MCP9700-01(A) Datasheet by Microchip Technology

6‘ MICROCHIP EH!
2005-2016 Microchip Technology Inc. DS20001942G-page 1
MCP9700/9700A
MCP9701/9701A
Features
• Tiny Analog Temperature Sensor
• Available Packages:
- SC70-5, SOT-23-3, TO-92-3
• Wide Temperature Measurement Range:
- -40°C to +125°C (Extended Temperature)
- -40°C to +150°C (High Temperature)
(MCP9700, SOT-23-3 and SC70-5 only)
•Accuracy:
- ±2°C (max.), 0°C to +70°C (MCP9700A/9701A)
- ±4°C (max.), 0°C to +70°C (MCP9700/9701)
• Optimized for Analog-to-Digital Converters (ADCs):
- 10.0 mV/°C (typical) (MCP9700/9700A)
- 19.5 mV/°C (typical) (MCP9701/9701A)
• Wide Operating Voltage Range:
-V
DD = 2.3V to 5.5V (MCP9700/9700A)
-V
DD = 3.1V to 5.5V (MCP9701/9701A)
• Low Operating Current: 6 µA (typical)
• Optimized to Drive Large Capacitive Loads
Typical Applications
• Hard Disk Drives and Other PC Peripherals
• Entertainment Systems
• Home Appliance
• Office Equipment
• Battery Packs and Portable Equipment
• General Purpose Temperature Monitoring
General Description
MCP9700/9700A and MCP9701/9701A sensors with
Linear Active Thermistor Integrated Circuit (IC) com-
prise a family of analog temperature sensors that
convert temperature to analog voltage.
The low-cost, low-power sensors feature an accuracy
of ±2°C from 0°C to +70°C (MCP9700A/9701A) and
±4°C from 0°C to +70°C (MCP9700/9701) while
consuming 6 µA (typical) of operating current.
Unlike resistive sensors, e.g., thermistors, the Linear
Active Thermistor IC does not require an additional
signal-conditioning circuit. Therefore, the biasing circuit
development overhead for thermistor solutions can be
avoided by implementing a sensor from these low-cost
devices. The Voltage Output pin (VOUT) can be directly
connected to the ADC input of a microcontroller. The
MCP9700/9700A and MCP9701/9701A temperature
coefficients are scaled to provide a 1°C/bit resolution
for an 8-bit ADC with a reference voltage of 2.5V and
5V, respectively. The MCP9700/9700A output 0.1°C/bit
for a 12-bit ADC with 4.096V reference.
The MCP9700/9700A and MCP9701/9701A provide a
low-cost solution for applications that require measure-
ment of a relative change of temperature. When mea-
suring relative change in temperature from +25°C, an
accuracy of ±1°C (typical) can be realized from 0°C to
+70°C. This accuracy can also be achieved by applying
system calibration at +25°C.
In addition, this family of devices is immune to the
effects of parasitic capacitance and can drive large
capacitive loads. This provides printed circuit board
(PCB) layout design flexibility by enabling the device to
be remotely located from the microcontroller. Adding
some capacitance at the output also helps the output
transient response by reducing overshoots or
undershoots. However, capacitive load is not required
for the stability of sensor output.
Package Types
3-Pin SOT-23
MCP9700/9700A
MCP9701/9701A
3-Pin TO-92
123
GNDVOUT
VDD
Bottom
View
MCP9700/9700A
MCP9701/9701A
1
GND
VDD
VOUT
NC
4
1
2
3
5
5-Pin SC70
NC
MCP9700/9700A
MCP9701/9701A
GND
VDD VOUT
3
12
Low-Power Linear Active Thermistor ICs
MCP9700/9700A and MCP9701/9701A
DS20001942G-page 2 2005-2016 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD....................................................................... 6.0V
Storage Temperature......................... -65°C to +150°C
Ambient Temp. with Power Applied... -40°C to +150°C
Output Current .................................................±30 mA
Junction Temperature (TJ).................................. 150°C
ESD Protection on All Pins (HBM:MM) ..... (4 kV:200V)
Latch-Up Current at Each Pin ....................... ±200 mA
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load
Parameter Sym. Min. Typ. Max. Unit Conditions
Power Supply
Operating Voltage Range VDD
VDD
2.3
3.1 —
—5.5
5.5 V
V
MCP9700/9700A
MCP9701/9701A
Operating Current IDD —612µA
IDD ——15µA T
A = 150°C (Note 1)
Line Regulation °C/VDD —0.1—°C/V
Sensor Accuracy (Notes 2,3)
TA = +25°C TACY —±1—°C
TA = 0°C to +70°C TACY -2.0 ±1 +2.0 °C MCP9700A/9701A
TA = -40°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9700A
TA = -10°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9701A
TA = 0°C to +70°C TACY -4.0 ±2 +4.0 °C MCP9700/9701
TA = -40°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9700
TA = -10°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9701
TA = -40°C to +150°C TACY -4.0 ±2 +6.0 °C HighTemperature (Note 1)
Sensor Output
Output Voltage, TA = 0°C V0°C — 500 — mV MCP9700/9700A
Output Voltage, TA = 0°C V0°C — 400 — mV MCP9701/9701A
Temperature Coefficient TC—10.0—mV/°CMCP9700/9700A
TC—19.5—mV/°CMCP9701/9701A
Output Nonlinearity VONL —±0.5— °CT
A = 0°C to +70°C (Note 3)
Note 1: MCP9700 with SC70-5 and SOT-23-3 packages only. The MCP9700 High Temperature is not available
with TO-92 package.
