XCL208, XCL209 Series Datasheet by Torex Semiconductor Ltd

TOIREX XCL208IXCL209 Series /— / 400mA Inductor Built-in Step-Down “micro DC/DC" Converters
1/22
XCL208/XCL209
Series
400mA Inductor Built-in Step-Down “micro DC/DC” Converters
GENERAL DESCRIPTION
The XCL208/XCL209 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in
one tiny package (2.5mm×2.15mm, h=1.05mm). A stable power supply with an output current of 400mA is configured using only
two capacitors connected externally.
An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit wiring.
A wide operating voltage range of 1.8V (2.0V) to 6.0V enables support for applications that require an alkaline battery (2-cell) or
AC adapter (5V) power supply. An internally fixed output voltage (0.8V to 4.0V) or an externally set output voltage can be selected.
The XCL208/XCL209 series uses synchronous rectification at an operating frequency of 3.0MHz. PWM control (XCL208) or
automatic PWM/PFM switching control (XCL209) can be selected. The XCL208 series has a fixed frequency, enabling the
suppression of output ripple. The XCL209 series achieves high efficiency while holding down output ripple across the full range of
loads, from light to heavy, enabling the extension of battery operation time.
Soft start and on/off functions with C
L
discharge are provided, and the IC can be put in the standby state by inputting a Low level
signal into the CE pin.
APPLICATIONS
Mobile phones, Smart phones
Bluetooth Headsets
Tablet PCs
PND
PC peripheral devices
DSC, Camcorders
FEATURES
Input Voltage : 1.8V ~ 6.0V (Type F)
: 2.0V ~ 6.0V (Type A/B)
Fixed Output Voltage : 0.8V ~ 4.0V (±2.0%)
High Efficiency : 90% (V
IN
=4.2V, V
OUT
=3.3V)
Output Current : 400mA
Oscillation Frequency : 3.0MHz (
±
15%)
CE Function :
A
ctive High
Soft-start Circuit Built-in
C
L
High Speed Auto Discharge
Protection Circuits : Current Limiter Built-in
(Constant Current & Latching)
Control Methods : PWM (XCL208)
PWM/PFM (XCL209)
Operating Ambient Temperature
: -40 ~ +85
Package : USP-10B03
Environmentally Friendly : EU RoHS Compliant, Pb Free
TYPICAL APPLICATION CIRCUIT
ETR28003-005
TYPICAL PERFORMANCE
CHARACTERISTICS
Efficiency vs. Output Current
XCL208x333DR/XCL209x333D
Green Operation Compatible
0
20
40
60
80
100
0.01 0.1 1 10 100 1000
Output Current:I
OUT
(mA)
Efficiency:EFFI(%
)
V
IN
= 4.2V
VOUT =3.3V
XCL209
(
PW M/ PFM
)
XCL208(PWM)
5.0V
XCL208A / XCL208B / XCL209A / XCL209B Type
XCL208F / XCL209F Type
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2/22
XCL208/XCL209 Series
BLOCK DIAGRAM
V
IN
AV
SS
V
OUT
L1
L
X
L2
CE
PV
SS
V
IN
AV
SS
V
OUT
L1
L
X
L2
CE
PV
SS
V
IN
AV
SS
FB
L1
L
X
L2
CE
PV
SS
1) XCL208A / XCL209A Type 2) XCL208B / XCL209B Type
3) XCL208F / XCL209F Type
NOTE:
The XCL208 offers a fixed PWM control, a signal from CE Control Logic to PWM/PFM Selector is fixed to "L" level inside. The XCL209 control
scheme is PWM/PFM automatic switching, a signal from CE Control Logic to PWM/PFM Selector is fixed to "H" level inside. The diodes placed
inside are ESD protection diodes and parasitic diodes.
W GEE E vow TOIREX
3/22
XCL208/XCL209
Series
PRODUCT CLASSIFICATION
XCL208①②③④⑤⑥ Fixed PWM
XCL209①②③④⑤⑥ PWM/PFM Auto Switching
(*1)
When other output voltages (semi-custom) are needed, please contact your local Torex sales office for more information.
Output voltage range is 0.8~4.0V.
(*2)
Halogen free and EU RoHS compliant.
(*3)
The reels are shipped in a moisture-proof packing
PIN CONFIGURATION
DESIGNATOR ITEM SYMBOL DESCRIPTION
Type
A V
IN
2.0V Fixed Output Voltage
Standard soft-start , No C
L
auto discharge
B V
IN
2.0V Fixed Output Voltage
C
L
auto discharge, High speed soft-start
F V
IN
1.8V Output Voltage External Setting
C
L
auto discharge, High speed soft-start
②③ Output Voltage
(*1)
10 1.0V
12 1.2V
15 1.5V
18 1.8V
25 2.5V
28 2.8V
2L 2.85V
30 3.0V
33 3.3V
08 External Setting 0.8V (XCL208F/XCL209F)
Oscillation Frequency 3 3.0MHz
⑤⑥
(*2)
Package (Order Unit) DR USP-10B03 (3,000psc/Reel)
(*3)
BOTTOM VIEW
4/22
XCL208/XCL209 Series
PIN ASSIGNMENT
FUNCTION
PIN NAME SIGNAL CONDITIONS STATUS
CE
L AVSSVCE0.25V Stand-by
H 0.65VVCE6V Active
* When the CE pin is left open, the IC may operate unstable. Please do not leave the CE pin open.
