Datasheet

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High Voltage Ceramic Capacitors
Radial-Leaded Singlelayer Disc
LINKS TO ADDITIONAL RESOURCES
RATED VOLTAGE
Urated, AC = Urated, DC/2.8 at 50 Hz / 60 Hz
Urated, DC: 10 000 V Urated, AC: 3500 V
Urated, DC: 15 000 V Urated, AC: 5300 V
Urated, DC: 20 000 V Urated, AC: 7000 V
INSULATION RESISTANCE
Min. 200 000 MΩ at 500 VDC / 60 s max.
TOLERANCE ON CAPACITANCE
± 20 %
DISSIPATION FACTOR
Max. 1.5 %
OPERATING TEMPERATURE RANGE
-30 °C to +105 °C
FEATURES
Ceramic singlelayer DC disc / AC disc capacitor
High reliability
High capacitance values up to 2 nF
Small sizes
Low losses
Radial leads
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
OPTIONS (on request)
± 10 % tolerance on nominal C-value
Customized lead styles
APPLICATIONS
High voltage power supplies for x-ray sources and pulsed
lasers
Baggage scanner
Medical x-ray
Industrial laser
Airpurifier / ionizer
DESIGN
The capacitors consist of a ceramic disc of which both sides
are silver-plated. Connection leads are made of tinned
copper clad steel wire having diameters of 0.026" (0.65 mm)
and 0.032" (0.80 mm).
The capacitors may be supplied with straight leads having
lead spacing of 0.37" (9.5 mm) and 0.49" (12.5 mm).
Coating is made of flame retardant epoxy resin in
accordance with “UL 94 V-0”.
CAPACITANCE RANGE
100 pF to 2000 pF
DIELECTRIC STRENGTH BETWEEN LEADS
1.5 x Urated, DC for maximum 60 s
Test voltage: customer re-test 1.35 x Urated, DC for maximum
60 s
Notes
Considered as destructive test in insulation liquid
Avoid flashover between wires and currents higher than 50 mA
CERAMIC DIELECTRIC
Y6P (± 10 % within -30 °C to +105 °C)
QUICK REFERENCE DATA
DESCRIPTION VALUE
Ceramic class 2
Ceramic dielectric Y6P
Temperature coefficient of
capacitance ± 10 % within -30 °C to +105 °C
Voltage (Urated, DC) 10 000 15 000 20 000
Min. capacitance (pF) 100 100 100
Max. capacitance (pF) 2000 2000 1000
Capacitance tolerance ± 20 %
Max. dissipation factor (%) 1.5
Min. insulation resistance (GΩ) 200
Operating temperature (°C) -30 to +105
Mounting Radial
3
3
3
D
D
D
3
D
3D Models
Related
Documents
Why It
Matters
Capabilities and
Custom Options
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Infographics
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Note
± 10 % tolerance is available upon request
DIMENSIONS in millimeters (inches)
ORDERING INFORMATION, CERAMIC 10 kVDC
C
(pF)
TOL.
(%)
MAXIMUM
DIAMETER
MAXIMUM
THICKNESS
LEAD SPACE
± 1 mm
(± 0.04")
WIRE SIZE
± 0.05 mm
(± 0.002")
LEAD LENGTH
± 5 mm
(± 0.2")
WIDTH
± 0.5 mm
(± 0.02") ORDERING CODE
mm INCH mm INCH mm INCH mm INCH mm INCH mm INCH
100
± 20
8 0.31 9 0.355
12.5
and
9.5
0.49
and
0.37
0.80
and
0.65
0.032
and
0.026
30 1.18
5.3 0.21 HVCC103Y6P101####
150 8 0.31 80.31 4.5 0.18 HVCC103Y6P151####
220 9 0.35 4.5 0.18 HVCC103Y6P221####
330 10 0.39
7.5 0.30
4.3 0.17 HVCC103Y6P331####
470 12 0.47 4.3 0.17 HVCC103Y6P471####
680 13 0.51 3.8 0.15 HVCC103Y6P681####
1000 15 0.59 3.8 0.15 HVCC103Y6P102####
1500 17 0.67 3.8 0.15 HVCC103Y6P152####
2000 19 0.75 3.8 0.15 HVCC103Y6P202####
ORDERING INFORMATION, CERAMIC 15 kVDC
C
(pF)
TOL.