2: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is
tested with VDD = 5.0V.
3: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation,
as shown in Equation 4-2. Also refer to Figure 2-16.
4: The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a
capacitive load of 1000 pF.
5: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal
response without PCB (leaded).
2005-2016 Microchip Technology Inc. DS20001942G-page 3
MCP9700/9700A and MCP9701/9701A
Output Current IOUT ——100µA
Output Impedance ZOUT —20—IOUT = 100 µA, f = 500 Hz
Output Load Regulation VOUT/
IOUT
—1—TA = 0°C to +70°C
IOUT = 100 µA
Turn-On Time tON — 800 — µs
Typical Load Capacitance CLOAD — — 1000 pF Note 4
SC-70 Thermal Response to 63% tRES — 1.3 — s 30°C (Air) to +125°C
(Fluid Bath) (Note 5)
TO-92 Thermal Response to 63% tRES —1.65— s
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load
Parameter Sym. Min. Typ. Max. Unit Conditions
Note 1: MCP9700 with SC70-5 and SOT-23-3 packages only. The MCP9700 High Temperature is not available
with TO-92 package.
2: The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is
tested with VDD = 5.0V.
3: The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation,
as shown in Equation 4-2. Also refer to Figure 2-16.
4: The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a
capacitive load of 1000 pF.
5: SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal
response without PCB (leaded).
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated:
MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load
MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Specified Temperature Range (Note 1)TA-40 — +125 °C MCP9700/9700A
TA-10 — +125 °C MCP9701/9701A
TA-40 — +150 °C High Temperature
(MCP9700, SOT23-3
and SC70-5 only)
Operating Temperature Range TA-40 — +125 °C Extended Temperature
TA-40 — +150 °C High Temperature
Storage Temperature Range TA-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5LD SC70 JA —331—°C/W
Thermal Resistance, 3LD SOT-23 JA —308—°C/W
Thermal Resistance, 3LD TO-92 JA —146—°C/W
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).
\\ \
MCP9700/9700A and MCP9701/9701A
DS20001942G-page 4 2005-2016 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V;
GND = Ground, Cbypass = 0.1 µF.
FIGURE 2-1: Accuracy vs. Ambient
Temperature (MCP9700A/9701A).
FIGURE 2-2: Accuracy vs. Ambient
Temperature, with VDD.
FIGURE 2-3: Supply Current vs.
Temperature.
FIGURE 2-4: Accuracy vs. Ambient
Temperature (MCP9700/9701).
FIGURE 2-5: Changes in Accuracy vs.
Ambient Temperature (Due to Load).
FIGURE 2-6: Load Regulation vs.
