ESP32-S2-WROVER, ESP32-S2-WROVER-I Datasheet by Espressif Systems

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ESP32S2WROVER
ESP32S2WROVERI
Datasheet
Version 1.1
Espressif Systems
Copyright © 2020
www.espressif.com
About This Document
This document provides the specifications for the ESP32-S2-WROVER and ESP32-S2-WROVER-I
module.
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Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.
Revision History
For revision history of this document, please refer to the last page.
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IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF
MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information in this
document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property
rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth
logo is a registered trademark of Bluetooth SIG.
All trade names, trademarks and registered trademarks mentioned in this document are property of their
respective owners, and are hereby acknowledged.
Copyright © 2020 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.
1 Module Overview
1 Module Overview
1.1 Features
MCU
ESP32-S2 embedded, Xtensa®single-core
32-bit LX7 microprocessor, up to 240 MHz
128 KB ROM
320 KB SRAM
16 KB SRAM in RTC
WiFi
802.11 b/g/n
Bit rate: 802.11n up to 150 Mbps
A-MPDU and A-MSDU aggregation
0.4 µs guard interval support
Center frequency range of operating channel:
2412 ~2484 MHz
Hardware
Interfaces: GPIO, SPI, LCD, UART, I2C, I2S,
Camera interface, IR, pulse counter, LED PWM,
TWAITM (compatible with ISO 11898-1), USB 1.1
OTG, ADC, DAC, touch sensor, temperature
sensor
40 MHz crystal oscillator
4 MB SPI flash
2 MB PSRAM
Operating voltage/Power supply: 3.0 ~3.6 V
Operating temperature ran
ge: –40 ~85 °C
Dimensions: (18 × 31 × 3.3) mm
Certification
Green certification: RoHS/REACH
RF certification: FCC/CE-RED/SRRC
Test
• HTOL/HTSL/uHAST/TCT/ESD
1.2 Description
ESP32-S2-WROVER and ESP32-S2-WROVER-I are two powerful, generic Wi-Fi MCU modules that have a rich
set of peripherals. They are an ideal choice for a wide variety of application scenarios relating to Internet of Things
(IoT), wearable electronics and smart home.
ESP32-S2-WROVER comes with a PCB antenna, and ESP32-S2-WROVER-I with an IPEX antenna. They both
feature a 4 MB external SPI flash and an additional 2 MB SPI Pseudo static RAM (PSRAM). The information in
this datasheet is applicable to both modules. The ordering information of the two modules is listed as
follows:
Table 1: Ordering Information
Module Chip embedded Flash PSRAM Module dimensions (mm)
ESP32-S2-WROVER (PCB) ESP32-S2 4 MB 2 MB (18.00±0.15)×(31.00±0.15)×(3.30±0.15)
ESP32-S2-WROVER-I (IPEX)
Notes:
1. The module with various capacities of flash is available for custom order.
2. For dimensions of the IPEX connector, please see Section 7.3.
At the core of this module is ESP32-S2 *, an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. The chip
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1 Module Overview
has a low-power co-processor that can be used instead of the CPU to save power while performing tasks that
do not require much computing power, such as monitoring of peripherals. ESP32-S2 integrates a rich set of
peripherals, ranging from SPI, I2S, UART, I2C, LED PWM, TWAITM, LCD, Camera interface, ADC, DAC, touch
sensor, temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed USB 1.1 On-The-Go (OTG)
interface to enable USB communication.
Note:
* For more information on ESP32-S2, please refer to ESP32-S2 Datasheet.
