ESP32-WROVER-B Datasheet by Espressif Systems

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ESP32WROVERB
Datasheet
Version 1.6
Espressif Systems
Copyright © 2021
www.espressif.com
About This Document
This document provides the specifications for the ESP32-WROVER-B modules with PCB antenna and IPEX
antenna.
Document Updates
Please always refer to the latest version on https://www.espressif.com/en/support/download/documents.
Revision History
For revision history of this document, please refer to the last page.
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Certification
Download certificates for Espressif products from www.espressif.com/en/certificates.
Contents
1 Overview 6
2 Pin Definitions 8
2.1 Pin Layout 8
2.2 Pin Description 9
2.3 Strapping Pins 10
3 Functional Description 12
3.1 CPU and Internal Memory 12
3.2 External Flash and SRAM 12
3.3 Crystal Oscillators 12
3.4 RTC and Low-Power Management 12
4 Peripherals and Sensors 14
5 Electrical Characteristics 15
5.1 Absolute Maximum Ratings 15
5.2 Recommended Operating Conditions 15
5.3 DC Characteristics (3.3 V, 25 °C) 15
5.4 Wi-Fi Radio 16
5.5 BLE Radio 17
5.5.1 Receiver 17
5.5.2 Transmitter 17
5.6 Reflow Profile 18
6 Schematics 19
7 Peripheral Schematics 20
8 Physical Dimensions 21
9 Recommended PCB Land Pattern 22
10 U.FL Connector Dimensions 23
11 Learning Resources 24
11.1 Must-Read Documents 24
11.2 Must-Have Resources 24
Revision History 26
List of Tables
1 ESP32-WROVER-B Ordering Information 6
2 ESP32-WROVER-B Specifications 7
3 Pin Definitions 9
4 Strapping Pins 10
5 Absolute Maximum Ratings 15
6 Recommended Operating Conditions 15
7 DC Characteristics (3.3 V, 25 °C) 15
8 Wi-Fi Radio Characteristics 16
9 Receiver Characteristics – BLE 17
10 Transmitter Characteristics – BLE 17
List of Figures
1 Pin Layout of ESP32-WROVER-B (Top View) 8
2 Reflow Profile 18
3 Schematics of ESP32-WROVER-B 19
4 Peripheral Schematics of ESP32-WROVER-B 20
5 Physical Dimensions of ESP32-WROVER-B (PCB/IPEX) 21
6 Recommended PCB Land Pattern of ESP32-WROVER-B 22
7 U.FL Connector Dimensions 23
1 Overview
1 Overview
ESP32-WROVER-B is a powerful, generic WiFi-BT-BLE MCU module that targets a wide variety of applications,
ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music
streaming and MP3 decoding.
This module is provided in two versions: one with a PCB antenna, the other with an IPEX antenna.
ESP32-WROVER-B features a 4 MB external SPI flash and an additional 8 MB SPI Pseudo static RAM (PSRAM).
The information in this datasheet is applicable to both modules.
The ordering information on the two variants of ESP32-WROVER-B is listed as follows:
Table 1: ESP32WROVERB Ordering Information
Module Chip embedded Flash PSRAM Module dimensions (mm)
ESP32-WROVER-B (PCB) ESP32-D0WD 4 MB 18 MB (18.00±0.10)×(31.40±0.10)×(3.30±0.10)
ESP32-WROVER-B (IPEX)
Notes:
1. ESP32-WROVER-B (PCB/IPEX) with 8 MB flash or 16 MB flash is available for custom order.
2. For detailed ordering information, please see Espressif Product Ordering Information.
3. For dimensions of the IPEX connector, please see Chapter 10.
At the core of the module is the ESP32-D0WD chip*. The chip embedded is designed to be scalable and
adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable
from 80 MHz to 240 MHz. The chip also has a low-power co-processor that can be used instead of the CPU to
save power while performing tasks that do not require much computing power, such as monitoring of
peripherals. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD
card interface, Ethernet, high-speed SPI, UART, I²S and I²C.
Note:
* For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet.
The integration of Bluetooth®, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted,
and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet
through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast
low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for
battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps,
and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer
industry-leading specifications and the best performance for electronic integration, range, power consumption,
and connectivity.
The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as
well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products
even after their release, at minimum cost and effort.