Ambient Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-2.0
-1.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50-25 0 255075100125150
Accuracy (°C)
TA(°C)
MCP9700A VDD = 3.3V
MCP9701A
VDD = 5.0V
Spec. Limits
-4.0
-2.0
0.0
2.0
4.0
6.0
-50 -25 0 25 50 75 100 125 150
Accuracy (°C)
TA(°C)
MCP9701/
MCP9701A
VDD = 5.5V
VDD = 3.1V
MCP9700
MCP9700A
VDD = 5.5V
VDD = 2.3V
0.0
2.0
4.0
6.0
8.0
10.0
12.0
-50 -25 0 25 50 75 100 125 150
TA (°C)
IDD (µA)
MCP9700/MCP9700A
MCP9701
MCP9701A
-4.0
-2.0
0.0
2.0
4.0
6.0
-50-25 0 255075100125150
Accuracy (°C)
TA(°C)
MCP9700
VDD = 3.3V
MCP9701
VDD = 5.0V Spec. Limits
-0.2
-0.1
0
0.1
0.2
-50 -25 0 25 50 75 100 125 150
TA (°C)
∆ Accuracy Due to Load
(°C)
MCP9701/MCP9701A
VDD = 5.0V
ILOAD = 100 µA
MCP9700/MCP9700
A
VDD
= 3.3
V
0.0
1.0
2.0
3.0
4.0
-50 -25 0 25 50 75 100 125
TA (°C)
Load Regulation ∆V/∆I (Ω)
MCP9700/MCP9700A
MCP9701/MCP9701A
VDD = 3.3V
IOUT = 50 µA
IOUT = 100 µA
IOUT = 200 µA
on (A °C/A on (A °C/A
2005-2016 Microchip Technology Inc. DS20001942G-page 5
MCP9700/9700A and MCP9701/9701A
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V;
GND = Ground, Cbypass = 0.1 µF.
FIGURE 2-7: Output Voltage at 0°C
(MCP9700/9700A).
FIGURE 2-8: Occurrences vs.
Temperature Coefficient (MCP9700/9700A).
FIGURE 2-9: Line Regulation (
°C/
VDD)
vs. Ambient Temperature.
FIGURE 2-10: Output Voltage at 0°C
(MCP9701/9701A).
FIGURE 2-11: Occurrences vs.
Temperature Coefficient (MCP9701/9701A).
FIGURE 2-12: Line Regulation (
°C/
VDD)
vs. Ambient Temperature.
0%
5%
10%
15%
20%
25%
30%
35%
400
420
440
460
480
500
520
540
560
580
600
V0°C (mV)
Occurrences
VDD = 3.3V
108 samples
MCP9700A
MCP9700
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
9.7
9.8
9.8
9.9
10.0
10.1
10.2
10.2
10.3
10.4
10.5
TC (mV/°C)
Occurrences
MCP9700
MCP9700A
VDD = 3.3V
108 samples
0%
5%
10%
15%
20%
25%
30%
35%
300
320
340
360
380
400
420
440
460
480
500
V0°C (mV)
Occurrences
MCP9701
VDD = 5.0V
108 samples
MCP9701A
MCP9701
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
19.2
19.3
19.3
19.4
19.5
19.6
19.7
19.7
19.8
19.9
20.0
TC (mV/°C)
Occurrences
MCP9701
MCP9701A
VDD = 5.0V
108 samples
0.00
0.05
0.10
0.15
0.20
0.25
0.30
-50 -25 0 25 50 75 100 125
Normalized Line Regulation
(ǻ°C/ǻVDD)
TA (°C)
MCP9701/MCP9701A
VDD = 3.1V to 5.5V
MCP9701/MCP9701A
VDD = 3.1V to 4.0V
7? N 3 i Fr
MCP9700/9700A and MCP9701/9701A
DS20001942G-page 6 2005-2016 Microchip Technology Inc.
Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V;
GND = Ground, Cbypass = 0.1 µF.
FIGURE 2-13: Output Voltage vs. Power
Supply.
FIGURE 2-14: Output vs. Settling Time to
Step VDD.
FIGURE 2-15: Thermal Response
(Air-to-Fluid Bath).
FIGURE 2-16: Output Voltage vs. Ambient
Temperature.
FIGURE 2-17: Output vs. Settling Time to
Ramp VDD.
FIGURE 2-18: Output Impedance vs.
Frequency.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VOUT (V)
TA = +26°C
0
2
4
6
8
10
12
-0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Time (ms)
VOUT (V)
-2.5
-1.7
-0.8
0.0
0.8
1.7
2.5
IDD (mA)
VDD_STEP
= 5V
TA
= 26°C
IDD
VOUT
30
55
80
105
130
-2024681012141618
Time (s)
TA (°C)
SC70-5
1 in. x 1 in. Copper Clad PCB
Leaded, without PCB
SC70-5
SOT-23-3
TO-92-3
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-50 -25 0 25 50 75 100 125
TA (°C)
VOUT (V)
MCP9700
MCP9700A
MCP9701
MCP9701A
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Time (ms)
VOUT (V)
-42.0
-30.0
-18.0
-6.0
6.0
18.0
30.0
IDD (µA)
IDD
VOUT
VDD_RAMP
= 5V/ms
TA
= +26°C
1
10
100
1000
0.1 1 10 100 1000 10000 100000
Frequency (Hz)
Output Impedance (Ω)
VDD = 5.0V
IOUT = 100 µA
TA = +26°C
1k 10k 100k100
10
10.