1.3 Applications
Generic Low-power IoT Sensor Hub
Generic Low-power IoT Data Loggers
Cameras for Video Streaming
Over-the-top (OTT) Devices
USB Devices
Speech Recognition
Image Recognition
Mesh Network
Home Automation
Smart Home Control Panel
Smart Building
Industrial Automation
Smart Agriculture
Audio Applications
Health Care Applications
Wi-Fi-enabled Toys
Wearable Electronics
Retail & Catering Applications
Smart POS Machines
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Contents
Contents
1 Module Overview 3
1.1 Features 3
1.2 Description 3
1.3 Applications 4
2 Block Diagram 8
3 Pin Definitions 9
3.1 Pin Layout 9
3.2 Pin Description 10
3.3 Strapping Pins 11
4 Electrical Characteristics 13
4.1 Absolute Maximum Ratings 13
4.2 Recommended Operating Conditions 13
4.3 DC Characteristics (3.3 V, 25 °C) 13
4.4 Current Consumption Characteristics 14
4.5 Wi-Fi RF Characteristics 15
4.5.1 Wi-Fi RF Standards 15
4.5.2 Transmitter Characteristics 15
4.5.3 Receiver Characteristics 15
5 Schematics 17
6 Peripheral Schematics 19
7 Physical Dimensions and PCB Land Pattern 20
7.1 Physical Dimensions 20
7.2 Recommended PCB Land Pattern 21
7.3 U.FL Connector Dimensions 22
8 Product Handling 23
8.1 Storage Condition 23
8.2 ESD 23
8.3 Reflow Profile 23
9 MAC Addresses and eFuse 24
10 Learning Resources 25
10.1 Must-Read Documents 25
10.2 Must-Have Resources 25
Revision History 26
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List of Tables
List of Tables
1 Ordering Information 3
2 Pin Definitions 10
3 Strapping Pins 11
4 Absolute Maximum Ratings 13
5 Recommended Operating Conditions 13
6 DC Characteristics (3.3 V, 25 °C) 13
7 Current Consumption Depending on RF Modes 14
8 Current Consumption Depending on Work Modes 14
9 Wi-Fi RF Standards 15
10 Transmitter Characteristics 15
11 Receiver Characteristics 15
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List of Figures
List of Figures
1 ESP32-S2-WROVER Block Diagram 8
2 ESP32-S2-WROVER-I Block Diagram 8
3 Pin Layout (Top View) 9
4 ESP32-S2-WROVER Schematics 17
5 ESP32-S2-WROVER-I Schematics 18
6 Peripheral Schematics 19
7 Physical Dimensions 20
8 Recommended PCB Land Pattern 21
9 U.FL Connector Dimensions 22
10 Reflow Profile 23
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F________________~ ESP327827WROVEH I I 40 MHZ 7V3 I Crystal Antenna I | ‘ ‘ \ / | I RF Matching I I ESP32-S2 I | EN GPIOs | ' I 32:51 V225; E ' | g may 5 | stI | E 2:13;; :13; g I I (n swan 5‘03 0, J _ _______________ _’ F ——————————————— —~ I 40 MHZ ESPazrserROVERrx I 3V8 I Crystal I Antenna I I I I \ / I RF Matching 7 o I ESPaz—sz | EN GPIDs I | | | I WW 1 map. 5 | | E 215:; _ 2:3; 2 | I (I) swam swoa a) I E _______________ _,
2 Block Diagram
2 Block Diagram
ESP32-S2
RF Matching
40 MHz
Crystal
3V3
ESP32-S2-WROVER
EN GPIOs
Antenna
SPI FLASH
SPICS0
SPICLK
SPIDI
SPIDO
SPIWP
SPIHD
VDD_SPI
SPI PSRAM
SPICLK
SPICS1
VDD_SPI
SIO0
SIO1
SIO2
SIO3
Figure 1: ESP32S2WROVER Block Diagram
SPI FLASH
ESP32-S2
RF Matching
40 MHz
Crystal
SPICS0
SPICLK
SPIDI
SPIDO
SPIWP
SPIHD
3V3
VDD_SPI
ESP32-S2-WROVER-I
EN GPIOs
Antenna
SPI PSRAM
SPICLK
SPICS1
VDD_SPI
SIO0
SIO1
SIO2
SIO3
Figure 2: ESP32S2WROVERI Block Diagram
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Keepout Zone D 3 N G w ‘11; ‘1‘; ‘1‘; ‘11; ‘11; ‘1‘; ‘11; ‘114 ‘1‘; ‘1‘; ‘114 ‘1‘; ‘1‘; ‘114 ‘1‘; ‘1‘; 0 O O 2 O 3 O IO42 1 r1 1 r1 11 r 4 O |O41 mm mm \cw‘ 5 O 34 fr‘; fr‘; ,1; fr‘; fr‘; 1040 6 O 33 1039 7 O 10 32 1038 8 O 11 31 1037 9 O 12 30 1036 .0: m 13 |O11 14 1034 |O12 15 |O13 16 mNO_ FNO_ ONO. meg £0. :9 mw0_ $0. :9 F71 F71 F71 F71 F71 F71 F71 F71 F71 F71