ABSOLUTE MAXIMUM RATINGS
PIN NUMBER PIN NAME FUNCTIONS
USP-10B03
1 PVSS (Power) Ground
2 LX Switching Output
3 NC No Connection
4 FB Output Voltage Sense Pin (Type F)
VOUT Fixed Output Voltage Pin (Type A/B)
5 AVSS (Analog) Ground
6 CE Active High Enable
7 NC No Connection
8 VIN Power Supply Input
9 L1 Inductor Electrodes
10 L2 Inductor Electrodes
Ta=25
PARAMETER SYMBOL RATINGS UNITS
Input Voltage VIN -0.3 ~ 6.5 V
Lx Pin Voltage VLx -0.3 ~ VIN+0.36.5 V
Output Voltage VOUT -0.3 ~ 6.5 V
FB Pin Voltage VFB -0.3 ~ 6.5 V
CE Input Voltage VCE -0.3 ~ 6.5 V
Lx Pin Current ILX ±1500 mA
Power Dissipation Pd 500(40mm x 40mm Standard board) (*1) mW
Operating Ambient Temperature Topr -40 ~ +85
Storage Temperature Tst g -40 ~ +125
Each voltage rating uses the VSS pin as a reference.
(*1) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.
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5/22
XCL208/XCL209
Series
ELECTRICAL CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT
CIRCUIT
Output Voltage V
OUT
V
IN
=V
CE
=5.0V, I
OUT
=30mA <E-1> <E-2> <E-3> V
Operating Voltage Range V
IN
2.0 - 6.0 V
Maximum Output Current I
OUTMAX
V
IN
=V
OUT(T)
+2.0V, V
CE
=1.0V
(*8)
400 - - mA
UVLO Voltage V
UVLO
V
CE
=V
IN
, V
OUT
=0V,
Voltage which Lx pin holding
“L” level
(*1),(*10)
1.00 1.40 1.78 V
Supply Current (XCL208) I
DD
V
IN
=V
CE
=5.0V, V
OUT
=V
OUT(T)
×1.1V - 46 65 μA
Supply Current (XCL209) - 21 35
Stand-by Current I
STB
V
IN
=5.0V, V
CE
=0V, V
OUT
=V
OUT(T)
×1.1V - 0 1 μA
Oscillation Frequency f
OSC
V
IN
=V
OUT(T)
+2.0V, V
CE
=1.0V, I
OUT
=100mA 2.55 3.00 3.45 MHz
PFM Switching Current
(*11)
I
PFM
V
IN
=V
OUT(T)
+2.0V, V
CE
=V
IN
, I
OUT
=1mA <E-4> <E-5> <E-6> mA
PFM Duty Limit
(*11)
DTY
LIMIT_PFM
V
CE
=V
IN
=<C-1>, I
OUT
=1mA - 200 300 %
Maximum Duty Cycle D
MAX
V
IN
=V
CE
=5.0V, V
OUT
=V
OUT(T)
×0.9V 100 - - %
Minimum Duty Cycle D
MIN
V
IN
=V
CE
=5.0V, V
OUT
=V
OUT(T)
×1.1V - - 0 %
Efficiency
(*2)
EFFI When connected to external components,
V
CE
=V
IN
=V
OUT(T)
+1.2V, I
OUT
=100mA - <E-7> - %
L
X
SW "H" ON Resistance 1 R
LxH1
V
IN
=V
CE
=5.0V, V
OUT
=0V, I
LX
=100mA
(*3)
- 0.35 0.55
L
X
SW "H" ON Resistance 2 R
LxH2
V
IN
=V
CE
=3.6V, V
OUT
=0V, I
LX
=100mA
(*3)
- 0.42 0.67
L
X
SW "L" ON Resistance 1 R
LxL1
V
IN
=V
CE
=5.0V
(*4)
- 0.45 0.65 -
L
X
SW "L" ON Resistance 2 R
LxL2
V
IN
=V
CE
=3.6V
(*4)
- 0.52 0.77 -
L
X
SW "H" Leakage Current
(*5)
I
LeakH
V
IN
=V
OUT
=5.0V, V
CE
=0V, V
LX
=0V - 0.01 1.00 μA
L
X
SW "L" Leakage Current
(*5)
I
LeakL
V
IN
=V
OUT
=5.0V, V
CE
= 0V, V
LX
=5.0V - 0.01 1.00 μA
Current Limit
(*9)
I
LIM
V
IN
=V
CE
=5.0V, V
OUT
=V
OUT(T)
×0.9V
(*7)
600 800 1000 mA
Output Voltage Temperature
Characteristics
V
OUT
/
(V
OUT
Topr)
I
OUT
=30mA,
-40℃≦Topr85 - ±100 -
ppm/
CE "H" Voltage V
CEH
V
OUT
=0V, Applied voltage to V
CE
,
Voltage changes Lx to “H” level
(*10)
0.65 - 6.00 V
CE "L" Voltage V
CEL
V
OUT
=0V, Applied voltage to V
CE,
Voltage changes Lx to “L” level
(*10)
AV
SS
- 0.25 V
CE "H" Current I
CEH
V
IN
=V
CE
= 5.0V, V
OUT
=0V -0.1 - 0.1 μA
CE "L" Current I
CEL
V
IN
=5.0V, V
CE
=0V, V
OUT
=0V -0.1 - 0.1 μA
Soft-start Time t
SS
V
CE
=0VV
IN
, I
OUT
=1mA 0.5 0.90 2.50 ms
Latch Time t
LAT
V
IN
=V
CE
=5.0V, V
OUT
=0.8×V
OUT(T)
,
Short Lx at 1 resistance
(*6)
1 - 20 ms
Short Protection Threshold Voltage
V
SHORT
Sweeping V
OUT
, V
IN
=V
CE
=5.0V,
Short Lx at 1 resistance, V
OUT
voltage which
Lx becomes “L” level within 1ms
<E-8> <E-9> <E-10> V
Inductance Value L Test Frequency=1MHz - 1.5 - μH -
Allowed Inductor Current I
DC
T=40 - 700 - mA -
Ta=25
1) XCL208Axx3DR/XCL209Axx3DR
Test conditions: Unless otherwise stated, V
IN
=5.0V, V
OUT(T)
=Nominal Voltage
NOTE:
(*1)
Including hysteresis operating voltage range.