2005-2016 Microchip Technology Inc. DS20001942G-page 7
MCP9700/9700A and MCP9701/9701A
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Power Ground Pin (GND)
GND is the system ground pin.
3.2 Output Voltage Pin (VOUT)
The sensor output can be measured at VOUT. The
voltage range over the operating temperature range for
the MCP9700/9700A is 100 mV to 1.75V. The voltage
range over the operating temperature range for the
MCP9701/9701A is 200 mV to 3V.
3.3 Power Supply Input (VDD)
The operating voltage as specified in the DC Electrical
Characteristics table is applied to VDD.
3.4 No Connect Pin (NC)
This pin is not connected to the die. It can be used to
improve thermal conduction to the package by
connecting it to a printed circuit board (PCB) trace from
the thermal source.
Pin No.
SC70
Pin No.
SOT-23
Pin No.
TO-92 Symbol Function
1 — — NC No Connect (this pin is not connected to the die.)
2 3 3 GND Power Ground Pin
322V
OUT Output Voltage Pin
411V
DD Power Supply Input
5 — — NC No Connect (this pin is not connected to the die.)
MCP9700/9700A and MCP9701/9701A
DS20001942G-page 8 2005-2016 Microchip Technology Inc.
4.0 APPLICATIONS INFORMATION
The Linear Active Thermistor™ IC uses an internal
diode to measure temperature. The diode electrical
characteristics have a temperature coefficient that
provides a change in voltage based on the relative
ambient temperature from -40°C to 150°C. The change
in voltage is scaled to a temperature coefficient of
10.0 mV/°C (typical) for the MCP9700/9700A and
19.5 mV/°C (typical) for the MCP9701/9701A. The
output voltage at 0°C is also scaled to 500 mV (typical)
and 400 mV (typical) for the MCP9700/9700A and
MCP9701/9701A, respectively. This linear scale is
described in the first-order transfer function shown in
Equation 4-1 and Figure 2-16.
EQUATION 4-1: SENSOR TRANSFER
FUNCTION
FIGURE 4-1: Typical Application Circuit.
4.1 Improving Accuracy
The MCP9700/9700A and MCP9701/9701A accuracy
can be improved by performing a system calibration at
a specific temperature. For example, calibrating the
system at +25°C ambient improves the measurement
accuracy to a ±0.5°C (typical) from 0°C to +70°C, as
shown in Figure 4-2. Therefore, when measuring
relative temperature change, this family of devices
measures temperature with higher accuracy.
FIGURE 4-2: Relative Accuracy to +25°C
vs. Temperature.
The change in accuracy from the calibration tempera-
ture is due to the output nonlinearity from the first-order
equation, as specified in Equation 4-2. The accuracy
can be further improved by compensating for the output
nonlinearity.
For higher accuracy using a sensor compensation
technique, refer to Application Note AN1001,
“IC Temperature Sensor Accuracy Compensation with
a PIC® Microcontroller” (DS00001001). The application
note shows that if the device is compensated in
addition to room temperature calibration, the sensor
accuracy can be improved to ±0.5°C (typical) accuracy
over the operating temperature (Figure 4-3).
FIGURE 4-3: MCP9700/9700A Calibrated
Sensor Accuracy.
The compensation technique provides a linear
temperature reading. The application note includes
compensation firmware so that a look-up table can be
generated to compensate for the sensor error.
-3.0
-2.0
-1.0
0.0
1.0
2.0
3.0
-50 -25 0 25 50 75 100 125
TA (°C)
Accuracy (°C)
VDD= 3.3V
10 Samples
-4.0
-2.0
0.0
2.0
4.0
6.0
-50 -25 0 25 50 75 100 125
Temperature (°C)
Accuracy (°C)
+ s
Average
- s
Spec. Limits
100 Samples
2005-2016 Microchip Technology Inc. DS20001942G-page 9
MCP9700/9700A and MCP9701/9701A
4.2 Shutdown Using Microcontroller
I/O Pin
The 6 µA (typical) low operating current of the
MCP9700/9700A and MCP9701/9701A family makes it
ideal for battery-powered applications. However, for
applications that require a tighter current budget, this
device can be powered using a microcontroller
Input/Output (I/O) pin. The I/O pin can be toggled to
shut down the device. In such applications, the micro-
controller internal digital switching noise is emitted to
the MCP9700/9700A and MCP9701/9701A as power
supply noise. However, this switching noise compro-
mises measurement accuracy, therefore a decoupling
capacitor and series resistor will be necessary to filter
out the system noise.
