MCP1601 Datasheet by Microchip Technology

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Q ‘MICROCHIP MCP1 601 C
2003-2013 Microchip Technology Inc. DS21762B-page 1
MCP1601
Features
Input Range of 2.7V to 5.5V
3 Operating Modes: PWM, PFM and LDO
Integrated BUCK and Synchronous Switches
Ceramic or Electrolytic Input/Output Filtering
Capacitors
750 kHz Fixed Switching Frequency
Oscillator Synchronization to 1 MHz PWM Mode
Auto-Switching from PWM/PFM Operation
100% Duty Cycle Capable for Low Input Voltage
500 mA Continuous Output Current Capability
Integrated Under-Voltage Lock-Out Protection
Integrated Over-Temperature Protection
Integrated Soft Start Circuitry
Low Output Voltage Capability to 0.9V
Temperature Range: -40°C to +85ºC
Small 8-Pin MSOP Package
Applications
Low Power Handheld CPUs and DSPs
Cellular Phones
Organizers and PDAs
•Digital Cameras
+5V or +3.3V Distributed Voltages
USB Powered Devices
Package Type
Description
The MCP1601 is a fully integrated synchronous BUCK
(step down) DC/DC converter for battery powered sys-
tems. With an input operating range of 2.7V to 5.5V, the
MCP1601 is ideal for applications being powered by
one single cell Li-Ion, 2 to 3 cell NiMH, NiCd or alkaline
sources. Output voltages can range from 0.9V to VIN to
accommodate a wide range of applications. Efficiency
can exceed 92% while operating at 750 kHz with load
current capability up to 500 mA. The MCP1601 is used
to minimize space, cost and wasted energy.
The PWM mode switching frequency is internally set to
a fixed 750 kHz allowing the use of low profile, surface
mount inductors and ceramic capacitors while
maintaining a typical efficiency of 92%.
The MCP1601 is capable of three distinct operating
modes: PWM, PFM and Low Drop Out.
When operating in PWM (pulse width modulation)
mode, the DC/DC converter switches at a single high
frequency determined by either the internal 750 kHz
oscillator or external synchronization frequency.
For applications that operate at very light to no load for
extended periods of time, the MCP1601 is capable of
operating in PFM (pulse frequency modulation mode)
to reduce the number of switching cycles/sec and
consume less energy.
The third mode of operation (LDO mode) occurs when
the input voltage approaches the output voltage and the
BUCK duty cycle approaches 100%. The MCP1601 will
enter a low drop out mode and the high-side P-Channel
BUCK switch will saturate, providing the output with the
maximum voltage possible.
The MCP1601 has integrated over-current protection,
over-temperature protection and UVLO (Under Voltage
Lockout) to provide for a fail safe solution with no
external components.
The MCP1601 is available in the 8-pin MSOP package,
with an operating temperature range of -40°C to +85°C.
8-Pin MSOP
VIN
SHDN
FB
AGND
LX
PGND
VOUT
SYNC/PWM
1
2
3
4
8
7
6
5
MCP1601
500 mA Synchronous BUCK Regulator
MCP1601
DS21762B-page 2 2003-2013 Microchip Technology Inc.
Typical Application
Functional Block Diagram
VOUT
PGND
LX
SHDN
VIN
1
2
3
4
8
7
6
5
MCP1601
FB
SYNC/
AGND
Input
Voltage
2.7V-4.2V
CIN
10 µF
10 µH
COUT
10 µF
R1
250 k
(for 1.8V)
R2
200 k
Typical Application (2.7V to 4.2V)
IOUT = 0 mA to 400 mA
COUT Range
10 µF to 47 µF
L Range
10 µH to 22 µH
C1
47 pF
VOUT Range
1.2V to 3.3V
PWM
+
-
EA
CCOMP
FB
RCOMP
Feedforward Oscillator
K*VIN
Duty
Clamp
10% - 90%
PWM Latch
R
OUT Inset
Timing
0.8V
ISENSEP
VREF
S
SQW
VIN
SHDN Internal
Circuit
UVLO
Enable Out
AGND
AGND
AGND
PFM Comparator
Internal
Band Gap
Reference Buffered 0.8V Output
VREF
SYNC/PWM
VREF
ISENSEP
ISENSEN
PFM Mode
Timing
LX
VOUT
PGND
PGND
Soft Start
ISENSEN
Duty
Clamp
800 k12 pF
10 pF
3M
-
-
+
VREF -
-
+
-
+
Enable
Cycle
Cycle
2003-2013 Microchip Technology Inc. DS21762B-page 3
MCP1601
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - AGND ......................................................................6.0V
SHDN, FB, SYNC/PWM, VOUT ..... (AGND-0.3V) to (VIN+0.3V)
LX to PGND................................................ -0.3V to (VIN+0.3V)
PGND to AGND ..................................................-0.3V to +0.3V
Output Short Circuit Current .................................continuous
Storage temperature .....................................-65°C to +150°C
Ambient Temp. with Power Applied ................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins4kV
Notice: Stresses above those listed under “Maximum rat-
ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo-
sure to maximum rating conditions for extended periods may
affect device reliability.