(*2)
EFFI={ (output voltage×output current) / (input voltage×input current) }×100
(*3)
ON resistance ()=(V
IN
- Lx pin measurement voltage) / 100mA
(*4)
Design value
(*5)
When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6)
Time until it short-circuits V
OUT
with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7)
When V
IN
is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8)
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9)
Current limit denotes the level of detection at peak of coil current.
(*10)
“H”=V
IN
~V
IN
-1.2V, “L”=+0.1V~-0.1V
(*11)
I
PFM
and DTY
LIMIT_PFM
are defined only for the XCL209 series.
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6/22
XCL208/XCL209 Series
ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT CIRCUIT
Output Voltage VOUT VIN=VCE=5.0V, IOUT=30mA <E-1> <E-2> <E-3> V
Operating Voltage Range VIN 2.0 - 6.0 V
Maximum Output Current IOUTMAX VIN=VOUT(T)+2.0V, VCE=1.0V (*8) 400 - - mA
UVLO Voltage VUVLO VCE=VIN, VOUT=0V,
Voltage which Lx pin holding “L” level (*1),(*10)
1.00 1.40 1.78 V
Supply Current (XCL208) IDD VIN=VCE=5.0V, VOUT=VOUT(T) ×1.1V - 46 65 μA
Supply Current (XCL209) - 21 35
Stand-by Current ISTB VIN=5.0V, VCE=0V, VOUT=VOUT
(
T
)
×1.1V - 0 1 μA
Oscillation Frequency fOSC VIN=VOUT(T)+2.0V, VCE=1.0V, IOUT=100mA 2.55 3.00 3.45 MHz
PFM Switching Current
(*11)
IPFM VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA <E-4> <E-5> <E-6> mA
PFM Duty Limit (*11) DTYLIMIT
PFM VCE=VIN=<C-1>, IOUT=1mA - 200 300 %
Maximum Duty Cycle DMAX VIN=VCE=5.0V, VOUT=VOUT
(
T
)
×0.9V 100 - - %
Minimum Duty Cycle DMIN VIN=VCE=5.0V, VOUT=VOUT
(
T
)
×1.1V - - 0 %
Efficiency (*2) EFFI VCE=VIN=VOUT(T)+1.2V, IOUT=100mA - <E-7> - %
L
X
SW "H" ON Resistance 1
RLxH1 VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3) - 0.35 0.55
L
X
SW "H" ON Resistance 2
RLxH2 VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3) - 0.42 0.67
L
X
SW "L" ON Resistance 1
RLxL1 VIN=VCE=5.0V (*4) - 0.45 0.65 -
L
X
SW "L" ON Resistance 2
RLxL2 VIN=VCE=3.6V (*4) - 0.52 0.77 -
L
X
SW "H" Leakage Current
(*5)
ILeakH VIN=VOUT=5.0V, VCE=0V, VLX=0V - 0.01 1.00 μA
Current Limit (*9) ILIM VIN=VCE=5.0V, VOUT=VOUT
(
T
)
×0.9V (*7) 600 800 1000 mA
Output Voltage Temperature
Characteristics
V
OUT
/
(V
OUT
Topr)
IOUT=30mA, -40℃≦Topr85℃, - ±100 -
ppm/
CE "H" Voltage VCEH VOUT=0V, Applied voltage to VCE Voltage
changes Lx to “H” level *10 0.65 - 6.00 V
CE "L" Voltage VCEL VOUT=0V, Applied voltage to VCE Voltage
changes Lx to “L” level *10 AVSS
- 0.25 V
CE "H" Current ICEH VIN=VCE=5.0V, VOUT=0V -0.1 - 0.1 μA
CE "L" Current ICEL VIN=5.0V, VCE=0V, VOUT=0V -0.1 - 0.1 μA
Soft-start Time tSS VCE=0VVIN, IOUT=1mA - <E-11> <E-12> ms
Latch Time tLAT VIN=VCE=5.0V, VOUT=0.8×VOUT(T),
Short Lx at 1 resistance
(*6)
1 - 20 ms
Short Protection Threshold Voltage
VSHORT
Sweeping VOUT, VIN=VCE=5.0V,
Short Lx at 1 resistance, VOUT voltage which
Lx becomes “L” level within 1ms
<E-8> <E-9> <E-10> V
CL Discharge RDCHG VIN=5.0V, LX=5.0V, VCE=0V, VOUT=Open 200 300 450
Inductance Value L Test Frequency=1MHz - 1.5 - μH -
Allowed Inductor Current IDC T=40 - 700 - mA -
Ta=25
2
)
XCL208Bxx3DR/XCL209Bxx3DR
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT (T)=Nominal Voltage
NOTE:
(*1) Including hysteresis operating voltage range.