3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
1GND
23V3
3IO0
4 IO1
5IO2
6IO3
Keepout Zone
7 IO4
8IO5
9IO6
10 IO7
11 IO8
12 IO9
13 IO10
14 IO11
15 IO12
16 IO13
42GND
41EN
40
IO46
39
IO45
38RXD0
37
TXD0
36IO42
35IO41
34IO40
33IO39
32IO38
31
IO37
30
IO36
29
IO35
28
IO34
27IO33
Pin 43
GND
GND
GND GND GND
GND
GNDGNDGND
17 IO14
18 IO15
19 IO16
20 IO17
21 IO18
22 IO19
23 IO20
24 IO21
25 IO26
26 GND
Figure 3: Pin Layout (Top View)
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3 Pin Definitions
Note:
The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer
to Figure 7.1 Physical Dimensions.
3.2 Pin Description
The module has 42 pins. See pin definitions in Table 2.
Table 2: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
IO0 3 I/O/T RTC_GPIO0, GPIO0
IO1 4 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
IO2 5 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
IO3 6 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
IO4 7 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
IO5 8 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
IO6 9 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
IO7 10 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
IO8 11 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7
IO9 12 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD
IO10 13 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4
IO11 14 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5
IO12 15 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6
IO13 16 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7
IO14 17 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS
IO15 18 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
IO16 19 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
IO17 20 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1
IO18 21 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3
IO19 22 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
IO20 23 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
IO21 24 I/O/T RTC_GPIO21, GPIO21
IO26 25 I/O/T SPICS1, GPIO26 (See the note below the table.)
GND 26 P Ground
IO33 27 I/O/T SPIIO4, GPIO33, FSPIHD
IO34 28 I/O/T SPIIO5, GPIO34, FSPICS0
IO35 29 I/O/T SPIIO6, GPIO35, FSPID
IO36 30 I/O/T SPIIO7, GPIO36, FSPICLK
IO37 31 I/O/T SPIDQS, GPIO37, FSPIQ
IO38 32 I/O/T GPIO38, FSPIWP
IO39 33 I/O/T MTCK, GPIO39, CLK_OUT3
IO40 34 I/O/T MTDO, GPIO40, CLK_OUT2
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3 Pin Definitions
Name No. Type Function
IO41 35 I/O/T MTDI, GPIO41, CLK_OUT1
IO42 36 I/O/T MTMS, GPIO42
TXD0 37 I/O/T U0TXD, GPIO43, CLK_OUT1
RXD0 38 I/O/T U0RXD, GPIO44, CLK_OUT2
IO45 39 I/O/T GPIO45
IO46 40 I GPIO46
EN 41 I
High: on, enables the chip.
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
GND 42 P Ground
Notice:
By default, IO26 is connected to the CS pin of the PSRAM and cannot be used for other functions.
For peripheral pin configurations, please refer to ESP32-S2 Datasheet.
3.3 Strapping Pins
ESP32-S2 has three strapping pins: GPIO0, GPIO45, GPIO46. The pin-pin mapping between ESP32-S2 and
the module is as follows, which can be seen in Chapter 5Schematics:
GPIO0 = IO0
GPIO45 = IO45
GPIO46 = IO46
Software can read the values of corresponding bits from register ”GPIO_STRAPPING”.