(%)
MAXIMUM
DIAMETER
MAXIMUM
THICKNESS
LEAD SPACE
± 1 mm
(± 0.04")
WIRE SIZE
± 0.05 mm
(± 0.002")
LEAD LENGTH
± 5 mm
(± 0.2")
WIDTH
± 0.5 mm
(± 0.02") ORDERING CODE
MM INCH mm INCH mm INCH mm INCH mm INCH mm INCH
100
± 20
8 0.31 9 0.355
12.5
and
9.5
0.49
and
0.37
0.80
and
0.65
0.032
and
0.026
30 1.18
5.3 0.21 HVCC153Y6P101####
150 8 0.31
80.31
4.5 0.18 HVCC153Y6P151####
220 9 0.35 4.5 0.18 HVCC153Y6P221####
330 10 0.39 4.3 0.17 HVCC153Y6P331####
470 12 0.47 4.3 0.17 HVCC153Y6P471####
680 13 0.51 4.3 0.17 HVCC153Y6P681####
1000 15 0.59 4.3 0.17 HVCC153Y6P102####
1500 19 0.75 4.3 0.17 HVCC153Y6P152####
2000 19 0.75 4.3 0.17 HVCC153Y6P202####
ORDERING INFORMATION, CERAMIC 20 kVDC
C
(pF)
TOL.
(%)
MAXIMUM
DIAMETER
MAXIMUM
THICKNESS
LEAD SPACE
± 1 mm
(± 0.04")
WIRE SIZE
± 0.05 mm
(± 0.002")
LEAD LENGTH
± 5 mm
(± 0.2")
WIDTH
± 0.5 mm
(± 0.02") ORDERING CODE
mm INCH mm INCH mm INCH mm INCH mm INCH mm INCH
100
± 20
8 0.31 9 0.355
12.5
and
9.5
0.49
and
0.37
0.8
and
0.65
0.032
and
0.026
30 1.18
5.3 0.21 HVCC203Y6P101####
150 8 0.31
8.5 0.33
4.5 0.18 HVCC203Y6P151####
220 9 0.35 5.0 0.2 HVCC203Y6P221####
330 12 0.47 5.1 0.2 HVCC203Y6P331####
470 13 0.51 5.1 0.2 HVCC203Y6P471####
680 15 0.59 5.1 0.2 HVCC203Y6P681####
1000 17 0.67 5.1 0.2 HVCC203Y6P102####
Wire size
Lead
space
Thickness
Width
4.0 (0.15)
Lead length
Diameter
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LEAD TYPE (position 6)
Notes
•1
th digit: lead type / lead spacing / gauge
2nd digit: A = long leads
LL = long leads
TCCSW = tinned copper clad steel wire
MARKING
SAMPLE < 470 pF SAMPLE < 330 pF SAMPLE
470 pF
SAMPLE
330 pF
10 kV 15 kV 20 kV 10 kV / 15 kV 20 kV
ORDERING CODE
HVCC153Y6P102MEAX
1 234567
1234567
SERIES
(HIGH VOLTAGE
CERAMIC CAPACITOR)
RATED VOLTAGE TEMPERATURE
CHARACTERISTICS
CAPACITANCE
VALUE
CAPACITANCE
TOLERANCE
1st DIGIT:
LEAD TYPE /
LEAD SPACING /
GAUGE
2nd DIGIT:
LEAD LENGTH
PACKAGING
STANDARD TYPE
CODE LEAD TYPE LEAD SPACING
(mm)
LEAD DIAMETER
(mm) # GAUGE MATERIAL LEAD LENGTH
(mm)
CA Straight LL 9.5 ± 1.0 0.65 22 TCCSW 30 ± 5
EA Straight LL 12.5 ± 1.0 0.80 20 TCCSW 30 ± 5
PACKAGING (position 7)
CODE VERSION
XBulk
YY - Year
WW - Week
101M
YYWW
YY - Year
WW - Week
101M
YYWW
YY - Year
WW - Wee
k
101M
YYWW
YY - Year
WW - Wee
102M
15kV
Y6P / YY WW
HVCC
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PERFORMANCE
NO. PARAMETER SPECIFICATION
TEST CONDITIONS METHOD AND NOTES
1 Capacitance Tol. K = ± 10 % at 1000 h
Tol. M = ± 20 % at 1000 h
Components are measured with a LCR-meter. Consider aging
of ceramic. Given tolerance is valid 1000 h ± 24 h after last
heating. Before and after that moment, aging offset has to be
considered.
