MCL2012V2 Datasheet by Eaton - Electronics Division

EEK I\I Fuwen'ng Business Wurldwide
Technical Data 10929 Effective June 2019
MCL2012V2
Multilayer chip inductor
Product features
0805 (2012 metric) package
High self resonant frequency (SRF)
Multilayer monolithic construction yields high
reliability
Suitable for wave and reflow soldering
Inductance range from 1.5 nH to 470 nH
Moisture sensitivity level (MSL): 1
Applications
Industrial connectivity (IoT)
Wireless communiations
Bluetooth
WiFi
Antenna
Machine-to-machine (M2M)
Mobile phones
Wearable devices
Wireless LAN
Computing/gaming consoles
Broadband components
RF transciever modules
Environmental data
Operating temperature range: -40 °C to +85 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
Pb
HALOGEN
HF
FREE
2
Technical Data 10929
Effective June 2019
MCL2012V2
Multilayer chip inductor
www.eaton.com/electronics
Product specifications
Part number
OCL
(nH) ±5%
I Rated
(mA) maximum
DCR (Ω)
maximum @ +25°C
SRF
(MHz) minimum Q
minimimum
Test frequency
(MHz) Test voltage
(mV)
MCL2012V2-1R5-R 1.5 ± 0.3nH 500 0.10 6000 10 100 50
MCL2012V2-1R8-R 1.8 ± 0.3nH 500 0.10 6000 10 100 50
MCL2012V2-2R2-R 2.2 ±0.3nH 500 0.10 6000 10 100 50
MCL2012V2-2R7-R 2.7 ±0.3nH 500 0.10 5500 12 100 50
MCL2012V2-3R0-R 3.0 ±0.3nH 500 0.13 5000 12 100 50
MCL2012V2-3R3-R 3.3± 0.3nH 500 0.13 5000 12 100 50
MCL2012V2-3R9-R 3.9 ±0.3nH 500 0.15 4500 12 100 50
MCL2012V2-4R7-R 4.7 ± 0.3nH 500 0.20 4000 12 100 50
MCL2012V2-5R6-R 5.6 ± 0.3nH 500 0.23 3500 15 100 50
MCL2012V2-6R8-R 6.8 500 0.25 3000 15 100 50
MCL2012V2-8R2-R 8.2 500 0.28 2500 15 100 50
MCL2012V2-100-R 10 500 0.30 2200 15 100 50
MCL2012V2-120-R 12 500 0.35 2000 15 100 50
MCL2012V2-150-R 15 500 0.40 1800 15 100 50
MCL2012V2-180-R 18 300 0.45 1600 15 100 50
MCL2012V2-220-R 22 300 0.50 1500 15 100 50
MCL2012V2-270-R 27 300 0.55 1400 15 100 50
MCL2012V2-330-R 33 300 0.60 1300 15 100 50
MCL2012V2-390-R 39 300 0.65 1100 15 100 50
MCL2012V2-470-R 47 300 0.70 1000 18 100 50
MCL2012V2-560-R 56 300 0.75 900 18 100 50
MCL2012V2-680-R 68 300 0.80 850 18 100 50
MCL2012V2-820-R 82 300 0.90 800 18 100 50
MCL2012V2-101-R 100 300 0.90 700 18 100 50
MCL2012V2-121-R 120 300 0.95 600 13 100 50
MCL2012V2-151-R 150 300 1.20 550 13 100 50
MCL2012V2-181-R 180 300 1.30 500 13 100 50
MCL2012V2-221-R 220 300 1.50 400 12 100 50
MCL2012V2-271-R 270 300 1.80 350 12 100 50
MCL2012V2-331-R 330 300 2.00 300 12 50 50
MCL2012V2-391-R 390 300 2.00 250 10 50 50
MCL2012V2-471-R 470 300 2.00 200 10 50 50
1. Test frequency and voltage is for OCL and Q at +25 °C
2. Resistance to soldering heat: +260 ±5 °C for 10 ± 1 second
3. At low temperature resistance (-40 ±2°C) the inductance change is within ±10% and the Q within ±20%
4. At high temperature rsistance (+85 ±2°C) the inductance change is within ±10% and the Q within ±20%
5. At high temperature load (+85 ±2°C) the inductance change is within ±10% and the Q within ±20%
6. Rated I: When rated I is applied to the product, self-temperature rise will be 40 °C or less.
7. Part Number Definition: MCL2012V2-xxx-R
MCL2012 = Product code and size
V2= Version indictaor
xxx= inductance value in nH, R= decimal point,
If no R is present then last character equals number of zeros
-R suffix = RoHS compliant
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3
Technical Data 10929
Effective June 2019