Table 2provides the specifications of ESP32-WROVER-B.
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1 Overview
Table 2: ESP32WROVERB Specifications
Categories Items Specifications
Certification
RF certification FCC/CE-RED/IC/TELEC/KCC/SRRC/NCC
Bluetooth certification BQB
Green certification RoHS, REACH
Test Reliablity HTOL/HTSL/uHAST/TCT/ESD
Wi-Fi Protocols
802.11 b/g/n (802.11n up to 150 Mbps)
A-MPDU and A-MSDU aggregation and 0.4 µs guard in-
terval support
Frequency range 2.4 GHz ~2.5 GHz
Bluetooth
Protocols Bluetooth v4.2 BR/EDR and BLE specification
Radio
NZIF receiver with –97 dBm sensitivity
Class-1, class-2 and class-3 transmitter
AFH
Audio CVSD and SBC
Hardware
Module interfaces
SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM,
I2S, IR, pulse counter, GPIO, capacitive touch sensor,
ADC, DAC, Two-Wire Automotive Interface (TWAI®, com-
patible with ISO11898-1)
On-chip sensor Hall sensor
Integrated crystal 40 MHz crystal
Integrated SPI flash 4 MB
Integrated PSRAM 8 MB
Operating voltage/Power supply 3.0 V ~3.6 V
Minimum current delivered by
power supply 500 mA
Recommended operating tem-
perature range –40 °C ~85 °C
Package size (18.00±0.10) mm × (31.40±0.10) mm × (3.30±0.10) mm
Moisture sensitivity level (MSL) Level 3
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2 Pin Definitions
2 Pin Definitions
2.1 Pin Layout
Keepout Zone
GND
IO23
IO22
TXD0
RXD0
IO21
NC
IO19
IO18
IO5
NC
NC
IO4
IO0
IO2
IO15
SD1
SD0
CLK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
GND
VDD33
EN
SENSOR_VP
SENSOR_VN
IO34
IO35
IO32
IO33
IO25
IO26
IO27
IO14
IO12
GND
IO13
SD2
SD3
CMD
39 GND
Figure 1: Pin Layout of ESP32WROVERB (Top View)
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2 Pin Definitions
2.2 Pin Description
ESP32-WROVER-B has 38 pins. See pin definitions in Table 3.
Table 3: Pin Definitions
Name No. Type Function
GND 1 P Ground
3V3 2 P Power supply
EN 3 I Module-enable signal. Active high.
SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0
SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3
IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4
IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5
IO32 8 I/O GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4,
TOUCH9, RTC_GPIO9
IO33 9 I/O GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output),
ADC1_CH5, TOUCH8, RTC_GPIO8
IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0
IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1
IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV
IO14 13 I/O GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK,
HS2_CLK, SD_CLK, EMAC_TXD2
IO12 14 I/O GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ,
HS2_DATA2, SD_DATA2, EMAC_TXD3
GND 15 P Ground
IO13 16 I/O GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID,
HS2_DATA3, SD_DATA3, EMAC_RX_ER
SHD/SD2 * 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD
SWP/SD3 * 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD
SCS/CMD * 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS
SCK/CLK * 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS
SDO/SD0 * 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS
SDI/SD1 * 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS
IO15 23 I/O GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13,
HS2_CMD, SD_CMD, EMAC_RXD3
IO2 24 I/O GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0,
SD_DATA0
IO0 25 I/O GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1,
EMAC_TX_CLK
IO4 26 I/O GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1,
SD_DATA1, EMAC_TX_ER
NC1 27 - -
NC2 28 - -
IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK
IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7
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2 Pin Definitions
Name No. Type Function
IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0
NC 32 - -
IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN
RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2
TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2
IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1
IO23 37 I/O GPIO23, VSPID, HS1_STROBE
GND 38 P Ground
Notice:
* Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected
to the SPI flash integrated on the module and are not recommended for other uses.
2.3 Strapping Pins
ESP32 has five strapping pins, which can be seen in Chapter 6Schematics:
• MTDI
• GPIO0
• GPIO2
• MTDO
• GPIO5
Software can read the values of these five bits from register ”GPIO_STRAPPING”.
During the chip’s system reset release (power-on-reset, RTC watchdog reset and brownout reset), the latches of
the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is
powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of
VDD_SDIO and other initial system settings.
Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a
strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak
pull-up/pull-down will determine the default input level of the strapping pins.
To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host
MCU’s GPIOs to control the voltage level of these pins when powering on ESP32.
After reset release, the strapping pins work as normal-function pins.
Refer to Table 4for a detailed boot-mode configuration by strapping pins.
Table 4: Strapping Pins
Voltage of Internal LDO (VDD_SDIO)
Pin Default 3.3 V 1.8 V
MTDI Pull-down 0 1
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2 Pin Definitions
Booting Mode
Pin Default SPI Boot Download Boot
GPIO0 Pull-up 1 0
GPIO2 Pull-down Don’t-care 0
Enabling/Disabling Debugging Log Print over U0TXD During Booting
Pin Default U0TXD Active U0TXD Silent
MTDO Pull-up 1 0
Timing of SDIO Slave
Pin Default
FE Sampling
FE Output
FE Sampling
RE Output
RE Sampling
FE Output
RE Sampling
RE Output
MTDO Pull-up 0 0 1 1
GPIO5 Pull-up 0 1 0 1
Note:
• Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing
of SDIO Slave” after booting.
• Internal pull-up resistor (R9) for MTDI is not populated in the module, as the flash and SRAM in ESP32-WROVER-B
only support a power voltage of 3.3 V (output by VDD_SDIO).
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3 Functional Description
3 Functional Description
This chapter describes the modules and functions integrated in ESP32-WROVER-B.
3.1 CPU and Internal Memory
ESP32-D0WD contains two low-power Xtensa®32-bit LX6 microprocessors. The internal memory
includes:
• 448 KB of ROM for booting and core functions.
• 520 KB of on-chip SRAM for data and instructions.
• 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed
by the main CPU during RTC Boot from the Deep-sleep mode.
• 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor
during the Deep-sleep mode.
• 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining
768 bits are reserved for customer applications, including flash-encryption and chip-ID.
3.2 External Flash and SRAM
ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the
ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to
protect developers’ programs and data in flash.
ESP32 can access the external QSPI flash and SRAM through high-speed caches.
• The external flash can be mapped into CPU instruction memory space and read-only memory space
simultaneously.
–When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be
mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be
reduced due to speculative reads by the CPU.
–When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a
time. 8-bit, 16-bit and 32-bit reads are supported.
• External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time.
8-bit, 16-bit and 32-bit reads and writes are supported.
ESP32-WROVER-B integrates a 4 MB SPI flash and an 8 MB PSRAM for more memory space.
3.3 Crystal Oscillators
The module uses a 40-MHz crystal oscillator.
3.4 RTC and LowPower Management
With the use of advanced power-management technologies, ESP32 can switch between different power
modes.
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3 Functional Description
For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and
Low-Power Management” in ESP32 Datasheet.
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4 Peripherals and Sensors
4 Peripherals and Sensors
Please refer to Section Peripherals and Sensors in ESP32 Datasheet.
Note:
External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are connected
to the module’s integrated SPI flash and PSRAM. GPIOs 16 and 17 are connected to the module’s integrated PSRAM.
For details, please see Section 6Schematics.
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5 Electrical Characteristics
5 Electrical Characteristics
5.1 Absolute Maximum Ratings
Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the
device. These are stress ratings only, and do not refer to the functional operation of the device that should follow
the recommended operating conditions.
