QRE1113/GR Datasheet by onsemi

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3 ON Semiconfluflmr® www.0nsemi.com § § & n Semmnauumcammmmans-"es Lu: 2002 1 February, 2020 — Rev. 7
© Semiconductor Components Industries, LLC, 2002
February, 2020 Rev. 7
1Publication Order Number:
QRE1113/D
QRE1113, QRE1113GR,
QRE1114GR
Miniature Reflective
Object Sensor
Features
Phototransistor Output
No Contact Surface Sensing
Miniature Package
Lead Form Style: Gull Wing
Two Leadform Options:
Through Hole (QRE1113)
SMT Gull Wing (QRE1113GR & QRE1114GR)
Two Packaging Options:
Tube (QRE1113)
Tape and Reel (QRE1113GR & QRE1114GR)
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Symbol Parameter Value Unit
TOPR Operating Temperature 40 to +85 °C
TSTG Storage Temperature 40 to +90 °C
TSOLISoldering Temperature (Iron)
(Notes 2, 3, 4)
240 for 5 s °C
TSOLFSoldering Temperature (Flow)
(Notes 3, 4)
260 for 10 s °C
EMITTER
IFContinuous Forward Current 50 mA
VRReverse Voltage 5 V
IFP Peak Forward Current (Note 5) 1 A
PDPower Dissipation (Note 1) 75 mW
SENSOR
VCEO Collector-Emitter Voltage 30 V
VECO Emitter-Collector Voltage 5 V
ICCollector Current 20 mA
PDPower Dissipation (Note 1) 50 mW
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Derate power dissipation linearly 1.00 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning agents.
4. Soldering iron 1/16 (1.6 mm) from housing.
5. Pulse conditions: tp = 100 ms; T = 10 ms.
This document, and the information contained herein, is CONFIDENTIAL AND
PROPRIETARY and the property of Semiconductor Components Industries,
LLC., dba ON Semiconductor. It shall not be used, published, disclosed or
disseminated outside of the Company, in whole or in part, without the written
permission of ON Semiconductor. Reverse engineering of any or all of the
information contained herein is strictly prohibited.
E 2020, SCILLC. All Rights Reserved.
www.onsemi.com
REFLECTIVE RECTANGULAR SURFACE MOUNT
CASE 100CY
REFLECTIVE RECTANGULAR THROUGH HOLE
CASE 100AQ
12 34
Pin 1: Anode
Pin 2: Cathode
Pin 3: Collector
Pin 4: Emitter
Device Package Shipping
ORDERING INFORMATION
QRE1113 Reflective
Rectangular
(Through Hole)
1600 / Tube
QRE1113GR
&
QRE1114GR
Reflective
Rectangular
(Surface Mount)
1000 /
Tape & Reel
For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
\ / 260°C PC Io S‘C/sec 60 sec. max. \ above 220°C www.cnsemi.com
QRE1113, QRE1113GR, QRE1114GR
www.onsemi.com
2
ELECTRICAL/OPTICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Unit
INPUT DIODE
VFForward Voltage IF = 20 mA 1.2 1.6 V
lRReverse Leakage Current VR = 5 V 10 mA
lPE Peak Emission
Wavelength
IF = 20 mA 940 nm
OUTPUT TRANSISTOR
lDCollector-Emitter Dark
Current
IF = 0 mA, VCE = 20 V 100 nA
COUPLED
lC(ON) On-State Collector
Current
IF = 20 mA, VCE = 5 V
(Note 6)
QRE1113 & QRE1113GR 0.10 0.90 mA
QRE1114GR 0.30 0.60 mA
ICX Cross-Talk Collector
Current
IF = 20 mA, VCE = 5 V (Note 7) 1mA
VCE(SAT) Saturation Voltage IF = 20 mA, IC = 50 mA (Note 6) 0.3 V
trRise Time VCC = 5 V, lC(ON) = 100 mA, RL = 1 kW20 ms
tfFall Time 20 ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
6. Measured using an aluminum alloy mirror at d = 1 mm.
7. No reflective surface at close proximity.
REFLOW PROFILE
Figure 1. Reflow Profile
Time (seconds)
1°C to 5°C/sec
1°C to 5°C/sec
260°C max. for 10 sec. max.