MCL2012V2
Multilayer chip inductor
www.eaton.com/electronics
No part marking
All soldering surfaces to be coplanar within 0.1 millimeters
Tolerances are ±0.2 millimeters unless stated otherwise
Pad layout tolerances are ±0.1 millimeters unless stated otherwise
Do not route traces or vias underneath the inductor
Dimensions (mm)
L
B
Recommended pad layout
C
Schematic
Part Number L W T a A B C
MCL2012V2-xxx-R 2.0 ±0.20 1.2 ±0.20 0.90 ±0.20 0.50 ±0.30 1.6 ±0.10 1.2 ±0.10 04 ±0.10
Packaging information (mm)
Drawing not to scale
Supplied in tape and reel packaging, 4000 parts per 7” diameter reel
W ±0.3 8.00
F±0.05 3.50
E1±0.10 1.75
E2 Min 6.25
P0±0.10 4.00
P1±0.2 4.00
P2±0.1 2.00
1.50D0+0.10/-0
A0 1.5±0.20
B0 2.3±0.20
T Max 1.10
T1 Max na
9.5 3:525:— 00 cv ( )
4
Technical Data 10929
Effective June 2019
MCL2012V2
Multilayer chip inductor
www.eaton.com/electronics
Inductance vs frequency
MCL2012V2-3R0-R
MCL2012V2-560-R
0
25
MCL2012V2-101-R
50
75
100
125
150
10
01
0
000
InductancenH
1000
FrequencyMHz
Q vs frequency
MCL2012V2-3R0-R
MCL2012V2-560-R
0
10 MCL2012V2-101-R
20
30
40
50
60
70
80
10
01
0
000
Q
1000
FrequencyMHz
5
Technical Data 10929
Effective June 2019
MCL2012V2
Multilayer chip inductor
www.eaton.com/electronics
Solder reflow profile
Table 1 - Standard SnPb solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5 mm) 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Table 2 - Lead (Pb) free solder (Tc)
Package
thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 – 2.5 mm 260 °C 250 °C 245 °C
>2.5 mm 250 °C 245 °C 245 °C
Temperature
t
tP
ts
TC -5 °C
Time 25 °C to peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
Max. ramp up rate = C/s
Max. ramp down rate = 6 °C/s
Reference J-STD-020
Profile feature Standard SnPb solder Lead (Pb) free solder
Preheat and soak • Temperature min. (Tsmin)100 °C 150 °C
• Temperature max. (Tsmax)150 °C 200 °C
• Time (Tsmin to Tsmax) (ts)60-120 seconds 60-120 seconds
Average ramp up rate Tsmax to Tp3 °C/ second max. 3 °C/ second max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)10 seconds** 10 seconds**
Average ramp-down rate (Tp to Tsmax)6 °C/ second max. 6 °C/ second max.
Time 25 °C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
HUME.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2019 Eaton
All Rights Reserved
Printed in USA
Publication No. 10929 BU-MC19061
June 2019
MCL2012V2
Multilayer chip inductor
Technical Data 10929
Effective June 2019
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used
in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
Time
T
smin
Tsmax
Tstyp
Tp
tp
First Wave Second Wave
Preheat area Cool down area
Wave solder profile
Reference EN 61760-1:2006
Profile feature Standard SnPb solder Lead (Pb) free solder
Preheat • Temperature min. (Tsmin)100 °C 100 °C
• Temperature typ. (Tstyp)120 °C 120 °C
• Temperature max. (Tsmax)130 °C 130 °C
• Time (Tsmin to Tsmax) (ts)70 seconds 70 seconds
D preheat to max Temperature 150 °C max. 150 °C max.
Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C
Time at peak temperature (tp)10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate ~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25 °C to 25 °C 4 minutes 4 minutes
Manual solder
+350 °C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended.
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