Thermal Management Catalog Datasheet by Parker Chomerics

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ENGINEERING YOUR SUCCESS.

Thermal Interface Materials

For Electronics Cooling

Products & Custom Solutions Catalog

These products can expose you to chemicals including carbon black (airborne and extracts), antimony trioxide, titanium dioxide, silica (crystalline), di(2-ethylhexyl)phthalate, ethylene

thiourea, acrylonitrile, 1,3-butadiene, epichlorohydrin, toluenediisocyanate, tetraﬂuoroethylene, ethylbenzene, formaldehyde, furfuryl alcohol, glass ﬁbers, methyl isobutyl ketone,

nickel (metallic and compounds), lead and lead compounds which are known to the State of California to cause cancer; and 1,3-butadiene, epichlorohydrin, di(2-ethylhexyl)phthalate,

di-isodecyl phthalate, ethylene thiourea, methyl isobutyl ketone, methanol, toluene, lead and lead compounds which are known to the State of Califormia to cause birth defects and

other reproductive harm. For more information go to www.P65Warnings.ca.gov.

WARNING:

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NOTES

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Heat Transfer Fundamentals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

Thermal Gels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Gap Filler Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Phase Change Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Thermal Tapes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

Potting and Underfill Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Dielectric Pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Heat Spreaders . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44

Thermal Greases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49

Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Thermal Management

Products & Custom Solutions

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Introduction

Parker Chomerics is a global provider of

EMI shielding and thermal interface

materials as well as electrically conductive

thermoplastics and optical products.

Parker provides products and services to

OEM and CEM electronics companies in the

telecommunications, information technology,

consumer, power conversion, medical device,

defense and transportation markets.

TIMs for Military and Aerospace

Applications

Introduction

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About Parker Hannifin

Corporation

Parker Hannifin (NYSE:PH) is

the world’s leading diversified

manufacturer of motion and control

technologies and systems, providing

precision-engineered solutions for a

wide variety of mobile, industrial and

aerospace markets. The company’s

products are vital to virtually

everything that moves or requires

control, including the manufacture

and processing of raw materials,

durable goods, infrastructure

development and all forms of

transport. Parker is strategically

diversified, value-driven and well

positioned for global growth as the

industry consolidator and supplier

of choice.

Dispensed Gels in

Automotive Electronic Control Unit

(ECU) Applications

TIMs for Light Emitting

Diode (LED) and

Industrial Applications

Gap Filler Pad

and Dispensed Gels for

Telecommunications

As each new electronic product generation requires higher power in

smaller packages, the challenges associated with thermal management

become more intense. Parker is committed to developing new,

high-performance products to meet the thermal and design challenges

of tomorrow’s systems. Thermal material drivers include:

• Lower thermal impedance

• Higher thermal conductivity

• Greater compliance and conformability

• High reliability

• Greater adhesion

• Ease of handling, application and use

• Long service life

Parker Chomerics’ drive to support our customers is also based on

our continuing commitment to:

• Thermal materials expertise

• Comprehensive applications engineering

• Optimized supply chain and logistics

• Worldwide fabrication and service

The objective of thermal manage in electronic packaging is the effici at from the semiconductor junction to the am nt. ‘>> lllll BASI C TH E0 RV The rate at which heat is co nd surface warp through a material is proportional to ctual Contact 000 the area normal to the heat llow and oints, leavlng air» to the temperature gradient along the A alleys align. Air v heat llow path. For a one dlmensional, steady state heat flow the rate is expressed by Fourier's equation: A heat and force Where: k : themial conductivity W/mrK o : rate of heat llow‘ w A : Contact area, m2 lstance of heat ﬂow‘ m T : temperature dliference, c Thermal oonductlvity, k, ls an intrinsic property of a homoge mlcmmerics

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BASIC THEORY

The rate at which heat is conducted

through a material is proportional to

the area normal to the heat flow and

to the temperature gradient along the

heat flow path. For a one dimensional,

steady state heat flow the rate is

expressed by Fourier’s equation:

Where:

k = thermal conductivity, W/m-K

Q = rate of heat flow, W

A = contact area, m2

d = distance of heat flow, m

T = temperature difference, C

Thermal conductivity, k, is an intrinsic

property of a homogeneous material

which describes the material’s ability

to conduct heat. This property is

independent of material size, shape

or orientation. For non-homogeneous

materials, those having glass mesh

or polymer film reinforcement, the

term “relative thermal conductivity”

is appropriate because the thermal

conductivity of these materials

depends on the relative thickness of

the layers and their orientation with

respect to heat flow.

Another inherent thermal property of

a material is its thermal resistance, R,

as defined in Equation 2.

This property is a measure of how a

material of a specific thickness resists

the flow of heat. The relationship

between k and R is shown by

substituting Equation (2) into (1) and

rearranging to form (3)

Equation 3 shows that for

homogeneous materials, thermal

resistance is directly proportional to

thickness. For non-homogeneous

materials, the resistance generally

increases with thickness but the

relationship may not be exactly linear.

Thermal conductivity and thermal

resistance describe heat transfer within

a material once heat has entered the

material. Because real surfaces are

never truly flat or smooth, the contact

plane between a surface and a material

can also produce a resistance to

the flow of heat. Figure 1a depicts

surface irregularities on a micro scale

and surface warp on a macro scale.

Actual contact occurs at the high

points, leaving air-filled voids where the

valleys align. Air voids resist the flow

of heat and force more of the heat to

flow through the contact points. This

constriction resistance is referred to

as surface contact resistance (Rcontact)

and can be a factor at all contacting

surfaces.

The thermal impedance [

] of a

material is defined as the sum of its

thermal resistance (Rmaterial) and any

contact resistance (Rcontact) between it

and the contacting surfaces as defined

in Equation 4.

Surface flatness, surface roughness,

clamping pressure, material thickness,

the presence of pressure sensitive

adhesive (PSA) and compressive

modulus have a major impact on

contact resistance. Because these

surface conditions can vary from

application to application, thermal

impedance of a material will also be

application dependent.

The objective of thermal management programs in

electronic packaging is the efficient removal of heat from the

semiconductor junction to the ambient environment.

This process can be separated into three major phases:

1. heat transfer within the semiconductor component package;

2. heat transfer from the package to a heat dissipater

(the initial heat sink);

3. heat transfer from the heat dissipater to the ambient

environment (the ultimate heat sink)

The first phase is generally beyond the control of the system

level thermal engineer because the package type defines the

internal heat transfer processes. In the second and third phases,

the packaging engineer’s goal is to design an efficient thermal

connection from the package surface to the initial heat spreader

and on to the ambient environment. Achieving this goal requires

a thorough understanding of heat transfer fundamentals as well

as knowledge of available interface materials and how their key

physical properties affect the heat transfer process.

Heat Transfer Fundamentals

Figure 1a. Schematic representation of two surfaces in contact and

heat flow across the interface without (left) and with thermal interface

material applied.

Air

Thermal Interface MaterialThermal Interface MaterialAir

Thermal Interface MaterialThermal Interface Material

Equation 1

k A

∆ T

Equation 2

= A∆ T

Equation 3

= d

Equation 4

material +

contact

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Heat generated by a semiconductor

must be removed to the ambient

environment to maintain the junction

temperature of the component within

safe operating limits. Often this heat

removal process involves conduction

from a package surface to a heat

spreader that can more efficiently

transfer the heat to the ambient

environment. The spreader has to

be carefully joined to the package to

minimize the thermal resistance of

this newly formed thermal joint.

Attaching a heat spreader to a

semiconductor package surface

requires that two commercial grade

surfaces be brought into intimate

contact. These surfaces are usually

characterized by a microscopic

surface roughness superimposed

on a macroscopic non-planarity that

can give the surfaces a concave,

convex or twisted shape. When two

such surfaces are joined, contact

occurs only at the high points. The

low points form air-filled voids.

Typical contact area can consist

of more than 90 percent air voids,

which represents a significant

resistance to heat flow.

THERMAL INTERFACE MATERIALS (TIMs)

THERMAL PROPERTIES

The key properties of interface

materials are thermal impedance

and thermal conductivity.

THERMAL IMPEDANCE

This is the measure of the total

resistance to the flow of heat from

a hot surface through an interface

material into a cold surface. Thermal

impedance is measured according

to the ASTM D5470 test method.

Although the current version of this

method is specific to high durometer

insulating pad materials tested at

high clamping forces, the method

has been successfully adapted for

use with low durometer materials

as well as fluid compounds.

Thermal impedance can be

measured using ASTM D5470 at

several clamping forces to generate a

pressure versus thermal impedance

plot as shown in Figure 2. This type

of data can be used to generate

information about the ability of a

material to conform to surfaces to

minimize contact resistance. Care must

be taken with this type of data because

contact resistance is also highly

influenced by surface characteristics.

To minimize the impact of test

equipment variations, this type of work

is best performed with the same test

surfaces for all materials being tested.

THERMAL CONDUCTIVITY

Thermal impedance data measured

according to ASTM D5470 can be used

to calculate the thermal conductivity

of an interface material. Rearranging

Equation (3) to give Equation (5)

and substituting into Equation (4) yields

Equation (6).

Equation (6) shows that for a homo-

geneous material, a plot of thermal

impedance [Θ] versus thickness (d) is

a straight line whose slope is equal to

the inverse of the thermal conductivity

and the intercept at zero thickness

is the contact resistance shown in

Figure 2. Thickness can be varied by

either stacking up different layers of the

material or by preparing the material

at different thicknesses.

COEFFICIENT OF THERMAL

EXPANSION

CTE is the tendency of a material

to change in volume in response to

changes in temperature.

HEAT CAPACITY

Heat capacity or thermal mass

represents the ability of a material

to store heat.

Figure 2. Thermal Impedance vs. Thickness

Slope = 1/k

contact

KEY PROPERTIES OF THERMAL INTERFACE MATERIALS

Thermally conductive materials are

used to eliminate these interstitial

air gaps from the interface by

conforming to the rough and

uneven mating surfaces. Because

the TIM has a greater thermal

conductivity than the air it replaces,

the resistance across the joint

decreases, and the component

junction temperature will be

reduced. A variety of material types

have been developed in response to

the changing needs of the electronic

packaging market.

Equation 5

material =

Equation 6

= +

contact

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Thermal Conductivity Conversion Guide

ELECTRICAL PROPERTIES

VOLTAGE BREAKDOWN

This is a measure of how much

voltage differential a material can

withstand under a specific set of test

conditions. This property is usually

measured using ASTM D149 where a

test specimen is subjected to ramped

alternating current voltage such that

dielectric failure is reached within 20

seconds after the start of the test. Five

specimens are tested and the average

voltage breakdown is calculated and

reported. The value is an average, not

a minimum. Voltage Breakdown can

be converted to Dielectric Strength by

dividing the voltage breakdown value

by the specimen thickness where

the dielectric failure occurred. This

test is an indication of the ability of a

material to withstand high voltages,

but does not guarantee how a

material will behave over time in a real

application. The value is influenced by

several factors. Humidity and elevated

temperature will reduce the voltage

breakdown because absorbed water

will degrade the electrical properties of

the material.

The size of the test electrode will affect

the observed breakdown voltage.

A larger test electrode will typically

yield a lower breakdown voltage. The

presence of partial discharge, as well

as mechanical stresses imposed on

the interface material, also reduce

voltage breakdown.

VOLUME RESISTIVITY

Volume resistivity is a measure of the

bulk electrical resistance of a unit

cube of a material. When determined

per ASTM D257, volume resistivity

can give an indication of how well an

interface material can limit leakage

current between an active component

and its grounded metal heat sink.

As with voltage breakdown, volume

resistivity can be significantly lowered

by humidity and elevated temperature.

ELASTOMERIC PROPERTIES

Interface materials exhibit properties

typical of highly filled elastomers,

namely compression deflection,

compression set and stress relaxation.

COMPRESSION DEFLECTION

Compression deflection refers to

resultant forces a material exerts while

being deflected. As a compressive

load is applied, the elastomer material

is deformed but the volume of the

material remains constant. The

compression deflection characteristics

can vary, depending on part geometry

(i.e., thickness and surface area), rate

of deflection, size of probe, etc.

STRESS RELAXATION

When a compressive load is applied to

an interface material, there is an initial

deflection followed by a slow relaxation

process whereby some of the load is

relieved. This process continues until

the compressive load is balanced by

the cohesive strength of the material.

COMPRESSION SET

Compression set is the result of stress

relaxation. After a material has been

subjected to a compressive load for an

extended time, part of the deflection

becomes permanent and will not be

recoverable after the load is reduced.

From Cal

sec-cm-˚C

BTU-in

hr-ft2-˚F

m-k

Multiplier 4.2 x 1022.9 x 1030.14 3.4 x 10-4 6.94 2.4 x 10-3

To W

m-k

BTU-in

hr-ft2-˚F

m-k

Cal

sec-cm-˚C

BTU-in

hr-ft2-˚F

Cal

sec-cm-˚C

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Gap Fillers come in two different types, gels and pads. Gels are low-closure-force,

electrically isolating, fully cured materials that are dispensed into place. Gap filler pads are low-

closure-force thermal pads designed to accommodate a wide gap range and electrical isolation.

Phase Change Materials are thin pads that are placed between a heatsink and

the IC chip that then change phase into a liquid at higher temperatures to achieve a thin bond line

for better thermal performance. Poly solder hybrid (PSH) materials consist of both binder and

fillers which both change phase.

Thermal Tapes have adhesive on both sides to hold a heat sink in contact with

an IC component.

Potting and Underfill Materials are one- or two-component materials that are

dispensed and then cured in place afterwards (unlike thermal gap filler gels, which are already

cured when dispensed).

Dielectric Pads are higher-closure-force pads specifically designed to be electrically

isolating, also known as a dielectric, as well as being thermally conductive. Dielectric pads are

typically used on power transistors that have an electrically energized base that will short out if

made to directly contact a metal heat sink.

Heat Spreaders utilize two different vehicles of thermal transfer: conduction to pull heat

off an integrated circuit, and convection to use air flow over the product to remove that heat from

the assembly.

