

–VOUT

+VS

Sensing

Element

MPX12

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Pressure

Temperature Compensation

Figure 2 shows the typical output characteristics of the

MPX12 series over temperature.

Because this strain gauge is an integral part of the silicon

diaphragm, there are no temperature effects due to

differences in the thermal expansion of the strain gauge and

the diaphragm, as are often encountered in bonded strain

gauge pressure sensors. However, the properties of the

strain gauge itself are temperature dependent, requiring that

the device be temperature compensated if it is to be used

over an extensive temperature range.

Temperature compensation and offset calibration can be

achieved rather simply with additional resistive components, or

by designing your system using the MPX2010D series sensor.

Several approaches to external temperature

compensation over both –40 to +125°C and 0 to +80°C

ranges are presented in Applications Note AN840.

LINEARITY

Linearity refers to how well a transducer's output follows

the equation: VOUT = VOFF + sensitivity x P over the operating

pressure range (Figure 3). There are two basic methods for

calculating nonlinearity: (1) end point straight line fit or (2) a

least squares best line fit. While a least squares fit gives the

“best case” linearity error (lower numerical value), the

calculations required are burdensome.

Conversely, an end point fit will give the “worst case” error

(often more desirable in error budget calculations) and the

calculations are more straightforward for the user.

Freescale’s specified pressure sensor linearities are based

on the end point straight line method measured at the

midrange pressure.

Figure 2. Output vs. Pressure Differential

Figure 3. Linearity Specification Comparison

Pressure Differential

Output (mVdc)

00.3

2.0

0.6

4.0

0.9

6.0

1.2

8.0 10

1.5

PSI

kPa

Span

Range

(Typ)

Offset

(Typ)

VS = 3 VDC

P1 > P2 -40°C

+25°C

+125°C

Linearity

Actual

Theoretical

Offset

(VOFF)

Max POP

Output (mVdc)

Pressure (kPa)

Span

(VFSS)

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Pressure

Figure 4. Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the differential/gauge die. A gel isolates

the die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

Operating characteristics, internal reliability and

qualification tests are based on use of dry clean air as the

pressure media. Media other than dry clean air may have

adverse effects on sensor performance and long term

reliability. Contact the factory for information regarding media

compatibility in your application.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor

as the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing gel which isolates

the die from the environment. Freescale’s MPx12 series is

designed to operate with positive differential pressure

applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table

Gel Die Coat

Wire Bond

Die

Stainless

Steel Cap

Thermoplastic

Case

Die Bond

Differential Sensing

Element

Lead Frame

Part Number Case Type Pressure (P1) Side

Identifier

MPX12D 344 Stainless Steel Cap

MPX12DP 344C Side with Part Marking

MPX12GP 344B Side with Port Attached

MPXV12DP 1351 Side with Part Marking

MPXV12GP 1369 Side with Port

MPXV12GW6U 1735 Side with Port

MPXV12GW7U 1560 Side with Port

MPXM12GS/GST1 1320A Side with Port Attached

OO O

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PACKAGE DIMENSIONS

CASE 344-15

ISSUE AA

UNIBODY PACKAGE

CASE 344B-01

ISSUE B

UNIBODY PACKAGE

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. – OUTPUT

STYLE 2:

PIN 1. VCC

2. – SUPPLY

3. + SUPPLY

4. GROUND

0.136 (0.005) T

1234

PIN 1

D4 PL

SEATING

PLANE

–T–

B–A– DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.595 0.630 15.11 16.00

B0.514 0.534 13.06 13.56

C0.200 0.220 5.08 5.59

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

J0.014 0.016 0.36 0.40

L0.695 0.725 17.65 18.42

M30 NOM 30 NOM

N0.475 0.495 12.07 12.57

R0.430 0.450 10.92 11.43

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION –A– IS INCLUSIVE OF THE MOLD

STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

STYLE 3:

PIN 1. GND

2. –VOUT

3. VS

4. +VOUT

DAMBAR TRIM ZONE:

THIS IS INCLUDED

WITHIN DIM. “F” 8 PL

Y0.048 0.052 1.22 1.32

Z0.106 0.118 2.68 3.00

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. - OUTPUT

SEATING

PLANE

–T–

PORT #1

POSITIVE

PRESSURE

PIN 1

–A–

–Q–

4 PL

–P–

0.25 (0.010) T

0.13 (0.005) Q S

12 34

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.145 1.175 29.08 29.85

B0.685 0.715 17.40 18.16

C0.305 0.325 7.75 8.26

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

H0.182 0.194 4.62 4.93

J0.014 0.016 0.36 0.41

K0.695 0.725 17.65 18.42

L0.290 0.300 7.37 7.62

N0.420 0.440 10.67 11.18

P0.153 0.159 3.89 4.04

Q0.153 0.159 3.89 4.04

R0.230 0.250 5.84 6.35

U0.910 BSC 23.11 BSC

0.220 0.240 5.59 6.10

(P1)

want an pear n mm «2 VAC|J|JM ‘ sums pun: \ CASE 3446-01 ISSUE B UNIBODY PACKAGE MPX12

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PACKAGE DIMENSIONS

CASE 344C-01

ISSUE B

UNIBODY PACKAGE

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. – OUTPUT

PORT #2

PORT #1

PORT #2

VACUUM

SEATING

PLANE SEATING

PLANE

PORT #1

POSITIVE PRESSURE

–Q–

12 43

PIN 1

4 PL

–P–

–T– –T–

0.25 (0.010) T

0.13 (0.005) Q S

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A1.145 1.175 29.08 29.85

B0.685 0.715 17.40 18.16

C0.405 0.435 10.29 11.05

D0.016 0.020 0.41 0.51

F0.048 0.064 1.22 1.63

G0.100 BSC 2.54 BSC

H0.182 0.194 4.62 4.93

J0.014 0.016 0.36 0.41

K0.695 0.725 17.65 18.42

L0.290 0.300 7.37 7.62

N0.420 0.440 10.67 11.18

P0.153 0.159 3.89 4.04

Q0.153 0.159 3.89 4.04

R0.063 0.083 1.60 2.11

U0.910 BSC 23.11 BSC

V0.248 0.278 6.30 7.06

W0.310 0.330 7.87 8.38

–A–

0.220 0.240 5.59 6.10

(P2) (P1)

.700 0.485 0.465 0.260 0.240 0.405 g 0.465 GAGE PLANE 0,180 0.390 0.370 _1% Li Q .006 (015).”: 2 PLACES 4 ws 0. 100 1 l ‘ Bx 0.042 0.030 DETAIL G _IIE 0.010 0.002 930.130 0.290 0.270 0.011 0135 0.009 E 0115 DETAIL G SEATING PLANE “”5511“... 1131.110513ch W I IECHANICAL OUTLINE | PRINT VERSION NOT 10 SCALE TITLE: DOCUMENT N0: QEASAQQZSSD REV: A 8 LD SNSR, DUAL PORT CASE NUMBER: 1351701 27 JUL 2005 STANDARD: NON—JEDEC CASE 1 351-0 ISSUE A SMALL OUTLINE PA Sensors Freescale Semiconductor

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PACKAGE DIMENSIONS

CASE 1351-01

ISSUE A

SMALL OUTLINE PACKAGE

NOTES: 1. CONTROLLING DIMENSION: INCH 2. INTERPRET DIMENSIONS AND TDLERANCES PER ASME Y14.5M—1994. ADIMENSIONS DO NOT INCLUDE MOLD FLASH OR PPROTRUSIONSV MOLD FLASH AND PROTRUSIONS SHALL NOT EXCEED ,005 PER SIDE. ADIMENSION DOES NOT INCLUDE DAMEAR PROTRUSIONV ALLOWABLE DAMBAR PROTRUSIUN SHALL BE .003 MAXIMUM. STYLE 1: STYLE 2: PIN GND PIN 1: N/C PIN +Vout PIN 2; Vs PIN Vs PIN 3: GND PIN —Vout PM 4: Vout PIN N/C PIN 5: we PIN N/C PIN 6: N/C PIN N/C PIN 7: N/C PIN N/c PIN a: N/C a” Biff?f§§¥LﬁN§£Jf§5 M IECHANICIIL OUTL|I£ PRINT VERSION NOT TO SCALE TITLE: DOCUMENT N0: QBASASQZSSD REV: A 8 LD SNSR, DUAL pORT CASE NUMBER: 1351701 27 JUL 2005 STANDARD: NON—JEDEC CASE 1 351 -D1

