CPC1978 Datasheet by IXYS Integrated Circuits Division

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Characteristics
Features
1.85Arms Load Current with 5°C/W Heat Sink
Low 2.3 On-Resistance
800VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Impedance: JC = 0.35 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Flammability Rating UL 94 V-0
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Recognized Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits brings OptoMOS®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1978 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 1.85Arms continuous load current with a
5°C/W heat sink.
The CPC1978 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal impedance
(0.35 °C/W).
Ordering Information
Switching Characteristics
Parameter Rating Units
Blocking Voltage 800 VP
Load Current, TA=25°C:
With 5°C/W Heat Sink 1.85 Arms / ADC
No Heat Sink 0.75
On-Resistance (max) 2.3
Thermal Impedance,
Junction-to-Case, JC 0.35 °C/W
3
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4
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Part Description
CPC1978J i4-PAC Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1978
800V Single-Pole, Normally Open
Power Relay
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CPC1978
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
1.2 Electrical Characteristics @ 25°C
1 Higher load currents possible with proper heat sinking.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (TC > 60ºC) a minimum LED drive current of 20mA is recommended.
Symbol Ratings Units
Blocking Voltage 800 VP
Reverse Input Voltage 5 V
Input Control Current 100 mA
Peak (10ms) 1 A
Input Power Dissipation 150 mW
Isolation Voltage, Input to Output 2500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current 1
Peak t10ms
IL--
10 AP
Continuous No Heat Sink 0.75
Continuous TC=25°C 7.25 Arms / ADC
Continuous TC=99°C IL(99) 0.825
On-Resistance 2IF=10mA, IL=1A RON -1.72.3
Off-State Leakage Current VL=800VPILEAK --1 A
Switching Speeds
Tu r n - O n IF=20mA, VL=10V ton -820 ms
Tu r n - O f f toff -0.155
Output Capacitance IF=0mA, VL=25V, f=1MHz Cout -390- pF
Input Characteristics
Input Control Current to Activate 3IL=1A IF--10 mA
Input Control Current to Deactivate - IF0.6 - - mA
Input Voltage Drop IF=10mA VF0.9 1.35 1.56 V
Reverse Input Current VR=5V IR--10 A
Input/Output Characteristics
Capacitance, Input-to-Output VIO=0V, f=1MHz CIO -1- pF
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CPC1978
2 Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal impedance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal impedance heat sink combinations.
Parameter Conditions Symbol Rating Units
Thermal Impedance (Junction to Case) - JC 0.35 °C/W
Thermal Impedance (Junction to Ambient) Free Air JA 33 °C/W
Junction Temperature (Operating) - TJ-40 to +100 °C
θCA = - θJC
(TJ - TA) IL(99)2
IL2 PD(99)
TJ = Junction Temperature (°C), TJ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL IL(MAX)
θJC = Thermal Impedance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Impedance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
Heat Sink Rating
IIIIXYS ass sun 545 ssu ckmg anhg: w;
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CPC1978
3 Performance Data*
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
35
30
25
20
15
10
5
01.65 1.66 1.67 1.691.681.70
On-Resistance (Ω)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1ADC)
Device Count (N)
0.12 0.16 0.200.10 0.14 0.18
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=10mA, IL=1ADC)
Turn-Off Time (ms)
Device Count (N)
7.0 8.0 9.06.5 7.5 8.5
25
20
15
10
5
0
Device Count (N)
Turn-On Time (ms)
Typical Turn-On Time
(N=50, IF=10mA, IL=1ADC)
35
30
25
20
15
10
5
0825 830 835 840 845 850
Blocking Voltage (VP)
Typical Blocking Voltage Distribution
(N=50)
Device Count (N)
-40
14
12
10
8
6
4
2
0-20 0 20 40 60 80 100
Typical Turn-On Time vs. Temperature
(IF=10mA, IL=0.5ADC)
Temperature (ºC)
Turn-On Time (ms)
05 1015202530354045
0.18
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.10 50
LED Forward Current (mA)
Turn-Off TIme (ms)
Typical Turn-Off Time
vs. LED Forward Current
(IL=0.5ADC)
LED Forward Current (mA)
05 1015202530354045
18
16
14
12
10
8
6
4
2
050
Turn-On Time (ms)
Typical Turn-On Time
vs. LED Forward Current
(IL=0.5ADC)
-40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0-20 0 20 40 60 80 100
Typical Turn-Off Time vs. Temperature
(IF=10mA, IL=0.5ADC)
Temperature (ºC)
Turn-Off Time (ms)
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CPC1978
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
-40
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0-20 0 20 40 60 80 100
Temperature (ºC)
Leakage (μA)
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=800VP)
-40
855
850
845
840
835
830
825
820
815 -20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
0 20406080100
0
1
2
3
4
5
1ºC/W
5ºC/W
10ºC/W
No Heat Sink
Temperature (ºC)
Load Current (Arms)
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
Load Current (A)
-2.25 -1.5 -0.75 0.75 1.5
02.25
1.25
1.00
0.75
0.50
0.25
0
-0.25
-0.50
-0.75
-1.00
-1.25
Typical Load Current vs. Load Voltage
(IF=10mA)
Load Voltage (V)
-40
3.2
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4 -20 0 20 40 60 80 100
On-Resistance (Ω)
Temperature (ºC)
Typical On-Resistance
vs. Temperature
(IF=20mA, IL=0.5A)
12
10
8
6
4
2
01ms10µs 100µs 100ms 10s10ms 1s 100s
Time
Load Current (AP)
Energy Rating Curve
Free Air, No Heat Sink
IIIIXYS Ms 0
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4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
4.3 Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to
the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake
cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of
the wash parameters used to clean the board, determination of the bake temperature and duration necessary to
remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must
not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
Device Moisture Sensitivity Level (MSL) Classification
CPC1978J MSL 1
Device Classification Temperature (TC)Dwell Time (tp)Max Reflow Cycles
CPC1978J 245°C 30 seconds 1
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4.5 Mechanical Dimensions
DCB Substrate
1.270 TYP
(0.050 TYP)
NOTE: Metallized external surface of DCB substrate maintains 2500Vrms
isolation to device internal structure and all external pins.
20.879 ± 0.254
(0.822 ± 0.010)
20.396 ± 0.508
(0.803 ± 0.020)
15.240 ± 0.508
(0.600 ± 0.020)
3.810 ± 0.254
(0.150 ± 0.010)
2.362 ± 0.381
(0.093 ± 0.015)
19.914 ± 0.254
(0.784 ± 0.010)
5.029 ± 0.127
(0.198 ± 0.005) 1.181 ± 0.076
(0.047 ± 0.003)
15.317 ± 0.254
(0.603 ± 0.010)
1.930 ± 0.381
(0.076 ± 0.015)
17.221 ± 0.254
(0.678 ± 0.010)
DIMENSIONS
mm
(inches)
0.635 ± 0.076
(0.025 ± 0.003)
2.794 ± 0.127
(0.110 ± 0.005)
NOTE: Not to be soldered
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to
specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not
limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits’ product may result in direct physical harm, injury, or death to a person or severe property or
environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1978-R10
©Copyright 2018, IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/21/2018

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