Thermal Greases are silicone-based pastes with a thermally conductive filler material

meant to draw heat away from a heat-generating component on a circuit board while filling very

thin bond lines.

Parker Chomerics

Thermal Interface Material Offerings

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Thermal Management Materials Selector

Gap Fillers Phase Change

Materials

Thermal

Tapes

Thermal Interface

Materials

Potting and

Underfill

Materials

Dielectric

Pads

Heat

Spreaders

Thermal

Greases

Standard

Phase Change

Materials (PSM)

Page 25

THERMFLOW

PC07DM-7

THERMFLOW

T710

THERMFLOW

T725

THERMFLOW

T766/T766-06

THERMATTACH

T418

THERMATTACH

T412

THERMATTACH

T404/T414

THERMATTACH

T405/T405-R

THERMFLOW

T557

THERMFLOW

T558

THERMFLOW

T777

CHO-THERM

T444

CHO-THERM

1674

CHO-THERM

T441

CHO-THERM

T609

CHO-THERM

1678

CHO-THERM

T500

T-WING

TW 10 T650

T660

T670

CHO-THERM

1671

THERM-A-FORM

CIP 35

THERM-A-FORM

1641

THERM-A-FORM

1642

THERM-A-FORM

T642

THERM-A-FORM

T644

THERM-A-FORM

T646

THERM-A-FORM

T647

THERM-A-GAP

T630

THERM-A-GAP

T635

THERM-A-GAP

T636

THERM-A-GAP

GEL 25NS

THERM-A-GAP

GEL 8010

THERM-A-GAP

GEL 30

THERM-A-GAP

GEL 37

THERM-A-GAP

GEL 45

THERM-A-GAP

TC50

Pads

Page 17

THERM-A-GAP

HCS10

THERM-A-GAP

569

THERM-A-GAP

570

THERM-A-GAP

579

THERM-A-GAP

580

THERM-A-GAP

G974

THERM-A-GAP

974

THERM-A-GAP

976

Poly Solder

Hybrid

Materials (PSH)

Page 25

Double-sided

Thermal

Interface Tapes

Page 28

Cure-in-Place

Materials

Page 32

Underfill

Materials

Page 32

Thermal

Insulator Pads

Page 36

Silicone

Grease

Page 49

Low Profile

Page 44

Gels

Page 12

THERMATTACH

T411

Thermal Performance

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THERM-A-GAP™ Gels

Dispensable, Very Low Compression Force, Thermal Gap Fillers

THERM-A-GAP™ Gels are highly conformable, pre-cured,

single-component compounds. The cross-linked gel

structure provides superior long term thermal stability

and reliable performance.

TYPICAL APPLICATIONS

• Automotive electronic control

units (ECUs)

- Engine control

- Transmission control

- Braking/traction control

• Power conversion equipment

• Power supplies and uninterruptible

power supplies

• Power semiconductors

• MOSFET arrays with common

heat sinks

• Televisions and consumer

electronics

FEATURES / BENEFITS

• Dispensable

• Fully cured

• Highly conformable at low

pressures

• No refrigeration, mixing or filler

settling issues in storage

• Single dispensable TIM can

eliminate multiple pad part

sizes/numbers

• Reworkable

Consult Applications Engineering for automated

dispensing equipment recommendations.

PERFORMANCE GUIDE

Flow Rate (grams/min)

Thermal Conductivity (W/m-K)

6.0

5.0

4.0

3.0

2.0

1.0

10 20 30 40 50 60

Gel 45

Gel 8010

Gel 37

TC 50

Gel 30

T636

T635

T630

Gel 25NS

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THERM-A-GAP™ Thermally Conductive Gels

Typical Properties†T630 T635 T636 Test Method

Physical

Color White White Yellow Visual

Binder Silicone Silicone Silicone --

Flow Rate, grams/min - 30 cc taper tip,

0.130" orifice, 90 psi (621 kPa) 10 8 8 Chomerics

Specific Gravity 2.0 1.5 1.2 ASTM D792

Typical Minimum Bondline Thickness, in (mm) 0.004 (0.10) 0.015 (0.38) 0.015 (0.38) --

Thermal

Thermal Conductivity, W/m-K 0.7 1.7 2.4 ASTM D5470

Heat Capacity, J/g-K 1.1 0.9 0.9 ASTM E1269

Coefficient of Thermal Expansion, ppm/K 350 400 400 ASTM E831

Operating Temperature Range, °F (°C) -67 to 392

(-55 to 200) -67 to 392

(-55 to 200) --

Electrical

Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) 200 (8) ASTM D149

Volume Resistivity, ohm-cm 1014 1014 1014 ASTM D257

Dielectric Constant @ 1,000 kHz 5.5 4.0 4.0 ASTM D150

Dissipation Factor @ 1,000 kHz 0.010 0.003 0.003 Chomerics

Regulatory

Flammability Rating

(See UL File E140244 for details) V-0 Not Tested V-0 UL 94

RoHS Compliant Yes Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) 0.55 (0.14) Not Tested 0.49 (0.18) ASTM E595

Shelf Life, months from date of manufacture 18 18 18 Chomerics

Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

Test method:

• ASTM C165 Modified

• Dispensed material and brought 0.50” diameter probe down to 0.100” height

• Strain rate 0.025 in/min

DEFLECTION – T630

Strain (%)

0 10 20 30 40 50 60 70 80

Force (psi)

† Typical properties: these are not to be construed as specifications .

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THERM-A-GAP™ Thermally Conductive Gels

Typical Properties†GEL 25NS GEL 8010 GEL 30 GEL 37 Test Method

Physical

Color Yellow White Pink Blue Visual

Binder Urethane Silicone Silicone Silicone --

Flow Rate, grams/min - 30 cc syringe with no

tip attachment, 0.100” orifice, 90 psi (621 kPa) 15 60 20 30 Chomerics

Specific Gravity 2.6 2.7 3.1 3.1 ASTM D792

Typical Minimum Bondline Thickness, in (mm) 0.004 (0.11) 0.002 (0.05) 0.004 (0.10) 0.004 (0.10) Chomerics

Thermal

Thermal Conductivity, W/m-K 2.5 3.0 3.5 3.7 ASTM D5470

Heat Capacity, J/g-K 0.96 1 1 1 ASTM E1269

Coefficient of Thermal Expansion, ppm/K < 300 150 150 150 ASTM E831

Operating Temperature Range, °F (°C) -58 to 257

(-50 to 125) -67 to 392

(-55 to 200) -67 to 392

(-55 to 200) Chomerics

Electrical

Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) 200 (8) 180 (7.0) ASTM D149

Volume Resistivity, ohm-cm 1014 1014 1014 1014 ASTM D257

Dielectric Constant @ 1000 kHz 6.7 6.3 7.0 5.9 ASTM D150

Dissipation Factor @ 1000 kHz 0.018 0.002 0.002 0.012 Chomerics

Regulatory

Flammability Rating V-0 V-0 V-0 V-0 UL 94

RoHS Compliant Yes Yes Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) 0.23 (0.04) 1.33 (0.34) 0.15 (0.05) 0.18 (0.07) ASTM E595

Shelf Life, months from date of manufacture 12 18 18 18 Chomerics

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

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THERM-A-GAP™ Thermally Conductive Gels

Typical Properties†GEL 45 TC50 Test Method

Physical

Color Black Gray Visual

Binder Silicone Silicone --

Flow Rate, grams/min - 30 cc syringe with no

tip attachment, 0.100” orifice, 90 psi (621 kPa) 55 10 Chomerics

Specific Gravity 3.1 3.25 ASTM D792

Typical Minimum Bondline Thickness, in (mm) 0.0035 (0.0889) 0.006 (0.15) Chomerics

Thermal

Thermal Conductivity, W/m-K 4.5 5.0 ASTM D5470

Heat Capacity, J/g-K 1 1 ASTM E1269

Coefficient of Thermal Expansion, ppm/K 150 150 ASTM E831

Operating Temperature Range, °F (°C) -67 to 392

(-55 to 200) -67 to 392

(-55 to 200) Chomerics

Electrical

Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) ASTM D149

Volume Resistivity, ohm-cm 1014 1014 ASTM D257

Dielectric Constant @ 1000 kHz 7.0 6.8 ASTM D150

Dissipation Factor @ 1000 kHz 0.002 0.022 Chomerics

Regulatory

Flammability Rating V-0 V-0 UL 94

RoHS Compliant Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) 0.15 (0.05) 0.07 (0.01) ASTM E595

Shelf Life, months from date of manufacture 18 18 Chomerics

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

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Ordering Information

THERM-A-GAP™ Thermally Conductive Gels

Cartridge Type

Material Type

T630

T635

T636

GEL 25NS

GEL 8010

GEL 30

GEL 37

GEL 45

TC50

GEL 75

Vessel Size

0010 = 10 cc Manual Dispense Syringe

0030 = 30 cc Taper Tip Tube

0300 = 300 cc Aluminum Cartridge (Caulking Style)

0030 = 30 cc EFD Plastic Cartridge

0180 = 180 cc EFD Plastic Cartridge

2500 = 1 US gal Pail

7500 = 5 US gal Pail

65 XX YYYYY ZZZZ

PART NUMBER:

These materials are available in the following formats.

Ordering Information: Custom Configurations

Larger custom cartridges and pails available . Please contact Parker Chomerics

for a pre-assigned part number for custom part sizes .

SEMCO is a registered trademark of PPG Aerospace

Dispensing Equipment Options Optional Supplier Description

Hand-Gun Pneumatic Dispensing 300 cc cartridges Bergdahl Associates SEMCO® Model 550

Hand-Gun Pneumatic Dispensing 180 cc (6 oz) cartridges Bergdahl Associates Model 250A-6 oz Sealant Gun

www.bergdahl.com

Pneumatic Shot Size Controllers

30 cc, 180 cc and 300 cc shot size dispensing equipment

EFD

Ultra 2400 Series

Ultra 1400 Series

Ultra 870 Series

30 cc/55 cc Adapter Assembly EFD 10000D5152

Dispensing Sleeve to support 6 oz (180 cc) SEMCO® tubes EFD 5192-6

www.efd-inc.com

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERM-A-GAP™ Pads

Thermally Conductive Gap Filler Pads

THERM-A-GAP™ gap-filler sheets and pads offer

excellent thermal properties and highest conformability

at low clamping forces.

FEATURES/BENEFITS

• Ultra low deflection force

• High thermal conductivity

• High tack surface reduces

contact resistance

• 974 and G974 supplied with

PSA for ease of use

• 976 is softer compared to similar

high conductivity materials

• “A” version offers high strength

acrylic PSA for permanent

attachment

All products are available on aluminum

foil “A” or on “clean break” glass “G”

fiber carrier. As with all previous Parker

Chomerics gap-fillers, the “A” versions

have a high strength acrylic pressure

sensitive adhesive (PSA) for permanent

attachment to the cold surfaces.

TYPICAL APPLICATIONS

• Telecommunications equipment

• Consumer electronics

• Automotive electronics (ECUs)

• LEDs, lighting

• Power conversion

• Power semiconductors

• Desktop computers, laptops,

servers

• Handheld devices

• Memory modules

• Vibration dampening

PERFORMANCE GUIDE

7.0

6.0

5.0

4.0

3.0

2.0

1.0

Hardness (Shore 00)

10 20 30 40 50 60 70

Thermal Conductivity (W/m-K)

569

580

570

579

HCS10

Hardness (Shore A)

10 20 30 40

974

976

G974

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERM-A-GAP™ Gap Filler Pads

Typical Properties†HCS10 569 570 579 580 Test Method

Physical

Color Orange /

Gray Carrier Gray Blue Pink Yellow Visual

Binder Silicone Silicone Silicone Silicone Silicone --

Carrier Options

Supported (standard):

G = Woven glass carrier - no PSA

A = Aluminum foil carrier - with acrylic PSA

Supported (custom):

PN = PEN film carrier

KT = Thermally enhanced polyimide carrier

Unsupported (no carrier):

579 and 580 only - no letter notation needed

HCS10A or

HCS10G A569, G569 or

569PN A570 or G570 A579, G579,

579PN, 579KT,

or 579

A580, G580,

or 580 --

Standard Thicknesses*, in (mm)

Unsupported (no carrier): 0.120-0.200 (3.0-5.0) 0.010 - 0.200

(0.25 - 5.0) 0.010 - 0.200

(0.25 - 5.0) 0.020 - 0.200

(0.5 - 5.0) 0.010 - 0.200

(0.25 - 5.0) 0.020 - 0.200

(0.5 - 5.0) ASTM D374

Specific Gravity 2.0 2.2 2.2 2.9 2.9 ASTM D792

Hardness, Shore 00 4 10 25 30 75 ASTM D2240

Percent Deflection @ various pressures**

(0.125 in thick sample)

@ 5 psi (34 kPa)

@ 10 psi (69 kPa)

@ 25 psi (172 kPa)

@ 50 psi (345 kPa)

% Deflected

ASTM C165

MOD (0.125 in

“G” Type, 0.50

in dia probe,

0.025 in/min rate)

Operating Temperature Range, °F (°C) -67 to 392

(-55 to 200) -67 to 392

(-55 to 200) --

Thermal

Thermal Conductivity, W/m-K 1 1.5 1.5 3 3 ASTM D5470

Thermal Impedance, °C-in2/W (°C-cm2/W)

@ 10 psi, @ 0.04 in (1 mm) thick, “G” version only 1.5

(9.7) 1.4

(9.1) 1.4

(9.1) 0.7

(4.5) 0.7

(4.5) ASTM D5470

Heat Capacity, J/g-K 1 1 1 1 1 ASTM E1269

Coefficient of Thermal Expansion, ppm/K N/A 250 250 150 150 Chomerics

Electrical

Dielectric Strength, Vac/mil (kVac/mm) 200 (8) 200 (8) 200 (8) 200 (8) 200 (8) ASTM D149

Volume Resistivity, ohm-cm 1014 1014 1014 1014 1014 ASTM D257

Dielectric Constant @ 1,000 kHz 5.3 6.5 6.5 8.0 8.0 ASTM D150

Dissipation Factor @ 1,000 kHz 0.013 0.013 0.013 0.010 0.010 Chomerics Test

Regulatory

Flammability Rating

(See UL File E140244 for details) V-0 V-0 V-0 V-0 V-0 UL 94

RoHS Compliant Yes Yes Yes Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) 0.44 (0.13) 0.42 (0.08) 0.35 (0.09) 0.19 (0.06) 0.18 (0.05) ASTM E595

Shelf Life, months from date of shipment 36 36 36 36 36 Chomerics

Shelf Life, months from date of shipment -

“A” aluminum foil carrier version only 18 18 18 18 18 Chomerics

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

* Thickness tolerance, in (mm) ±10% nominal thickness @ 0 .1 in (2 .5 mm) or less; ± 0 .01 in (0 .25 mm) @ nominal thickness greater than 0 .1 in (2 .5 mm) .