PIN FUNCTION TABLE
NAME FUNCTION
VIN Input Source Voltage
SHDN Device Shutdown Pin
FB Output Voltage Feedback Input
AGND Analog Ground
VOUT Sensed Output Voltage
SYNC/PWM Synchronous Clock input or PWM/
PFM select
PGND Power Ground
LXOutput Inductor Node
ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, VIN=4.2V, VOUT=1.8V, ILOAD = 10 mA, TA=-40°C to +85°C.
Parameters Sym Min Typ Max Units Conditions
Power Input Requirements
Voltage VIN 2.7 5.5 V ILOAD = 0 mA to 500 mA
Shutdown Current I(VIN) 0.05 1.0 µA Shutdown Mode (SHDN = GND)
PFM Mode Current I(VIN) 119 180 µA SYNC/PWM = GND, PFM Mode
(ILOAD = 0 mA)
Oscillator Section
Internal Oscillator Frequency FOSC 650 750 850 kHz SYNC/PWM = VIN
External Oscillator Capture Range FSYNC 850 1000 kHz FSYNC > FOSC
External Oscillator Duty Cycle FSYN-FALL 10 90 % FSYNC = 1 MHz
Internal Power Switches
RDSon P-CHANNEL RDSon-P — 500 — mIP=100 mA, TA=+25°C, VIN=4.2V
RDSon N-CHANNEL RDSon-N 500 — mIN=100 mA, TA=+25°C, VIN =4.2V
Dropout Voltage VDROPOUT 250 mV VOUT = 2.7V, ILOAD = 300 mA,
TA=+25°C, VDROPOUT=97%VOUT
Pin Leakage Current ILX -1.0 1.0 µA SHDN = 0V, VIN = 5.5V, LX = 0V, LX =
5.5V
Output PWM Mode
Peak Current Limit IPEAK-PWM 1.0 A PWM Mode, SYNC/PWM = VIN, TA =
+25°C
Output Voltage
Output Voltage Range VOUT 0.9 — VIN V
Reference Feedback Voltage VFB 0.78 0.8 0.82 V
Feedback Input Bias Current IVFB —0.1—nA
Line Regulation VLINE-REG —0.1—%/VV
IN=2.7V to 5.5V, ILOAD=10 mA
Load Regulation VLOAD-REG —1.5%V
IN = 3.6V,
ILOAD = 0 mA to 300 mA
Start-Up Time TSTART 0.5 ms PWM Mode, SYNC/PWM=VIN
MCP1601
DS21762B-page 4 2003-2013 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
Protection Features
Average Short Circuit Current 890 mA RLOAD < 1 ohm
Under-Voltage Lockout UVLO 2.4 2.7 V For VIN decreasing
Under-Voltage Lockout Hysteresis UVLO-HYS — 190 — mV
Thermal Shutdown TSHD — 160 — °C
Thermal Shutdown Hysteresis TSHD-HYS —10—°C
Interface Signals (SHDN, SYNC/PWM)
Logic Low Input VIN-HIGH 15 % of
VIN
Logic High Input VIN-HIGH 45 % of
VIN
Input Leakage Current IIN-LK ——0.1µA
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.7V to 5.5V
Parameters Symbol Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 — +85 °C
Operating Junction Temperature Range TJ-40 — +125 °C
Storage Temperature Range TA-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 8 Pin MSOP JA 208 °C/W Single-Layer SEMI G42-88
Board, Natural Convection
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VIN=4.2V, VOUT=1.8V, ILOAD = 10 mA, TA=-40°C to +85°C.
Parameters Sym Min Typ Max Units Conditions
2003-2013 Microchip Technology Inc. DS21762B-page 5
MCP1601
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, VIN = 4.2V, VOUT = 1.8V, L = 10 µH, COUT= 10 µF (X5R Ceramic), CIN = 10 µF (X5R
Ceramic), SYNC/PWM=VIN.
FIGURE 2-1: Efficiency vs. Load Current
(VOUT = 1.2V).
FIGURE 2-2: Efficiency vs. Load Current
(VOUT = 1.8V).
FIGURE 2-3: Efficiency vs. Load Current
(VOUT = 3.3V).
FIGURE 2-4: PFM Mode Quiescent
Current vs. Input Voltage.
FIGURE 2-5: Oscillator Frequency vs.
Input Voltage.