(See general information for further instructions)
2 Dissipation factor DF / tan δ = max. 1.5 %
3 Insulation resistance
IR = min. 200 GΩ in 60 s
t = 5 s
U = 500 VDC ± 10 VDC
NOTE: very high resistances are sensitive to the surrounding
area (may lead to unstable measurement values)
4Dielectric strength
(between lead wires)
U1 = +1.35 x URDC/URAC max. 60 s
U2 = -1.35 x URDC/URAC max. 60 s
tU1 = tU2 = 60 s
Imax. = 50 mA
1. Apply +1.35 x URDC/URAC for max. 60 s
2. Unload part (Imax. = 50 mA)
3. Apply -1.35 x URDC for max. 60 s
4. Unload part (Imax. = 50 mA)
5. Avoid current spikes higher than 50 mA
5 Appearance and marking No visible damage.
The marking shall be legible Visual inspection
6 Dimensions Dimensions are within specification Measurement by caliper gauge
7.1 Temperature characteristics /
TCC
EIA code = Y6P
ΔC/C0 = ± 10 %
Temp. range = -30 °C to 105 °C
Measurement is done from cooler temperatures to hotter
temperatures in reasonable temperature steps. For
decreasing temperature run deaging effects must be
considered.
7.2 Temperature characteristics /
TCDF
DF / tan δ = max. 1.5 %
Temp. range = 20 °C to 105 °C
8Dielectric strength of
body insulation
U = 5000 VDC
t = 60 s
1. Connect both lead wires together
2. Dip component headfirst into a bath with oil and
metal balls (fig.)
3. Apply voltage between lead wires and metal balls
9Pulse test
tr = 1.2 μs
tf = 50 μs
U = 1.25 x URDC
n = 50 x single polarity
10 Life test
U = 1.25 x URDC
t = min. 1000 h
T = max. 105 °C
Imax. = 50 mA
1. Initial measurement including no. 1, 2, 3, and 4
2. Condition the components to test temperature
3. Carry out life test / avoid 0 Ω short circuit
4. Final measurement including no. 1, 2, 3, and 4
Result: voltage breakdowns are not accepted
11 Steady state test
(without load)
T = 40 °C
RH = 93 %
t = 240 h / 10 days
U = 1.5 x URDC
1. Initial measurement including no. 1, 2, 3, and 4
2. Carry out steady state test
3. Final measurement including no. 1, 2, 3, and 4
Result: voltage breakdowns are not accepted
Metal
foil About 3 mm to 4 mm
Metal balls
U
(V)
30 %
100 %
Rise time:
ts = 1.2 μs ± 30 %
Half value time:
tr = 50 μs ± 20 %
Over swing:
ü < 5 %
50 %
1.2 μs
50 μs
90 %
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TYPICAL TCC Y6P
TYPICAL TCDF Y6P
12 Temperature cycle
TLOW = -40 °C
THIGH = +105 °C
tDWELL = 1800 s
tCHANGE = about 300 s
n = 50 x
1. Initial measurement including no. 1, 2, 3, and 4
2. Carry out temperature cycle
3. Final measurement including no. 1, 2, 3, and 4
Result: voltage breakdowns and cracks in coating are not
accepted
13 Solderability
TSOLDER = max. 250 °C
t = max. 3 s
dist. solder-epoxy = min. 2 mm
1. Initial measurement incl. no. 1, 2, 3, and 4
2. Carry out test
(solder material: no known restrictions)
3. Final measurement incl. 1, 2, 3, and 4
Result: voltage breakdowns are not accepted
14 Strength of lead wire / pulling FPULL = max. 10 N
tPULL = max. 10 s
Fix the body of component, apply a tensile weight gradually to
each lead wire in the radial direction of capacitor up to 20 N,
and keep it for 10 s ± 1 s
15 Strength of lead wire / bending FBEND = max. 5 N
tBEND = 2 s to 3 s
Bending each lead wire to 90° from the lead egress with 2.5 N
force, then back to original position and bent again from the
same direction. Totally 3 bends, 3 s each time.