Custom thicknesses may be available upon request .

** The typical deflection range is approximately 5-40% .

*** Laminated polyester film provides low abrasion on one side as well as improved dielectric isolation .

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERM-A-GAP™ Gap FIller Pads

Typical Properties†G974 974 976 Test Method

Physical

Color Blue Blue Gold Visual

Binder Silicone Silicone Silicone --

Carrier Fiberglass

with PSA PSA None* --

Standard Thicknesses*, in (mm) 0.010 - 0.100

(0.25 - 2.54) 0.020 - 0.060

(0.51 - 1.52) 0.040 - 0.200

(1.00 - 5.08) ASTM D374

Specific Gravity 1.4 1.4 1.3 ASTM D792

Hardness, Shore A 40 40 10 ASTM D2240

Penetrometer, mm 25 25 60 Chomerics

Percent Deflection @ Various Pressures**

(0.060 in thick sample)

@ 5 psi (34 kPa)

@ 10 psi (69 kPa)

@ 25 psi (172 kPa)

@ 50 psi (345 kPa)

% Deflection

ASTM C165 MOD

(0.060 in thick,

0.50 in diameter,

0.025 in/min rate)

Thermal

Thermal Conductivity, W/m-K 5.0 6.0 6.5 ASTM D5470

Thermal Impedance, °C-in2/W (°C-cm2/W)

@ 50 psi (345 kPa), 0.040 in (1 mm) 0.51

(3.3) 0.45

(2.9) 0.30

(1.9) ASTM D5470

Heat Capacity, J/g-K 0.9 0.9 0.9 ASTM E1269

Coefficient of Thermal Expansion, ppm/°C 100 100 100 Chomerics

Operating Temperature Range, °F (°C) -67 to 392

(-55 to 200) -67 to 392

(-55 to 200) --

Electrical

Dielectric Strength, Vac/mil (kVac/mm) 200 (5.1) 200 (5.1) 200 (5.1) ASTM D149

Volume Resistivity, ohm-cm 1014 1014 1014 ASTM D257

Dielectric Constant @ 1,000 kHz 3.2 3.2 3.2 ASTM D150

Dissipation Factor @ 1,000 kHz < 0.001 < 0.001 < 0.001 Chomerics

Regulatory

Flammability Rating

(See UL File E140244 for details) V-0 Not Tested V-0 UL 94

RoHS Compliant Yes Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) 0.59 (0.18) 0.59 (0.18) 0.64 (0.21) ASTM E595

Shelf Life, months from date of shipment 12 12 24 Chomerics

Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

* THERM-A-GAP 976 is only offered without a carrier, PSA not available .

** The typical deflection range for G974 and 974 is approximately 5-20%; 976 is 5-30% .

v» ‘y‘ \ 579 579K unsupponad( (m camer) with m pse‘able uner no lm mlcmmerics

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THERM-A-GAP™ Gap Filler Pads

HCS10G

with gray fiberglass carrier,

peelable liner

G569

with gray fiberglass carrier,

peelable liner

A579

with aluminum PSA carrier,

peelable liner

579

unsupported (no carrier),

peelable liner

579KT

with thermally enhanced polyimide carrier,

no liner

579PN

with PEN film carrier,

no liner

Blue base liner on all pads

remove prior to installation

Product examples showing carrier options and liners.

G579

with fiberglass carrier,

peelable liner

DO NOT REMOVE

PEEL LINER ONLY

DO NOT REMOVE

PEEL LINER ONLY

DO NOT REMOVE

PEEL LINER ONLY

DO NOT REMOVE

PEEL LINER ONLY

DO NOT REMOVE

PEEL LINER ONLY

DO NOT REMOVE

Available Carriers

• G – woven fiberglass (no PSA) – this carrier option provides

reinforcement and a clean break / low-tack interface surface,

allowing for re-use of the pad if necessary or for prototyping.

• A – aluminum foil (with PSA) – this carrier’s primary function is

to allow a pressure sensitive adhesive on the gap pad.

• PN – PEN film (polyethylenenapthalate) – this carrier permits

the gap pad to see a shearing motion and offers a clear,

cost-effective dielectric film with fair thermal performance.

• KT – thermally enhanced polyimide – this carrier permits

the gap pad to see a shearing motion and offers an excellent

dielectric film with enhanced thermal performance.

• No carrier (no letter distinction) – the no carrier or

“un-reinforced” option allows the gap pad to have high-tack

surfaces on both sides, allowing for the pad to be highly

conformable, but it does make cutting and handling of the

product more difficult.

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Sheet Thickness (in)*

Available in 0.010” increments

from 0.010” - 0.200”

(0.254 mm - 5.0 mm)

0.010 = 01

0.020 = 02†

0.030 = 03

0.040 = 04

0.050 = 05

0.060 = 06

0.070 = 07

0.080 = 08

0.090 = 09

0.100 = 10

Sheet Size

0909 = 9” x 9” sheet

(228.6 mm x 228.6 mm)

Material Type

HCS10G

G569

569PN

G570

G579

579PN

579KT

579

G580

580

Ordering Information

61 XX 0909 ZZZZ

THERM-A-GAP™ HCS10, 569, 570, 579 and 580 Thermally Conductive Pads

PART NUMBER:

0.110 = 11

0.120 = 12††

0.130 = 13

0.140 = 14

0.150 = 15

0.160 = 16

0.170 = 17

0.180 = 18

0.190 = 19

0.200 = 20

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths,

lengths and part sizes, etc .

Available options include:

• Custom die-cut parts on sheets, or as individual parts

• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)

• Custom thicknesses available upon request (up to 1” thick)

• Custom molded designs and ribbed sheets

* See typical properties table for thicknesses

† Minimum thickness for A570, G570, G579 and A580, G580

†† Minimum thickness for 579 and 580

9" x 9" Sheets - No Pressure Sensitive Adhesive (PSA)

“G”, “PN”, “KT” carrier

and unsupported

Sheet Thickness (in)*

Available in 0.010" increments

from 0.010" - 0.200"

(0.254 mm - 5.0 mm)

0.010 = 01

0.020 = 02†

0.030 = 03

0.040 = 04

0.050 = 05

0.060 = 06

0.070 = 07

0.080 = 08

0.090 = 09

0.100 = 10

Sheet Size

0909 = 9” x 9” sheet

(228.6 mm x 228.6 mm)

Material Type

HCS10A

A569

A570

A579

A580

62 XX 0909 ZZZZ

PART NUMBER:

0.110 = 11

0.120 = 12

0.130 = 13

0.140 = 14

0.150 = 15

0.160 = 16

0.170 = 17

0.180 = 18

0.190 = 19

0.200 = 20

9" x 9" Sheets - Pressure Sensitive Adhesive (PSA) 1 Side

“A” carrier only

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Sheet Thickness (in)*

Available in 0.010”, 0.015”,

and in 0.010” increments from

0.020” - 0.200” (2.54 mm - 5.0 mm)

0.010 = 28539

0.015 = 28540**

0.020 = 20698†

0.030 = 20913

0.040 = 20684

0.050 = 27395

0.060 = 20991

0.070 = 20685

0.080 = 21259

Material Type

HCS10G

G569

569PN

G570

G579

579PN

579KT

579

G580

580

69 11 YYYYY ZZZZ

PART NUMBER:

0.100 = 20672

0.120 = 27102††

0.130 = 20675

0.140 = 27100

0.150 = 27101

0.160 = 20686

0.180 = 27103

0.200 = 20687

THERM-A-GAP™ HCS10, 569, 570, 579 and 580 Thermally Conductive Pads

18" x 18" Sheets - No Pressure Sensitive Adhesive (PSA)

“G”, “PN”, “KT” carrier

and unsupported

Sheet Thickness (in)*

Available in 0.010”, 0.015”,

and in 0.010” increments from

0.020” - 0.200” (2.54 mm - 5.0 mm)

0.010 = 28539

0.015 = 28540

0.020 = 20698†

0.030 = 20913

0.040 = 20684

0.050 = 27395

0.060 = 20991

0.070 = 20685

0.080 = 21259

Material Type

HCS10A

A569

A570

A579

A580

69 12 YYYYY ZZZZ

PART NUMBER:

0.100 = 20672

0.120 = 27102

0.130 = 20675

0.140 = 27100

0.150 = 27101

0.160 = 20686

0.180 = 27103

0.200 = 20687

18" x 18" Sheets - Pressure Sensitive Adhesive (PSA) 1 Side

“A” carrier only

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths,

lengths and part sizes, etc .

Available options include:

• Custom die-cut parts on sheets, or as individual parts

• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)

• Custom thicknesses available upon request (up to 1” thick)

• Custom molded designs and ribbed sheets

* See typical properties table for thicknesses

** Minimum thickness for G579

† Minimum thickness for A570, G570, and A580, G580

†† Minimum thickness for 579 and 580

Ordering Information

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

HANDLING INFORMATION

These products are defined by Parker Chomerics

as “articles” according to the following generally

recognized regulatory definition for articles:

An article is a manufactured item “formed to a

specific shape or design during manufacturing,”

which has “end use functions” dependent upon

its size and shape during end use and which has

generally “no change of chemical composition

during its end use.”

In addition:

• There is no known or anticipated exposure to

hazardous materials/substances during routine

and anticipated use of the product.

• The product’s shape, surface and design is

more relevant than its chemical composition.

These materials are not deemed by Parker

Chomerics to require an MSDS. For further

questions, please contact Parker Chomerics at

781-935-4850.

* See typical properties table for thicknesses

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths,

lengths and part sizes, etc .

Available options include:

• Custom die-cut parts on sheets, or as individual parts

• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)

• Custom molded designs and ribbed sheets

Ordering Information

THERM-A-GAP™ 976 Thermally Conductive Pads

Thickness (in)*

Available in 0.010” increments from

0.040” - 0.200” (1.00 mm - 5.0 mm)

0.040 = 04

0.050 = 05

0.060 = 06

0.070 = 07

0.080 = 08

0.090 = 09

0.100 = 10

0.110 = 11

0.120 = 12

Sheet Size

0912 = 9” x 12” sheet

(228.6 mm x 304.8 mm)

2025 = 20” x 25” sheet

(508 mm x 635 mm)

61 XX YYYY 976

PART NUMBER:

0.130 = 13

0.140 = 14

0.150 = 15

0.160 = 16

0.170 = 17

0.180 = 18

0.190 = 19

0.200 = 20

9" x 12" and 20" x 25" Sheets - No Pressure Sensitive Adhesive (PSA)

976 only

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Ordering Information

THERM-A-GAP™ 974 and G974 Thermally Conductive Pads

Thickness (in)*

Available in 0.010” increments

0.010 = 01

0.020 = 02**

0.030 = 03

0.040 = 04

0.050 = 05

Sheet Size

0912 = 9” x 12” sheets

(228.6 mm x 304.8 mm)

2025 = 20” x 25” sheets

(508 mm x 635 mm)

Material Type

974

G974

62 XX YYYY ZZZZ

PART NUMBER:

0.060 = 06†

0.070 = 07

0.080 = 08

0.090 = 09

0.100 = 10

9" x 12" and 20" x 25" Sheets - Pressure Sensitive Adhesive (PSA) 1 Side

974 and G974 only

HANDLING INFORMATION

These products are defined by Parker Chomerics

as “articles” according to the following generally

recognized regulatory definition for articles:

An article is a manufactured item “formed to a

specific shape or design during manufacturing,”

which has “end use functions” dependent upon

its size and shape during end use and which has

generally “no change of chemical composition

during its end use.”

In addition:

• There is no known or anticipated exposure to

hazardous materials/substances during routine

and anticipated use of the product.

• The product’s shape, surface and design is

more relevant than its chemical composition.

These materials are not deemed by Parker

Chomerics to require an MSDS. For further

questions, please contact Parker Chomerics at

781-935-4850.

* See typical properties table for thicknesses

** Minimum thickness 974

† Maximum thickness 974

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths,

lengths and part sizes, etc .

Available options include:

• Custom die-cut parts on sheets, or as individual parts

• “A” version offered die-cut (up to 0 .040”) on continuous rolls (higher volumes)

• Custom molded designs and ribbed sheets

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERMFLOW®

Non-Silicone, Phase-Change Thermal Interface Pads

THERMFLOW® phase-change Thermal Interface Materials

(TIMs) completely fill interfacial air gaps and voids.

THERMFLOW phase-change materials

are designed to displace entrapped air

between power dissipating electronic

components. Phase-change materials

maximize heat sink performance

and improve component reliability.

THERMFLOW pads soften as

they reach component operating

temperatures.

Upon reaching operating temperature,

THERMFLOW materials will fully

change phase and attain minimum

bond-line thickness (MBLT) to

maximize surface wetting. This results

in practically no thermal contact

resistance due to a very small thermal

resistance path.

At room temperature, THERMFLOW

materials are solid and easy to handle.

This allows them to be consistently

and cleanly applied as dry pads to a

heat sink or component surface. With

light clamping pressure, they will readily

conform to both mating surfaces.