FIGURE 2-6: Output Voltage vs. Load
Current.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
40
50
60
70
80
90
100
0 100 200 300 400 500
Load Current (mA)
Efficiency (%)
VOUT = 1.2V
Auto PWM/PFM
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
50
60
70
80
90
100
110
0 100 200 300 400 500
Load Current (mA)
Efficiency (%)
VOUT = 1.8V
Auto PWM/PFM
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
50
60
70
80
90
100
110
0 100 200 300 400 500
Load Current (mA)
Efficiency (%)
VOUT = 3.3V
Auto PWM/PFM
VIN = 5.0V
VIN = 4.5V
VIN = 5.5V
100
110
120
130
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Input Voltage (V)
PFM Mode Quiescent Current
(µA)
VOUT = 1.8V
PFM Mode
ILOAD = 0
TA = - 40°C
TA = + 0°C
TA = + 85°C
TA = + 25°C
680.0
700.0
720.0
740.0
760.0
780.0
2.73.13.53.94.34.75.15.5
Input Voltage (V)
Internal Oscillator Frequency
(kHz)
TA = + 125°C
TA = - 40°C
TA = + 25°C
TA = 0°C
ILOAD = 10 mA
Forced PWM Mode
1.100
1.125
1.150
1.175
1.200
1.225
1.250
1.275
1.300
0 100 200 300 400 500
Load Current (mA)
Output Voltage (V)
VOUT = 1.2V
Auto PWM/PFM
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
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MCP1601
DS21762B-page 6 2003-2013 Microchip Technology Inc.
Note: Unless otherwise indicated, VIN = 4.2V, VOUT = 1.8V, L = 10 µH, COUT= 10 µF (X5R Ceramic), CIN = 10 µF (X5R
Ceramic), SYNC/PWM=VIN.
FIGURE 2-7: Output Voltage vs. Load
Current.
FIGURE 2-8: Output Voltage vs. Load
Current.
FIGURE 2-9: Input to Output Voltage
Differential for 100% Duty Cycle vs. Load
Current.
FIGURE 2-10: Switch Leakage vs.
Temperature.
FIGURE 2-11: Typical PWM Mode of
Operation Waveforms.
FIGURE 2-12: Typical PFM Mode of
Operation Waveforms.
1.700
1.720
1.740
1.760
1.780
1.800
1.820
0 100 200 300 400 500
Load Current (mA)
Output Votlage (V)
VOUT = 1.8V
Auto PWM/PFM
VIN = 2.7V
VIN = 3.6V
VIN = 4.2V
3.10
3.13
3.15
3.18
3.20
3.23
3.25
3.28
3.30
3.33
3.35
0 100 200 300 400 500
Load Current (mA)
Output Voltage (V)
VOUT = 3.3V
Auto PWM/PFM
VIN = 4.5V
VIN = 5.0V
VIN = 5.5V
0
50
100
150
200
250
300
350
400
450
0 100 200 300 400 500
Load Current (mA)
Dropout Voltage (mV)
VOUT = 3.3V
VOUT = 2.7V
Dropout = (VIN-VOUT) in mV @ 97% of VOUT
0.0
1.5
3.0
4.5
-40 -15 10 35 60 85
Ambient Temperature (°C)
LX Leakage Current (nA)
VIN = 5.0V
Synchronous NChannel
BUCK Switch PChannel
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2003-2013 Microchip Technology Inc. DS21762B-page 7
MCP1601
Note: Unless otherwise indicated, VIN = 4.2V, VOUT = 1.8V, L = 10 µH, COUT= 10 µF (X5R Ceramic), CIN = 10 µF (X5R
Ceramic), SYNC/PWM=VIN.
FIGURE 2-13: Typical Startup From
Shutdown Waveform.
FIGURE 2-14: Startup From 0V Input.
FIGURE 2-15: Load Step Response
(Forced PWM).
FIGURE 2-16: Load Step Response (PFM
to PWM).
FIGURE 2-17: Line Step Response
(Forced PWM).
FIGURE 2-18: Line Step Response (PFM
Mode).
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MCP1601
DS21762B-page 8 2003-2013 Microchip Technology Inc.
Note: Unless otherwise indicated, VIN = 4.2V, VOUT = 1.8V, L = 10 µH, COUT= 10 µF (X5R Ceramic), CIN = 10 µF (X5R
Ceramic), SYNC/PWM=VIN.
FIGURE 2-19: Typical Output Ripple
Voltage (Forced PWM Mode).
FIGURE 2-20: Typical Output Ripple
Voltage (PFM Mode).
FIGURE 2-21: External Oscillator
Synchronization.
2003-2013 Microchip Technology Inc. DS21762B-page 9
MCP1601
3.0 PIN FUNCTIONS
TABLE 3-1: PIN FUNCTION TABLE
3.1 Input Voltage (VIN)
Connect the unregulated input voltage source to VIN. If
the input voltage source is located more than several
inches away, or is a battery, a typical input capacitor of
10 µF is recommended.
3.2 Shutdown Input (SHDN)
Connect SHDN to a logic low input to force the device
into a shutdown low quiescent current mode. When in
shutdown, both the P-Channel and N-Channel
switches are turned off, in addition to the internal oscil-
lator and other circuitry. When connected to a logic high
input, the device will operate in the selected mode.
3.3 Feedback Input (FB)
Connect FB to an external resistor divider to set output
voltage regulation. The feedback pin is typically equal
to 0.8V. See Section 5.0, “Applications Information”, for
details in selecting feedback resistors.