(*2) EFFI={ ( output voltage×output current ) / ( input voltage×input current) }×100
(*3) ON resistance ()= (VIN - Lx pin measurement voltage) / 100mA
(*4) Design value
(*5) When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6) Time until it short-circuits VOUT with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9) Current limit denotes the level of detection at peak of coil current.
(*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series.
When connected to externa‘ component; TOIi’EX
7/22
XCL208/XCL209
Series
ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNIT
CIRCUIT
FB Voltage V
FB
V
IN
=V
CE
=5.0V, V
FB
voltage which Decrease
V
FB
from 0.9V, Lx becomes “H”
(*10)
level 0.784 0.800 0.816 V
Operating Voltage Range V
IN
1.8 - 6.0 V
Maximum Output Current I
OUTMAX
V
IN
=3.2V, V
CE
=1.0V
(*8)
400 - - mA
UVLO Voltage V
UVLO
V
CE
=V
IN
, V
FB
=0.4V,
Voltage which Lx pin holding “L” level
(*1), (*10)
1.00 1.40 1.78 V
Supply Current (XCL208) I
DD
V
IN
=V
CE
= 5.0V, V
FB
=0.88V - 46 65 μA
Supply Current (XCL209) - 21 35
Stand-by Current I
STB
V
IN
=5.0V, V
CE
=0V, V
FB
=0.88V - 0 1.0 μA
Oscillation Frequency f
OSC
V
IN
=3.2V, V
CE
=1.0V, I
OUT
=100mA 2.55 3.00 3.45 MHz
PFM Switching Current
(*11)
I
PFM
V
IN
=3.2V, V
CE
= V
IN
, I
OUT
=1mA <E-4> <E-5> <E-6> mA
PFM Duty Limit
(*11)
DTY
LIMIT_PFM
V
IN
=V
CE
=2.2V, I
OUT
=1mA - 200 300 %
Maximum Duty Cycle MAXDTY V
IN
=V
CE
=5.0V, V
FB
=0.72V 100 - - %
Minimum Duty Cycle MINDTY V
IN
=V
CE
=5.0V, V
FB
=0.88V - - 0 %
Efficiency
(*2)
EFFI V
CE
=V
IN
=2.4V, I
OUT
=100mA - <E-7> - %
L
X
SW "H" ON Resistance 1 R
LxH1
V
IN
=V
CE
=5.0V, V
FB
=0.72V, I
LX
=100mA
(*3)
- 0.35 0.55
L
X
SW "H" ON Resistance 2 R
LxH2
V
IN
=V
CE
=3.6V, V
FB
=0.72V, I
LX
=100mA
(*3)
- 0.42 0.67
L
X
SW "L" ON Resistance 1 R
LxL1
V
IN
=V
CE
=5.0V
(*4)
- 0.45 0.65 -
L
X
SW "L" ON Resistance 2 R
LxL2
V
IN
=V
CE
=3.6V
(*4)
- 0.52 0.77 -
LX SW "H" Leakage Current
(*5)
I
LeakH
V
IN
=V
FB
=5.0V, V
CE
=0V, L
X
=0V - 0.01 1.00 μA
Current Limit
(*9)
I
LIM
V
IN
=V
CE
=5.0V, V
FB
=0.72V
(*7)
600 800 1000 mA
Output Voltage Temperature
Characteristics
V
OUT
/
(V
OUT
Topr)
I
OUT
=30mA, -40℃≦Topr85℃, - ±100 -
ppm/
CE "H" Voltage V
CEH
V
FB
=0.72V, Applied voltage to V
CE
,
Voltage changes L
X
to “H” level
(*10)
0.65 - 6.00 V
CE "L" Voltage V
CEL
V
FB
=0.72V, Applied voltage to V
CE
,
Voltage changes L
X
to “L” level
(*10)
AV
SS
- 0.25 V
CE "H" Current I
CEH
V
IN
=V
CE
=5.0V, V
FB
=0.72V -0.1 - 0.1 μA
CE "L" Current I
CEL
V
IN
=5.0V, V
CE
=0V, V
FB
=0.72V -0.1 - 0.1 μA
Soft-start Time t
SS
When connected to external components,
V
CE
=0VV
IN
, I
OUT
=1mA - 0.25 0.40 ms
Latch Time t
LAT
V
IN
=V
CE
=5.0V, V
FB
=0.64V,
Short Lx at 1 resistance
(*6)
1 - 20 ms
Short Protection Threshold Voltage
V
SHORT
V
IN
=V
CE
=5.0V, V
FB
voltage which Decrease
V
FB
from 0.4V, Lx becomes “L”
(*10)
level 0.150 0.200 0.250 V
C
L
Discharge R
DCHG
V
IN
=5.0V, L
X
=5.0V, V
CE
=0V, V
FB
=Open 200 300 450
Inductance Value L Test Frequency=1MHz - 1.5 - μH -
Allowed Inductor Current I
DC
T=40 - 700 - mA -
Ta=25
3) XCL208F083DR/XCL209F083DR
V
OUT(T)
=Nominal Voltage
Test conditions: Unless otherwise stated, V
IN
=5.0V, V
OUT
=1.2V, and the order of voltage application is V
FB
V
IN
V
CE
NOTE:
(*1)
Including hysteresis operating voltage range.
(*2)
EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
(*3)
ON resistance ()= (V
IN
- Lx pin measurement voltage) / 100mA
(*4)
Design value
(*5)
When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6)
Time until it short-circuits V
OUT
with GND via 1 of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7)
When V
IN
is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8)
When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9)
Current limit denotes the level of detection at peak of coil current.