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PACKAGE DIMENSIONS

CASE 1351-01

ISSUE A

SMALL OUTLINE PACKAGE

{:0 DIM MIN MAX MIN MAX A um um 7n 752 N mm mm nus uzs ‘ I: ma nmz ass n17 ‘ n was ms nu ma E ‘ El was hues 1m \ mm a mum 2mm ‘ r ms nzss 522 an H H ._. K mm mm 305 no ‘ L nom arm ‘55 Ian M um am 525 735 u man men 20: 22: :2 mm mm oz: m 1 nus ms 292 :m n 7 u' 7

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PACKAGE DIMENSIONS

CASE 1369-01

ISSUE O

SMALL OUTLINE PACKAGE

NOTES:

CONTROLLING DIMENSION: INCH.

INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M, 1994.

DIMENSIONS "D" AND "E1" DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.

0.004 (0.1)

DETAIL G

SEATING

PLANE

∅

e/2

0.004 (0.1) BC

A0.008 (0.20) B

8Xb

2 PLACES 4 TIPS

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.300 0.330 7.11 7.62

A1 0.002 0.010 0.05 0.25

b0.038 0.042 0.96 1.07

D0.465 0.485 11.81 12.32

E1 0.465 0.485 11.81 12.32

M0.270 0.290 6.86 7.36

N0.080 0.090 2.03 2.28

P0.009 0.011 0.23 0.28

T0.115 0.125 2.92 3.17

0.100 BSC 2.54 BSC

F0.245 0.255 6.22 6.47

K0.120 0.130 3.05 3.30

L0.061 0.071 1.55 1.80

0˚ 7˚ 0˚ 7˚

0.717 BSC 18.21 BSC

GAGE

PLANE

DETAIL G

LA1

.014 (0.35)

03.065 imﬁﬁﬁil Am L 1—“: 2 , 415 @442 31:! E +.255+ .245 .550 A .540 -33- 335 537 365 ,527 .735 .755 ‘ ax _" ””3 Q .004 c 11 PIN #1 % F 002 I—I—I-I __ IDENTIFIER (NOTCH) , W 7 + \-VIEW D SEATING '050 « ex .042 PLANE 6x-—> «“ ‘— .033 9 “E ifigHEQCSNL‘g’ygﬁ W MECHANICAL ounn: I PRINT VERSION NOT TO SCALE TITLE: DOCUMENT N0:98ASA106ESD REV: a $0, 8 I/O, .420 X .420 PKG, CASE NuMEER:1735—oz 19 FEB 2009 'IOO IN PITCH STANDARD: NON—JEDEC

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PACKAGE DIMENSIONS

CASE 1735-02

ISSUE B

SMALL OUTLINE PACKAGE

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CASE 1735-02

ISSUE B

SMALL OUTLINE PACKAGE

NOTES: 1, DIMENSIONING AND TOLERANCING PER ASME YMESM — 1994. 2, CONTROLLING DIMENSION: INCH, ADIMENSIONS DO NOT INCLUDE MOLD PROTRUSION. 4, MAXIMUM MOLD PROTRUSION IS .008. 5, ALL VERTICAL SURFACES 5‘ TYPICAL DRAFT, @DIMENSION TO CENTER OF LEAD WHEN FORMED PARALLEL: STANDARD: NON—JEDEC o WHEEL;gigswgggggjgg ‘NC IAECHANICAL OUTLINE PRINT VERSION NOT To SCALE TITLE: DOCUMENT NO:93ASA1USBGD REV: a $0, 8 I/O, .420 X .420 PKG, CASE NUMEER:I735—02 19 FEB 2009 .100 IN PITCH