3.4 Analog Ground Return (AGND)
Tie all small signal ground returns to AGND. (See
Section 5.6, “Printed Circuit Board Layout”, for details).
3.5 Oscillator Synchronization or
PWM/ PFM Select Mode Input
(SYNC/PWM)
Connect an external oscillator to SYNC/PWM to syn-
chronize. With an external oscillator present, the device
is forced into a PWM-only mode of operation. For inter-
nal oscillator operation, the SYNC/PWM pin is tied high
to operate in a forced PWM-only mode and low for a
PWM/PFM mode of operation.
3.6 Output Voltage Sense (VOUT)
Connect the output voltage directly to VOUT for sensing.
3.7 Power Ground Return (PGND)
Connect all large signal ground returns to PGND. (See
Section 5.6, “Printed Circuit Board Layout”, for details).
3.8 BUCK Inductor Connection (LX)
Connect LX directly to the BUCK inductor. This pin car-
ries large signal-level currents and all connections
should be as short and wide as possible. (See
Section 5.6, “Printed Circuit Board Layout”, for details).
Pin Name Function
1V
IN Input Voltage
2SHDNShutdown Input
3 FB Feedback Input
4A
GND Analog Ground Return
5 SYNC/
PWM Oscillator Synchronization or
PWM/ PFM Select Mode Input
6V
OUT Sensed Output Voltage Input
7P
GND Power Ground Return
8L
XBUCK Inductor Output
MCP1601
DS21762B-page 10 2003-2013 Microchip Technology Inc.
4.0 DEVICE OPERATION
The MCP1601 is a synchronous DC/DC converter with
integrated switches. Developed to provide high effi-
ciency across a wide line and load range, the
MCP1601 integrates the three modes of operation
described below. In addition to three operating modes,
the MCP1601 also integrates many features that mini-
mize external circuitry, saving board space and cost.
With two external resistors used to set the output volt-
age, the MCP1601 output is adjustable from 0.9V to
VIN.
4.1 Operating Modes
The MCP1601 has three distinct modes of operation,
with each one optimized for a specific operating condi-
tion commonly encountered in handheld portable
power applications.
4.1.1 FEEDFORWARD VOLTAGE PULSE
WIDTH MODULATION (PWM) MODE
The Pulse Width Modulation (PWM) mode of operation
is desired when operating from typical to maximum out-
put currents with the proper head room voltage at the
input. This mode of operation optimizes efficiency and
noise by switching at a fixed frequency. Typical output
ripple voltage is less than 10 mV when using a 10 µH
inductor and 10 µF ceramic capacitor. The internal
operating frequency of the MCP1601 is 750 kHz, nom-
inal. The duty cycle, or “ON” time, of the high-side, inte-
grated, P-Channel MOSFET is determined by the
continuous mode BUCK transfer function. For the con-
tinuous inductor current case, the duty cycle can be
approximated by VOUT/VIN. The integrated high-side
BUCK P-Channel switch will conduct for the “on” time.
At the end of the “on” time, the high-side P-Channel
switch is turned off and the integrated, low-side, N-
Channel synchronous switch is turned on to freewheel
the inductor current. The PWM mode architecture
employed in the MCP1601 is a feedforward voltage
mode control and feeds the input voltage into the PWM
oscillator ramp. This information is used to quickly
change the operating duty cycle in the event of a sud-
den input voltage change. The effects on the output
voltage are minimized. To force the MCP1601 into
PWM mode, the SYNC/PWM pin should be tied to a
logic high. The forced PWM mode should be used for
applications that require the fastest transient response
from light load to heavy load or applications that require
a single switching frequency independent of load.
An external oscillator between 850 kHz and 1 MHz can
be connected to the SYNC/PWM pin for synchroniza-
tion to an external clock source. The MCP1601 will
always operate in the PWM mode when synchronized
to an external oscillator.
4.1.2 PULSE FREQUENCY MODULATION
(PFM) MODE
The MCP1601 is also capable of operating in a pulse
frequency modulation mode. This mode of operation is
desired for applications that have very long periods of
inactivity and the output current requirement placed on
the MCP1601 is very low. By entering the PFM mode of
operation, the switching frequency becomes mainly a
function of load current and will decrease as the load
current decreases. By switching slower, the energy
used turning “on” and “off” the high-side P-Channel and
low-side N-Channel is reduced, making the PFM mode
more efficient with light output load currents. When
load activity is encountered, the MCP1601 will auto-
matically switch from the PFM mode to the fixed fre-
quency PWM mode by sensing the increase in load
current. The auto PWM/PFM mode is selected by plac-
ing a logic low at the SYNC/PWM input pin. If an exter-
nal clock is used to synchronize the MCP1601
switching frequency, the PFM mode is automatically
disabled.