(*10)
“H”=V
IN
~V
IN
-1.2V, “L”=+0.1V~-0.1V
(*11)
I
PFM
and DTY
LIMIT_PFM
are defined only for the XCL209 series.
400mA
8/22
XCL208/XCL209 Series
ELECTRICAL CHARACTERISTICS (Continued)
VOUT
PFM
Duty
VIN (V)
VOUT (V) IPFM (mA)
EFFI (%)
VSHORT (ms) tss (ms)
MIN. TYP. MAX. MIN. TYP. MAX. TYP. MIN. TYP. MAX. TYP. MAX.
<C-1> <E-1> <E-2> <E-3> <E-4> <E-5> <E-6> <E-7> <E-8> <E-9> <E-10> <E-11> <E-12>
1.00 2.0V 0.980 1.000 1.020 190 260 350 79 0.375 0.500 0.625 0.25 0.40
1.20 2.20 1.176 1.200 1.224 190 260 350 82 0.450 0.600 0.750 0.25 0.40
1.50 2.50 1.470 1.500 1.530 180 240 300 84 0.563 0.750 0.938 0.25 0.40
1.80 2.80 1.764 1.800 1.836 170 220 270 85 0.675 0.900 1.125 0.32 0.50
2.50 3.50 2.450 2.500 2.550 170 220 270 86 0.938 1.250 1.563 0.32 0.50
2.80 3.80 2.744 2.800 2.856 170 220 270 86 1.050 1.400 1.750 0.32 0.50
2.85 3.85 2.793 2.850 2.907 170 220 270 86 1.069 1.425 1.781 0.32 0.50
3.00 4.00 2.940 3.000 3.060 170 220 270 86 1.125 1.500 1.875 0.32 0.50
3.30 4.30 3.234 3.300 3.366 170 220 270 86 1.238 1.650 2.063 0.32 0.50
e.g. Circuit (XCL208F/XCL209F Type)
VOUT (V) R1 (k) R2 (k) CFB (pF)
0.9 100 820 150
1.2 150 300 100
1.5 130 150 220
1.8 300 240 150
2.5 510 240 100
3.0 330 120 150
3.3 470 150 100
4.0 120 30 470
<XCL208/XCL209 F type output voltage setting>
The output voltage can be set by adding external dividing resistors. The output voltage is determined by R1 and R2 in the
equation below. The sum of R1 and R2 is normally kept 1M or less. The output voltage range can be set from 0.9V to 6.0V
based on the 0.8V ±2.0% reference voltage source.
Note that when the input voltage (VIN) is less than or equal to the set output voltage, an output voltage (VOUT) higher than the
input voltage (VIN) cannot be output.
V
OUT=0.8×(R1+R2)/R2
Adjust the value of the phase compensation speedup capacitor CFB so that fzfb=1/(2×π×CFB×R1) is 10kHz or less. It is
optimum to adjust to a value from 1kHz to 20kH based on the components used and the board layout.
[Calculation example]
When R1=470k, R2=150k, VOUT=0.8×(470k+150k)/150k=3.3V
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9/22
XCL208/XCL209
Series
TEST CIRCUITS
10/22
XCL208/XCL209 Series
OPERATIONAL DESCRIPTION
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally 3.0MHz. Clock pulses generated in
this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback (Type
F: FB pin voltage) divided by the internal split resistors, R1 and R2. When a feed back voltage is lower than the reference voltage,
the output voltage of the error amplifier is increased. The gain and frequency characteristics of the error amplifier output are fixed
internally to deliver an optimized signal to the mixer.
<Current Limit>
The current limiter circuit of the XCL208/XCL209 series monitors the current flowing through the P-ch MOS driver transistor
connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode.
When the driver current is greater than a current limit level, the current limit function operates to turn off the pulses from the
Lx pin at any given timing.
When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over
current state.
When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps through . If an over current state continues for a latch
time and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver
transistor, and goes into operation suspension state. Once the IC is in suspension state, operations can be resumed by either turning
the IC off via the CE pin, or by restoring power to the VIN pin. The suspension state does not mean a complete shutdown, but a state
in which pulse output is suspended; therefore, the internal circuitry remains in operation. The current limit of the XCL208/XCL209
series can be set at 800mA at typical. Depending on the state of the PC Board, latch time may become longer and latch operation
may not work. In order to avoid the effect of noise, an input capacitor is placed as close to the IC as possible.
The XCL208/XCL209 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator,
phase compensation circuit, output voltage adjustment resistors, P-ch MOSFET driver transistor, N-ch MOSFET switching
transistor for the synchronous switch, current limiter circuit, UVLO circuit with control IC, and an inductor. (See the block
diagram below.) Using the error amplifier, the voltage of the internal voltage reference source is compared with the feedback
voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error amplifier
output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator
compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and
delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle.
This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-ch MOS
driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple
feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used
ensuring stable output voltage. Type A
Limit#ms Limit#ms
ILx
VOUT
Lx
VCE
VIN
Current Limit Level
0mA
VSS
Restart
V
IN
AV
SS
V
OUT
L1
L
X
L2
CE
PV
SS
5mm. Vnhl- mn omutvmun m ommvmm mmge Chavicunsacs Rmmg : cums? (WP) nmmmmw
11/22
XCL208/XCL209
Series
OPERATIONAL DESCRIPTION(Continued)
<Short-Circuit Protection>
The short-circuit protection circuit monitors the internal R1 and R2 divider voltage (Type F: FB pin voltage). In case where
output is accidentally shorted to the Ground and when the FB point voltage decreases less than half of the reference voltage
(Vref) and a current more than the I
LIM
flows to the driver transistor, the short-circuit protection quickly operates to turn off
and to latch the driver transistor. In the latch state, the operation can be resumed by either turning the IC off and on via the
CE pin, or by restoring power supply to the V
IN
pin.