Standard THERMFLOW products are

electrically non-conductive, however

metal-to-metal contact is possible after

the material undergoes phase-change,

decreasing their electrical isolation

properties. PC07DM-7 is the only

THERMFLOW material recommended

for use as a dielectric insulator.

Parker Chomerics offers two types of

phase change materials—traditional

thermal interface pads (PCM) and

dual phase change polymer solder

hybrids (PSH).

DUAL PHASE CHANGE POLYMER

SOLDER HYBRID MATERIALS

(PSH)

THERMFLOW brand products are

also available as dual phase change

polymer solder hybrid (PSH) thermal

interface materials, in which case, both

binder and filler change phases, to

exhibit the lowest thermal impedance

of the THERMFLOW family.

These thermal interface materials

provide superior long term reliability

performance. For optimum

performance, THERMFLOW must be

exposed to temperatures above 64°C

during operation or by a burn-in cycle

to achieve lowest thermal impedance

and highest thermal performance.

TYPICAL APPLICATIONS

• Microprocessors

• Graphics processors

• Chipsets

• Memory modules

• Power modules

• Power semiconductors

APPLICATION

Material may flow when oriented

vertically, especially at higher

temperatures. This does not affect

thermal performance, but should be

considered if appearance is important.

CLEAN UP

THERMFLOW material can be

removed with solvents such as

toluene, MEK or isopropyl alcohol.

FEATURES/BENEFITS

• Low thermal impedance

• Proven solution – years of

production use in personal

computer OEM applications

• Demonstrated reliability through

thermal cycling and accelerated

age testing

• Can be pre-applied to heat sinks

• Protective release liner prevents

contamination of material prior to

final component assembly

• Tabs available for easy removal of

release liner (T710, T725*, T557,

T777, PC07DM)

* T725 is only offered with a tab

• Available in custom die-cut shapes,

kiss-cut on rolls

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERMFLOW® Non-Silicone, Phase-Change Thermal Interface Pads

Typical Properties†PC07DM-7 T710 with PSA T725 T766/T766-06 T557 T558 T777 Test Method

Physical

Color Pink Light Gray/

Off-White Pink Purple/Gray Foil Gray Gray/Gray Foil Gray Visual

Carrier 1 mil

Polyester 2 mil

Fiberglass None -

Free Film 1 mil

Metal Foil None -

Free Film 1 mil

Metal Foil None -

Free Film --

Standard Thicknesses*,

in (mm) 0.007 (0.178) 0.0055 (0.138) 0.005 (0.125) 0.0035 (0.088)

0.006 (0.152) 0.005 (0.125) 0.0045 (0.115) 0.0045 (0.115) ASTM D374

Specific Gravity 1.1 1.15 1.1 2.6 2.4 3.65 1.95 ASTM D792

Phase Transition

Temperature, °C 55 45 55 55 45/62*** 45/62*** 45/62*** ASTM D3418

Weight Loss,

125°C for 48 Hours <0.5% <0.5% <0.5% <0.5% <0.5% <0.5% <0.5% --

Thermal

Thermal Impedance @ 70°C,

°C-in2/W (°C-cm2/W)

@ 10 psi (69 kPa)

@ 25 psi (172 kPa)

@ 50 psi (345 kPa)

Minimum

Bond-line

Thickness

0.35 (2.2)

0.30 (1.93)

0.28 (1.81)

Minimum Bond-

line Thickness

@ 50°C

0.23 (1.48)

0.16 (1.03)

0.12 (0.77)

2.9 mil

0.11 (0.71)

0.06 (0.39)

0.04 (0.26)

Minimum

Bond-line

Thickness

0.15 (0.97)

0.09 (0.58)

0.06 (0.39)

Minimum

Bond-line

Thickness

0.02 (0.13)

0.015 (0.097)

0.008 (0.052)

Minimum

Bond-line

Thickness

0.03 (0.19)

0.013 (0.084)

0.0097 (0.06)

Minimum

Bond-line

Thickness

0.02 (0.13)

0.015 (0.097)

0.0055 (0.035)

ASTM D5470

Operating Temperature

Range, °F (°C) -67 to 257

(-55 to 125) -67 to 257

(-55 to 125) --

Electrical

Volume Resistivity,

ohm-cm 1014 1014 1014 1014

Metal Foil* Non

conductive**

Non

conductive**/

Metal Foil*

Non

conductive** ASTM D257

Voltage Breakdown,

kVac 5 N/A N/A N/A N/A N/A N/A ASTM D149

Regulatory

Flammability Rating Not Tested Not Tested V-0 Not Tested Not Tested Not Tested V-0 UL 94

RoHS Compliant Yes Yes Yes Yes Yes Yes Yes Chomerics

Certification

Shelf Life, months from

date of shipment 12 12 12 12 12 12 12 Chomerics

Storage Conditions, °F (°C) @

50% Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

* Phase-change material exhibits 1014 ohm-cm volume resistivity . Metal foil is electrically conductive .

** The phase-change material is electrically non-conductive . However, as it contains dispersed solder for enhanced thermal properties,

it can exhibit through-conductivity at thinner bond line thickness (approximately <2 mils) . It should not be used as an electrical insulator .

*** The lower phase-transition temperature is for the polymer . The higher value is for the low melting alloy filler .

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Ordering Information

THERMFLOW® Non-Silicone, Phase-Change Thermal Interface Pads

Length

10 = 100 ft

40 = 400 ft

Width

Examples:

0100 = 1”

0750 = 7.5”

2400 = 24”

Material

PC07DM-7

T710

T725

T766

T766-06

T557

T558

T777

64 XX YYYY ZZZZ

PART NUMBER:

THERMFLOW materials are supplied

in several standard formats (see part

number guide below).

Custom die-cut shapes can also be

provided on kiss-cut rolls by Parker

Chomerics’ extensive network of distributor/

fabricators. To ease release liner

removal, an optional tab can be added.

Standard tolerances for slitting widths

and individually cut pieces are ±0.020 in

(±0.51 mm).

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths,

lengths and part sizes, etc .

Available options include:

• Custom kiss cut parts on sheets, or as individual parts

• Offered die-cut on continuous rolls (higher volumes)

HANDLING INFORMATION

These products are defined by Parker Chomerics

as “articles” according to the following generally

recognized regulatory definition for articles:

An article is a manufactured item “formed to a

specific shape or design during manufacturing,”

which has “end use functions” dependent upon

its size and shape during end use and which has

generally “no change of chemical composition

during its end use.”

In addition:

• There is no known or anticipated exposure to

hazardous materials/substances during routine

and anticipated use of the product.

• The product’s shape, surface, and design is

more relevant than its chemical composition.

These materials are not deemed by Parker

Chomerics to require an MSDS. For further

questions, please contact Parker Chomerics at

781-935-4850.

Length

10 = 100 ft

40 = 400 ft

Width

Examples:

0100 = 1”

0750 = 7.5”

2400 = 24”

66 XX YYYY T710

PART NUMBER:

Roll Stock - No Pressure Sensitive Adhesive (PSA)

Roll Stock - With Pressure Sensitive Adhesive (PSA)

T710 only

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERMATTACH® Double-Sided Thermal Tapes

Thermally Conductive Attachment Tapes

THERMATTACH® double-sided thermal interface tapes

provide exceptional bonding properties between electronic

components and heat sinks, eliminating the need for

mechanical fasteners.

TYPICAL APPLICATIONS

• Mount heat sinks to components

dissipating < ~25 W

• Attach heat sinks to PC (esp.

graphics) processors

• Heat sink attachment to motor

control processors

• Telecommunication infrastructure

components

FEATURES / BENEFITS

• Offered in various forms to provide

thermal, dielectric, and flame

retardant properties

• Offered in custom die-cut

configurations to suit a variety of

applications

• Eliminates the need for

mechanical attachment (i.e. screws,

clips, rivets, fasteners)

• Proven reliability under various

mechanical, thermal and

environmental stresses

• Embossed version available

• UL recognized V-0 flammability

• No curing required, unlike epoxy or

acrylic preforms or liquid systems

• Easily reworkable

PERFORMANCE GUIDE

Least suited

Application

T412

T418

Ceramic

Attachment

Metal

Attachment

Plastic

Attachment

Dielectric

Performance

Thermal

Performance T404/T414

T411

T418

T411

T412 T418

T412

T405/T405-R

T404/T414

T405/T405-R

T404/T414 T418

T404/T414

T411

Best suited

T418

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERMATTACH® Thermally Conductive Attachment Tapes

Typical Properties†T404/T414 T405/T405-R T411 T418 T412 Test Method

Physical

Color Beige White Clear/Metallic Light Yellow Gray Visual

Recommended for Plastic

Component Attachment No No Yes No No --

Embossed Standard Standard No Optional Standard --

Reinforcement Carrier Filled

Polyimide Aluminum Aluminum

Mesh Fiberglass Aluminum

Mesh Visual

Thickness, in (mm) 0.005 (0.127) 0.006 (0.15) 0.010 (0.25) 0.010 (0.25) 0.009 (0.23) ASTM D374

Thickness Tolerance, in (mm) ± 0.001

(0.025) ± 0.001

(0.025) --

Adhesive CTE, ppm/ºF 300 300 400 300 300 ASTM D3386

Glass Transition Temperature Range, ºF (ºC) -22 (-30) -22 (-30) -58 (-50) -4 (-20) -22 (-30) ASTM D1356

Operating Temperature Range, ºF (ºC) -22 to 257

(-30 to 125) -22 to 257

(-30 to 125) -58 to 302

(-50 to 150) -22 to 257

(-30 to 125) -22 to 257

(-30 to 125) --

Thermal

Thermal Impedance

°C-in2 / W (°C-cm2/W) @ 300psi 0.6 (3.7) 0.5 (3.4) 1.0 (6.5) 1.2 (7.7) 0.30 (2.0) ASTM D5470

Thermal Conductivity, W/m-K 0.4 0.5 0.5 0.5 1.4 ASTM D5470

Electrical

Voltage Breakdown, kVac 5 N/A N/A 5 N/A ASTM D149

Volume Resistivity, ohm-cm 3.0 X 1014 N/A N/A 1.0 X 1013 1.0 X 102ASTM D257

Mechanical/Adhesion

Lap Shear Al-Al @ 25°C, psi (kPa) 100 (689) 100 (689) 40 (270) 150 (1,034) 70 (480) ASTM D1002

90° Peel Adhesion to 0.002”

aluminum foil, lbf /in (N/cm) 1.5 (2.6) 1.5 (2.6) 2.0 (3.5) 4.0 (6.9) 1.0 (1.76) ASTM D1000

Die Shear Adhesion after

400 psi attachment, psi (kPa)

– 2 hour sample dwell time 77ºF (25ºC) 130 (897) 125 (862) 110 (759) 150 (1,034) 135 (931) Chomerics #54

Creep Adhesion, days

77ºF (15ºC)

302ºF (125ºC)

>50

>10

>50

>10

>50

>10 >50

>10

>50

>10 PSTC-7

Regulatory

Flammability Rating

(See UL File E140244 for details) V-0 V-0 V-0 V-0 Not Tested UL 94

RoHS Compliant Yes Yes Yes Yes Yes Chomerics

Certification

Shelf Life, months from shipment 12 12 12 12 12 Chomerics

Outgassing, % TML (% CVCM) 0.56 (0.02) 0.25 (0.01) Not Tested Not Tested 0.14 (0.00) ASTM E595

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Ordering Information

THERMATTACH® Thermally Conductive Attachment Tapes

Length

10 = 100 ft

40 = 400 ft

Width

0750 = 7.5"

1150 = 11.5"

2400 = 24"

Material Type

T405

T405-R

T411

T412

T418

67 XX YYYY ZZZZ

PART NUMBER:

These attachment tapes are available on continuous rolls.

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths, lengths and part sizes, etc .

Available options include:

• Custom kiss cut parts on sheets, or as individual parts

HANDLING INFORMATION

These products are defined by Parker Chomerics

as “articles” according to the following generally

recognized regulatory definition for articles:

An article is a manufactured item “formed to a

specific shape or design during manufacturing,”

which has “end use functions” dependent upon

its size and shape during end use and which has

generally “no change of chemical composition

during its end use.”

In addition:

• There is no known or anticipated exposure to

hazardous materials/substances during routine

and anticipated use of the product.

• The product’s shape, surface and design is

more relevant than its chemical composition.

These materials are not deemed by Parker Chomerics

to require an MSDS. For further questions, please

contact Parker Chomerics at 781-935-4850.

Length

10 = 100 ft

40 = 400 ft

Width

0600 = 6"

0900 = 9"

1900 = 19"

Material Type

T404

T414

67 XX YYYY ZZZZ

PART NUMBER:

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

Minimum: 10 psi at room temperature for 15 seconds

PREFERRED: 30 psi at room temperature for 5 seconds

THERMATTACH® Thermally Conductive Attachment Tapes

Tape Application Instructions: T404, T405, T405-R, T411, T412, T413, T414, T418

MATERIALS NEEDED

• Clean lint-free cloth rag

• Industrial solvent

• Rubber gloves

For optimal performance, Parker

Chomerics recommends interface

flatness of 0.001 in/in (0.025 mm/25

mm) to 0.002 in/in (0.050 mm/25 mm)

maximum.

Step 1: Ensure that bonding

surfaces are free from oil, dust or any

contamination that may affect bonding.

Using rubber gloves, wipe surfaces

with a cloth dampened with industrial

solvents such as MEK, toluene,

acetone or isopropyl alcohol.

Step 2: Cut tape to size* and remove

a liner or remove pre-cut tape from roll.

*Note: Due to variations in heat sink

surfaces, Parker Chomerics’ data

indicates that it sometimes is beneficial

to be cut slightly smaller than the area

of the heat sink. See illustration.

Step 3: Apply to center of heat sink

bonding area and smooth over entire

surface using moderate hand pressure

/ rubbing motion. A roller may be

useful to help smooth the part to the

surface by rolling from the center out

to beyond the edges of the part. This

ensures optimal contact between

tape and heat sink.

