PMEG3050EP Datasheet by Nexperia USA Inc.

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Table 1. Quick reference data nexpefla
PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
12 December 2017 Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-
Mounted Device (SMD) plastic package.
2. Features and benefits
Average forward current: IF(AV) ≤ 5 A
Reverse voltage: VR ≤ 30 V
Low forward voltage
High power capability due to clip-bond technology
AEC-Q101 qualified
Small and flat lead SMD plastic package
Capable for reflow and wave soldering
3. Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Reverse polarity protection
Low power consumption applications
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
δ = 0.5 ; f = 20 kHz; Tamb ≤ 35 °C;
square wave
[1] - - 5 AIF(AV) average forward
current
δ = 0.5 ; f = 20 kHz; Tsp ≤ 130 °C;
square wave
- - 5 A
VRreverse voltage Tj = 25 °C - - 30 V
VFforward voltage IF = 5 A; Tj = 25 °C - 315 360 mV
IRreverse current VR = 30 V; Tj = 25 °C - 2.6 8 mA
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
PMEG3050EP Table 2. Pinning information “‘1 [ 1 1%” symom Table 3. Ordering information Table 4. Marking codes
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 2 / 14
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode[1]
2 A anode
1 2
CFP5 (SOD128)
sym001
1 2
[1] The marking bar indicates the cathode.
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
PMEG3050EP CFP5 plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8
mm x 2.6 mm x 1 mm body
SOD128
7. Marking
Table 4. Marking codes
Type number Marking code
PMEG3050EP A7
PMEG3050EP Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). BEE
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 3 / 14
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRreverse voltage Tj = 25 °C - 30 V
δ = 0.5 ; f = 20 kHz; Tamb ≤ 35 °C; square
wave
[1] - 5 AIF(AV) average forward current
δ = 0.5 ; f = 20 kHz; Tsp ≤ 130 °C; square
wave
- 5 A
IFSM non-repetitive peak
forward current
tp = 8 ms; Tj(init) = 25 °C; square wave - 70 A
[2] - 0.625 W
[3] - 1.05 W
Ptot total power dissipation Tamb ≤ 25 °C
[1] - 2.1 W
Tjjunction temperature - 150 °C
Tamb ambient temperature -55 150 °C
Tstg storage temperature -65 150 °C
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PMEG3050EP Table 6. Thermal characteristics [1121 [ll[§l mm [51 onsaamz
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 4 / 14
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
[1] [2] - - 200 K/W
[1] [3] - - 120 K/W
Rth(j-a) thermal resistance
from junction to
ambient
in free air
[1] [4] - - 60 K/W
Rth(j-sp) thermal resistance
from junction to solder
point
[5] - - 12 K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a
significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5] Soldering point of cathode tab.
006aab752
10
1
102
103
Zth(j-a)
(K/W)
10- 1
tp(s)
10- 3 102103
10110- 2 10- 1
1
duty cycle =
0.75
0.5 0.33
0.2
0.25
0.1
0.05
0.02 0.01
0
FR4 PCB, standard footprint
Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG3050EP 095mm 095mm
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 5 / 14
006aab753
10
1
102
103
Zth(j-a)
(K/W)
10- 1
tp(s)
10- 3 102103
10110- 2 10- 1
1
duty cycle =
0.75
0.5 0.33
0.2
0.25
0.1
0.05
0.02 0.01
0
FR4 PCB, mounting pad for cathode 1 cm2
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab754
tp(s)
10- 3 102103
10110- 2 10- 1
10
1
102
Zth(j-a)
(K/W)
10- 1
duty cycle =
10.75
0.5
0.33
0.2
0.25
0.1
0.05
0.02 0.01
0
Ceramic PCB, Al2O3, standard footprint
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG3050EP Table 7. Characteristics flDEaaD755 unsaams
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 6 / 14
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
IF = 1 A; Tj = 25 °C - 240 275 mV
IF = 3 A; Tj = 25 °C - 285 340 mV
VFforward voltage
IF = 5 A; Tj = 25 °C - 315 360 mV
VR = 5 V; Tj = 25 °C - 330 - µAIRreverse current
VR = 30 V; Tj = 25 °C - 2.6 8 mA
VR = 1 V; f = 1 MHz; Tj = 25 °C - 800 - pFCddiode capacitance
VR = 10 V; f = 1 MHz; Tj = 25 °C - 260 - pF
006aab755
10- 2
10- 3
1
10- 1
10
IF
(A)
10- 4
VF(V)
0.0 0.50.40.2 0.30.1
(1)
(2)
(3) (4) (5)
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = −40 °C
Fig. 4. Forward current as a function of forward
voltage; typical values
006aab756
VR(V)
0 302010
1
10- 1
10- 2
10- 3
10- 4
10- 5
10- 6
IR
(A)
10- 7
(1)
(2)
(3)
(4)
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = −40 °C
Fig. 5. Reverse current as a function of reverse
voltage; typical values
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Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 7 / 14
VR(V)
0 302010
006aab757
500
1000
1500
Cd
(pF)
0
f = 1 MHz; Tamb = 25 °C
Fig. 6. Diode capacitance as a function of reverse
voltage; typical values
IF(AV) (A)
0 862 4
006aab758
0.6
1.2
1.8
PF(AV)
(W)
0.0
(1)
(2)
(3)
(4)