Also, when sharp load transient happens, a voltage drop at the V
OUT
is propagated through C
FB
, as a result, short circuit
protection may operate in the voltage higher than short-circuit protection voltage.
<UVLO Circuit>
When the V
IN
pin voltage becomes 1.4V (TYP.) or lower, the P-channel output driver transistor is forced OFF to prevent false
pulse output caused by unstable operation of the internal circuitry. When the V
IN
pin voltage becomes 1.8V or higher, by releasing
the UVLO state then the soft-start function initiates output startup operation. The soft-start function operates even when the V
IN
pin voltage falls momentarily below the UVLO operating voltage same as releasing the UVLO function. The UVLO circuit does
not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal circuitry remains in
operation.
<PFM Switch Current>
In PFM control operation, until coil current reaches to I
PFM
, the IC keeps the P-ch MOSFET on.
In this case, on-time (t
ON
) that the P-ch MOSFET is kept on can be given by the following formula.
t
ON
= L
×
I
PFM
/ (V
IN
V
OUT
) I
PFM
<PFM Duty Limit>
In the PFM control operation, the maximum PFM Duty Limit is set to 200% (TYP.). Therefore, under the condition that the step-
down ratio is small, it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to I
PFM
. I
PFM
<C
L
High Speed Discharge>
The XCL208B/XCL209B and the XCL208F/XCL209F can quickly discharge the electric charge at the output capacitor (C
L
)
when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is inputted via the N-ch transistor
located between the L
X
pin and the V
SS
pin. When the IC is disabled, electric charge left at the output capacitor (C
L
) is quickly
discharged so that it may avoid application malfunction. Discharge time is set by the C
L
auto-discharge resistance (R
DCHG
)
and the output capacitance (C
L
). By setting time constant as τ(τ=C
L
x R
DCHG
), discharge time of the output voltage is
calculated by the following formula.
V = V
OUT(T)
x e
–t/
τ
or t=
τ
ln (V
OUT(T)
/ V)
V : Output voltage after discharge
V
OUT(T)
: Output voltage
t: Discharge time,
τ: C
L
x R
DCHG
C
L
: Output capacitance (C
L
)
R
DCHG
: C
L
auto-discharge resistance
I
PFM
I
PFM
0
10
20
30
40
50
60
70
80
90
100
0 102030405060708090100
CL=10uF
CL=20uF
CL=50uF
12/22
XCL208/XCL209 Series
OPERATIONAL DESCRIPTION(Continued)
(A)
SW_CE OPERATIONAL STATES
ON Stand-by
OFF Active
(B)
SW_CE OPERATIONAL STATES
ON Active
OFF Stand-by
<CE Pin Function>
The operation of the XCL208/XCL209 series will enter into the stand-by mode when a low level signal is input to the CE pin.
During the stand-by mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high impedance at the Lx pin
and VOUT pin. The IC starts its operation by inputting a high level signal to the CE pin. The input to the CE pin is a CMOS input
and the sink current is 0μA (TYP.).
<Soft-Start>
Soft-start time is internally set. Soft-start time is defined as the time to reach 90% of the output nominal voltage when the CE
pin is turned on.
t
SS
V
CEH
V
OUT
0V
0V
設定電圧の90%
90% of setting voltage
IC内部
IC
R1
R2
SW_CE
SW_CE
V
IN
CE
V
IN
CE
V
DD
V
DD
使用例A 使用例B
(A) (B)
< IC inside > < IC inside >
DP 9
13/22
XCL208/XCL209
Series
NOTE ON USE
1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2. The XCL208/XCL209 series is designed for use with ceramic output capacitors. If, however, the potential difference is too
large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching
energy and oscillation could occur on the output. In this case, increase 10μF to the output capacitance for adding insufficient
capacitance. Also, if the output capacitance is too large, the output voltage is slowly rising and the IC may not operate.
Adjust the output capacitance so that the output voltage can go up within the soft-start time.
3. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
4. Depending on the input-output voltage differential, or load current, some pulses may be skipped as 1/2, 1/3 and the ripple voltage
may increase.
5. When the difference between input and output is large in PWM control, very narrow pulses will be outputted, and there is the
possibility that 0% duty cycles may be continued during some cycles.
6. When the difference between input and output is small, and the load current is heavy, very wide pulses will be outputted and
there is the possibility that 100% duty cycles may be continued during some cycles.
7. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current of the coil increases
when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current
becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the
peak current according to the following formula:
Ipk = (V
IN
- V
OUT
) x OnDuty / (2 x L x f
OSC
) + I
OUT
L: Coil Inductance Value
f
OSC
: Oscillation Frequency
8. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off.
During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current
flows; therefore, care must be taken when selecting the rating for the external components such as a coil.
9. When V
IN
is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid
the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible.
11. Use of the IC at voltages below the minimum operating voltage range may lead to instability.
12. This IC should be used within the stated absolute maximum ratings of external components in order to prevent damage to
the device.
13. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the
leak current of the driver transistor.