Step 4: Center heat sink onto

component and apply using any one

of the recommended temperature/

pressure options:

More pressure equals better wetting

out of the adhesive to the contact

surfaces. A twisting motion during

assembly of the substrates will

typically improve wetting.

Note that typically 70% of the

ultimate adhesive bond strength

is achieved with initial application,

and 80-90% is reached within 15

minutes. Ultimate adhesive strength is

achieved within 36 hours; however the

next manufacturing step can typically

occur immediately following the initial

application.

REMOVAL INSTRUCTIONS

Materials needed: Single-edged

razor blade or a small, thin-bladed

pocketknife; soft, thin metal spatula.

Use safety precautions when handling

sharp instruments and organic solvents.

Step 1: Carefully insert the blade edge

into the bond line at a corner between

the heat sink and the component. The

penetration need not be very deep.

Step 2: Remove the blade and insert

the spatula into the wedge. Slowly

twist the spatula blade so that it exerts

a slight upward pressure.

Step 3: As the two surfaces start to

separate, move the spatula blade

deeper into the bond line and continue

the twisting motion and upward force.

Step 4: After the two components are

separated, the tape can be removed

and discarded. If adhesive remains

on the component surfaces, it must

be removed. Wipe with a clean rag

(lint-free) dabbed with MEK, toluene, or

isopropyl alcohol. Use sufficient solvent

to remove all adhesive.

Step 5: Solvent cleaned components

must be verified 100% free of cleaning

solvent prior to reattachment of

adhesive.

* Not Recommended

Typical Properties T418 T412 T404/T414 T405/T405-R T411

Performance

Ceramic Attachment

Metal Attachment

Plastic Attachment

Dielectric Performance

Thermal Performance

Thermally Conductive Attachment Tapes

* * * *

* * *

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERM-A-FORM™

Cure-in-Place Potting and Underfill Materials

THERM-A-FORM™ thermally conductive silicone elastomer

products are dispensable form-in-place compounds

designed for heat transfer without excessive compressive

force in electronics cooling applications.

FEATURES / BENEFITS

• Cures in place once dispensed

• Dispensable form-in-place

gap filling, potting, sealing

and encapsulating

• Excellent blend of high thermal

conductivity, flexibility and ease

of use

• Conformable to irregular shapes

without excessive force on

components

• Ready-to-use cartridge system

eliminates weighing, mixing and

de-gassing steps

• Variety of kit sizes and

configurations available to suit

any application (handheld twin-

barrel cartridges, Semco® tubes

and pneumatic applicators)

• Vibration damping

PERFORMANCE GUIDE

4.0

3.0

2.0

1.0

Viscosity (Poise)

1000 2000 3000 4000 5000 6000

Thermal Conductivity (W/m-K)

T642

1642

T644

1641

TYPICAL APPLICATIONS

• Automotive electronic control

units (ECUs)

- Engine control

- Transmission control

- Braking/traction control

• Power conversion equipment

• Power supplies and uninterruptible

power supplies

• Power semiconductors

• MOSFET arrays with common

heat sinks

• Televisions and consumer

electronics

T646

T647

CIP 35

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERM-A-FORM™ Cure-in-Place and Underfill Materials

Typical Properties†T646 T642 T644 T647 CIP 35 Test Method

Physical

Color Yellow Blue Pink Gray Green Visual

Binder Silicone Silicone Silicone Silicone Silicone --

Filler Aluminum

Oxide Boron Nitride Boron Nitride Aluminum

Oxide Aluminum Oxide /

Boron Nitride --

Number of Components 2-part 2-part 2-part 2-part 2-part --

Mix Ratio (by weight) 1 : 1 10 : 1 1 : 1 1 : 1 1 : 1

Specific Gravity 2.45 1.50 1.45 2.8 2.87 ASTM D792

Hardness, Shore A 50 70 15 25 55 ASTM D2240

Viscosity, poise > 5000 2500 3000 > 5000 5000 ASTM D2196

Pot Life, minutes 300 60 360 300 100 Time to 2X Starting

Viscosity at 23°C

Cure Cycles 3 min @ 150°C

60 min @ 60°C

48 hrs @ 23°C

3 min @ 150°C

30 min @ 70°C

48 hrs @ 23°C

3 min @ 150°C

60 min @ 60°C

72 hrs @ 23°C

3 min @ 150°C

60 min @ 60°C

48 hrs @ 23°C

30 min @ 150ºC

180 min @ 100ºC

48 hrs @ 23ºC Chomerics

Thermal

Thermal Conductivity, W/m-K 0.90 1.20 1.20 3.0 3.5 ASTM D5470

Heat Capacity, J/g-K 1 1 1 0.9 1 ASTM E1269

Coefficient of Thermal Expansion,

ppm/K 250 300 300 150 150 ASTM E831

Operating Temperature Range,

°F (°C) -58 to 302

(-50 to 150) -58 to 302

(-50 to 150) -67 to 392

(-55 to 200) --

Electrical

Dielectric Strength,

kVac/mm (Vac/mil) 10 (250) 20 (500) 20 (500) 10 (250) 10 (250) ASTM D149

Volume Resistivity, ohm-cm 1.0 x 1014 1.0 x 1013 1.0 x 1013 1.0 x 1014 1.0 x 1014 ASTM D257

Dielectric Constant @ 1,000 kHz 6.5 4.0 4.0 8 8 ASTM D150

Dissipation Factor @ 1,000 kHz 0.013 0.001 0.001 0.010 0.010 Chomerics

Regulatory

Flammability Rating

(See UL File E140244 for details) V-0 Not Tested Not Tested V-0 V-0 UL 94

RoHS Compliant Yes Yes Yes Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) 0.17 (0.10) 0.32 (0.21) 0.39 (0.29) Not Tested 0.22 (0.06) ASTM E595

Shelf Life, months from

date of manufacture 3 3 3 3 12 Chomerics

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERM-A-FORM™ Cure-in-Place and Underfill Materials

Typical Properties†1641 1642 Test Method

Physical

Color White Blue Visual

Binder Silicone Silicone --

Filler Aluminum

Oxide Aluminum

Oxide --

Number of Components 1-part 2-part --

Mix Ratio (by weight) N/A 100 : 3

Specific Gravity 2.1 2.3 ASTM D792

Hardness, Shore A 56 76 ASTM D2240

Viscosity, poise 3000 2500 ASTM D2196

Pot Life, minutes 30 60 Time to 2X Starting

Viscosity at 23°C

Cure Cycles 48 hrs @ 23°C

@ 50% RH

60 min @ 100°C

4 hrs @ 65°C

1 week @ 23°C Chomerics

Thermal

Thermal Conductivity, W/m-K 0.90 0.95 ASTM D5470

Heat Capacity, J/g-K 1 1 ASTM E1269

Coefficient of Thermal Expansion,

ppm/K 150 200 ASTM E831

Operating Temperature Range,

°F (°C) -94 to 392

(-70 to 200) -94 to 392

(-70 to 200) --

Electrical

Dielectric Strength,

kVac/mm (Vac/mil) 20 (500) 20 (500) ASTM D149

Volume Resistivity, ohm-cm 1.0 x 1013 1.0 x 1013 ASTM D257

Dielectric Constant @ 1,000 kHz 3.9 3.9 ASTM D150

Dissipation Factor @ 1,000 kHz 0.010 0.010 Chomerics

Regulatory

Flammability Rating

(See UL File E140244 for details) Not Tested Not Tested UL 94

RoHS Compliant Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) Not Tested 0.40 (0.18) ASTM E595

Shelf Life, months from

date of manufacture 6 12 Chomerics

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

Typical Properties†1641 1642 Test Method

Physical

Color White Blue Visual

Binder Silicone Silicone --

Filler Aluminum

Oxide Aluminum

Oxide --

Number of Components 1-part 2-part --

Mix Ratio (by weight) N/A 100 : 3

Specific Gravity 2.1 2.3 ASTM D792

Hardness, Shore A 56 76 ASTM D2240

Viscosity, poise 3000 2500 ASTM D2196

Pot Life, minutes 30 60 Time to 2X Starting

Viscosity at 23°C

Cure Cycles 48 hrs @ 23°C

@ 50% RH

60 min @ 100°C

4 hrs @ 65°C

1 week @ 23°C Chomerics

Thermal

Thermal Conductivity, W/m-K 0.90 0.95 ASTM D5470

Heat Capacity, J/g-K 1 1 ASTM E1269

Coefficient of Thermal Expansion,

ppm/K 150 200 ASTM E831

Operating Temperature Range,

°F (°C) -94 to 392

(-70 to 200) -94 to 392

(-70 to 200) --

Electrical

Dielectric Strength,

kVac/mm (Vac/mil) 20 (500) 20 (500) ASTM D149

Volume Resistivity, ohm-cm 1.0 x 1013 1.0 x 1013 ASTM D257

Dielectric Constant @ 1,000 kHz 3.9 3.9 ASTM D150

Dissipation Factor @ 1,000 kHz 0.010 0.010 Chomerics

Regulatory

Flammability Rating

(See UL File E140244 for details) Not Tested Not Tested UL 94

RoHS Compliant Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) Not Tested 0.40 (0.18) ASTM E595

Shelf Life, months from

date of manufacture 6 12 Chomerics

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

Product Part Number Volume (mass) Description

1641

65-00-1641-0000 2.5 fluid ounces

(70 grams) 1-Component foil squeeze tube

65-01-1641-0000 12 fluid ounces

(340 grams)

1-Component

SEMCO® cartridge

1642 65-00-1642-0000 277 grams

(approx 120 cc) 1-Pint plastic jar A / vial of B

T642

65-00-T642-0035 35 cc

(53 grams)

10:1 Dual element cartridge

65-00-T642-0250 250 cc

(372 grams)

T644

65-00-T644-0045 45 cc

(68 grams)

1:1 Dual element cartridge

65-00-T644-0200 200 cc

(300 grams)

T646

65-00-T646-0045 45 cc

(115 grams)

65-00-T646-0200 200 cc

(507 grams)

T647

65-00-T647-0045 45 cc

(125 grams)

65-00-T647-0200 200 cc

(560 grams)

CIP 35

65-00-CIP35-0045 45 cc

(128 grams)

65-00-CIP35-0200 200 cc

(570 grams)

65-00-CIP35-0400 400 cc

(1140 grams)

65-00-CIP35-1200 1200 cc

(3440 grams) (2) 600 cc SEMCO® cartridges

65-1P-CIP35-5600 5600 cc

(16 kg)

(2) 1-Gallon pails,

each pail has 8 kg

65-5P-CIP35-10452 10,452 cc

(30 kg)

(2) 5-Gallon pails,

each pail has 15 kg

Ordering Information

THERM-A-FORM™ T64x and 164x Series

Mixpac™ Dispensing Systems are available from multiple

sources. When contacting Mixpac equipment suppliers,

reference cartridge volume (cc) and dual element cartridge

A:B mix ratio. Refer to table for volume and mix ratio

information.

MIXPAC is a trademark of Sylzer.

SEMCO is a registered trademark of PPG Aerospace. Figure 1: Typical Applicator

APPLICATION INSTRUCTIONS

35 cc and 45 cc Kits (See Figure 1)

Push safety latch (A) upward. Insert

the pushrod (B) into the applicator

with the pushrod gear teeth facing

downward. Insert the cartridge (C) into

the slots on top of the applicator. Push

the retainer clamp (D) down firmly to

lock the cartridge in place. Remove

the cartridge cap (E) with a 1/4 turn

counter-clockwise. Attach the static

mixer (F) to the cartridge. (For the 10:1

cartridge, make certain that the small

notch on the mixer tube face is toward

the large barrel containing Part A.)

Turn the mixer tube 1/4 turn clockwise

to lock it in place. Cut the tip of the

mixing nozzle to obtain the desired

bead size, or attach a needle with the

Luer adapter. After use, discard the

static mixer and replace the cap on

any remaining material.

Phone +1 781-935-4850 www.parker.com/chomerics

CHO-THERM®

Thermally Conductive Electrical Insulator Pads

CHO-THERM® Thermal Insulator Pads are designed for

use as alternatives to greased mica insulators between

discrete power devices and heat sinks. These products

are offered as dry pads, or with an optional acrylic

adhesive (PSA) layer for attachment.