During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog
reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as
strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down.
IO0, IO45 and IO46 are connected to the internal pull-up/pull-down. If they are unconnected or the connected
external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of
these strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2.
After reset, the strapping pins work as normal-function pins.
Refer to Table 3for a detailed boot-mode configuration of the strapping pins.
Table 3: Strapping Pins
VDD_SPI Voltage 1
Pin Default 3.3 V 1.8 V
IO45 2Pull-down 0 1
Booting Mode
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3 Pin Definitions
Pin Default SPI Boot Download Boot
IO0 Pull-up 1 0
IO46 Pull-down Don’t-care 0
Enabling/Disabling ROM Code Print During Booting 3 4
Pin Default Enabled Disabled
IO46 Pull-down See the fourth note See the fourth note
Note:
1. Firmware can configure register bits to change the settings of ”VDD_SPI Voltage”.
2. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior.
3. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V by
default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is powered up by
external circuit.
4. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit.
5. When eFuse UART_PRINT_CONTROL value is:
0, print is normal during boot and not controlled by IO46.
1 and IO46 is 0, print is normal during boot; but if IO46 is 1, print is disabled.
2 and IO46 is 0, print is disabled; but if IO46 is 1, print is normal.
3, print is disabled and not controlled by IO46.
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4 Electrical Characteristics
4 Electrical Characteristics
4.1 Absolute Maximum Ratings
Table 4: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
TST ORE Storage temperature –40 85 °C
4.2 Recommended Operating Conditions
Table 5: Recommended Operating Conditions
Symbol Parameter Min Typ Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 A
T Operating temperature –40 85 °C
Humidity Humidity condition 85 %RH
4.3 DC Characteristics (3.3 V, 25 °C)
Table 6: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance 2 pF
VIH High-level input voltage 0.75 × VDD VDD + 0.3 V
VIL Low-level input voltage –0.3 0.25 × VDD V
IIH High-level input current 50 nA
IIL Low-level input current 50 nA
VOH
2High-level output voltage 0.8 × VDD V
VOL
2Low-level output voltage 0.1 × VDD V
IOH
High-level source current (VDD = 3.3 V, VOH >=
2.64 V, PAD_DRIVER = 3) 40 — mA
IOL
Low-level sink current (VDD = 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3) 28 — mA
RP U Pull-up resistor 45 k
RP D Pull-down resistor 45 k
VIH_nRST Chip reset release voltage 0.75 × VDD VDD + 0.3 V
VIL_nRST Chip reset voltage –0.3 0.25 × VDD V
Note:
1. VDD is the I/O voltage for a particular power domain of pins.
2. VOH and VOL are measured using high-impedance load.
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4 Electrical Characteristics
4.4 Current Consumption Characteristics
With the use of advanced power-management technologies, the module can switch between different power
modes. For details on different power modes, please refer to Section RTC and Low-Power Management in
ESP32-S2 Datasheet.
Table 7: Current Consumption Depending on RF Modes
Work mode Description Peak (mA)
Active (RF working)
TX
802.11b, 20 MHz, 1 Mbps, @19.5 dBm 310
802.11g, 20 MHz, 54 Mbps, @15 dBm 220
802.11n, 20 MHz, MCS7, @13 dBm 200
802.11n, 40 MHz, MCS7, @13 dBm 160
RX 802.11b/g/n, 20 MHz 63
802.11n, 40 MHz 68
Note:
The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF
port. All transmitters’ measurements are based on a 100% duty cycle.
The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle.
Table 8: Current Consumption Depending on Work Modes
Work mode Description Current consumption (Typ)
Modem-sleep The CPU is
powered on
240 MHz 22 mA
160 MHz 17 mA
Normal speed: 80 MHz 14 mA
Light-sleep 550 µA
Deep-sleep
The ULP co-processor is powered on. 235 µA
ULP sensor-monitored pattern 22 µA @1% duty
RTC timer + RTC memory 25 µA
RTC timer only 20 µA
Power off CHIP_PU is set to low level, the chip is powered off. 1 µA
Note:
The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache
idle.
