DLP0NSyyyyHL2y Spec Datasheet by Murata Electronics

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8960 No. JEFL243E-0018F-O1 Chip Common Mode Choke Coil on DLPONSNSSOHL2L DLPONSN67OHL2L DLPONSNQOOHL2L DLPONSN121 HL2L DLPONSC280HL2L DLPONSCQOOHL2L |_l|_l l_|l_| |_l F‘I
Spec No. JEFL243E-0018F-01 P1/10
MURATA MFG.CO., LTD
Reference Only
0.45±0.05
(Top View)
(Bottom View)
(Side View)
0.65±0.05
0.20 +0.05/-0.10
0.85±0.05
0.50±0.10
(1) (2)
(3)(4)
:Electrode
(in : mm)
0.27±0.10
Chip Common Mode Choke Coil
DLP0NS□□□□HL2 Reference Specification
1. Scope
This reference specification applies to Chip Common Mode Choke Coil DLP0NS Series.
2. Part Numbering
(ex.) DL P 0N S N 121 H L 2 L
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
(1) Chip Common Mode Choke Coil
(2) Structure (P : Film Type)
(3) Dimension (L×W)
(4) Type
(5) Category N : General Use
C : mipi D-phy Use
(DSICSIUniPro)
3. Rating
Customer
Part Number
Murata
Part Number
Common Mode Impedance
(at 100MHz, Under
Standard Testing Condition)
Rated
Voltage
Withstanding
Voltage
Rated
Current
DC
Resistance
Insulation
Resistance
DLP0NSN350HL2L 35Ω±10Ω
5V(DC) 12.5V(DC)
100mA 1.2Ω±25%
100MΩ
min.
DLP0NSN350HL2B
DLP0NSN670HL2L 67Ω ±20% 110mA 2.4Ω±25%
DLP0NSN670HL2B
DLP0NSN900HL2L 90Ω ±20% 100mA 3.0Ω±25%
DLP0NSN900HL2B
DLP0NSN121HL2L 120Ω ±20% 90mA 3.8Ω±25%
DLP0NSN121HL2B
DLP0NSC280HL2L 28Ω±20% 100mA 1.3Ω±25%
DLP0NSC280HL2B
DLP0NSC900HL2L 90Ω±35% 75mA 4.0Ω±30%
DLP0NSC900HL2B
Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C
4. Standard Testing Conditions
<Unless otherwise specified> <In case of doubt>
Temperature : Ordinary Temperature 15 to 35°C Temperature : 20 ± 2°C
Humidity : Ordinary Humidity 25 to 85%(RH) Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
5.Style and Dimensions
Equivalent Circuits
No polarity.
Unit Mass(Typical value)
0.001g
6.Marking
No Marking.
(6) Impedance (Typ. at 100MHz)
(7) Circuit H : Characteristic Impedance 100Ω system
(8) Features
(9) Number of Line
(10) Packaging Code L : Taping / B : Bulk
(1) (2)
(4) (3)
8990 No. JEFL243E70018F701 Table 1 slee‘ Table 2
Spec No. JEFL243E-0018F-01 P2/10
MURATA MFG.CO., LTD
Reference Only
7. Electrical Performance
No. Item Specification Test Method
7.1 Common Mode
Impedance
Meet item 3. Measuring Frequency : 100±1MHz (ref.item 10.)
Measuring Equipment : KEYSIGHT4291A or the
equivalents
(In case of doubt in standard condition, the heat
treatment(200°C, about 10 minutes)shall be applied.
7.2 Withstanding
Voltage
Products shall not be damaged. Test Voltage : 2.5 times for Rated Voltage
Time : 1 to 5 seconds
Charge Current : 1 mA max.(ref.item 10.)
7.3 DC Resistance
(Rdc)
Meet item 3. Measuring current : 90mA max.(ref.item 10.)
7.4 Insulation
Resistance (I.R.)
Measuring voltage : Rated Voltage
Measuring time : 1 minute max. (ref.item 10.)
8.Mechanical Performance
No. Item Specification Test Method
8.1 Appearance and
Dimensions
Meet item 5.
Visual Inspection and measured with Slide Calipers.