260°C
120 sec. max.
60 sec. max.
above 220°C
Preheating
180°C to 200°C
220°C
Temperature (5C)
\ Sansmg Oman wm Paw Lame “Mam! MW \ \ \\ Nmmahzna m VcE = w v u = 25'0 VCE=mV/
QRE1113, QRE1113GR, QRE1114GR
www.onsemi.com
3
TYPICAL PERFORMANCE CURVES
Figure 2. Normalized Collector Current vs.
Distance between Device and Reflector
Figure 3. Collector Current vs. Forward Current
Figure 4. Normalized Collector Current vs.
Collector to Emitter Voltage
Figure 5. Collector Emitter Dark Current
(Normalized) vs. Ambient Temperature
dDISTANCE (mm)
0
0.0
0.2
0.4
0.6
0.8
1.0
IF = 10 mA
VCE = 5 V
TA = 25˚C
Mirror
Sensing Object:
White Paper (90% reflective)
0
d
123 45
IF FORWARD CURRENT (mA)
VCE COLLECTOR EMITTER VOLTAGE (V)
0.1 1 10
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
IF = 25mA
IF=20mA
IF=10mA
IF=15mA
IF=5mA
d = 1 mm, 90% reflection
TA = 25˚C
TA AMBIENT TEMPERATURE (˚C)
25 40 55 70 85
102
101
100
101
102
Normalized to:
VCE = 10 V
TA = 25˚C
VCE = 10 V
VCE = 5 V
IC(ON) NORMALIZED COLLECTOR CURRENT
IC(ON) COLLECTOR CURRENT (mA)
ICEO NORMALIZED DARK CURRENT
IC(ON) NORMALIZED COLLECTOR CURRENT
0481216 20
0.0
0.2
0.4
0.6
0.8
1.0
QRE1113 & QRE1113GR
QRE1114GR
QRE1113, QRE1113GR, QRE1114GR
www.onsemi.com
4
TYPICAL PERFORMANCE CURVES (Continued)
Figure 6. Forward Current vs. Forward Voltage Figure 7. Rise and Fall Time vs. Load Resistance
Figure 8. Forward Voltage vs. Ambient
Temperature
Figure 9. Radiation Diagram
VF FORWARD VOLTAGE (V)
IF FORWARD CURRENT (mA)
1.0 1.1 1.2 1.3 1.4 1.5
0
10
20
30
40
50
TA = 25˚C
RL LOAD RESISTANCE (kW)
0.1 101
1
10
100 VCC = 10 V
tpw = 100 us
T=1ms
TA = 25˚C
IC = 0.3 mA
IC = 1 mA
tf
tf
tr
tr
RISE AND FALL TIME (ms)
VF FORWARD VOLTAGE (V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
IF = 50 mA
IF = 10 mA
IF = 20 mA
TA AMBIENT TEMPERATURE (˚C)
40 20020406080
ANGULAR DISPLACEMENT
00.20.40.6 0.60.40.2
1.0
0.9
0.8
0.7
RELATIVE RADIANT INTENSITY
QRE1113, QRE1113GR, QRE1114GR
www.onsemi.com
5
TAPING DIMENSIONS FOR GR OPTION
Figure 10. Taping Dimensions for GR Option
2.0±0.05 4.0
0.25
5.5±0.05
12.0±0.3
8.0
3.73
4.75
1.98
ø1.5
1.75
Progressive Direction
General tolerance ±0.1
Dimensions in mm
REEL DIMENSIONS
Figure 11. Reel Dimensions
ø13.0 ± 0.5
2.2 ± 0.5
9.0 ± 0.5
12.0 ± 0.15
ø60.0 ± 0.5
ø178.0 ± 1.0
www onsem' com
QRE1113, QRE1113GR, QRE1114GR
www.onsemi.com
6
Precautionary Notes
1. Refer to application note AND8003/D, “Storage and Handling of Dry Packed Surface Mounted Devices” for details of handling procedure.