TYPICAL APPLICATIONS

• Power conversion

equipment

• Power supplies & UPS

• Power semiconductors

• Automotive electronics

• Motor and engine

controllers

• Televisions and

consumer electronics

FEATURES / BENEFITS

• Excellent mechanical strength and

puncture resistance

• Available with & without acrylic PSA

• UL recognized V-0 flammability rating

COMMERCIAL GRADE

• Good thermal properties

• Good to excellent dielectric strength

• Available on continuous rolls for

easy peel and stick application

HIGH POWER

• Excellent thermal properties

• High dielectric strength

• 100% inspected for dielectric

properties on every sheet

• Extremely low NASA outgassing

• Proven through decades of use

in demanding military and

aerospace applications

PERFORMANCE GUIDE

3.0

2.5

2.0

1.5

1.0

0.5

Voltage Breakdown-Dry (Vac)

Thermal Conductivity (W/m-K)

1678

1674

1671

T500

T609

T444

T441

(0.008)

T441

(0.013)

1000

2000

3000

4000

5000

6000

7000

8000

9000

10,000

11,000

12,000

13,000

14,000

T441

(0.018)

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

CHO-THERM® Thermal Insulator Pads

Typical Properties†T444 1674 T441 T609 Test Method

Physical

Color Beige Blue Pink Lt. Green Visual

Material Non-Silicone Silicone Silicone Silicone --

Reinforcement Carrier Filled Polyimide Fiberglass Fiberglass Fiberglass Visual

Thickness, in (mm) 0.003 (0.08) 0.010 (0.25) 0.008 (0.20) 0.013 (0.33) 0.018 (0.46) 0.010 (0.25) ASTM D374

Thickness Tolerance, in (mm) 0.0005

(± 0.013) 0.001

(± 0.025) 0.001

(± 0.025) --

Operating Temperature Range, ºF (ºC) -40 to 392

(-40 to 200) -40 to 392

(-40 to 200) --

Thermal

Thermal Impedance,

°C-in2/W (°C-cm2/W) @ 300 psi* 0.37 (2.4) 0.41 (2.6) 0.41 (2.6) 0.56 (3.6) 0.64 (4.1) 0.33 (2.1) ASTM D5470

Thermal Conductivity, W/m-K 0.4 1.0 1.1 1.1 1.1 1.5 ASTM D5470

Heat Capacity, J/g-°C 1 1 1 1 1 1 ASTM E1296

Coefficient of Thermal

Expansion, ppm/°C 400 300 300 300 300 150 ASTM E831

Electrical

Voltage Breakdown Dry, Vac 5,000 2,500 8,700 11,400 13,800 4,000 ASTM D149

Voltage Breakdown Wet, Vac Not Tested Not Tested 8,100 10,500 12,900 Not Tested ASTM D149

Volume Resistivity Dry, ohm-cm 1014 1014 1014 1014 1014 1014 ASTM D257

Volume Resistivity Wet, ohm-cm Not Tested Not Tested 1014 1014 1014 Not Tested ASTM D257

Mechanical

Tensile Strength, psi (Mpa) 3,000 (20.7) 1,500 (10.3) 2,800 (19.3) 2,500 (17.3) 2,000 (13.8) 3,900 (26.9) ASTM D412

Tear Strength, lb/in (kN/m) 150 (26.3) 100 (17.5) 135 (23.6) 110 (19.3) 70 (12.25) 300 (52.5) ASTM D642

Elongation, % N/A 2 40 40 40 30 ASTM D412

Hardness, Shore A 90 85 80 80 80 70 ASTM D2240

Specific Gravity 1.70 2.45 2.45 2.45 2.45 2.10 ASTM D792

Regulatory

Flammability Rating

(See UL File E140244) V-0 Not Tested V-0 V-0 V-0 V-0 UL 94

RoHS Compliant Yes Yes Yes Yes Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) Not Tested 0.45 (0.20) Not Tested Not Tested Not Tested Not Tested ASTM E595

Shelf Life, months from shipment,

dry pad (with PSA) (12) Indefinite (12) Indefinite (12) Indefinite (12) Indefinite (12) Indefinite (6) Chomerics

Storage Conditions, °F (°C) @ 50%

Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

* Tested without PSA . PSA typically adds 0 .05 °C-in2/W (0 .30 °C-cm2/W)

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

CHO-THERM® Thermal Insulator Pads

Typical Properties†1678 T500 1671 Test Method

Physical

Color Pink Green White Visual

Reinforcement Carrier Fiberglass Fiberglass Fiberglass --

Thickness, in (mm) 0.010 (0.25) 0.010 (0.25) 0.015 (0.38)* ASTM D374

Thickness Tolerance, in (mm) ± 0.002

(0.050) ± 0.002

(0.050) --

Operating Temperature Range, ºF (ºC) -40 to 392

(-40 to 200) -40 to 392

(-40 to 200) --

Thermal

Thermal Impedance, °C-in2/W (°C-cm2/W) @ 300 psi** 0.20 (1.26) 0.19 (1.2) 0.23 (1.48) ASTM D5470

Thermal Conductivity, W/m-K 2.0 2.1 2.6 ASTM D5470

Heat Capacity, J/g-°C 1 1 1 ASTM E1296

Coefficient of Thermal Expansion, ppm/K 250 250 250 ASTM E831

Electrical

Voltage Breakdown Dry, Vac 2,500 4,000 4,000 ASTM D149

Volume Resistivity Dry, ohm-cm 1016 1016 1016 ASTM D149

Dielectric Constant at 1,000 kHz 3.6 3.5 3.6 ASTM D150

Dissipation Factor at 1,000 kHz 0.007 0.003 0.007 Chomerics

Mechanical

Tensile Strength, psi (Mpa) 3,000 (20.7) 3,000 (20.7) 3,000 (20.7) Chomerics

Tear Strength, lb/in (kN/m) 200 (35) 400 (70) 400 (70) Chomerics

Elongation, % 20 20 15 Chomerics

Hardness, Shore A 80 80 80 ASTM D2240

Specific Gravity 1.55 1.60 1.55 ASTM D792

Regulatory

Flammability Rating (See UL File E140244) V-0 V-0 HB UL 94

RoHS Compliant Yes Yes Yes Chomerics

Certification

Outgassing, % TML (% CVCM) 0.55 (0.12) 0.40 (0.10) 0.76 (0.07) ASTM E595

Shelf Life, months from shipment, dry pad (with PSA) Indefinite (18) Indefinite (18) Indefinite (18) Chomerics

Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

† Typical properties: these are not to be construed as specifications .

* 1671 material is available in custom thicknesses .

** Tested without PSA . PSA typically adds 0 .05 °C-in2/W (0 .30 °C-cm2/W) .

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Ordering Information

CHO-THERM® Thermal Insulator Pads

Adhesive Code

11 = No PSA

12 = PSA one side

Die-Cut Parts

For standard die-cut

parts, please see tables on

pages 41 to 43.

Material Type

1674

T441

T444

T609

60 XX YYYY ZZZZ

PART NUMBER:

• Die-cut parts on continuous rolls

• Slit rolls starting at 0.5" wide; maximum width is material specific

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths,

lengths and part sizes, etc .

Available options include:

• Custom die-cut parts on sheets, or as individual parts

* Minimum width in 1674

** Minumum width in T441

† Minimum width in T444

Format

4 = No Pressure Sensitive

Adhesive (PSA)

6 = With Pressure Sensitive

Adhesive (PSA)

Roll Length (ft)

10 = 100 ft

40 = 400 ft

Roll Width (in)

0075 = 0.75 in

0100 = 1.00 in

0150 = 1.50 in

0200 = 2.00 in

0800 = 8.00 in

1100 = 11.00 in

1150 = 11.50 in

1600 = 16.00 in*

2200 = 22.00 in**

2400 = 24.00 in†

Material Type

1674

T441

T444

T609

6W XX YYYY ZZZZ

PART NUMBER:

Standard Die-Cut Parts

Roll Stock

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Ordering Information

CHO-THERM® Thermal Insulator Pads

Adhesive Code

11 = No PSA

12 = PSA 1 side

13 = PSA 2 Sides

Die-Cut Parts

For standard die-cut parts,

please see tables on

pages 41 to 43.

Material Type

T500

1671

1678

60 XX YYYY ZZZZ

PART NUMBER:

* 1671 is available in custom thicknesses

up to 0.060" in increments of .005".

Ordering Information: Custom Configurations

Please contact Parker Chomerics for a pre-assigned part number, for custom widths,

lengths and part sizes, etc .

Available options include:

• Custom die-cut parts on sheets, or as individual parts

HANDLING INFORMATION

These products are defined by Parker Chomerics

as “articles” according to the following generally

recognized regulatory definition for articles:

An article is a manufactured item “formed to a

specific shape or design during manufacturing,”

which has “end use functions” dependent upon

its size and shape during end use and which has

generally “no change of chemical composition

during its end use.”

In addition:

• There is no known or anticipated exposure to

hazardous materials/substances during routine

and anticipated use of the product.

• The product’s shape, surface, and design is

more relevant than its chemical composition.

These materials are not deemed by Parker Chomerics

to require an MSDS. For further questions, please

contact Parker Chomerics at 781-935-4850.

Format

1 = Sheet with No Pressure

Sensitive Adhesive (PSA)

2 = Sheet with Pressure Sensitive

Adhesive (PSA) 1 Side

3 = Sheet with Pressure Sensitive

Adhesive (PSA) 2 Sides

Material Thickness (in)

10 = 0.010" (T500 & 1678)

15 = 0.015"* (1671)

Sheet Size (in)

0808 = 8” X 8” sheet

0810 = 8” X 10” sheet

Material Type

T500

1671

1678

6W XX YYYY ZZZZ

PART NUMBER:

Standard Die-Cut Parts

8" x 8" or 8" x 10" Sheets

¢ 3‘— c an {2) >84 DDIA(Z) A Down) 7‘“ 1— x55 F a t sz) —. we ~— E A—.5oo n mus) cnmz 1117—. m Ghomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Recommended

Screw Torque

Configuration Dimensions (inches) Ordering Number

A B C D E F G

#4-40 5 in-lb

#6-32 6 in-lb

TO-3 1.563

1.563

1.593

1.650

1.700

1.730

1.780

2.07

1.050

1.100

1.065

1.140

1.187

1.250

1.56

0.140

0.156

0.140

0.122

0.140

0.165

0.140

0.165

0.156

0.140

0.165

0.140

0.122

0.080

0.140

0.070

0.046

0.062

0.093

0.062

0.046

0.062

0.093

0.094

0.046

0.062

60-XX-D065-ZZZZ

60-XX-4305-ZZZZ

60-XX-4511-ZZZZ

60-XX-D370-ZZZZ

60-XX-D371-ZZZZ

60-XX-6875-ZZZZ

60-XX-D372-ZZZZ

60-XX-D373-ZZZZ

60-XX-D374-ZZZZ

60-XX-4996-ZZZZ

60-XX-5442-ZZZZ

60-XX-D375-ZZZZ

60-XX-D376-ZZZZ

60-XX-D377-ZZZZ

60-XX-D378-ZZZZ

#4-40 5 in-lb

#6-32 6 in-lb

3 LEAD

TO-3

1.65 1.140 0.140 0.093 1.187 0.430 60-XX-D379-ZZZZ

#4-40 5 in-lb

#6-32 6 in-lb

4 LEAD

TO-3

1.560

1.563

1.050

0.158

0.156

0.080

0.063

1.170

1.187

60-XX-D380-ZZZZ

60-XX-D381-ZZZZ

#4-40 5 in-lb

#6-32 6 in-lb

8 LEAD

TO-3

1.650 1.187 0.156 0.60 60-XX-D382-ZZZZ

#4-40 5 in-lb

#6-32 6 in-lb

10 LEAD

TO-3

1.650 1.140 0.165 0.040 60-XX-D383-ZZZZ

1 in-lb = 1.152 kg-cm

A_. mama) him comm l mo 3 T mum .. r-Im » I 2w (9— + —<> 5 v cnum m_ I ‘izﬂ “A—. ”WW T— DIM “I; é} um mmz) m Ghomerics :J

Phone +1 781-935-4850 www.parker.com/chomerics

Recommended

Screw Torque

Configuration Dimensions (inches) Ordering Number

A B C D E F G

#4-40 3 in-lb

#6-32 4 in-lb

TO-66 1.250

1.312

1.375

1.440

0.700

0.762

0.825

1.000

0.140

0.062

0.075

60-XX-4353-ZZZZ

60-XX-5527-ZZZZ

60-XX-4997-ZZZZ

60-XX-D384-ZZZZ

#4-40 3 in-lb

#6-32 4 in-lb

3 LEAD

TO-66

1.275 0.750 0.156 0.100 0.960 60-XX-D385-ZZZZ

#4-40 3 in-lb

#6-32 4 in-lb

4 LEAD

TO-66

1.312 0.762 0.140 0.062 0.960 0.200 0.100 60-XX-D386-ZZZZ

#4-40 3 in-lb

#6-32 4 in-lb

9 LEAD

TO-66

1.440 1.000 0.140 0.055 0.960 0.480 0.325 60-XX-D387-ZZZZ

#4-40 3 in-lb

#6-32 4 in-lb

MULTI LEAD

TO-66

1.35 0.800 0.140 0.400 60-XX-D388-ZZZZ

#4-40 2 in-lb TO-220 0.437

0.437

0.500

0.610

0.687

0.710

0.750

0.855

0.860

1.125

1.410

0.312

0.385

0.560

0.562

0.500

0.410

0.500

0.600

0.562

0.630

0.740

0.625

0.810

0.140

0.170

0.245

0.218

0.160

0.225

---

0.187

0.240

0.218

0.230

0.200

0.355

0.093

0.122

0.120

0.125

0.141

0.156

---

0.147

0.125

0.150

0.115

0.125

0.093

0.160

0.145

0.147

60-XX-D389-ZZZZ

60-XX-D390-ZZZZ

60-XX-D391-ZZZZ

60-XX-D392-ZZZZ

60-XX-5791-ZZZZ

60-XX-8302-ZZZZ

60-XX-D393-ZZZZ

60-XX-8531-ZZZZ

60-XX-6956-ZZZZ

60-XX-D394-ZZZZ

60-XX-D395-ZZZZ

60-XX-D396-ZZZZ

60-XX-D397-ZZZZ

60-XX-D398-ZZZZ

60-XX-D399-ZZZZ

60-XX-D400-ZZZZ

60-XX-D401-ZZZZ

#4-40 2 in-lb

0.910

0.983

0.500

0.750

0.200

0.432

0.125

0.156

0.580

0.665

0.046

0.101

0.265

0.217

60-XX-D402-ZZZZ

60-XX-D403-ZZZZ

E mu m + 7. 4 A 219 mama) can!) 7 kg» 1 L-.J J L.J DDIA. I m Chomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Recommended

Screw Torque

Configuration Dimensions (inches) Ordering Number

A B C D E F G

#4-40 2 in-lb TYPE II

TO-220

1.00 0.500 0.200 0.141 0.626 60-XX-4969-ZZZZ

#10-32 2 in-lb

#25-28 7 in-lb

DIODE WASHERS

DO-4

DO-5

0.360

0.510

0.512

0.625

0.750

0.800

0.812

0.875

1.000

1.180

1.250

1.500

0.260

0.140

0.200

0.161

0.195

0.125

0.190

0.260

0.115

0.145

0.313

0.140

0.255

0.515

0.380

0.200

0.500

60-XX-D404-ZZZZ

60-XX-D405-ZZZZ

60-XX-D406-ZZZZ

60-XX-D407-ZZZZ

60-XX-4659-ZZZZ

60-XX-D408-ZZZZ

60-XX-D409-ZZZZ

60-XX-D410-ZZZZ

60-XX-D411-ZZZZ

60-XX-D412-ZZZZ

60-XX-D413-ZZZZ

60-XX-D414-ZZZZ

60-XX-4661-ZZZZ

60-XX-D415-ZZZZ

60-XX-D416-ZZZZ

60-XX-D417-ZZZZ

60-XX-D418-ZZZZ

TO-36 1.063 0.690 0.200 60-XX-4306-ZZZZ

TO-5 and TO-18

3 holes

4 holes

0.250

0360

0.390

0.250

0.360

0.390

0.100

0.200

0.100

0.200

0.036

0.040

0.036

0.040

60-XX-D419-ZZZZ

60-XX-4374-ZZZZ

60-XX-D420-ZZZZ

60-XX-D421-ZZZZ

60-XX-D422-ZZZZ

60-XX-D423-ZZZZ

#4-40 2 in-lb RECTIFIER 1.000

1.125

1.250

1.000

1.125

1.250

0.187

0.140

0.200

60-XX-D424-ZZZZ

60-XX-D425-ZZZZ

60-XX-D426-ZZZZ

#4-40 2 in-lb TIP

PACKAGE

0.865

0.984

1.260

0.650

0.787

0.650

---

0.780

0.984

0.140

---

0.142

60-XX-5792-ZZZZ

60-XX-D427-ZZZZ

60-XX-D428-ZZZZ

60-XX-D429-ZZZZ

60-XX-D430-ZZZZ

1 in-lb = 1.152 kg-cm

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

T-WING® HEAT SPREADERS

Thin Heat Spreaders

Parker Chomerics’ family of thin heat spreaders provides a

low-cost, effective means of cooling IC devices in restricted

spaces where conventional heat sinks are inappropriate.