8.2 Solderability The electrodes shall be at least
95% covered with new solder
coating.
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C, 6090s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240±3°C
Immersion Time : 3±0.5s
Immersion and emersion rates : 25 mm / s
8.3 Resistance to
Soldering Heat
Meet Table 1.
Table 1
Flux : Ethanol solution of rosin,25(wt)%
Pre-Heating : 150±10°C, 6090s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270±5°C
Immersion Time : 5±1s
Immersion and emersion rates : 25 mm / s
Then measured arter exposure in the room condition
for 4 to 48 hours.
8.4 Drop It shall be dropped on concrete or steel board.
Method : free fall
Height : 1m
The Number of Times : 10 times
8.5 Vibration It shall be soldered on the substrate.
Oscillation Frequency : 10 to 2000 to 10Hz for 15
minutes
Total amplitude : 3.0 mm or Acceleration amplitude
196 m/s2 whichever is smaller.
Testing Time : A period of 2 hours in each of 3
mutually perpendicular directions.
8.6 Bending
Strength
Meet Table 2.
Table 2
Substrate : (t =1.0 mm).
Deflection : 3 mm
Speed of Applying Force : 1.0 mm / s
Keeping time : 5 seconds
Appearance No damaged
Common Mode
Impedance
Change
within ± 20%
I.R. 100MΩ min.
DC Resistance
Change within ± 30%
45
R230
F
Deflection
45 Product
Pressure jig
Appearance No damaged
DC Resistance
Change within ± 30%
8990 No. JEFL243E70018F701 GmiGo , BmiBo
Spec No. JEFL243E-0018F-01 P3/10
MURATA MFG.CO., LTD
Reference Only
9.Environmental Performance (Products shall be soldered on the glass-epoxy substrate)
No. Item Specification Test Method
9.1 Temperature
Cycle
Meet Table 1. 1 Cycle
Step 1 -40°C(+0°C,-3°C) / 30(+3,-0) min
Step 2 Ordinary Temp. / within 3 min
Step 3 +85(+3°C,-0°C) / 30(+3,-0) min
Step 4 Ordinary Temp. / within 3 min
Total of 100 cycles.
Then measured after exposure in the room condition
for 4 to 48 hours.
9.2 Humidity Temperature : 40±2°C
Humidity : 90 to 95 % (RH)
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
9.3 Heat life Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours. (ref. Item 10.)
9.4 Cold Resistance Temperature : -40± 2°C
Time : 1000 hours(+48 hours,-0 hours)
Then measured after exposure in the room condition
for 4 to 48 hours.
10. Terminal to be Tested.
When measuring and supplying the voltage,the following terminal is applied.
No. Item Terminal to be Tested
10.1 Common Mode
Impedance
10.2
Withstanding Voltage
Insulation Resistance
Heat Life
10.3 DC Resistance
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance, residual
inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Z using the formula below.
Z = (Rx2+Xx2) 1/2
Where
Rx = Gm - Go
(Gm-Go) + (Bm-Bo) Rs
Xx = - (Bm - Bo)
(Gm-Go) + (Bm-Bo) Xs
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the
case of being specified special condition.
IN OUT
IN
OUT
IN OUT
IN OUT
Spec No. JEFL243E-0018 1 10000 1000 100 Impedanceln] 10 710 -15 720 725 Insertion Loss(Common)[dB] lnsenion LossldB] DLPONSC Series nwnNswnmz DLvnNsnxomz I I D ‘ 00 Frequencywnx] mvousmom mousmaom 1 1 0 1 00 Frequency[MH1] nwmsamm 1 1 0 1 00 Frequency[MH1] 1 000 1 000 ‘ 0000 1 0000 1 0000 10000 1000 ‘ Impedanceln] Insemon Loss(Common)[dB] Insertion Loss[d3] 100 10 DLPONSN Series nwwsmzmz uwwsusnom uwowsusrom uwnmuhnxn DwaNsuzmx I0 100 1000 10000 FrequencylMHx] DwnNSNziuan mmNsNeanz DxPnNsNawHLz owuNsmszz 10 100 1000 10000 Frequen(y[MH1] uwwsmsnm nwoNstmm uwwsmmm mvnNsmnm 7 10 100 1000 10000 Frequencv[MH1]
Spec No. JEFL243E-0018F-01 P4/10
MURATA MFG.CO., LTD
Reference Only
13.Impedance Frequency Characteristics(Typical)
DLP0NSC Series DLP0NSN Series
DLP0NSC280HL2
Reference On 8960 No. JEFL243E-0018F-O1 m] E (4)]D \ii,» ‘9‘ . u may m \L ‘ 3 ‘ lama m 14.3 Pu 14.4 P2 0.2 Sp E % %/ / F'la 14.5 Dim
Spec No. JEFL243E-0018F-01 P5/10
MURATA MFG.CO., LTD
Reference Only
14.Specification of Packaging
14.1 Appearance and Dimensions ( 8mm-wide, 2mm pitch Plastic tape)
*Dimension of the Cavity is measured
at the bottom side.