When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consump-
tion changes accordingly.
In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and
the peripherals used.
During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C are able to
operate.
The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodi-
cally. When touch sensors work with a duty cycle of 1%, the typical current consumption is 22 µA.
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Wi-Fi RF Characte Wi-Fi RF Standards ards on quency range of operat 484 MHz ess standard 1 1b/g/n 5.5 and 11 Mb 12‘ 18, 24, 36 77‘ 72.2 Mb 77‘ 150 Mb pe a, IPEX an shou1d operate m We ce regu1alory cy range 15 configurable modules ma! use 1PEX or other m no! need m concern smitter Chara ics Parameter power is configur iver Charac Parameter
4 Electrical Characteristics
4.5 WiFi RF Characteristics
4.5.1 WiFi RF Standards
Table 9: WiFi RF Standards
Name Description
Center frequency range of operating channel note12412 ~2484 MHz
Wi-Fi wireless standard IEEE 802.11b/g/n
Data rate 20 MHz
11b: 1, 2, 5.5 and 11 Mbps
11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
11n: MCS0-7, 72.2 Mbps (Max)
40 MHz 11n: MCS0-7, 150 Mbps (Max)
Antenna type PCB antenna, IPEX antenna
1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center
frequency range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 . For other modules without IPEX antennas,
users do not need to concern about the output impedance.
4.5.2 Transmitter Characteristics
Table 10: Transmitter Characteristics
Parameter Rate Typ Unit
TX Power note1
11b, 1 Mbps 19.5
dBm
11b, 11 Mbps 19.5
11g, 6 Mbps 18
11g, 54 Mbps 15
11n, HT20, MCS0 18
11n, HT20, MCS7 13.5
11n, HT40, MCS0 18
11n, HT40, MCS7 13.5
1. Target TX power is configurable based on device or certification requirements.
4.5.3 Receiver Characteristics
Table 11: Receiver Characteristics
Parameter Rate Typ Unit
RX Sensitivity
1 Mbps –97
dBm
2 Mbps –95
5.5 Mbps –93
11 Mbps –88
6 Mbps –92
9 Mbps –91
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4 Electrical Characteristics
Parameter Rate Typ Unit
12 Mbps –89
18 Mbps –86
24 Mbps –83
36 Mbps –80
48 Mbps –76
54 Mbps –74
11n, HT20, MCS0 –92
11n, HT20, MCS1 –88
11n, HT20, MCS2 –85
11n, HT20, MCS3 –82
11n, HT20, MCS4 –79
11n, HT20, MCS5 –75
11n, HT20, MCS6 –73
11n, HT20, MCS7 –72
11n, HT40, MCS0 –89
11n, HT40, MCS1 –85
11n, HT40, MCS2 –83
11n, HT40, MCS3 –79
11n, HT40, MCS4 –76
11n, HT40, MCS5 –72
11n, HT40, MCS6 –70
11n, HT40, MCS7 –68
RX Maximum Input Level
11b, 1 Mbps 5
dBm
11b, 11 Mbps 5
11g, 6 Mbps 5
11g, 54 Mbps 0
11n, HT20, MCS0 5
11n, HT20, MCS7 0
11n, HT40, MCS0 5
11n, HT40, MCS7 0
Adjacent Channel Rejection
11b, 11 Mbps 35
dB
11g, 6 Mbps 31
11g, 54 Mbps 14
11n, HT20, MCS0 31
11n, HT20, MCS7 13
11n, HT40, MCS0 19
11n, HT40, MCS7 8
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8 HO.
6 Peripheral Schematics
6 Peripheral Schematics
5
5
4
4
3
3
2
2
1
1
D
D
C
C
B
B
A
A
X1: ESR = Max. 70 KΩ
NC: No component.