2. Product soldering terminals are silver plated and oxidization may occur with prolonged exposure to ambient environment. Oxidized terminal
may have poor solderability performance. Keep unsealed devices in moisture barrier bag sealed with desiccant or in dry cabinet at <5%
relative humidity.
3. Store PCB in sealed moisture barrier bag together with desiccant or store in dry cabinet at <5% relative humidity. Mounted device that has
been exposed to ambient environment for long period of time may suffer moisture related damage if PCB is subjected to subsequent high
temperature processes.
0N Snmiwndunw“ +100 ‘7 0.40 L20 3.80 >l #040 11 020 Notes: 3. 0 * .20 0.94 10.4 8.4 +ll* 0~20 1. Dimensions for all drawings are in millimeters. 2. Tolerance of :0.15mm on all nonenomlnal dlmenslons 0N Seneanuuaunanu ‘3 rlghls m a|hers are Imaemavks ul Semlcanduclur campenenus Induslnes, as film ON Semiconducmr or us suhsldlanas m me Unlled sxaxes andlaralhev cmmlnes ON Semlcunducmr vesewes me nghl to make changes wunauuunner mouse to any emuums nenen 0N Semlmnducmv makes rm wananly, represenlalmn m guaranlee regarding lne sullablllly al lls man Is 4m any pamculav purpose nm does ON Semlcnnduclm assume any llablllly avlslng aum me sppllcelmn ar use at any pmducmv clrcufl anu speclficelly disclmms any and an lla uy lncludlng wlllmul llmllalmn spemal. consequenllal ar mmdeulal damages ON Semlmmuclar dues m| aanvey any llcense under us pa|enl nghls nor me
REFLECTIVE RECTANGULAR THROUGH HOLE
CASE 100AQ
ISSUE O
DATE 30 SEP 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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98AON13409G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
REFLECTIVE RECTANGULAR THROUGH HOLE
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
0N Semiwndudw" m 2.59 77+77 I 4— 1.66 .7 TOP VIEW LAND PATTERN RECOMMENDATION ‘ 0.40 + + I123 {3233/ ‘ kl I 1.10 e ‘4 «0.61 NOM. (4X) (0.3358) FLAT AREA 4‘80 440 NOTES: SIDE VIEW A. NOINDUSTRY STANDARD APPLIES TOTHIS PACKAGE B. ALL DIMENSIONS ARE IN MILLIMETERS C. TOLERANCE OF :0.15MM ON ALL NONVNOMINAL DIMENSIONS ON Samanauamy and are hademavk: av Samanauamr Campunenls lnduslnes uc dba ON Samanauaxar ar us suhsxdxanes In the Umled sxaxas andJm mhev cmm‘nes ON Samanauaxar vesewes ma “gm to make changes wmmm mnna. name to any means nanan ON Samnaaaw makes m7 walvamy represenlalmn m guarantee regardmg the smawmy av IVS manuals Iur any pamcuIav purpase nnv aaas ON Samanaaamy assume any Mammy ansmg nulnI [he aaancauan m use HI any pmduclnv cIrcml and specmcalIy dxscIaIms any and an Mammy IncIudmg mam nnmauan spemaI cansequenhaI m mudeflvlaI damages ON Sammnauaxar dues nn| aanyay any naansa under Ms paler“ nghls Ivar [he ngms av n|hers
ARUSM313 / REFLECTIVE RECTANGULAR SURFACE MOUNT
CASE 100CY
ISSUE O
DATE 31 JAN 2017
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13407G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ARUSM313 / REFLECTIVE RECTANGULAR SURFACE MOUNT
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
a a e lrademavks av Semxcunduclm Cnmvnnems In "sine \ghlsmanumhernlpalems \rademavks Dav www menu cumrsuerguwaxem Mavkmg gm 9 www nnserm cum
www.onsemi.com
1
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