245 Flux Cored Wire Datasheet by Kester Solder

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ID- :52 kester E.I K
Product Description
Kester 245 was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry
is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of
245 results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that
obtained with mildly activated rosin flux. 245 was formerly classified as Type LR per MIL-F-14256. 245 is Bellcore GR-78
compliant.
Reliability Properties
Copper Mirror Corrosion: Low
Tested to J-STD-004, IPC-TM-650, Method
2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method
2.6.15
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.35.1
Chloride and Bromides: None
Detected
Tested to J-STD-004, IPC-TM-650, Method
2.3.35
Spread Test (typical):
Tested to J-STD-004, IPC-TM-650, Method
2.4.46
Area of
Spread mm2
(in2)
Plastic Rosin Core 194 (0.30)
285 Mildly Activated Rosin 335 (0.52)
245 No-Clean 348 (0.54)
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method
2.3.33
Surface Insulation Resistivity (SIR)
40C/90%RH, IPC (typical): Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
Surface Insulation Resistance (SIR),
IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method
2.6.3.3
Test Conditions: 85°C, 85% RH, 7 days, 100V
Blank 245
Day 1 1.33*1010 1.56*108
Day 4 8.78*109 1.48*109
Day 7 7.53*109 2.76*109
RoHS Compliance
This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the
stated banned substances. (Applies only if this core flux is combined with a lead-free alloy)
Performance Characteristics:
Highly reliable post-soldering
residue
Minimal residue
Compatible with leaded and lead
free alloys
Classified as ROL0 per J-STD-004
Compliant to Bellcore GR-78
245 Flux-Cored Wire
No-Clean Cored Wire for Lead-bearing and Lead-free Alloys
®
Technical Data Sheet
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
IEI IIE IEI kester
Cleaning
The 245 flux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will
not clean the residues off the surface of the circuit board after the soldering process. A saponifier or cleaning agent
specifically designed to clean a no-clean flux is required to clean the residues. Please contact Kester Technical Support
for further information.
Application Notes
Availability
245 cored wire is available in a wide variety of alloys, wire diameters, flux percentages and roll sizes in both leaded and
lead free alloys. Please refer to www.kester.com for wire diameters, flux percentages and roll sizes that are available.
Note: Core size 50, 58 and 66 = 1.1%, 2.2% and 3.3% flux core.
Process Considerations
Solder iron tip temperatures are most commonly between 315-343°C (600-650°F) for Sn63Pb37 and Sn62Pb36Ag02
alloys, and 371-400°C (700-750°F) for lead-free alloys. Heat both the land area and component lead to be soldered with
the iron prior to touching the land with the cored wire. Do not apply the wire directly to the soldering iron tip. If needed,
Kester 951 or 952-D6 no clean flux may be used as a compatible liquid flux to aid in reworking soldered joints. Kester 951
and 952-D6 are available in Flux-Pens® for optimum board cleanliness.
®
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
Storage and Warranty Period
Storage must be in a dry, non-corrosive environment between 10-40°C (50-104°F). The surface may lose its shine and
appear a dull shade of grey. This is a surface phenomenon and is not detrimental to product functionality. Flux-cored
solder wire has a limited warranty period determined by the alloy used in the wire. For alloys containing more than 70%
lead, the warranty period is 2 years from the date of manufacture. Other alloys have a warranty period of 3 years from the
date of manufacture.

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