EN
IO0
IO12
IO13
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO42
IO41
IO37
IO36
IO38
IO40
IO39
IO14
IO15
IO16
IO17
IO19
IO20
IO21
IO46
RXD0
TXD0
IO45
EN
IO35
IO34
IO33
TMS
TDI
TDO
TCK
IO0
USB_D+
USB_D-
IO18
GND
GND GND
VDD33
GND GND
GND
GND
VDD33
GND
GND
GND
GND GND
VDD33
GND
JP3
USB OTG
1
1
2
2
C3
0.1uF
SW1
R3 0(NC)
C2
TBD
U1
ESP32-S2-WROVER/ESP32-S2-WROVER-I
GND
1
3V3
2
IO0
3
IO1
4
IO2
5
IO3
6
IO4
7
IO5
8
IO6
9
IO7
10
IO8
11
IO9
12
IO10
13
IO11
14
GND 42
IO45 39
RXD0 38
TXD0 37
IO42 36
IO41 35
IO40 34
IO39 33
IO38 32
IO37 31
IO36 30
IO35 29
IO34 28
IO33 27
IO14
17
IO15
18
IO16
19
IO17
20
IO18
21
IO19
22
IO20
23
IO21
24
IO26
25
GND
26
EPAD 43
IO12
15
IO13
16
EN 41
IO46 40
C7 12pF(NC)
C6
20pF(NC)
R7 0
R4 0
R2 NC
X1
32.768KHz(NC)
12
JP4
Boot Option
11
22
R1 TBD
C5
20pF(NC)
JP1
UART
1
1
2
2
3
3
4
4
C4 12pF(NC)
C1
22uF
C8 0.1uF
R5 0(NC)
R6 0
R8 10K
JP2
JTAG
1
1
2
2
3
3
4
4
Figure 6: Peripheral Schematics
Note:
Soldering the EPAD to the ground of the base board is not a must, though doing so can get optimized thermal
performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
To ensure the power supply to the ESP32-S2 chip during power-up, it is advised to add an RC delay circuit at the
EN pin. The recommended setting for the RC delay circuit is usually R = 10 kand C = 1 µF. However, specific
parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence
timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer to Section Power
Scheme in ESP32-S2 Datasheet.
GPIO18 works as U1RXD and is in an uncertain state when the chip is powered on, which may affect the chip’s
entry into download boot mode. To solve this issue, add an external pull-up resistor.
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1
Unit: mm 3303015 Tolerance: +/-0.1 mm 13 00mm 0.30 i 31 00:0 15 1019 530 83 10 AA <3 g="" r225="" 4.00="" c:="" j="" e="" m="" 3="" 2="" a="" m="" a="" '="" m="" 15="" 8a="" a="" 7="" u="" i="" 50="" 0="" 85="" v="" m="" m="" d="" 2="" 25="" g="" u="" 45="" top="" view="" side="" view="" bottom="" view="">
7 Physical Dimensions and PCB Land Pattern
7 Physical Dimensions and PCB Land Pattern
7.1 Physical Dimensions
31.00±0.15
18.00±0.15 0.80
3.30±0.15
1.50
0.9
0.45
1
0.90
0.85
15.45
10.19
4.00
4.00
2.25
0.45
Unit: mm
Tolerance: +/-0.1 mm
Top View Side View Bottom View
6.30
8.35
23.10
15.84
19.30
2,25
10.44
1.50
1.00
0.50
1.00
0.50
0.85
0.90
0.1
Figure 7: Physical Dimensions
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1
Unit: mm Vie for thermal pad \J Copper 42X1.50 Ono fl w 6M 2 w _ 3.2 Q o A , So a m m o Zrmwm o: 7/” 1 m 1|. Zr4% a n 4 , n n 7/4 A» A mum w W 1 w o; 7. om WWW % \‘ ”flammmmm”@w2@ 4m : m. g : 8.3% 0 z
7 Physical Dimensions and PCB Land Pattern
7.2 Recommended PCB Land Pattern
42x0.90
42x1.50
0.50
0.50
1.00
2.25
1.50
1.50
15.45
Antenna Area
18.00
31.00
6.30
1
17 26
42
4.10
4.10
1.10 0.40
1.10
0.40
7.81
Unit: mm
Copper
Via for thermal pad
Figure 8: Recommended PCB Land Pattern
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1
125:0‘15 fig?” L % [160:0 10 Q E g mEUOiOOS D 360:015 fiofi m E E 3 3 ¢ W , >< cav="" nd="" 0851010="" sectidn="" aa="" (110)="" 37="" 050:005="" 0851010="" 3001015=""><3 shell="" 1="" copper="" alloy/au="" plated="" over="" ni="" (2)="" contact="" t="" copper="" alloy/au="" plated="" over="" ni="" (d="" hous‘ng="" 1="" h‘ght="" temp="" plasnc="" uleavro/whhe="" \te="" part="" nameq'ty="" materwal/hmsh="">