4.3 Layout Considerations
The MCP9700/9700A and MCP9701/9701A family of
sensors does not require any additional components to
operate. However, it is recommended that a decoupling
capacitor of 0.1 µF to 1 µF be used between the
VDD and GND pins. In high-noise applications, connect
the power supply voltage to the VDD pin using a
200resistor with a 1 µF decoupling capacitor. A high
frequency ceramic capacitor is recommended. It is nec-
essary that the capacitor is located as close as possible
to the VDD and GND pins in order to provide effective
noise protection. In addition, avoid tracing digital lines
in close proximity to the sensor.
4.4 Thermal Considerations
The MCP9700/9700A and MCP9701/9701A family
measures temperature by monitoring the voltage of a
diode located in the die. A low-impedance thermal path
between the die and the PCB is provided by the pins.
Therefore, the sensor effectively monitors the
temperature of the PCB. However, the thermal path for
the ambient air is not as efficient because the plastic
device package functions as a thermal insulator from
the die. This limitation applies to plastic-packaged
silicon temperature sensors. If the application requires
the measurement of ambient air, the TO-92 package
should be considered.
The MCP9700/9700A and MCP9701/9701A sensors
are designed to source/sink 100 µA (max.). The power
dissipation due to the output current is relatively
insignificant. The effect of the output current can be
described by Equation 4-2.
EQUATION 4-2: EFFECT OF
SELF-HEATING
At TA=+25°C (V
OUT = 0.75V) and maximum
specification of IDD =12µA, V
DD =5.5V and
IOUT = +100 µA, the self-heating due to power
dissipation (TJ–T
A) is 0.179°C.
TJTA
–JA VDDIDD VDD VOUT
–+IOUT
=
Where:
TJ= Junction Temperature
TA= Ambient Temperature
JA =
Package Thermal Resistance (331°C/W)
VOUT = Sensor Output Voltage
IOUT = Sensor Output Current
IDD = Operating Current
VDD = Operating Voltage
MCP9700/9700A and MCP9701/9701A
DS20001942G-page 10 2005-2016 Microchip Technology Inc.
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
5-Lead SC70 Example
XXNN
Device Code
MCP9700T-E/LT AUNN
MCP9700AT-E/LT AXNN
MCP9700T-H/LT BCNN
MCP9701T-E/LT AVNN
MCP9701AT-E/LT AYNN
Note: Applies to 5-Lead SC70.
BC25
3-Lead TO-92
3-Lead SOT-23 Example
Device Code
MCP9700T-E/TT AENN
MCP9700AT-E/TT AFNN
MCP9700T-H/TT AGNN
MCP9701T-E/TT AMNN
MCP9701AT-E/TT APNN
Note: Applies to 3-Lead SOT-23.
XXNN
AE25
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
XXXXXX
XXXXXX
XXXXXX
YWWNNN
Example
MCP
9700E
TO
614256
3
e
Device
MCP9700-E/TO
MCP9700A-E/TO
MCP9701-E/TO
MCP9701A-E/TO
Note: Applies to 3-Lead TO-92.
2005-2016 Microchip Technology Inc. DS20001942G-page 11
MCP9700/9700A and MCP9701/9701A
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MCP9700/9700A and MCP9701/9701A
DS20001942G-page 12 2005-2016 Microchip Technology Inc.
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2005-2016 Microchip Technology Inc. DS20001942G-page 13
MCP9700/9700A and MCP9701/9701A
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DS20001942G-page 14 2005-2016 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2005-2016 Microchip Technology Inc. DS20001942G-page 15
MCP9700/9700A and MCP9701/9701A
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DS20001942G-page 16 2005-2016 Microchip Technology Inc.
NOTES:
2005-2016 Microchip Technology Inc. DS20001942G-page 17
MCP9700/9700A and MCP9701/9701A
APPENDIX A: REVISION HISTORY
Revision G (June 2016)
The following is the list of modifications:
1. Added the MCP9700T-H/TT package version.
2. Minor typographical changes.
Revision F (July 2014)
The following is the list of modifications:
3. Updated the Package Type information.
4. Note 4 in the DC Electrical Characteristics table
was added.