TYPICAL APPLICATIONS

• Microprocessors

• Memory modules

• Laptop PCs and other high

density, handheld portable

electronics

• High speed disk drives

DESIGN DETAILS

• Low profile (0.33 mm/0.013 in)

allows use in limited space

environments

• Easy peel and stick adhesion to all

surfaces, including packages with

residual silicone mold release

• Offers low cost cooling for many

package types

• Low application force

(<5 psi/ 0.03 MPa) minimizes risk of

damage to component

• Available in a range of standard sizes

• Pliable nature allows conformance

to concave or otherwise non-flat

surfaces for optimal thermal and

mechanical performance

• Light weight (0.039 oz/in2)

• Standard parts are scored for easy

forming and alignment

• Easy removal for device

replacement

• Available die-cut on continuous rolls

TESTING SUMMARY

Summaries of test procedures used for

T-WING heat spreaders are described

below. Thermal performance, adhesion

strength and visual inspection were

used as pass/fail criteria.

Apparatus

Anatek® Thermal Analyzer: The ATA

was used to measure Rj-a before and

after environmental stressing. PQFP:

196 lead, plastic PQFPs known to

contain silicone mold release were

evaluated. T-WING Heat Spreader:

1 in x 4 in T-WING parts were applied

to the PQFP packages with a 5 psi

(0.03 MPa) mounting pressure.

FEATURES/BENEFITS

• Component junction

temperature reduction of

10 to 20°C is common

• Easily added to existing

designs to lower component

temperatures and improve

reliability

• Custom shapes available for

complex designs

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERMAL PERFORMANCE

Various sizes of T-WING heat

spreaders were applied to a 196 lead

PQFP using less than 5 psi (0.03 MPa)

bonding pressure. Within 30 minutes

of application, the test boards were

mounted in an Analysis Tech® thermal

analyzer. The devices were heated

to equilibrium (45 to 60 minutes) with

approximately 3 watt load on 3 x 3 in

(7.6 x 7.6 cm) test boards.

Two test environments were used:

restricted convention, achieved with

a 1 x 5 x 6 in (2.5 x 12.7 x 15.2 cm)

plexiglass box; and 100 LFM (30 m/

min) air flow. Results were obtained

using thermocouples for Tc (centered

on case) and Rj-a.

Environmental Stressing

Control: Specimens were maintained

for 1000 hours at standard laboratory

conditions, 23°C, 35-60% RH.

Heat Aging: Test specimens were

placed in a forced convection hot air

oven maintained at 150°C ±5°C for

1000 hours. Test specimens were then

removed and tested.

Elevated Temperature/

High Humidity:

Specimens were placed in a humidity

chamber maintained at 85°C ± 2°C

and 90%-0 +10% RH for 1000 hours.

Temperature Cycling: Specimens

were subjected to 500 cycles

from -50°C to +150°C in a Tenney

Temperature Cycling Oven.

Temperature Shock: Specimens were

subjected to 100 temperature shocks

by immersion into -50° and +150°C

liquids. Temperatures were monitored

with thermocouples.

Evaluation Procedure

Visual: All test specimens were

examined for de-bonding, delamination

or other signs that the tape was failing

after environmental stress.

Thermal Performance: T-WING

was applied to the PQFP with 5 psi

mounting pressure. After a one hour

dwell, the Rj-a of each specimen was

measured at 100 LFM and under

restricted convection conditions.

The Rj-a was again measured after

environmental stressing.

90° Peel Strength: A T-WING heat

spreader was applied to each

PQFP with 5 psi mounting pressure.

The specimens were subjected

to environmental stress and then

tested for 90° peel strength at

room temperature.

Results

Visual: There was no visual evidence

of T-WING adhesion failure to the PQFP

after the environmental stresses.

Thermal Performance: The before

and after thermal resistances are given

in Table 4. The data shows that the

thermal resistances were essentially

unchanged by the exposures.

90° Peel Strength: The results of the

peel strength tests are given above.

The data shows that the average peel

strength actually increases with high

temperature/humidity and temperature

shock, while remaining unchanged

with heat aging and decreasing slightly

with temperature cycling.

APPLICATION INSTRUCTIONS

Materials needed: Clean cotton cloth

or rag, industrial solvent, rubber gloves.

Step 1: For best results, clean the top

surface of the component using a

lint-free cotton cloth.

Step 2: Wipe the bonding surface

of the component with an industrial

solvent, such as MEK, acetone or

isopropyl alcohol. In the case of a

plastic package, select a cleaner

that will not chemically attack the

plastic substrate. Do not touch the

cleaned surface during any part of the

assembly process. If the surface has

been contaminated, repeat Steps 1

and 2.

Step 3: Remove the clear release liner

from the T-WING part, exposing the

pressure-sensitive adhesive (PSA).

Avoid touching exposed adhesive

with fingers.

Step 4: For best bond strength and

contact area, center the exposed

PSA onto the component. Press and

smooth the entire T-WING bonding

area with firm finger pressure of about

5 psi, for 5 seconds.

Note: Bond strength will increase as

a function of time as the adhesive

continues to wet out the bonding

surface. Increasing any of the

application variables (pressure,

temperature and time) can improve

bonding results.

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

Typical Thermal Properties†

(Performed on surface of 196 lead 3 Watt PQFP package) Standard Part Size in (mm)

Environment* Properties

Without

T-WING

0.5 x 2

(12.7 x 50.8)

0.5 x 3

(12.7 x 76.2)

0.75 x 3

(19.1 x 76.2)

1 x 3

(25.4 x 76.2)

1 x 4

(25.4 x 101.6)

1.5 x 4

(38.1 x

101.6)

Restricted

Convection**

Thermal Resistance

Rj-a, °C/W 26 25 23 23 22 20 19

Case

Temperature, °C 92 82 78 76 72 70 68

100 LFM***

Thermal Resistance

Rj-a, °C/W 18 16 14 14 14 13 12

Case

Temperature, °C 68 57 52 49 46 44 44

† Typical properties: these are not to be construed as specifications.

* Measured values do not account for heat losses through bottom of case and leads. Ambient temperature range from 21oC to 24oC.

** Restricted convection in a simulated notebook computer environment - a 1 x 5 x 6 in (2.54 x 12.7 x 15.2 cm) plexiglass box.

*** T-WING long axis perpendicular to air flow direction in wind tunnel.

Notes

Rj-a = thermal resistance from junction to ambient

LFM = airflow rate (linear feet per minute)

T-WING® Heat Spreaders

Typical Properties†T-WING Test Method

Physical

Color Black Visual

Total Thicknesses, in (mm) 0.013 (0.33) ASTM D374

PSA Type Silicone based --

PSA Thickness, in (mm) 0.002 (0.05) Visual

Insulator Type Black polyester --

Insulator Layer Thickness, in (mm) 0.001 (0.025) --

Weight, oz/in20.039 --

Thermal Conductor Copper --

Maximum Operating Temperature, °F (°C) 257 (125) --

Thermal Conductor Thickness, in (mm) 0.007 (0.178) --

Electrical

Dielectric Strength, Vac/mil (kVac/mm) 5,000 (200) for each

dielectric layer ASTM D149

Volume Resistivity, ohm-cm N/A ASTM D149

Dielectric Constant @ 1,000 MHz N/A ASTM D150

Dissipation Factor @ 1,000 kHz N/A Chomerics

Regulatory

Flammability Rating (See UL File E140244) V-0 UL 94

RoHS Compliant Yes Chomerics

Certification

Shelf Life, months from date of manufacture 12 Chomerics

Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90

(10 to 32) Chomerics

Typical Properties

† Typical properties: these are not to be construed as specifications .

Phone +1 781-935-4850 www.parker.com/chomerics

Environment 90° Peel Strength

oz/in gm/cm

Control 36 393

Heat Aging 36 393

High Temperature/Humidity 46 514

Temperature Shock 38 424

Temperature Cycling 30 335

Environment Before After

Heat Aging

Rj-a, °C/W Restricted Convection 20.3 20.6

Rj-a, °C/W 100 LFM 12.7 13.1

High Temperature/Humidity

Rj-a, °C/W Restricted Convection 21.4 21.4

Rj-a, °C/W 100 LFM 14.1 14

Temperature Cycling

Rj-a, °C/W Restricted Convection 21.4 21.7

Rj-a, °C/W 100 LFM 14.1 13.9

Test Procedure Result Test Method

Lap Shear - Room Temperature apply/60 min. R.T. dwell/R.T. pull 960 oz/in2 (414 kPa) ASTM D1000

Lap Shear - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 53 oz/in2 (23 kPa) ASTM D1000

90° Peel - Room Temperature apply/1 min. R.T. dwell/R.T. pull 40 oz/in (441 g/cm) ASTM B571/D2861

90° Peel - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 20 oz/in (220 g/cm) ASTM B571/D2861

Creep Adhesion, days 275°F (135°C), 7 oz/in2 (3 kPa), on aluminum >80 days, no failure P.S.T.C. No. 7

Note: Tested with a 1” x 4” (25.4 x 101.6 mm) T-WING.

Note: Average of three samples tested per ASTM B571/D2861.

Typical Adhesion Performance

Environmental Stress Thermal Performance Environmental Stress Adhesive Performance

ma mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

Part Numbers

Size (inches/mm)

A: Length, inches (mm) B: Width, inches (mm) C: Adhesive Width, inches (mm)

60-12-20264-TW10 2.0 (50.8) 0.50 (12.7) 0.50 (12.7)

60-12-20265-TW10 3.0 (76.2) 0.50 (12.7) 0.50 (12.7)

60-12-20266-TW10 3.0 (76.2) 0.75 (19.1) 0.75 (19.1)

60-12-20267-TW10 3.0 (76.2) 1.00 (25.4) 1.00 (25.4)

60-12-20268-TW10 4.0 (101.6) 1.00 (25.4) 1.00 (25.4)

60-12-20269-TW10 4.0 (101.6) 1.50 (38.1) 1.50 (38.1)

Ordering Information

T-WING® Heat Spreaders

Standard Parts: Refer to table below for part numbers and sizes. T-WING

heat spreaders are available in standard packages of 100 parts/pkg.

Custom Parts: Custom configured T-WING parts are also available. Contact

Parker Chomerics’ Applications Engineering Department for details.

Available in standard sizes 1,000 parts per plastic tray. Also available die-cut

on continuous rolls.

Folding Scores

0.0015 in. Black PET

0.007 in. RA Copper

0.0015 in. Black PET

Release Liner

0.002 in. Thermattach PSA

mlchomerics

Phone +1 781-935-4850 www.parker.com/chomerics

THERMAL GREASES

Parker Chomerics thermal greases offer a range of

performance covering the simplest to the most demanding

thermal requirements. These materials are screened,

stenciled or dispensed and require virtually no compressive

force to conform under typical assembly pressures.

TYPICAL APPLICATIONS

• Mobile, desktop, server CPUs

• Engine and transmission

control modules

• Memory modules

• Power conversion equipment

• Power supplies and UPS

• Power semiconductors

FEATURES/BENEFITS

• Silicone based materials conduct

heat between a hot component

and a heat sink or enclosure

• Fills interface variable tolerances

in electronics assemblies and heat

sink applications

• Dispensable, highly conformable

materials require no cure cycle,

mixing or refrigeration

• Thermally stable and require

virtually no compressive force to

deform under typical assembly

pressures

• Supports high power applications

requiring material with minimum

bond line thickness and high

conductivity

• Ideal for rework and field repair

situations

PERFORMANCE GUIDE

3.0

2.0

1.0

Viscosity (cps)

100,000 200,000 300,000 400,000

Thermal Conductivity (W/m-K)

T660

T650

T670

mlcmmerics

Phone +1 781-935-4850 www.parker.com/chomerics

MATERIAL APPLICATION

T650

Material is supplied in various syringe

or bulk packaging (see ordering

information) for dispensing onto

components or heat sinks. Excess

material can be wiped with a clean

cloth and suitable solvent.

T660

Packaging the same as T650.

For optimum performance, the

processor should be allowed to

reach temperatures greater than

65ºC (149°F). This causes the solder

fillers to melt and conform to the

mating surfaces, obtaining a minimum

bondline thickness at the interface.

This process only needs to occur

one time to achieve optimum thermal

performance of the grease.