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Fig. 7. Average forward power dissipation as a
function of average forward current; typical
values
VR(V)
0 252010 155
006aab759
14
PR(AV)
(W)
10
6
2
0
4
8
12
(1)
(2)
(4)
(3)
Tj = 125 °C
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Fig. 8. Average reverse power dissipation as a
function of reverse voltage; typical values
Tamb (°C)
0 50 100 150 1751257525
006aab760
2.5
5.0
7.5
IF(AV)
(A)
0.0
(1)
(2)
(3)
(4)
FR4 PCB, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 9. Average forward current as a function of
ambient temperature; typical values
PMEG3050EP 095mm /// amh 095mm 006535763 Emu
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 8 / 14
Tamb (°C)
0 50 100 150 1751257525
006aab761
2.5
5.0
7.5
IF(AV)
(A)
0.0
(4)
(2)
(1)
(3)
FR4 PCB, mounting pad for cathode 1 cm2
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 10. Average forward current as a function of
ambient temperature; typical values
Tamb (°C)
0 50 100 150 1751257525
006aab762
2.5
5.0
7.5
IF(AV)
(A)
0.0
(4)
(2)
(1)
(3)
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 11. Average forward current as a function of
ambient temperature; typical values
Tsp (°C)
0 50 100 150 1751257525
006aab763
2.5
5.0
7.5
IF(AV)
(A)
0.0
(4)
(2)
(1)
(3)
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 12. Average forward current as a function of solder point temperature; typical values
PMEG3050EP 27 11“; i \ ; M + \ 1 . ,,,,+,, 7 L 1 \ 7 L14 JL
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 9 / 14
11. Test information
tp
tcy
P
t
006aac658
duty cycle δ =
tp
tcy
Fig. 13. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations:
IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS
defined as RMS current.
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in
automotive applications.
12. Package outline
07-09-12Dimensions in mm
1.1
0.9
0.22
0.10
0.6
0.3
5.0
4.4 4.0
3.6
1.9
1.6
2.7
2.3
1
2
Fig. 14. Package outline CFP5 (SOD128)
PMEG3050EP sod128_lr
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 10 / 14
13. Soldering
Fig. 15. Reflow soldering footprint for CFP5 (SOD128)
PMEG3050EP Wave soldering footprint information SOD123 I 7]
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 11 / 14
SOD128Wave soldering footprint information
sod128_fw
occupied area
dummy track (solder resist and Cu free)
solder resist
solder lands
Issue date
Dimensions in mm
17-06-06
17-06-07
4.2
(2×)
5.7 4.35
(2×)
3.5 (2×) 3.65 (2×)
2.3
10.2
5.8
Fig. 16. Wave soldering footprint for CFP5 (SOD128)
PMEG3050EP Table 8. Revision history
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 12 / 14
14. Revision history
Table 8. Revision history
Data sheet ID Release date Data sheet status Change notice Supersedes
PMEG3050EP v.2 20171212 Product data sheet - PMEG3050EP_1
Modifications: Features and benefits: Capable for reflow and wave soldering added
Soldering: Wave soldering footprint added.
PMEG3050EP_1 20091210 Product data sheet - -
cl he m sign. a|a sheer \s explained m sec 5 ol device‘s) described m s damment was published he Iaqest product status mtg www exgna com PMEG3050EP ' ns Mcummemial sale 7 Max us or con ' m me genera‘ ierms and canal m g llwww nexgena com/QM enems
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 13 / 14
15. Legal information
Data sheet status
Document
status [1][2]
Product
status [3]
Definition
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nexperia.com.
Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
Nexperia does not give any representations or warranties as to the accuracy
or completeness of information included herein and shall have no liability for
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
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Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
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Notice: All referenced brands, product names, service names and
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PMEG3050EP
Nexperia PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
PMEG3050EP All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved
Product data sheet 12 December 2017 14 / 14
16. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 4
10. Characteristics............................................................ 6
11. Test information......................................................... 9
12. Package outline.......................................................... 9
13. Soldering................................................................... 10
14. Revision history........................................................12
15. Legal information..................................................... 13
© Nexperia B.V. 2017. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 12 December 2017

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