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PACKAGE DIMENSIONS

CASE 1735-02

ISSUE B

SMALL OUTLINE PACKAGE

425 ' 4I5 s ‘ 5 ’ .425 9.452 7 1 Ms 4442 a T mes moss .255» A .26 .560 — — - 220 54m .210 335 537 .555 527 7, .785 755 120 PIN m '00 TDENTTFIER (NoTcH) VTEW D 050 L SEAHNG EX 034 PLANE 026 _ “WEEK 9 Wﬁﬁ“; 'm‘ Khm’m’ﬁ- ”“7 KCHANICAL OUTLINE | PRINT VERsToN NOT To SCALE TITLE: DOCUMENT NO. 95ASA106HD REV. D SO, 8 \/O, .420 X .420 PKG, CASE NUMEER:ISBD—03 25 FEB 2009 *100 IN P‘TCH STANDARD NON—JEDEC

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PACKAGE DIMENSIONS

CASE 1560-03

ISSUE D

SMALL OUTLINE PACKAGE

.011 .009 V‘EW D 0 Mason: stwcwbucmn INC LL plc-ﬂ: RESERVED MECHANICAL OUTLINE PRINT VERSION NOT To SCALE TT TLE: SO, 8 I/O, .420 X .420 PKG. .100 \N P‘TCH DOCUMENT NO: QBASATOGHD CASE NUMBER: 1560703 REV: D 25 FEB 2005 STANDARD: NON—JEDEC

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PACKAGE DIMENSIONS

CASE 1560-03

ISSUE D

SMALL OUTLINE PACKAGE

N OTES: L DIMENSION‘NG AND TOLERANCING PER ASME “4.5M , ‘994, 2. CONTROLUNG D‘MENS‘ON: \NCH. ADIMENSIONS DO NOT \NCLUDE MOLD PROTRUSION. 4, MAX‘MUM MOLD FROTRUSION IS ‘005. 5, ALL VERT‘CAL SURFACES 5' TYP‘CAL DRAFTV ADIMENSION T0 CENTERI OF LEAD WHEN FORMED PARALLEL, .100 \N P‘TCH Q FREEEfCLSyEEYVéCgaNgéSgS' W Ecrwucu. can": PR‘NT VERSION NOT TO SCALE TITLE: DOCUMENT N0198ASA1DBI1D REV: 0 SO, 8 I/O, .420 X .420 PKG, CASE NUMBERz1560—03 25 FEB 2009 STANDARD: NONrJEDEC

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PACKAGE DIMENSIONS

CASE 1560-03

ISSUE D

SMALL OUTLINE PACKAGE

DETA‘L E 0233 1 2 \ GAGE iiiﬁ KJ E—' ‘ PLANE ‘ A“ $245.1 J W ' 0,023 ‘ mam-ma 0-002 com ° 10,117 noun l’ 0202 0.192 3%; 4L H. Elm it o 335 o 325 E SEATING PLANE J / @ﬁDEWL E \ A enemy“ muccwm ALL mum; KL; _ m: HECHAN ICAL OUTLINE PRINT VERSION NOT TO SCALE TITLE: 5 LD MiPAC, PORTED DOCUMENT NO: 98ARH99057A CASE NUMBER: 1320A—02 REV: A 22 JUL 2005 STANDARD: NONrJEDEC MPX12 CA MP 18

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PACKAGE DIMENSIONS

CASE 1320A-02

ISSUE A

MPAK PACKAGE

NOTES: 1. DIMENSIONS ARE IN INCHES. 2, INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M*|994, gDIMENSIONS DOES NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH 0R PROTRUSION SHALL NOT EXCEED .006" PER SIDE‘ 4, ALL VERTICAL SURFACES TO BE 5" MAXIMUM. ADIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMEAR PROTRUSION SHALL HE ,008 MAXIMUM. o”55“};551‘393559353 “ ceramic». ouan: PRINT VERSION NOT TO SCALE TITLE: DOCUMENT N0: 98ARH99087A REV: A 5 LD M—PAC, PORTED CASE NUMBER: 1320A—02 22 JUL 2005 STANDARD: NONEJEDEC

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CASE 1320A-02

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MPX12

Rev. 11

07/2009

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MPX12 Series Datasheet by Rochester Electronics, LLC

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