Table 5: Absolute Maximum Ratings
Symbol Parameter Min Max Unit
VDD33 Power supply voltage –0.3 3.6 V
Ioutput
1Cumulative IO output current - 1,100 mA
Tstore Storage temperature –40 150 °C
1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains
(VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash
and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
2. Please see Appendix IO_MUX in ESP32 Datasheet for IO’s power domain.
5.2 Recommended Operating Conditions
Table 6: Recommended Operating Conditions
Symbol Parameter Min Typical Max Unit
VDD33 Power supply voltage 3.0 3.3 3.6 V
IV DD Current delivered by external power supply 0.5 - - A
T Operating temperature –40 - 85 °C
5.3 DC Characteristics (3.3 V, 25 °C)
Table 7: DC Characteristics (3.3 V, 25 °C)
Symbol Parameter Min Typ Max Unit
CIN Pin capacitance - 2 - pF
VIH High-level input voltage 0.75×VDD1- VDD1+0.3 V
VIL Low-level input voltage –0.3 - 0.25×VDD1V
IIH High-level input current - - 50 nA
IIL Low-level input current - - 50 nA
VOH High-level output voltage 0.8×VDD1- - V
VOL Low-level output voltage - - 0.1×VDD1V
IOH
High-level source current VDD3P3_CPU power domain 1,2- 40 - mA
(VDD1= 3.3 V, VOH >= 2.64 V, VDD3P3_RTC power domain 1,2- 40 - mA
output drive strength set to the
maximum) VDD_SDIO power domain 1,3- 20 - mA
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5 Electrical Characteristics
Symbol Parameter Min Typ Max Unit
IOL
Low-level sink current
(VDD1= 3.3 V, VOL = 0.495 V,
output drive strength set to the maximum)
- 28 - mA
RP U Resistance of internal pull-up resistor - 45 - kΩ
RP D Resistance of internal pull-down resistor - 45 - kΩ
VIL_nRST Low-level input voltage of CHIP_PU to power off the chip - - 0.6 V
Notes:
1. Please see Appendix IO_MUX in ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power
domain of pins.
2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced
from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases.
3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test.
5.4 WiFi Radio
Table 8: WiFi Radio Characteristics
Parameter Condition Min Typical Max Unit
Operating frequency range note1- 2412 - 2484 MHz
Output impedance note2- - * - Ω
TX power note311n, MCS7 12 13 14 dBm
11b mode 17.5 18.5 20 dBm
Sensitivity 11b, 1 Mbps - –98 - dBm
11b, 11 Mbps - –89 - dBm
11g, 6 Mbps - –92 - dBm
11g, 54 Mbps - –74 - dBm
11n, HT20, MCS0 - –91 - dBm
11n, HT20, MCS7 - –71 - dBm
11n, HT40, MCS0 - –89 - dBm
11n, HT40, MCS7 - –69 - dBm
Adjacent channel rejection 11g, 6 Mbps - 31 - dB
11g, 54 Mbps - 14 - dB
11n, HT20, MCS0 - 31 - dB
11n, HT20, MCS7 - 13 - dB
1. Device should operate in the frequency range allocated by regional regulatory authorities. Target operating frequency
range is configurable by software.
2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas,
users do not need to concern about the output impedance.
3. Target TX power is configurable based on device or certification requirements.
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5 Electrical Characteristics
5.5 BLE Radio
5.5.1 Receiver
Table 9: Receiver Characteristics – BLE
Parameter Conditions Min Typ Max Unit
Sensitivity @30.8% PER - - –97 - dBm
Maximum received signal @30.8% PER - 0 - - dBm
Co-channel C/I - - +10 - dB
Adjacent channel selectivity C/I
F = F0 + 1 MHz - –5 - dB
F = F0 – 1 MHz - –5 - dB
F = F0 + 2 MHz - –25 - dB
F = F0 – 2 MHz - –35 - dB
F = F0 + 3 MHz - –25 - dB
F = F0 – 3 MHz - –45 - dB
Out-of-band blocking performance
30 MHz ~2000 MHz –10 - - dBm
2000 MHz ~2400 MHz –27 - - dBm
2500 MHz ~3000 MHz –27 - - dBm
3000 MHz ~12.5 GHz –10 - - dBm
Intermodulation - –36 - - dBm
5.5.2 Transmitter
Table 10: Transmitter Characteristics – BLE
Parameter Conditions Min Typ Max Unit
RF transmit power - - 0 - dBm
Gain control step - - 3 - dBm
RF power control range - –12 - +9 dBm
Adjacent channel transmit power
F = F0 ± 2 MHz - –52 - dBm
F = F0 ± 3 MHz - –58 - dBm
F = F0 ± > 3 MHz - –60 - dBm
∆f1avg - - - 265 kHz
∆f2max - 247 - - kHz
∆f2avg/∆f1avg - - –0.92 - -
ICFT - - –10 - kHz
Drift rate - - 0.7 - kHz/50 µs
Drift - - 2 - kHz
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5 Electrical Characteristics
5.6 Reflow Profile
50 150
0
25
1 ~ 3 ℃/s
0
200
250
200
–1 ~ –5 ℃/s
Cooling zone
100
217
50
100 250
Reflow zone
217 ℃ 60 ~ 90 s
Temperature (℃)
Preheating zone
150 ~ 200 ℃ 60 ~ 120 s
Ramp-up zone
Peak Temp.