(in:mm)
14.2 Specification of Taping
(1)Packing quantity(Standard quantity) 10000 pcs. / reel
(2)Packing Method
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.
(3)Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4)Spliced point
The cover tape have no spliced point.
(5)Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
14.3 Pull Strength of Plastic Tape
Plastic Tape 5N min.
Cover Tape 10N min.
14.4 Peeling off force of Cover Tape
0.2 to 0.7N(Minimum value is Typical)
Speed of Peeling off : 300 mm/min.
14.5 Dimensions of Leader-tape, Trailer and Reel
(in:mm)
165 to 180 degree FCover tape
Plastic tape
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
(1)(2)(3)(4) indicates
terminal number
(1) (2)
(3)
(4)
φ
1.5+0.1
送り穴
引き出し方向
キャビティ
-0
2.0±0.1
2.0±0.05
0.75±0.05
0.95±0.05
4.0±0.1
1.75±0.1
3.5±0.05
8.0±0.2
0.55±0.05
0.25±0.05
Direction of feed
Cavity
Sprocket Hole
8960 No. JEFL243E-0018F-01 ber(«1), 0000 & Outer Case Dimensions Case I W D H 186 186 93 5 Flux Use rosinrbased flux, but not highly acidic flux (with chlorine comem exceeding 0 2(M)% ) Solder Use Sn73.0AgrO.SCu solder
Spec No. JEFL243E-0018F-01 P6/10
MURATA MFG.CO., LTD
Reference Only
14.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity, etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
14.7 Marking for Outside package
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS marking(2), Quantity, etc
14.8 Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
WDH
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
15.
!Caution
15.1 Mounting Direction
Mount products in right direction.
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also flames or
other serious trouble.
15.2 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and / or reliability
requirements to the applications listed in the above.
16. Notice
This product is designed for solder mounting. (reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solde
r
Use Sn-3.0Ag-0.5Cu solde
r
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
Z Z
right direction wrong direction
W
D
Label
H
8960 No. JEFL243E-0018F-01 (3) Mounting Componen When a componenl i during lhe lighlening ©|:I->|:I Screw Hale Recommended 16.5 Attention Regarding F‘C‘B‘ De < the="" arrangement="" of="" producls=""> P.C.B. shall be designed so lh far from lhe ponion of perforal The ponion of perforalion shal as narrow as possible, and sha so as nor lo be applled lhe sire case of P C B separalion
Spec No. JEFL243E-0018F-01 P7/10
MURATA MFG.CO., LTD
Reference Only
16.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is
limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
16.3 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be location the sideways
Direction (Length : a<b) to the machanical Stress.
Warping direction
roducts(warping direction 1, warping direction
2) shall be located carefully so that products
are not subject to the mechanical stress due to
warping the board. Because they may be
subjected the mechanical stress in order of
warping direction 1>warping direction 2.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB,
therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
16.5 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Poor example
Good example
b
a
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Perforation
Slit
A
B
b
a
b
a
Warping direction 1 Warping direction 2
Screw Hole Recommended
Reference Onl S 60 No. JEFL243E-0018F-O1 wan /////% omvo
Spec No. JEFL243E-0018F-01 P8/10
MURATA MFG.CO., LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
0.80
0.30
0.30
0.90
*(1)(2)(3)(4)Indicates terminal number
Resist
Copper foil pattern
No pattern
(in : mm)
(1) (2)
(4) (3)
0.50
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.6 Attention Regarding P.C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 1005 size or 0603 size.