To enter the PFM mode of operation, the SYNC/PWM
pin must be held to a logic low level and the peak induc-
tor current, sensed internal to the MCP1601, is below
the internal PFM threshold for more than 1024 clock
cycles. If both of these conditions are met, the
MCP1601 will enter the PFM mode. While in the PFM
mode, the MCP1601 will disable the low-side N-Chan-
nel switch to optimize efficiency at low operating cur-
rents. A cycle will begin by turning on the high-side
P-Channel switch and will end when the output voltage
exceeds a predetermined voltage set point. If the peak
inductor current exceeds the internal PFM mode cur-
rent threshold prior to the output voltage exceeding the
voltage set point, the load current has increased and
the MCP1601 will automatically switch to PWM opera-
tion. The typical hysteresis on the PFM comparator is
6 mV. The typical output ripple voltage is below 40 mV
when using a 10 µH inductor and 10 µF ceramic output
capacitor when VIN = 4.2V. For proper PFM mode oper-
ation, the value of the external inductor and the exter-
nal capacitor should be the same. For example, when
using a 10 µH inductor, a 10 µF capacitor should be
used. When using a 22 µH inductor, a 22 µF capacitor
should be used.
4.1.3 LOW DROP OUT (LDO) MODE
When the input voltage to the MCP1601 is decreasing
and approaches the set output voltage level, the duty
cycle increases to a maximum of 90% (typically). To
continue to regulate the output to as high a voltage as
possible, the MCP1601 enters the low drop out mode
of operation. In this mode, the high-side P-Channel
MOSFET acts like a saturated LDO. This mode allows
the operation of the load circuitry down to the minimum
input supply that is typical in battery-powered
applications.
2003-2013 Microchip Technology Inc. DS21762B-page 11
MCP1601
4.2 Cross-Conduction Timing
Proper timing between turning on the P-Channel, high-
side MOSFET and turning off the N-Channel, low-side
MOSFET (and vice versa) is critical to obtaining high
efficiency. This delay between transitions is what limits
the maximum duty cycle obtainable by the MCP1601.
The delay between transitions leads to more time when
the external inductor current is freewheeling through
the internal N-Channel body diode and leads to a
decrease in efficiency. If the timing delay is too short
and both the internal P-Channel MOSFET and N-
Channel MOSFET conduct, high peak currents will be
observed shooting through the device. This will also
reduce the operating efficiency. The MCP1601 inset
timing is integrated to optimize efficiency for the entire
line and load operating range of the device.
4.3 Integrated Protection Features
4.3.1 SHUTDOWN
By placing a logic low on the SHDN pin of the
MCP1601, the device will enter a low quiescent current
shutdown mode. This feature turns off all of the internal
bias and drivers within the MCP1601 in an effort to min-
imize the quiescent current. This feature is popular for
battery-operated, portable power applications. The
shutdown low quiescent current is typically 1 µA.
4.3.2 INTERNAL OSCILLATOR AND
SYNCHRONIZATION CAPABILITY
The internal oscillator is completely integrated and
requires no external components. The frequency is set
nominally to 750 kHZ in an effort to minimize the exter-
nal inductor and capacitor size needed for the BUCK
topology. In addition to the internal 750 kHz oscillator,
the MCP1601 is capable of being synchronized to an
external oscillator. The external oscillator frequency
must be greater than 850 kHz and less than 1 MHz. For
proper synchronization, the duty cycle of the external
synchronization clock must be between 10% and 90%.
The minimum low voltage level should be below 15% of
VIN and the high level of the clock should be above
45% of VIN. Rise and fall time requirements for the
external synchronization clock must be faster than
100 ns from 10% to 90%. When synchronizing to an
external clock, the MCP1601 will always operate in the
PWM mode in an effort to eliminate multiple switching
frequency’s and their harmonics.
4.3.3 INTERNAL SOFT START
The MCP1601 completely integrates the soft start func-
tion and requires no external components. The soft
start time is typically 0.5 ms and is reset during over-
current and over-temperature shutdown.
4.3.4 OVER-TEMPERATURE
PROTECTION
The MCP1601 protects the internal circuitry from over-
temperature conditions by sensing the internal device
temperature and shutting down when it reaches
approximately 160°C. The device will shut down, the
temperature will cool to approximately 150°C, soft start
will be enabled and normal operation will resume with
no external circuit intervention.
4.3.5 UNDER-VOLTAGE LOCKOUT
Protection from operating at sustained input voltages
that are out of range is prevented with the integrated
Under-Voltage Lockout feature. When the input voltage
dips below 2.5V (typically), the MCP1601 will shutdown
and the soft start circuit will be reset. Normal operation
will resume when the input voltage is elevated above
2.7V, maximum. This hysteresis is provided to prevent
the device from starting with too low of an input voltage.
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MCP1601
DS21762B-page 12 2003-2013 Microchip Technology Inc.
5.0 APPLICATIONS INFORMATION
FIGURE 5-1: Typical Application Circuit.
5.1 Setting Output Voltage
The MCP1601 output voltage is set by using two exter-
nal resistors for output voltages 1.2V. For output volt-
ages < 1.2V, a third 1 M series resistor is necessary
to compensate the control system. A 200 k resistor is
recommended for R2, the lower end of the voltage
divider. Using higher value resistors will make the cir-
cuit more susceptible to noise on the FB pin, causing
unstable operation. Lower value resistors can be used
down to 20 k or below, if necessary.