235 ~ 250 ℃
Soldering time
> 30 s
Time (sec.)
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 2: Reflow Profile
Note:
Solder the module in a single reflow.
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7%:1
7 Peripheral Schematics
7 Peripheral Schematics
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
MTMS
MTDI
MTCK
MTDO
GND
EN
SENSOR_VP
GPI36
SENSOR_VN
GPI39
GPI34
GPI35
GPIO32
GPIO33
GPIO25
GPIO26
GPIO27
GPIO14
GPIO13
GND
GPIO22
TXD0
RXD0
GPIO21
GPIO19
GPIO18
GPIO4
GPIO0
GPIO5
GPIO23
GPIO15
GPIO2
GND
GPIO12
SD2
SD3
CMD SCK
SDO
SDI
EN
GPIO14
GPIO12
GPIO13
GPIO15
GND
VDD33
GND
VDD33
GND
GND
GND
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SW1
R1
TBD
R2 0R(5%)
JP2
Boot Option
11
22
C2
0.1uF/50V(10%)
JP3
JTAG
11
22
33
44
JP1
UART
1
1
2
2
3
3
4
4
U1
ESP32-WROVER-B
GND1
1
3V3
2
EN
3
SENSOR_VP
4
SENSOR_VN
5
IO34
6
IO35
7
IO32
8
IO33
9
IO25
10
IO26
11
IO27
12
IO14
13
IO12
14
GND2
15
IO13
16
SD2
17
SD3
18
CMD
19 CLK 20
SD0 21
SD1 22
IO15 23
IO2 24
IO0 25
IO4 26
NC1 27
NC2 28
IO5 29
IO18 30
IO19 31
NC 32
IO21 33
RXD0 34
TXD0 35
IO22 36
IO23 37
GND3 38
P_GND 39
C3
TBD
C4 0.1uF/50V(10%)
C1
22uF/25V(10%)
Figure 4: Peripheral Schematics of ESP32WROVERB
Note:
• Soldering Pad 39 to the Ground of the base board is not necessary for a satisfactory thermal performance. If users
do want to solder it, they need to ensure that the correct quantity of soldering paste is applied.
• To ensure the power supply to the ESP32 chip during power-up, it is advised to add an RC delay circuit at the EN pin.
The recommended setting for the RC delay circuit is usually R = 10 kΩand C = 1 µF. However, specific parameters
should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing
of the chip. For ESP32’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in
ESP32 Datasheet.
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ESP32-WROVER-B Datasheet v1.6
Ow mwa
9 Recommended PCB Land Pattern
9 Recommended PCB Land Pattern
Unit: mm
Copper
Via for thermal pad
Antenna Area
1
19 20
38
38x1.50
38x0.90
18.00
31.40
1.27
1.10
6.22
0.50
22.86
3.70
0.90
0.50
3.70
0.90
0.50
16.16
7.50
Figure 6: Recommended PCB Land Pattern of ESP32WROVERB
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ESP32-WROVER-B Datasheet v1.6
125:0‘15 ”é? UTESiUTIU L U35t015 933001005 SECTIDN AiA (310) [1851010 300:0‘15 O SHELL T COPPER ALLOY/Au PLATED OVER Ni (2) CONTACT T COPPER ALLOY/Au PLATED OVER Ni (D HOUSTNG t HTGHT TEMP. PLASTTC UL94er/WHTTE TTE PART NAMEQ'TY MATERTAL/ETNTSH
10 U.FL Connector Dimensions
10 U.FL Connector Dimensions
Unit: mm
Figure 7: U.FL Connector Dimensions
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ESP32-WROVER-B Datasheet v1.6
11 Learning Resourc .1 Must-Read Docum following link prowdes document ESPSZ Datasheet This document provides an intr pin definitions, functional descr ESPSZ ECO V3 User Guide This document desc bes differ E00 and Workaroun oi Bug This document deta ardwa ESP/DP Programmi uide lt hosts extensive d entat ESPSZ Technica/ R e M The manual orovid ed ESP32 Hardware 5 The Zip files inolu boards. ESPSZ Hard/ware The guidelines 0 based on the E boards. ESPSZ A T mm This documen several com in Espressi/ Pro 2 Must are the ESP ESPSZ BB his is an owled P32 P32 biis le 2
11 Learning Resources
11 Learning Resources
11.1 MustRead Documents
The following link provides documents related to ESP32.