14. The current limit is set to 1000mA (MAX.)
at typical. However, the current of 1000mA or more may flow.
In case that the current limit functions while the V
OUT
pin is shorted to the GND pin, when P-ch MOSFET is ON, the
potential difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large.
By contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the V
OUT
pin is
shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this
operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount
of current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for
several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent
damage to the device.
Current flows into P-ch MOSFET to reach the current limit (I
LIM
).
The current of I
LIM
or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET.
Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.
Lx oscillates very narrow pulses by the current limit for several ms.
The circuit is latched, sto
pp
in
g
its o
p
eration.
Delay Limit
#ms
Lx
ILIM
ILx
XCL208 209 XCL208 209 TOREX TOREX mum USP-“Em
14/22
XCL208/XCL209 Series
NOTE ON USE (Continued)
15. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected as
close as possible to the VIN & VSS pins.
16. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode.
17. For the XCL209, when PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for
the range of MAXDUTY area with small input/output differential. Once the design has been completed, verification with actual
components should be done.
18. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
19. Instructions of pattern layouts
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN (No.8) and PVSS (No.1) pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.
(5) Internal driver transistors bring on heat because of the output current and ON resistance of the driver transistors.
(6) Please connect Lx (No.2) pin and L1 (No.9) pin on the PCB layout.
(7) Please connect VOUT (No.4) pin and L2 (No.10) pin on the PCB layout. (Type A/B)
<Type A/B (VOUT)>
<Type F (FB)>
CL
VOUT
GND
CIN
VIN GND
CE
IC
XCL208/209
USP-10B03
TOREX
LX
RFB1
CFB
FB
CL
VOUT
GND
CIN
VIN GND
CE
IC
XCL208/209
USP-10B03
TOREX
LX
RFB1
CFB
FB
TOP VIEW BOTTOM VIEW PCB mounted TOP VIEW
TOP VIEW BOTTOM VIEW PCB mounted TOP VIEW
: IC
: Ceramic Cap
: Chip Resistance
15/22
XCL208/XCL209
Series
NOTE ON USE (Continued)
20. Typical application circuit
NOTE:
The integrated Inductor can be used only for this DC/DC converter. Please do not use this inductor for other reasons.
Please use B, X5R, and X7R grades in temperature characteristics for the C
IN
and C
L
capacitors.
These grade ceramic capacitors minimize capacitance-loss as a function of voltage stress.
If necessary, increase capacitance by adding or replacing.
Examples of external components
PART NUMBER MANUFACTURE RATED VOLTAGE / INDUCTANCE /
FEATURES Size (L×W)
C
IN
LMK107BJ475KA TAIYO YUDEN 10V/4.7μF/X5R 1.6mm×0.8mm
LMK212B7475KG TAIYO YUDEN 10V/4.7μF/X7R 2.0mm×1.25mm
C
L
LMK107BBJ106MA TAIYO YUDEN 10V/10μF/X5R 1.6mm×0.8mm
LMK212B7106MG TAIYO YUDEN 10V/4.7μF/X7R 2.0mm×1.25mm
<Typical application circuits Type A/B> < Typical application circuits Type F>
Example of external components
C
IN
: 10V/4.7μFLMK107BJ475KA TAIYO YUDEN
C
L
: 10V/10μFLMK107BBJ106MA TAIYO YUDEN
Example of external components (V
OUT
=1.8V)
C
IN
: 10V/4.7μFLMK107BJ475KA TAIYO YUDEN
C
L
: 10V/10μFLMK107BBJ106MA TAIYO YUDEN
R
FB1
: 300k
R
FB2
: 240k
C
FB
: 150pFC1005CH1H151J TDK
L2
VIN VOUT
AVSS
L1 LX
PVSS
CE
CIN CL
VOUT
VIN
VCE
L2
VIN FB
AVSS
L1 LX
PVSS
CE
CL
CIN
CFB
RFB 1
RFB 2
VOUT
VIN
VCE
XCL209
16/22
XCL208/XCL209 Series
TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current (2) Output Voltage vs. Output Current
(3) Ripple Voltage vs. Output Current (4) Oscillation Frequency vs. Ambient Temperature
(5) Supply Current vs. Ambient Temperature (6) Output Voltage vs. Ambient Temperature
0
20
40
60
80
100
0.1 1 10 100 1000
Output Current:I
OUT
(mA)
Efficiency:EFFI(%
)
(
PWM
)
2.4V
    3.6V
V
IN
= 4.2V
XCL209(PWM/PFM)
XCL208
1.5
1.6
1.7
1.8
1.9
2.0
2.1
0.1 1 10 100 1000
Output Current:I
OUT
(mA)
Output Voltage:V
OUT
(V)
V
IN
=4.2V,3.6V,2.4V
XCL208/XCL209
0
20
40
60
80
100
0.1 1 10 100 1000
Output Current:I
OUT
(mA)
Ripple Voltage:Vr(mV)
V
IN
=2.4
V
XCL208 XCL209
V
IN
=2.4V
3.6V,4.2
3.6V,4.2V
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
-50 -25 0 25 50 75 100
Ambient Temperature: Ta ()
V
IN
=3.6V
Oscillation Frequency : fosc(MHz)
0
5
10
15
20
25
30
35
40
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (
)
Supply Current : I
DD
(μA)
V
IN
=6.0V
4.0V
2.0V
1.5
1.6
1.7
1.8
1.9
2.0
2.1
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (
)