The feedback reference voltage for the MCP1601 is
typically 0.8V. The equation used to calculate the
output voltage is shown below.
EQUATION
Example:
Desired VOUT = 2.5V
VFB = 0.8V
R2 = 200 k
R1 = 425 k
5.1.1 LEAD CAPACITOR
Capacitor C1 is used for applications that utilize
ceramic output capacitors. To lower the PFM mode rip-
ple voltage, a 47 pf capacitor for C1 is used to couple
the output AC ripple voltage to the internal PFM mode
comparator. For PWM mode, only applications that use
electrolytic capacitors that have 0.2or greater of ESR
(Equivalent Series Resistance), C1 is not necessary.
5.2 Choosing External Components
5.2.1 CAPACITORS
The MCP1601 was developed to take full advantage of
the latest ceramic capacitor technology, though electro-
lytic types can be used as well. When selecting the best
capacitor for the application, the capacitance, physical
size, ESR, temperature coefficient, ripple current rat-
ings (electrolytic) and cost are considered in making
the best choice.
When selecting ceramic capacitors for COUT, the tem-
perature coefficient of the dielectric should be evalu-
ated. Two dielectrics are recommended as they are
stable over a wide temperature range (X5R and X7R).
Other dielectrics can be used, but their capacitance
should stay within the recommended range over the
entire operating temperature range.
1M
For VOUT < 1.2V ONLY
VOUT
PGND
LX
SHDN
VIN
1
2
3
4
8
7
6
5
MCP1601
FB
SYNC/
AGND
Input
Voltage
2.7V-4.2V
CIN
10 µF
10 µH
COUT
10 µF
R1
250 k
(for 1.8V)
R2
200 k
MCP1601 Application Circuit
IOUT = 0 mA to 400 mA
COUT Range
10 µF to 47 µF
L Range
10 µH to 22 µH
C1
47 pF
VOUT Range
1.2V to 3.3V
PWM
R1R2VOUT VFB
1=
Where: VOUT is the desired output voltage,
VFB is the MCP1601 internal feedback
reference voltage
R1 is the resistor connected to VOUT
in the voltage divider
R2 is the resistor connected to ground
in the voltage divider
2003-2013 Microchip Technology Inc. DS21762B-page 13
MCP1601
5.2.1.1 Input
For all BUCK-derived topologies, the input current is
pulled from the source in pulses, placing some burden
on the input capacitor. For most applications, a 10 µF
ceramic capacitor connected to the MCP1601 input is
recommended to filter the current pulses. Less capaci-
tance can be used for applications that have low source
impedance. The ripple current ratings for ceramic
capacitors are typically very high due to their low loss
characteristics. Lower-cost electrolytic capacitors can
be used, but ripple current ratings should not be
exceeded.
5.2.1.2 Output
For BUCK-derived topologies, the output capacitor fil-
ters the continuous AC inductor ripple current while
operating in the PWM mode. Typical inductor AC ripple
current for the MCP1601 is 120 mA peak-to-peak with
a 3.6V input, 10 µH inductor for a 1.8V output applica-
tion. Using an output capacitor with 0.3 of ESR, the
output ripple will be approximately 36 mV.
The recommended range for the output capacitor is
from 10 µF (±20%) to 47 µF (±20%). Larger value
capacitors can be used, but require evaluation of the
control system stability.
EQUATION
The above equation assumes that the output capaci-
tance is large enough so that the ripple voltage (as a
result of charging and discharging the capacitor) is
negligible and can be used for applications that use
electrolytic capacitors with esr > 0.3
When using a 10 µF ceramic X5R dielectric capacitor,
the output ripple voltage is typically less than 10 mV.
5.2.2 BUCK INDUCTOR
There are many suppliers and choices for selecting the
BUCK inductor. The application, physical size require-
ments (height vs. area), current rating, resistance,
mounting method, temperature range, minimum induc-
tance and cost all need to be considered in making the
best choice.
When choosing an inductor for the MCP1601 Synchro-
nous BUCK, there are two primary electrical
specifications to consider.
1. Current rating of the inductor.
2. Resistance of the inductor.
When selecting a BUCK inductor, many suppliers
specify a maximum peak current.
The maximum peak inductor current is equal to the
maximum DC output current plus 1/2 the peak-to-peak
AC ripple current in the inductor. The AC ripple current
in the inductor can be calculated using the following
relationship.
EQUATION
Solving for IL:
EQUATION
Example:
The approximate “on” time is equal to the
Duty Cycle (VOUT / VIN) x 1/FSW.
Many suppliers of inductors rate the maximum RMS
(Root Mean Square) current. The BUCK inductor RMS
current is dependent on the output current, inductance,
input voltage, output voltage and switching frequency.
For the MCP1601, the inductor RMS current over the
2.7V to 5.5V input range, 0.9V to 5V output voltage
range is no more than 15% higher than the average DC
output current for the minimum recommended induc-
tance of 10 µH ±20%. When selecting an inductor that
has a maximum RMS current rating, use a simple
approximation that the RMS current is 1.2 times the
maximum output current.