T670

T670 high performance thermal grease

is supplied in easy access metal

cans or pails. Mix with a spatula and

remove the desired amount onto the

component or stencil screen. Stencil

desired pad part size onto heat sink for

immediate assembly or shipping.

† Typical properties: these are not to be construed as specifications .

* Not recommended for dielectric applications .

** Material may settle during storage, remixing may be required .

Thermal Greases

Typical Properties†T650 T660 T670 Test Method

Physical

Color Pale Blue Light Gray White Visual

Specific Gravity 2.3 2.4 2.6 ASTM D792

Viscosity, cps 190,000 170,000 350,000 --

Operating Temperature Range, ºF (ºC) -58 to 392

(-50 to 200) -58 to 392

(-50 to 200) --

Phase Transition Temperature, ºF (ºC) N/A 144 (62) N/A ASTM D3418

Weight Loss % @ 150°C, 48 Hours 0.21 0.17 <0.2 TGA

Thermal

Thermal Conductivity, W/m-K 0.8 0.9 3.0 ASTM D5470

Thermal Impedance,°C-in2/W (°C-cm2/W) @ 100 psi 0.02 (0.13) @ 50°C

0.02 (0.13) @ 65°C 0.02 (0.13) @ 50°C

0.009 (0.06) @ 65°C 0.01 (0.07) @ 50°C

0.01 (0.07) @ 65°C ASTM D5470

Heat Capacity, J/g-K 111 ASTM E1269

Coefficient of Thermal Expansion, ppm/K 300 300 150 ASTM E831

Electrical

Volume Resistivity, ohm-cm 1014 N/A 1014 ASTM D257

Voltage Breakdown, Vac/mil 150* N/A* 150* ASTM D149

Regulatory

Flammability Rating Not Tested Not Tested Not Tested UL 94

RoHS Compliant Yes Yes Yes Chomerics

Certification

Outgassing, % TML 0.21 0.17 <0.2 ASTM E595

Shelf Life, months from date of manufacture** 24 24 24 Chomerics

Storage Conditions, °F (°C) @ 50% Relative Humidity 50 to 90

(10 to 32) 50 to 90

(10 to 32) Chomerics

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Ordering Information

Thermal Greases

Material Type

T670

T660

T650

Vessel Size

Volume in cc

0080 = 80 cc in 8 ounce container

0160 = 160 cc in 8 ounce container

3790 = 1 gallon pail

65 00 YYYY

PART NUMBER:

Part Number Examples

65-00-T650-0160 = T650 Material (160 cc) in an 8 ounce container

65-00-T670-3790 = T670 Material in a 3790 cc (gallon) pail

ZZZZ

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Alumina (Al2O3): A relatively inexpensive

ceramic in powder or sintered sheet

form. Its thermal conductivity of 30

W/m-K and excellent dielectric properties

make it useful in low to moderate power

commercial applications.

Ambient Temperature: The temperature

of the air surrounding a heat source.

Apparent Thermal Conductivity:

This value differs from bulk thermal

conductivity as apparent thermal

conductivity also includes contact

resistance when measured, as described

in the Heat Transfer Fundamentals

section of this guide. Also see Thermal

Conductivity.

Arcing: An electrical discharge between

the edges of metal semiconductor

package and the metal heat sink on

which it is mounted.

Binder: A polymer (i.e. silicone,

urethanes, acrylic, epoxy etc.) used in

thermal interface materials to provide

desired mechanical, thermal and

electrical properties and hold in a stable

form the fillers whose primary purpose

is the transfer of heat. Binders are also

good electrical insulators.

Bondline Thickness: Average thickness

between heat spreading device and

components.

Boron Nitride (BN): A non-abrasive

ceramic material that has higher thermal

conductivity than alumina. Because it is

an expensive raw material, it is usually

used in high performance interface

materials.

Breakdown Voltage: The amount of

voltage required to cause a dielectric

failure through an insulator when tested

under a set of specific conditions. This

value does not imply that the insulator

can be operated at those voltages.

Burr: A thin ragged fin left on the edge

of a piece of metal (semiconductor

package or heat sink) by a cutting or

punching tool.

Calorie: A unit of energy equal to the

quantity of heat required to raise the

temperature of 1 gram of water by

one degree Celsius.

Ceramic: A name given to oxides of

metals. Ceramics are usually hard, heat

and corrosion resistant and high dielectric

strength powders that can be formed

into shapes by fusion or sintering.

Chamfer: A bevel cut into the edge of

heat sink mounting holes.

Coefficient of Thermal Expansion

(CTE) : A measure of a material’s

change in volume in response to a

change in temperature.

Compression Set: The permanent

deformation of an elastomeric material

caused by a compressive force.

Conduction: The transfer of heat

energy through matter.

Convection: The transfer of heat that

results from motion of a fluid (gas

or liquid).

Corona: An electrical discharge within

or on an insulator accompanied by

ionization of the air within or contacting

the surface of the insulator. Also called

partial discharge. It is the main mode of

insulation failure exposed to long term

AC voltages.

Creep Distance: The distance that an

insulator has to extend beyond the

edge of a semiconductor package to

prevent arcing.

Cure-In-Place: Any material that is

dispensed as a liquid and cures in

the application.

Cut-Through: A phenomenon that

occurs when sharp edges or burrs on

the metal semiconductor package or

heat sink cut through the thermal pads

and reduce or eliminate their insulating

strength.

Compression / Deflection: The

change in thickness of an elastomeric

interface material in response to a

compressive load. Because these

materials are incompressible, deflection

is accompanied by a proportional

increase in area.

Degreaser or Degreasing Solvent:

The solvent used to clean flux and other

organic residues off printed circuit boards

after they are manufactured. Interface

materials must be able to tolerate

exposure to degreasing solvents without

degrading performance.

Dielectric: A material that acts as

an insulator.

Dielectric Constant: See Permittivity.

Dielectric Strength: The voltage

gradient, expressed as kV/mm, that

will cause a dielectric failure in an

insulating material under very specific

test conditions. Dielectric strength

does not imply that the insulator can

withstand those potential gradients for

an extended period of time.

Durometer: An instrument for

measuring the hardness of rubber.

Measures the resistance to the

penetration of an indentor point into

the surface of the rubber.

Electronic Control Unit or Electronic

Control module (ECU/ECM): Various

electronic controllers, typically used in

automotive applications. (i.e. steering

and braking)

Electrical Insulator: A material having

high electrical resistivity and high

dielectric strength and therefore suitable

for separating components at different

potentials to prevent electrical contact

between them.

THERMAL MANAGEMENT GLOSSARY

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Filler: A fine, dispersible ceramic or

metallic powder (i.e. boron nitride,

alumina, graphite, silver flake, etc.) whose

thermal conductivity is at least twenty

times greater than that of the binder.

Flow Rate: The volume, mass or weight

of a fluid passing through a device of

any type, per unit of time, expressed in

gallons- or liters-per-hour.

Flux: An organic compound used to

enhance the wetting and adhesion of

metal solder to the copper surfaces on

printed circuit boards.

Footprint: The area of the base of an

electronic device which comes in contact

with a thermal interface material.

Hard Tooling: A die cutting tool

manufactured from a machined metal

block. The cost is high, therefore it

is normally used when long runs are

anticipated.

Hardness: A measure of the ability of a

material to withstand penetration by a

hard pointed object. Regarding thermal

interface materials, this property is usually

inversely proportional to the ability of a

material to conform to uneven surfaces.

Hardness Shore A (Shore D, Shore 00):

An instrument reading on a scale of

0 to 100 measuring the hardness of a

material. There are three scales: Shore 00,

A and D. Shore 00 is used for soft rubbers

like gels, Shore A is used for hard rubbers

and Shore D for inelastic plastics.

Heat (Q): A form of energy generated by

the motion of atoms or molecules. Heat

energy is expressed in units of joules.

Heat Capacity: The measure of a

material’s ability to store heat.

Heat Flow: The rate at which heat is

flowing per unit time expressed as Watts.

Heat Flux (Q/A): The rate of heat flow

per unit surface area expressed as

Watts/cm2.

Heat Transfer: The movement of heat

from one body to another (solid, liquid,

gas, or a combination) by means of

conduction, convection, or radiation.

Interface: A boundary that exists

between any two contacting surfaces.

There are five types of interfaces that

can exist between the different forms of

matter: gas-liquid, liquid-liquid, gas-solid,

liquid-solid, and solid-solid.

Junction: The junction is the active

part of a semiconductor, usually silicon,

where the current flow causes heat to

be generated.

MBLT: Minimum bond line thickness.

When two opposing substrates obtain

closest possible distance under pressure.

Micro-inch: This unit of measure, a

millionth of an inch, is used to describe

the roughness of a surface and is the

average distance between the peaks

and valleys on the surface.

Mil: A unit of length equal to one-

thousandth of an inch.

PCM: Abbreviation of phase change

material.

Permeability: A measure of a material’s

ability to align its magnetic domains in

response to an applied magnetic field.

Permittivity: A measure of a dielectric

material’s ability to polarize in response to

an applied electric field, and transmit the

electric field through the material.

Polyimide: An organic polymer with

exceptional electrical insulation and high

temperature capabilities. In film form, it

is used on everything from printed circuit

boards to space suits.

Power Supply: A self contained unit

which converts AC current to DC for

use in electronic devices.

Pressure Sensitive Adhesive (PSA):

An adhesive that is tacky at normal

temperatures and requires only slight

pressure to form a permanent bond. A

PSA requires no further cure to maintain

the bond.

PSH: Class of polymer solder

hybrid. A synergistic blend of eutectic

solder and specialty polymers. They

provide a highly reliable thermal interface

material with a resin carrier and filler

content that both melt to obtain minimum

bond line thickness.

Radiation: A heat transfer process

whereby heat is given off through

electromagnetic radiation, usually

infrared rays.

Reinforcement: A woven glass mesh or

polymer film that is used as a support in

thermal interface materials.

Permanent Set: Permanent Set is

defined as the amount of residual

displacement in a rubber part after the

distorting load has been removed.

Relaxation: Stress Relaxation is a

gradual increase in deformation of an

elastomer under constant load over

time, accompanied by a corresponding

reduction in stress level.

Rheology: The science of the

deformation and flow of materials.

Semiconductor: An electronic material

that can be an insulator under one

condition and switch to a conductor

under a different condition

Shear-Thinning: A characteristic of

a fluid whereby the fluid’s viscosity

decreases with increased shear stress.

Materials the exhibit shear-thinning

are also described as pseudoplastic.

Filled polymer resins commonly exhibit

this behavior. (Example: toothpaste is

shear-thinning. It does not flow when

left alone, but when squeezed with

increased force, it flows more readily.)

Thermal Management Glossary

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Silicon: A non-metallic element

occurring extensively in the earth’s

crust in silica and silicates. Silicon is

the basis for the junction found in most

semiconductor devices.

Solder: A mixture of metals that is used

to connect electronic devices to the

copper patterns on a printed circuit

board.

Solvent Resistance: The ability of

thermal management products to resist

swelling when exposed to organic

solvents such as degreasing solvents,

hydraulic fluids, coolants and jet fuel.

Specific Gravity: The ratio of the

density of a substance to the density

of water. The specific gravity of water

is 1 at standard condition temperature

and pressure.

Specific Heat: The amount of heat

per unit mass required to raise the

temperature by one degree Celsius.

(See Heat Capacity.)

Steel Mill Die: A die cutting tool of

moderate cost, cast from steel. It is

used for high speed cutting.

Steel Rule Die: A low cost die cutting

tool manufactured by shaping sharpened

steel foil to the desired shape and fixing

in a plywood and steel rule metal. It is

used for short runs.

Surface Finish: A measure of the

roughness of a surfaces, usually

expressed in units of micro-inches.

Swelling: A phenomenon that results

when an elastomer is exposed to a

degreasing solvent and the elastomer

absorbs the solvent. The volume of the

elastomer increases and its physical

strength is greatly reduced. In this

swollen state, the elastomer can be

easily damaged and should not be

subjected to any mechanical stress

until the elastomer has been dried.

Tear Strength: A measure of the ability

of a material to withstand tearing/ ripping

stresses. It is usually measured in pounds

force per inch of thickness.

Temperature: A measure of the average

kinetic energy of a material. The standard

unit of temperature is a Kelvin (K).

Temperature determines the direction

of heat flow between any two systems

in thermal contact. Heat will always flow

from the area of higher temperature

(T source) to one of lower temperature

(T sink).

Temperature Gradient (∆T): The

difference in temperatures in the direction

of the heat flow between two points in

a system.

Tensile Strength: A measure of the

ability of a material to withstand a

tension (pulling apart) force. It is usually

measured in MPa or psi of material

cross section.

Thermal Conductivity (K): A quantitative

measure of the ability of a material to

conduct heat expressed in units of

W/m-K.

Thermal Contact Resistance (Ri): The

resistance to the flow of heat caused by

interstitial air trapped in the irregularities

of between contacting solid surfaces.

Units are K-cm2/W.

Thermogravimetric Analysis: Chemical

analysis by the measurement of weight

changes of a system or compound as a

function of increasing temperature.

Thermal Impedance (θ): Thermal

impedance is the sum of the thermal

resistance of an interface material and

the thermal resistances at the interfaces

in contact with the material. K-in2 /Watt.

Thermal Interface Materials (TIMs):

Materials that are inserted between

two contacting solid surfaces and aid

heat flow by eliminating gaps between

the irregular surfaces. Interstitial air is

replaced by material that is significantly

more conductive than air.

Thermal Resistivity: The quantitative

measure of a material’s resistance to the

conduction of heat. (It is the inverse of

thermal conductivity.)

Thermocouple: A thermoelectric device

consisting of two dissimilar metallic wires

fused into a bead which generates a

voltage proportional to the temperature

of the bead.

Thixotropy: A characteristic of a fluid

whereby the fluid’s viscosity decreases

as a function of time at a fixed shear rate.

Viscosity tends to re-build with time as

the shear stress is reduced. (Example:

gels and colloids are often thixotropic.

The longer they are shaken in a can, the

Thermal Management Catalog Datasheet by Parker Chomerics

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