1 bend: bending to 90° the return to normal position is one
bend. Start from 1.6 mm to 3.2 mm from the part body
PERFORMANCE
NO. PARAMETER SPECIFICATION
TEST CONDITIONS METHOD AND NOTES
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
-40
-30
-20
-10
0
10
20
30
40
-40-30-20-100 102030405060708090100110
Axis Title
Dissipation Factor
2nd line
2nd line
ΔC/C0(%)
Temperature (°C)
10
100
1000
10000
0
0.5
1.0
1.5
2.0
-40-30-20-100 102030405060708090100110
Axis Title
1st line
2nd line
2nd line
Dissipation Factor (%)
Temperature (°C)
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TYPICAL Y6P - ΔC/C0 / % VS. Urated, DC
TYPICAL Y6P - ΔC/C0 / % VS. FREQUENCY
TYPICAL Y6P DF VS. FREQUENCY
10
100
1000
10000
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20
0 102030405060708090100110120
Axis Title
1st line
2nd line
2nd line
ΔC/C0(%)
Rated DC Voltage (%)
10
100
1000
10000
-10
-8
-6
-4
-2
0
1101001000
Axis Title
1st line
2nd line
2nd line
ΔC/C0(%)
Frequency (kHz)
10
100
1000
10000
0
10
20
30
40
50
1101001000
Axis Title
1st line
2nd line
2nd line
Dissipation Factor in 10-3
Frequency (kHz)
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TYPICAL AC CURRENT VS. APPLIED VOLTAGE
1. QUALIFICATION
1.1 BASICS
All components are tested according to the related testing plan, which you find in series datasheet. The test procedures are
more severe than noted in the datasheet due to aging and storage effects of the components. We do not guarantee if any limit
is exceeded. Internal test procedures are more severe than noted in the table “Performance” because of aging and storage
effects of the components.
1.2 LIMITS OF APPLICATION
Please take care whilst designing our parts into one of these applications, which require highest reliability and possible errors
might harm life, body or property of a third party.
- Transportation (aerospace, aircraft, train, ship, submarine, etc.)
- Medical equipment
- Critical control equipment (power plant, traffic signals, disaster prevention)
- Other application requiring similar reliability characteristics
2. STORAGE
2.1 ORIGINAL PACKAGING
Storing in the sealed original packages is preferred.
2.2 STORING CONDITIONS
Epoxy coating does not protect perfectly from all environmental conditions. Some materials can penetrate the epoxy and harm
the performance of the parts. Therefore it is not recommended to use or store the parts in corrosive or humid atmosphere.
Optimal storing conditions should not exceed +10 °C to +35 °C and relative humidity up to 60 %. Drying the components is
recommended before assembly (see section 4.3).
3. ASSEMBLY
3.1 WIRE FORMING
If wire forming is needed, excessive mechanical force to the component body must be avoided as it might cause cracks in the
ceramic element.
Do not crack coating extension of the epoxy layer, when applying force onto the wire.
10
100
1000
10000
0
1
2
3
4
5
6
7
012345678910
Axis Title
1st line
2nd line
2nd line
AC Current (mA)
Applied Voltage (kVRMS)
2000 pF
1000 pF
470 pF
330 pF
150 pF
f = 50 Hz
Tamb = 25 °C
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3.2 SOLDERING
Do not exceed resistance to soldering heat specification of the component. Subjecting this product to excessive heating could
melt the internal junction solder and may result in thermal shocks that can crack the ceramic element.