Output Voltage : V
OUT
(V)
V
IN
=3.6V
XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR
XCL209B183DR XCL208B183DR/XCL209B183DR
17/22
XCL208/XCL209
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) UVLO Voltage vs. Ambient Temperature (8) CE "H" Voltage vs. Ambient Temperature
(9) CE "L" Voltage vs. Ambient Temperature (10) Soft Start Time vs. Ambient Temperature
(11) "Pch / Nch" Driver on Resistance vs. Input Voltage (12) Rise Wave Form
0.0
0.3
0.6
0.9
1.2
1.5
1.8
-50-250 255075100
Ambient Temperature: Ta (
)
UVLO Voltage : UVLO (V)
CE=V
IN
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (
)
CE "H" Voltage : V
CEH
(V)
V
IN
=5.0V
3.6V
2.4V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (
)
CE "L" Voltage : V
CEL
(V)
V
IN
=5.0V
3.6V
2.4V
0.0
1.0
2.0
3.0
4.0
5.0
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (
)
Soft Start Time : tss (ms)
V
IN
=3.6V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0123456
Input Voltage : V
IN
(V)
Pch on Resistance
Nch on Resistance
Lx SW ON Resistance:RLxH,RLxL ()
XCL208B333DR/XCL209B333DR
XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR
CE:0.0V1.0V
V
IN
= 5.0V
I
OUT
= 1.0mA
Time:100μs/div
V
OUT
1ch
2ch
1ch:1V/div 2ch:1V/div
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18/22
XCL208/XCL209
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(13) Soft-Start Time vs. Ambient Temperature (14) C
L
Discharge Resistance vs. Ambient Temperature
(15) Load Transient Response
MODEPWM/PFM Automatic Switching Control
0
100
200
300
400
500
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (
)
V
IN
=5.0V
I
OUT
=1.0mA
Soft Start Time : tss (μs)
100
200
300
400
500
600
-50 -25 0 25 50 75 100
Ambient Temperature: Ta (
)
CL Discharge Resistance: (
)
V
IN
=6.0V
4.0V
2.0V
XCL208B333DR/XCL209B333DR XCL208B333DR/XCL209B333DR
XCL209B183DR XCL209B183DR
XCL209B183DR XCL209B183DR
law/ma sv Iann=Im m. b—J Vour MW m- Ioonwm Zeh'SOMV/dw Time:100usldiv M~:36V,le;1 8V m- mom/aw zcn'somvraw TIme'100us/div 16V)!” 1.8V lmyfillnA= worm am >— m- Ioonwm Zeh'SOMV/dw Time:100usldiv vu:3 W,Vouv:1 av '0‘"va 2 1M 1m y r———————— mow—u.- Vow m- mom/aw zcn'somvraw TIme:100us/div
19/22
XCL208/XCL209
Series
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
MODEPWM Control
XCL208B183DR XCL208B183DR
XCL208B183DR XCL208B183DR
XCL208/XCL209 www.mrexsemi.com/‘echmca\-suggonlgackages ‘ USP-10303 PKG USP-10303 Power Dwsswgauon
20/22
XCL208/XCL209 Series
PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE OUTLINE / LAND PATTERN THERMAL CHARACTERISTICS
USP-10B03 USP-10B03 PKG Standard Board USP-10B03 Power Dissipation
TOIREX
21/22
XCL208/XCL209
Series
MARKING RULE
represents products series
represents integer of output voltage and oscillation frequency
represents the decimal part of output voltage
Example
Mark
,
③)
,
represents production lot number
0109, 0A0Z, 119Z, A1A9, AAAZ, B1ZZ in order.
(G, I, J, O, Q, W excluded)
*No character inversion used.
MARK PRODUCT SERIES
8 XCL208******
9 XCL209******
OUTPUT
VOLTAGE(V)
MARK
OSCILLATION FREQUENCY =3.0MHz
(XCL20*F**3**(FB) (XCL20*A**3**) (XCL20*B**3**)
0.x F 0 A
1.x
-
1 B
2.x 2 C
3.x 3 D
4.x 4 E
OUTPUT
VOLTAGE (V) MARK
PRODUCT SERIES
OUTPUT
VOLTAGE (V) MARK
PRODUCT SERIES
X.0 0 XCL20***0*** X.05 A XCL20***A***
X.1 1 XCL20***1*** X.15 B XCL20***B***
X.2 2 XCL20***2*** X.25 C XCL20***C***
X.3 3 XCL20***3*** X.35 D XCL20***D***
X.4 4 XCL20***4*** X.45 E XCL20***E***
X.5 5 XCL20***5*** X.55 F XCL20***F***
X.6 6 XCL20***6*** X.65 H XCL20***H***
X.7 7 XCL20***7*** X.75 K XCL20***K***
X.8 8 XCL20***8*** X.85 L XCL20***L***
X.9 9 XCL20***9*** X.95 M XCL20***M***
OSCILLATION
FREQUENCY
MARK
XCL20*F08*** XCL20*A18*** XCL20*B3D***
3.0MHz F 8 1 8 D D
① ②
1
2
3
8
7
6
45
USP-10B03
22/22
XCL208/XCL209 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or completeness
of the information contained in this datasheet nor grant any license to any intellectual property rights
of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require extremely
high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human
life, bodily injury, serious property damage including but not limited to devices or equipment used in 1)
nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other
transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless
Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or
property damage resulting from such failure, customers are required to incorporate adequate safety
measures in their designs, such as system fail safes, redundancy and fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
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Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.