Example:
IOUT(MAX) = 300 mA, the inductor should have an RMS
rating > 360 mA (1.2 x IOUT(MAX)).
VRipple ILRipple COUTesr
=
VIN =3.6V
VOUT =1.8V
FSW =750kHz
IOUT(MAX) =300mA
TON = (1.8V/3.6V) x 1/(750 kHz)
TON = 667 ns
VL= 3.6V - 1.8V = 1.8V
IL= (1.8V/10 µH) x 667 ns
IL=120mA
IL(PEAK) =I
OUTMAX + 1/2 IL
IL(PEAK) = 300 mA + (120 mA) / 2
IL(PEAK) =360mA
VLLtd
dI
=
ILVLLt=
Where: t is equal to the “on” time of the P-Channel
switch and,
VL = the voltage across the inductor
(VIN - VOUT)
OUT fl
MCP1601
DS21762B-page 14 2003-2013 Microchip Technology Inc.
DC resistance is another common inductor specifica-
tion. The MCP1601 will work properly with inductor DC
resistance down to 0. The trade-off in selecting an
inductor with low DC resistance is size and cost. To
lower the resistance, larger wire is used to wind the
inductor. The switch resistance in the MCP1601 is
approximately 0.5. Inductors with DC resistance
lower than 0.1 will not have a significant impact on the
efficiency of the converter.
5.3 L and COUT Combinations
When selecting the L-COUT output filter components,
the inductor value range is limited from 10 µH to 22 µH.
However, when using the larger inductor values, larger
capacitor values should be used. The following table
lists the recommended combinations of L and COUT.
TABLE 5-1: L-COUT COMBINATIONS
5.4 Passive Component Suppliers
TABLE 5-2: CERAMIC CAPACITOR
SUPPLIERS
TABLE 5-3: ELECTROLYTIC CAPACITOR
SUPPLIERS
LC
OUT
10 µH 10 µF to 47 µF
15 µH 15 µF to 47 µF
22 µH 22µF to 47 µF
Note: For proper PFM mode operation, the value
of the external inductor and the external
capacitor should be the same. For exam-
ple, when using a 10 µH inductor, a 10 µF
capacitor should be used. When using a
22 µH inductor, a 22 µF capacitor should
be used.
Supplier Type Description
Murata®Ceramic 10 µF 0805 X5R 6.3V
#GRM21BR60J106K
Murata®Ceramic 10 µF 1206 X5R 6.3V
#GRM319R60J106K
Taiy o
Yuden™ Ceramic 10 µF 1210 X5R 6.3V
JMK325BJ106MD
AVX™ Ceramic 10 µF 0805 X5R 6.3V
#08056D106MAT4A
AVX™ Ceramic 10 µF 1206 X5R 6.3V
#12066D106MAT4A
Kemet®Ceramic 10 µf 1210 6.3V
#C1210C106M9PAC
Murata®Ceramic 22 µF 1206 X5R 6.3V
GRM31CR60J226ME20B
Taiy o
Yuden™ Ceramic 22 µF 1210 X5R 6.3V
JMK325BJ226MY
Note: Taiyo Yuden 1210 is a low profile case
(1.15 mm)
Supplier Type Description
Kemet®Tantalum 47 µF D Case 200 M10V
#T495D476M010AS
AVX™ Tantalum 47 µF C Case 300 M 6.3V
#TPSC476M006S300
Sprague®Tantalum 47 µF C Case 110 M 16V
594D47X0016C2T
Sprague®Tantalum 22 µF B Case 380 M 6.3V
594D226X06R3B2T
Sprague®Tantalum 15 µF B Case 500 M 10V
594D156X0010B2T
2003-2013 Microchip Technology Inc. DS21762B-page 15
MCP1601
TABLE 5-4: INDUCTOR SUPPLIERS
5.5 Efficiency
Efficiency will be affected by the external component
selection and the specific operating conditions for the
application. In Section 2.0, “Typical Performance
Curves”, there are curves plotted using typical induc-
tors that can be used to estimate the converter
efficiency for 1.2V, 1.8V and 3.3V.
5.6 Printed Circuit Board Layout
The MCP1601 is capable of switching over 500 mA at
750 kHz. As with all high-frequency, switch mode,
power supplies, a good board layout is essential to pre-
venting the noise generated by the power train switch-
ing from interfering with the sensing circuitry. The
MCP1601 has not demonstrated a sensitivity to layout,
but good design practice will prevent undesired results.
FIGURE 5-2: Component Placement.
When designing a board layout for the MCP1601, the
first thing to consider is the physical placement of the
external components. In Figure 5-2, SM0805 10 µF
ceramic capacitors are used for CIN and COUT. The
SM0603 package is used for R1, R2 and C1. The induc-
tor used is the Coilcraft® LPO2506 series low profile
(0.047” high). The board outline in this example is 1” x
1”. CIN, L and COUT are positioned around the
MCP1601 to make the high current paths as short as
possible.