Manual Soldering / Rework
Set the soldering iron (50 W max.) to less than 400 °C and solder the wires within 4 seconds onto the PCB. Exceeding that
recommendations might reduce the electrical performance of the component.
Wave Soldering
Most common way to assemble these kind of components is carried out in 4 steps:
1. Increasing temperature to 120 °C within about 20 s
2. Preheating at 120 °C for about 60 s
3. Soldering at 260 °C in less than 10 s
4. Gradual air cooling in constant air flow
Reflow Soldering
It is not recommended to use reflow soldering with these components.
3.3 MOLDING AND COATING
Molding and / or applying another coating material might harm the performance of the components. Therefore it is
recommended to test the electrical characteristics of the molded / coated part in advance.
Typical error is a reduced withstand voltage because of an inadequate solvent in the molding material, which penetrates the
epoxy coating (please see recommendations for cleaning and drying in section 4.1 to 4.3). A similar result can be caused by an
inadequate coating material, which might pull the original epoxy off the ceramic element.
4. CLEANING AND DRYING
4.1 CLEANING AGENTS
Cleaning agents might have an influence to the performance of the components after washing and after unsuitable drying. The
following agents have been tested and classified:
Recommended
•DI water
• Isopropanol
•Ethanol
Ehtyl alcohol
• ...
Not Recommended
• Acetone
•...
4.2 ULTRASONIC
Settings for ultrasonic cleaning
Rinse bath capacity: output of 20 Watts per liter or less
Rinsing time: 5 min max.
Do not vibrate the PCB / PWB directly.
Excessive ultrasonic cleaning may lead to permanent destruction of the component.
4.3 DRYING
It is recommended to dry the assembled PCB (washed components) for 1 hour at a temperature of 20 °C higher than the boiling
point of the used cleaning agent, but at least 125 °C. Exceeding 150 °C permanently should be avoided. It is recommended to
properly insulate the assembled PCB (see section 5.2) immediately after drying.
5. TESTING AND OPERATION
5.1 SHORT CIRCUIT
Avoid repetitive zero-ohm-short circuits because they might harm the components core construction, such as arcs between
lead wires because of inadequate insulation material (e.g air).
5.2 INSULATION
During operation, components should be surrounded by adequate insulating material (silicone oil, epoxy or molding material).
Voltage breakdowns or leakage current through this material (between lead wires or to ground) is not acceptable. It is
recommended to properly clean and dry the assembled PCB (see section 4.1 to 4.3) before enclosing in insulating material.
5.3 APPLIED VOLTAGE
When using DC-rated components in AC applications (also ripple) the peak to peak voltage should not exceed the nominal
DC-rating of the component.
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6. CAUTION
6.1 OPERATING VOLTAGE AND FREQUENCY CHARACTERISTIC
When sinusoidal or ripple voltage applied to DC ceramic disc capacitors, be sure to maintain the peak-to-peak value or the peak
value of the sum of both AC + DC within the rated voltage.
When start or stop applying the voltage, resonance may generate irregular voltage.
When rectangular or pulse wave voltage is applied to DC ceramic disc capacitors, the self-heating generated by the capacitor
is higher than the sinusoidal application with the same frequency. The allowable voltage rating for the rectangular or pulse wave
corresponds approximately with the allowable voltage of a sinusoidal wave with the double fundamental frequency.
The allowable voltage varies, depending on the voltage and the waveform.
Diagrams of the limiting values are available for each capacitor series on request.
6.2 OPERATING TEMPERATURE AND SELF-GENERATED HEAT
The surface temperature of the capacitors must not exceed the upper limit of its rated operating temperature.
During operation in a high-frequency circuit or a pulse signal circuit, the capacitor itself generate heat due to dielectric losses.
Applied voltage should be the load such as self-generated heat is within 20 °C on the condition of environmental temperature
25 °C.
Note, that excessive heat may lead to deterioration of the capacitor’s characteristics.
VOLTAGE DC DC + AC AC
Waveform figure
RELATED DOCUMENTS
General Information www.vishay.com/doc?22001
Product Sheet www.vishay.com/doc?48508
Infographic www.vishay.com/doc?48450
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p-p
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