•ESP32 Datasheet
This document provides an introduction to the specifications of the ESP32 hardware, including overview,
pin definitions, functional description, peripheral interface, electrical characteristics, etc.
•ESP32 ECO V3 User Guide
This document describes differences between V3 and previous ESP32 silicon wafer revisions.
•ECO and Workarounds for Bugs in ESP32
This document details hardware errata and workarounds in the ESP32.
•ESP-IDF Programming Guide
It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference.
•ESP32 Technical Reference Manual
The manual provides detailed information on how to use the ESP32 memory and peripherals.
•ESP32 Hardware Resources
The zip files include the schematics, PCB layout, Gerber and BOM list of ESP32 modules and development
boards.
•ESP32 Hardware Design Guidelines
The guidelines outline recommended design practices when developing standalone or add-on systems
based on the ESP32 series of products, including the ESP32 chip, the ESP32 modules and development
boards.
•ESP32 AT Instruction Set and Examples
This document introduces the ESP32 AT commands, explains how to use them, and provides examples of
several common AT commands.
•Espressif Products Ordering Information
11.2 MustHave Resources
Here are the ESP32-related must-have resources.
•ESP32 BBS
This is an Engineer-to-Engineer (E2E) Community for ESP32 where you can post questions, share
knowledge, explore ideas, and help solve problems with fellow engineers.
•ESP32 GitHub
ESP32 development projects are freely distributed under Espressif’s MIT license on GitHub. It is
established to help developers get started with ESP32 and foster innovation and the growth of general
knowledge about the hardware and software surrounding ESP32 devices.
•ESP32 Tools
This is a webpage where users can download ESP32 Flash Download Tools and the zip file ”ESP32
Certification and Test”.
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11 Learning Resources
•ESP-IDF
This webpage links users to the official IoT development framework for ESP32.
•ESP32 Resources
This webpage provides the links to all available ESP32 documents, SDK and tools.
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ESP32-WROVER-B Datasheet v1.6
Revision History
Revision History
Date Version Release notes
2021-02-09 V1.6
Updated Figure 5:Physical Dimensions of ESP32-WROVER-B (PCB/IPEX) and Figure 6:
Recommended PCB Land Pattern of ESP32-WROVER-B
Deleted Reset Circuit and Discharge Circuit for VDD33 Rail in Section 7:Peripheral
Schematics
Modified the note below Figure 2:Reflow Profile.
Updated the trade mark from TWAI™ to TWAI®.
2020-11-27 V1.5 Added TWAITM in Table 2;
Updated the C value in RC circuit from 0.1 µF to 1 µF.
2020-03-13 V1.4
• Changed the module’s operating temperature range from –40°C ~65°C to –40°C
~85°C
• Added documentation feedback link
2019.09 V1.3
• Changed the supply voltage range from 2.7 V ~3.6 V to 3.0 V ~3.6 V;
• Added Moisture sensitivity level (MSL) 3 in Table 2ESP32-WROVER-B Specifica-
tions;
• Added notes about ”Operating frequency range” and ”TX power” under Table 8
Wi-Fi Radio Characteristics;
• Updated Section 7Peripheral Schematics and added a note about RC delay circuit
under it;
• Updated Figure 9Recommended PCB Land Pattern.
2019.01 V1.2 Changed the RF power control range in Table 10 from –12 ~+12 to –12 ~+9 dBm.
2018.10 V1.1
Added notes on module custom options to Table 1;
Added ”Cumulative IO output current” entry to Table 5: Absolute Maximum Ratings;
Added more parameters to Table 7: DC Characteristics.
2018.07 V1.0
Official release:
• Added certifications and reliability test items the module has passed in Table 2:
ESP32-WROVER-B Specifications;
• Updated the dimensions of the module;
• Changed the module’s recommended operating temperature from –40°C ~85°C
to –40°C ~65°C;
• Updated table 8: Wi-Fi Radio.
2018.06 V0.1 Preliminary release.
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