SOP-J8 Taping Spec Datasheet by Rohm Semiconductor

Molding Resin Die Bonding Wire Lead / Die Attach Die Pad
Package Information : SOP-J8
1. Package Information
  Package Name SOP-J8
     Type    SOP
     Pin Count    8
     Outline Dimension
Drowing No.    EX111-5001
     Package Weight [g]    0.08
     Lead Finish    Pure Tin
     MSL Level    Level1
2. Package Structure
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Direction oHeed Pocket Quadrants —> Reel Hg 1 Quadrant Aes-gnments (or PW 1 onentatxon m Tape E2 PIN1 we placed (othetoplefl corner TR PW! us p‘aced tethetopugm comer TL PW! vs placed wme \owerlefl E1 PM ‘5 p‘aced tome lower ngm Pee‘back 16510 130’ Pee‘back speed 300i10mm/mvn $5
SOP-J8                           Package Information
3. Packing Specification
3.1 Packing form, Quantity, PIN1 Orientation
Packing Form Tape&Reel
Packing Quantity [pcs] 2,500
PIN 1 Orientation E2
3.2 Use material
 Item Material
 Embossed carrier tape PS
Cover tape PET+PE
Reel PS
Air cap PE
Unit box Cardboard
 Shipping box Cardboard
3.3 Leader specification
No component pockets are 320 mm or more.
3.4 Trailer specification
No component pockets are 80 mm or more. Tape is free from reel.
3.5 Peelback strength
Cover tape peelback strength is 0.2 N to 0.7 N.
Fig. 2 Test method
3.6 Missing Ics
(1) No consecutive dropouts.
(2) A maximun 0.1 % of specified number of products in each packing may be missing.
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
(unitzmm) Tape Dimension Tape Tolerance 6.80 5.50 (p15 $1.5 1,75 5.50 2.00 4.00 8.00 2.00 0.30 12.0 10.1 10.1 +0.1/-0 MIN 10.1 10.1 10.1 10.1 10.1 10.1 10.3
SOP-J8                           Package Information
3.7 Tape and Reel Specification
3.7.1 Tape Dimension
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
SOP-J8                           Package Information
3.7.2 Reel Dimension
      Reel Dimension       Reel Tolerance    
 A 330       ±2.0    
B 80 ±1.0
C 13 ±0.2
D 21 ±0.8
E 2 ±0.5
W1 13.5 ±1.0
 W2  17.5       ±1.0    
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Unit box (Unitzmm) R | ee Labe‘ Aircap |:> o 0 fl 0 O O O O O O 000 r) “I 346 355 Product No. Oul going inspeclion stamp BX1234XXX- XX ( ) E _ E Quanli1y \ ‘UIIIIIHHHIIMIIIIWHIWW 2 Doopcs 0124 A5110F BX1234XXX xx W1 ( ) Lol number MNo «24 n2: pcs Pb MND 12} 324 pas @ MADE «4 PMUPMES _ Imemal produd code Markmg lot number Pb Free Mark
SOP-J8                           Package Information
3.8 Packing Method
1reel(s) or less per unit box
3.9 Packing Style
5unit boxes or less per shipping box
Shipping Box Dimension
X 372
Y 368
 Z  305
3.10 Label Specification
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
3.9 0.76 1.35
SOP-J8                           Package Information
4. Footprint dimensions
In actual design, please optimize in accordance with the situation of your board design and soldering
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
\—. Production lot number Production week code Producxion year code
SOP-J8                           Package Information
5. Marking Specification
6. Storage conditions
6.1 Storage environment
Recommended storage conditions
          Min.  Max.     Unit
 Temperature 5 30 °C
 Humidity 40  70     % RH
6.2 Storage period
         Min.  Max.     Unit
 Storage period -  1    year
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
Package surface temperature 26° CMAX Pvehealmglempevamle 130‘c~190”c Preheaung zone 12059:: MAX Soldenng ‘emperzlme 22m ~ 230% Soldenng Empemm Solderlng zone 50sec MAX 1~4“ C/sec iNonce) \. Maxumum 2rumes somenng Preneaung tempevalule \ Time 10secMAX Preheahng Zone Soldenng Zone
SOP-J8                           Package Information
7. Soldering conditions
7.1 Recommended temperature profile for reflow
7.2 Recommended condition for wave soldering
Preheating temperature : 120 °C to 150 °C
Preheating time : 60 sec MAX
Soldering temperature : 260 °C ±3 °C
Soldering time : 12 sec MAX
Notes for wave soldering
(1)Soldering time is provided for total soldering time in case of dual wave soldering.
(2) Do not use other soldering methods with wave soldering.
(3) Recommend to clean the board to eliminate flux, solder waste,
and other impurities for reliability, after soldering.
(4) Optimize soldering condition to prevent solder bridging.
7.3 Recommended condition for solder iron
Solder iron temperature : 380 °C or less
Mounting time : 4 sec or less
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©2016 ROHM Co., Ltd. All rights reserved 2016/09/19 - Rev. 001
© 201 ROHM Co., Ltd. All rights reserved.
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