MOD-CH101 Datasheet by TDK InvenSense

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DS-000333
MOD_CH101 Datasheet
Chirp Microsystems reserves the right to change
specifications and information herein without notice.
Chirp Microsystems
2560 Ninth Street, Ste 200, Berkeley, CA 94710 U.S.A
+1(510) 640–8155
www.chirpmicro.com
Document Number: DS-000333
Revision: 1.0
Release Date: 09/30/2019
MOD_CH101 Datasheet
TDK Chirp Microsystems Sing
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GENERAL INFORMATION
The MOD_CH101 sensor module is designed for rapid integration of
Chirp’s CH-101 ultrasonic Time-of-Flight (ToF) range sensor into
customer enclosures. It is especially useful for prototyping and small-
scale production in applications that are not extremely space
constrained. The module’s electronic interface is via a standard 8-pin
flat flex cable (FFC) connector. The module includes an acoustic
housing that determines the CH-101 sensor’s field-of-view. The
MOD_CH101-03-01 sensor module includes an omnidirectional
acoustic housing with a 0.7 mm diameter acoustic port and a 5.3 mm
outer diameter.
DEVICE INFORMATION
PART NUMBER PACKAGE LID OPENING
MOD_CH101-03-01 8x8x3.57 PCBA 1-Hole
RoHS and Green-Compliant Package
Figure 1. Front view of CH-101 sensor module with
omnidirectional housing (P/N MOD_CH101-03-01)
APPLICATIONS
Augmented and Virtual Reality
Drones and Robotics
Mobile and Computing Devices
Obstacle avoidance
Printers and Scanners
Proximity sensing
Presence detection: always-on sensing to
lock/unlock and power on/off notebooks, tablets,
white goods, etc.
Smart Home
FEATURES
Fast, accurate range-finding
Operating range from 4 cm to 1.2 m
Sample rate up to 100 samples/sec
1.0 mm RMS range noise at 30 cm range
Programmable modes optimized for medium
and short-range sensing applications
Customizable Field-of-View (FoV) up to 180°
Multi-object detection
Works in sunlight and any other lighting
Insensitive to object color, detects optically
transparent surfaces like glass windows
Easy to integrate
Single sensor for receive and transmit
Single 1.8V supply
I²C Fast-Mode compatible interface, data rates
up to 400 kbps
Dedicated programmable range interrupt pin
Platform-independent software driver enables
turnkey range-finding
Miniature integrated module
Low-power micro-controller running advanced
ultrasound firmware
Operating temperature range: -40° to 85°C
Ultra-low supply current
1 sample/s:
o 13 µA (10 cm max range)
o 15 µA (1.0 m max range)
30 samples/s:
o 33 µA (10 cm max range)
o 130 µA (1.0 m max range)
Host Interface: I2C at up to 400 kbps
Single Supply voltage: 1.8V ±5%
RoHS and Green compliant
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TABLE OF CONTENTS
GENERAL INFORMATION ............................................................................................................................................................................... 2
DEVICE INFORMATION ................................................................................................................................................................................. 2
APPLICATIONS ............................................................................................................................................................................................ 2
FEATURES .................................................................................................................................................................................................. 2
1 INTRODUCTION ......................................................................................................................................................................... 5
1.1 PURPOSE AND SCOPE ....................................................................................................................................................................... 5
1.2 PRODUCT OVERVIEW ....................................................................................................................................................................... 5
1.1 PART NUMBERING ........................................................................................................................................................................... 5
2 DIMENSIONS AND PROPERTIES ................................................................................................................................................. 6
3 INTEGRATION INTO MOTHERBOARD ......................................................................................................................................... 7
4 MECHANICAL ............................................................................................................................................................................. 9
5 SENSOR MOUNTING AND INGRESS PROTECTION ..................................................................................................................... 10
5.1 SENSOR MOUNTING ....................................................................................................................................................................... 10
5.2 INGRESS PROTECTION ..................................................................................................................................................................... 11
6 REVISION HISTORY ................................................................................................................................................................... 12
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LIST OF FIGURES
Figure 1. Front view of CH-101 sensor module with omnidirectional housing (P/N MOD_CH101-03-01) ................................................ 2
Figure 2. Main dimensions of the MOD_CH101-03-01 assembly .............................................................................................................. 6
Figure 3. Flat cable connector pin layout (left) and CH-101 board layout (right) ...................................................................................... 7
Figure 4. Flat flex cable connector motherboard side pin layout .............................................................................................................. 8
Figure 5. Default orientation of sensor on motherboard (CH-101 acoustic port is facing down) ............................................................. 8
Figure 6. Recommended MOD_CH101-03-01 module mounting ............................................................................................................ 10
Figure 7. Beam pattern measurements of module in 100 mm plate (raw linear LSB units left, normalized dB right) ............................ 10
Figure 8. Beam pattern measurements of bare module (raw linear LSB units left, normalized dB right) ............................................... 11
Figure 9. CH-101 sensor module alongside Acoustex 042 acoustic fabric (left); fabric-covered sensor module inserted into a clear plastic
application enclosure (right). ................................................................................................................................................................... 11
LIST OF TABLES
Table 1. Geometric Dimensions for MOD_CH101-03-01 ........................................................................................................................... 9
Table 2. Recommended Flat Flex Cable and Connector ............................................................................................................................ 9
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1 INTRODUCTION
1.1 PURPOSE AND SCOPE
This document is a preliminary product specification, providing a description, specifications, and design related information for the
MOD_CH101 ultrasonic time-of-flight sensor module. Specifications are subject to change without notice.