Supplier L Type Area (mm) Height
(mm) DC
Resistance Max.
Current Series
Sumida®10 µH Unshielded 4.1 mm x 3.8 mm 3.0 mm 230 M0.76A C32
Sumida®10 µH Shielded 4.0 mm x 4.0 mm 1.8 mm 160 M0.66A CDRH3D16
Sumida®10 µH Shielded 5.7 mm x 5.7 mm 3.0 mm 65 M1.3A CDRH5D28
CT* 10 µH Shielded 7.3 mm x 7.3 mm 3.5 mm 70 M1.7A CTCDRH73
Coilcraft®10 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 75 M1.0A DS1608
Coilcraft®15 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 90 M0.8A DS1608
Coilcraft®22 µH Shielded 6.6 mm x 4.5 mm 3.0 mm 110 M0.7A DS1608
Coilcraft®10 µH Unshielded
Wafer 6.0 mm x 5.4 mm 1.3 mm 300 M0.60A LPO6013
Coilcraft®15 µH Unshielded
Wafer 6.0 mm x 5.4 mm 1.3 mm 380 M0.55A LPO6013
Taiy o
Yuden™ 10 µH Shielded 5.0 mm x 5.0 mm 2.0 mm 66 M0.7A NP04SB100M
Note: CT* = Central Technologies
MCP1601
C
IN
C
OUT
R
1
C
1
R
2
PGND
PGND
AGND
AGND
SILK
MCP1601
DS21762B-page 16 2003-2013 Microchip Technology Inc.
FIGURE 5-3: Top Layer.
The top layer of the board layout is shown in
Figure 5-3. The power conversion process is made up
of two types of circuits. One circuit carries changing
large signals (current, voltage), like CIN, COUT, L and
the VIN, LX PGND pins of the MCP1601. The other cir-
cuitry is much smaller in signal and is used to sense,
regulate and control the high-power circuitry. These
components are R1, R2, C1 and pins FB, AGND. The top
layer is partitioned so that the larger signal connections
are short and wide, while the smaller signals are routed
away from the large signals.
The MCP1601 utilizes two ground pins to separate the
large signal ground current from the small signal circuit
ground. The large signal (“Power Ground”) is labeled
“PGND”. The small signal is labeled “Analog Ground” or
“AGND”. In Figure 5-3, the PGND and the AGND are kept
separate on the top layer.
FIGURE 5-4: Bottom Layer.
In Figure 5-4, the bottom layer is a partitioned ground
plane that connects AGND to PGND near the input
capacitor. The large signal current will circulate on the
top PGND partition. The lower partition is used for a
“quiet” ground, where AGND is connected.
MCP1601
PGND
AGND
PGND
AGND
BOT
NNN
2003-2013 Microchip Technology Inc. DS21762B-page 17
MCP1601
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
8-Lead MSOP Example:
XXXXXX
YWWNNN
1601I
344025
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
MCP1601
DS21762B-page 18 2003-2013 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
L
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037.035FFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
c
B
7
7
.004
.010
0
.006
.012
(F)
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff §
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016
.114
.114
.022
.118
.118
.002
.030
.193
.034
MIN
p
n
Units
.026
NOM
8
INCHES
1.000.950.90.039
0.15
0.30
.008
.016
6
0.10
0.25
0
7
7
0.20
0.40
6
MILLIMETERS*
0.65
0.86
3.00
3.00
0.55
4.90
.044
.122
.028
.122
.038
.006
0.40
2.90
2.90
0.05
0.76
MINMAX NOM
1.18
0.70
3.10
3.10
0.15
0.97
MAX
8
E1
E
B
n 1
2
§ Significant Characteristic
.184 .200 4.67 .5.08
p
A
A1
A2
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2003-2013 Microchip Technology Inc. DS21762B-page 19
MCP1601
7.0 REVISION HISTORY
Revision B (January 2013)
Added a note to each package outline drawing.
MCP1601
DS21762B-page 20 2003-2013 Microchip Technology Inc.
NOTES:
PART NO. /XX
2003-2013 Microchip Technology Inc. DS21762B-page21
MCP1601
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
PART NO. X/XX
PackageTemperature
Range
Device
Device: MCP1601: 500 mA Synchronous BUCK Regulator
MCP1601T: 500 mA Synchronous BUCK Regulator
Tape and Reel
Temperature Range: I = -40°C to +85°C
Package: MS = Plastic Micro Small Outline (MSOP), 8-lead
Examples:
a) MCP1601-I/MS: 8LD MSOP package.
b) MCP1601T-I/MS: Tape and Reel,
8LD MSOP package.
MCP1601
DS21762B-page 22 2003-2013 Microchip Technology Inc.
NOTES:
YSTEM <2>
2003-2013 Microchip Technology Inc. DS21762B-page 23
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2003-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620768990
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
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and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ ‘MICRDCHIP
DS21762B-page 24 2003-2013 Microchip Technology Inc.
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