16.7 Standard Land Dimensions
16.8 Soldering(Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
Product
P.C.B.
Hole
×
Standard Profile
Limit Profile
Temp.
Time
90s±30s
230
260
245℃±3
220℃
30s60s
60s max.
180
150
(s)
(℃)
Spec No. JEFL243E-0018F-O1 a Standard thickness of the solder paste should be 100 to 150um. o Use the solder paste priming pattern of the right pattern, 0 For the resist and copper foil pattern. use standard land dimensions, $ o Use Sn-3.0Ag-0.5Cu solder. (1) Standard printing pattern ot solder paste ———1 (a (2) Reworking with Soldering iron . The following conditions shall be strictly followed when using a soldering iron afler be mounted by reflow soldering. Pre»heating: 150°C. 1 min Soldering iron output: 30W max. - Tip temperature: 380°C max. Tip diameterzwsmm max. - Soldering time : 3(+1.-0) seconds. Times : 2times max. . Do not touch the products directly with the tip of the soldering iron. (3) Solder Volume Solder shall be used not to be exceeded the upper limits as shown below. uppei Limit Recommendahle Upper Lllltlt Recommendahle I var § 1 § T (T Chipthickness) Accordingly increasing the solder volume. the mechanical stress to product is also increa Excessive solder volume may cause the tailure ot mechanical or electrical pertormance. 16.9 Cleaning Conditions Products shall be cleaned on the folloWing conditions. (1) Cleaning temperature shall be limited to 60°C max, (40°C max. tor lsopropyl alcohol.) (2) Ultrasonic cleaning shall comply with the following conditions. avoiding the resonance phen at the mounted products and PC. . ~ Power : 20W] 1 max, ~ Frequency : ZBkHz to 40kHz ~ Time : 5 minutes max. (3) Cleaner 1. Alternative cleaner . lsopropyl alcohol (IPA) Z. Aqueous agent . PINE ALPHA ST»100S (4) There shall be no residual flux and residual cleaner after cleaning. In the case ot using aqueous agent. products shall be dried completely after rinse with de-i water in order to remove the cleaner. (5) Other cleaning Please contact us, 16.10 Handling of a substrate After mounting products on a substrate. do not apply any stress to the product caused by be the substrate when cropping the substrate. inserting and removing a connector trom the subs screw to the substrate. Excessive mechanical stress may cause cracking in the product. Bending TWisting 16.11 Operating Environment Do not use this product under the following environmental conditions. on deterioration such as insulation resistance may result from the use, (1) in corrosive gases (acidic gases. alkaline gases. chlorine. sulfur gases. organic gases an (2) in the atmosphere where liquid such as organic solvent. may splash on the products. MURATA MFG.CO.. LTD
Spec No. JEFL243E-0018F-01 P9/10
MURATA MFG.CO., LTD
Reference Only
(1) Standard printing pattern of solder paste
Standard thickness of the solder paste should be 100 to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land dimensions.
Use Sn-3.0Ag-0.5Cu solder.
(2) Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron after being
mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 380°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Do not touch the products directly with the tip of the soldering iron.
(3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
16.9 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
Power : 20W/ l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner Isopropyl alcohol (IPA)
2. Aqueous agent PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
16.11 Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance,
such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
1/3 T t T T : Chip thickness
t
Upper Limit
Upper Limit
Recommendable
Recommendable
(in mm)
0.50
(inmm)
0.30
0.30 0.30 0.30
Reference On 8960 No. JEFL243E-0018F-O1
Spec No. JEFL243E-0018F-01 P10/10
MURATA MFG.CO., LTD
Reference Only
16.12 Storage Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity : 15 to 85% relative humidity
No rapid change on temperature and humidity
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to prevent the
following deterioration.
Poor solderability due to the oxidized electrode.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
17.
!Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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