1.2 PRODUCT OVERVIEW
The MOD_CH101 sensor module is designed for rapid integration of Chirp’s CH-101 ultrasonic sensor into customer enclosures. It is
especially useful for prototyping and small-scale production in applications that are not extremely space constrained. It also provides
a flexible flat cable connector to connect the CH-101 sensor.
1.3 PART NUMBERING
This datasheet specifies the following part numbers
Part Number Description
MOD_CH101-03-01 Ultrasonic sensor module with CH-101-03 sensor and omnidirectional acoustic housing
The MOD_CH101-03 is an omnidirectional sensor module designed to fit a 5.4 mm diameter hole in the application enclosure and
enclosure wall thickness up to 1 mm.
MOD_CH101-XX-YY
CH-101 part number
Acoustic housing type
@TDK Chirp Microsystems Pin I 035.30 10 ‘ 357 8‘0 V—‘W O 5.30 8 0 Ouuvuu (150.70
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2 DIMENSIONS AND PROPERTIES
The outer dimensions of the MOD_CH101-03-01 assembly are shown in Figure 2. The acoustic port has a diameter of 0.7 mm and is in
the center of the front face. During transducer operation, the port cannot be occluded or covered.
The MOD_CH101 is designed to attach to the application enclosure using adhesive. The module should be installed such that the front
face is flush with the outside of the application enclosure. If the application enclosure’s wall thickness is smaller than the maximum
allowable wall thickness, as specified in Table 1, it is recommended that a spacer be used at the backside of the application enclosure
to ensure that the module surface is flush with the surface of the enclosure.
Figure 2. Main dimensions of the MOD_CH101-03-01 assembly
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3 INTEGRATION INTO MOTHERBOARD
Electrical connection to the CH-101 module is via an 8-pin 0.5 mm pitch flat flex cable (FFC) connector. Part numbers of the FFC
connectors on the module PCB and the recommended FFC cables are shown in Table 2. The electrical schematic of the module,
including the connector pinout and the connections to the CH-101 sensor, is shown in Figure 3. Note that the 0.1 uF decoupling
capacitor, as recommended in the CH-101 datasheet, is included in the module. Consult the CH-101 datasheet and application notes
for additional information on electrical connection and operation of the CH-101 sensor.
Figure 3. Flat cable connector pin layout (left) and CH-101 board layout (right)
In Figure 5, the motherboard side connections are shown for connecting MOD_CH101 through a flat flex cable to an identical FFC
connector on the motherboard. Note that the pin numbering is reversed between the two schematics (Figure 3 and Figure 4).
Each CH-101 requires its own PROG line and each CH-101 has its own INT line, the remaining connections can be shared. (Refer to the
CH-101 datasheet for additional information.)
In Figure 5, the resulting orientation of the MOD_CH101 is shown when using the specified motherboard pinout. The acoustic port of
the CH-101 is facing downward, allowing the FFC to be curled upward and have the CH-101 facing away from the board. If the preferred
orientation is for the MOD_CH101 to be facing upward or towards the board, the connections on the motherboard should be mirrored,
such that the motherboard pinout matches Figure 3.