7 Physical Dimensions and PCB Land Pattern
7.3 U.FL Connector Dimensions
Unit: mm
Figure 9: U.FL Connector Dimensions
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1
8 Product Handling
8 Product Handling
8.1 Storage Condition
The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric
environment of < 40 °C/90%RH.
The module is rated at moisture sensitivity level (MSL) 3.
After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C and /60%RH.
The module needs to be baked if the above conditions are not met.
8.2 ESD
Human body model (HBM): 2000 V
Charged-device model (CDM): 500 V
Air discharge: 6000 V
Contact discharge: 4000 V
8.3 Reflow Profile
50 150
0
25
1 ~ 3 /s
0
200
250
200
–1 ~ –5 /s
Cooling zone
100
217
50
100 250
Reflow zone
217 60 ~ 90 s
Temperature ()
Preheating zone
150 ~ 200 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 /s
Preheating zone — Temp.: 150 ~ 200 Time: 60 ~ 120 s
Reflow zone — Temp.: >217 60 ~ 90 s; Peak Temp.: 235 ~ 250 Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 Ramp-down rate: –1 ~ –5 /s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 10: Reflow Profile
Note:
Solder the module in a single reflow.
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1
9 MAC Addresses and eFuse
9 MAC Addresses and eFuse
The eFuse in ESP32-S2 has been burnt into 48-bit mac_address. The actual addresses the chip uses in station
or AP modes correspond to mac_address in the following way:
Station mode: mac_address
AP mode: mac_address + 1
There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read
disable controller. Six of them can be used to store encrypted key or user data, and the remaining one is only
used to store user data.
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1
Learning Must-Rea \owing link provxd 8/332 hxs document p erview, pm de (as?! r/DF Progra sls extensx
10 Learning Resources
10 Learning Resources
10.1 MustRead Documents
The following link provides documents related to ESP32-S2.
ESP32-S2 Datasheet
This document provides an introduction to the specifications of the ESP32-S2 hardware, including
overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc.
ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
ESP32-S2 Technical Reference Manual
The manual provides detailed information on how to use the ESP32-S2 memory and peripherals.
Espressif Products Ordering Information
10.2 MustHave Resources
Here are the ESP32-S2-related must-have resources.
ESP32-S2 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32-S2 where you can post questions, share
knowledge, explore ideas, and help solve problems with fellow engineers.
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1
Revision History
Revision History
Date Version Release notes
2020-12-17 V1.1
Added TWAI to Chapter 1Module Overview
Updated Table 7Current Consumption Characteristics
Updated the capacitance value of RC delay circuit to 1 µF in Chapter 6
Peripheral Schematics
Updated note in Section 8.3 Reflow Profile
2020-06-01 V1.0 Official release
2020-03-16 V0.5 Preliminary release
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ESP32-S2-WROVER & ESP32-S2-WROVER-I Datasheet v1.1