5. Updated the Temperature Range in the Product
Identification System section.
6. Added maximum IDD specification for the High
Temperature device.
Revision E (April 2009)
The following is the list of modifications:
1. Added High Temperature option throughout
document.
2. Updated plots to reflect the high temperature
performance.
3. Updated Package Outline drawings.
4. Updated Revision history.
Revision D (October 2007)
The following is the list of modifications:
1. Added the 3-lead SOT-23 devices to data sheet.
2. Replaced Figure 2-15.
3. Updated Package Outline Drawings.
Revision C (June 2006)
The following is the list of modifications:
1. Added the MCP9700A and MCP9701A devices
to data sheet.
2. Added TO92 package for the
MCP9700/MCP9701.
Revision B (October 2005)
The following is the list of modifications:
1. Added Section 3.0 “Pin Descriptions”.
2. Added the Linear Active Thermistor™ IC
trademark.
3. Removed the 2nd order temperature equation
and the temperature coeficient histogram.
4. Added a reference to AN1001 and correspond-
ing verbiage.
5. Added Figure 4-2 and corresponding verbiage.
Revision A (November 2005)
• Original release of this document.
MCP9700/9700A and MCP9701/9701A
DS20001942G-page 18 2005-2016 Microchip Technology Inc.
NOTES:
PART No. v 41x 41x
2005-2016 Microchip Technology Inc. DS20001942G-page 19
MCP9700/9700A and MCP9701/9701A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: MCP9700: Linear Active Thermistor™ IC
MCP9700A: Linear Active Thermistor™ IC
MCP9701: Linear Active Thermistor™ IC
MCP9701A: Linear Active Thermistor™ IC
Tape and Reel: T = Tape and Reel (1)
Blank = Tube
Temperature Range: E = -40C to +125C (Extended Temperature)
H= -40
C to +150C (High Temperature)
(MCP9700, SOT-23-3 and SC70-5 only)
Package: LT = Plastic Small Outline Transistor, 5-lead
TO = Plastic Transistor Outline, 3-lead
TT = Plastic Small Outline Transistor, 3-lead
PART NO. X/XX
PackageTemperature
Range
Device
Examples:
a) MCP9700T-E/LT: Linear Active Thermistor IC
Tape and Reel
Extended temperature
5LD SC70 package
b) MCP9700-E/TO: Linear Active Thermistor IC
Extended temperature
3LD TO-92 package
c) MCP9700T-E/TT: Linear Active Thermistor IC
Tape and Reel
Extended temperature
3LD SOT-23 package
d) MCP9700T-H/LT: Linear Active Thermistor IC
Tape and Reel
High temperature
5LD SC70 package
a) MCP9700AT-E/LT: Linear Active Thermistor IC
Tape and Reel
Extended temperature
5LD SC70 package
b) MCP9700A-E/TO: Linear Active Thermistor IC
Extended temperature
3LD TO-92 package
c) MCP9700AT-E/TT: Linear Active Thermistor IC
Tape and Reel
Extended temperature
3LD SOT-23 package
a) MCP9701T-E/LT: Linear Active Thermistor IC
Tape and Reel
Extended temperature
5LD SC70 package
b) MCP9701-E/TO: Linear Active Thermistor IC
Extended temperature
3LD TO-92 package
c) MCP9701T-E/TT: Linear Active Thermistor IC
Tape and Reel
Extended temperature
3LD SOT-23 package
a) MCP9701AT-E/LT: Linear Active Thermistor IC
Tape and Reel
Extended temperature
5LD SC70 package
b) MCP9701A-E/TO: Linear Active Thermistor IC
Extended temperature
3LD TO-92 package
c) MCP9701AT-E/TT: Linear Active Thermistor IC
Tape and Reel
Extended Temperature
3LD SOT-23 package
a) MCP9700T-H/TT: Linear Active Thermistor IC
Tape and Reel
High Temperature
3LD SOT-23 package
b) MCP9700T-H/LT: Linear Active Thermistor IC
Tape and Reel
High Temperature
5LD SC70 package
–
X (1)
Tape and Reel
Option
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
MCP9700/9700A and MCP9701/9701A
DS20001942G-page 20 2005-2016 Microchip Technology Inc.
NOTES:
YSTEM
2005-2016 Microchip Technology Inc. DS20001942G-page 21
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2005-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0666-2
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ MICRDCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS20001942G-page 22 2005-2016 Microchip Technology Inc.
AMERICAS
Corporate Office
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Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
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Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
07/14/15