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-
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-
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Figure 4. Flat flex cable connector motherboard side pin layout
Figure 5. Default orientation of sensor on motherboard (CH-101 acoustic port is facing down)
Chirp Microsystems Dimension M0D7CH101-03-01 Uni! Accusuc part We 0 7 mm From pme dmmeter 5 3 mm Recommended application endosure opening dxameter 5.4 mm Maxxmum appHcauon enclosure wall memes; 1 mm Maxxmum width 8 mm Flat cehle connector type Molex 50348070800 Mo‘ex 151660073 ..151660094
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4 MECHANICAL
Dimension MOD_CH101-03-01
Unit
Acoustic port hole 0.7 mm
Front plate diameter 5.3 mm
Recommended application enclosure opening diameter
5.4 mm
Maximum application enclosure wall thickness 1 mm
Maximum width 8 mm
Maximum height 8 mm
Table 1. Geometric Dimensions for MOD_CH101-03-01
Flat cable connector type Molex 503480-0800
Recommended flat cable Molex 151660073...151660094
Table 2. Recommended Flat Flex Cable and Connector
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5 SENSOR MOUNTING AND INGRESS PROTECTION
5.1 SENSOR MOUNTING
The MOD_CH101-03-01 is omnidirectional, allowing the sensor to detect objects over a very wide field-of-view (FoV). However,
omnidirectional response is only achieved when the sensor is mounted in a flat surface, free from reflecting edges. To achieve the best
acoustic performance, users are recommended to mount the MOD_CH101-03-01 module in a flat plate measuring at least 100 cm in
diameter. An example mounting plate is shown in Figure 6, where the sensor has been inserted into a 5.3 mm diameter hole has been
drilled in a 1 mm thick plastic plate measuring 135 mm x 175 mm.
Figure 6. Recommended MOD_CH101-03-01 module mounting
Pulse-echo beam-pattern plots of the MOD_CH101-03-01 module mounted in the recommended plate are shown in Figure 7. This
beam-pattern was measured by placing a 1 m2 target at a 30 cm distance from the CH-101 module and recording the CH-101 ToF
amplitude as the sensor is rotated 180°. The plots are shown in both raw LSB units and normalized dB units, where 0 dB corresponds
to the peak amplitude (5000 LSB) recorded on-axis. Chirp defines the field-of-view (FoV) as the full-width at half-maximum (FWHM)
of the beam pattern; in other words, the FoV is the range of angles over which the amplitude remains above half the peak amplitude
(or -6 dB in dB units). When mounted in the recommended plate, the sensor’s FoV is approximately 160° and the pulse-echo amplitude
diminishes relatively smoothly from 0° to ±80°.
Figure 7. Beam pattern measurements of module in 100 mm plate (raw linear LSB units left, normalized dB right)
For comparison, the pulse-echo beam-pattern plot measured for a bare MOD_CH101-03-01 module is shown in Figure 8. The beam
pattern shows three lobes: a main lobe and two side-lobes that are centered at ±45°. The bare module will work well for detecting on-
axis targets but targets located at ±25° will have approximately 70% lower (-10 dB) amplitude, possibly resulting in poor range-finding
performance.
CH-101 sensor module
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Figure 8. Beam pattern measurements of bare module (raw linear LSB units left, normalized dB right)
5.2 INGRESS PROTECTION
Users should take care to avoid exposing the CH-101 module’s acoustic port to water or fine particles. For applications requiring dust
ingress protection, Chirp recommends using Acoustex 042 acoustic fabric (Saati S.p.A.). The Acoustex 042 fabric can be cut to size and
placed over the top of the sensor module when it is inserted into an application enclosure, as shown in Figure 9. Covering the sensor
module with Acoustex 042 will result in somewhat lower pulse-echo amplitude and reduced maximum range but does not otherwise
impact CH-101 sensor performance.
Figure 9. CH-101 sensor module alongside Acoustex 042 acoustic fabric (left); fabric-covered sensor module inserted into a clear
plastic application enclosure (right).
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6 REVISION HISTORY
Revision Date Revision Description
9/30/2019 1.0 Initial Release
This information furnished by Chirp Microsystems, Inc. (“Chirp Microsystems”) is believed to be accurate and reliable. However, no responsibility is assumed by Chirp
Microsystems for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without
notice. Chirp Microsystems reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance,
without prior notice. Chirp Microsystems makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document.
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trademark of TDK Corporation. Other company and product names may be trademarks of the respective companies with which they are associated.
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