TPS51200 Datasheet by Texas Instruments

l TEXAS INSTRUMENTS V'.‘
2
3
4
5
1
9
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10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
3.3 VIN
PGOOD
SLP_S3
VTTREF
VLDOIN
VTT
VDDQ
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS51200
SLUS812D FEBRUARY 2008REVISED FEBRUARY 2020
TPS51200 Sink and Source DDR Termination Regulator
1
1 Features
1 Input Voltage: Supports 2.5-V Rail and 3.3-V Rail
VLDOIN Voltage Range: 1.1 V to 3.5 V
Sink and Source Termination Regulator Includes
Droop Compensation
Requires Minimum Output Capacitance of 20-μF
(Typically 3 × 10-μF MLCCs) for Memory
Termination Applications (DDR)
PGOOD to Monitor Output Regulation
EN Input
REFIN Input Allows for Flexible Input Tracking
Either Directly or Through Resistor Divider
Remote Sensing (VOSNS)
±10-mA Buffered Reference (REFOUT)
Built-in Soft Start, UVLO, and OCL
Thermal Shutdown
Supports DDR, DDR2, DDR3, DDR3L, Low-
Power DDR3, and DDR4 VTT Applications
10-Pin VSON Package With Thermal Pad
2 Applications
Memory Termination Regulator for DDR, DDR2,
DDR3, DDR3L, Low-Power DDR3 and DDR4
Notebooks, Desktops, and Servers
Telecom and Datacom
Base Stations
LCD-TVs and PDP-TVs
Copiers and Printers
Set-Top Boxes
3 Description
The TPS51200 device is a sink and source double
data rate (DDR) termination regulator specifically
designed for low input voltage, low-cost, low-noise
systems where space is a key consideration.
The TPS51200 maintains a fast transient response
and requires a minimum output capacitance of only
20 μF. The TPS51200 supports a remote sensing
function and all power requirements for DDR, DDR2,
DDR3, DDR3L, Low-Power DDR3 and DDR4 VTT
bus termination.
In addition, the TPS51200 provides an open-drain
PGOOD signal to monitor the output regulation and
an EN signal that can be used to discharge VTT
during S3 (suspend to RAM) for DDR applications.
The TPS51200 is available in the thermally efficient
10-pin VSON thermal pad package, and is rated both
Green and Pb-free. It is specified from –40°C to
+85°C.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TPS51200 VSON (10) 3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified DDR Application
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Typical Characteristics.............................................. 8
7 Detailed Description............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 17
8 Application and Implementation ........................ 18
8.1 Application Information............................................ 18
8.2 Typical Application ................................................. 18
8.3 System Examples ................................................... 21
9 Power Supply Recommendations...................... 27
10 Layout................................................................... 27
10.1 Layout Guidelines ................................................. 27
10.2 Layout Example .................................................... 28
10.3 Thermal Design Considerations............................ 28
11 Device and Documentation Support ................. 30
11.1 Device Support...................................................... 30
11.2 Documentation Support ....................................... 30
11.3 Community Resources.......................................... 30
11.4 Trademarks........................................................... 30
11.5 Electrostatic Discharge Caution............................ 30
11.6 Glossary................................................................ 30
12 Mechanical, Packaging, and Orderable
Information ........................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (November 2016) to Revision D Page
Added "keep total REFOUT capacitance below 0.47 μF" in Pin Functions table ................................................................. 4
Changes from Revision B (September 2016) to Revision C Page
Added references to DDR3L DRAM technology throughout.................................................................................................. 1
Added DDR3L test conditions to Output DC voltage, VO and REFOUT specification .......................................................... 6
Added Figure 4....................................................................................................................................................................... 8
Added Figure 9....................................................................................................................................................................... 9
Updated Figure 16 to include DDR3L data .......................................................................................................................... 10
Changes from Revision A (September 2015) to Revision B Page
Changed " –10 mA < IREFOUT < 10 mA" to "–1 mA < IREFOUT < 1 mA" in all test conditions for the REFOUT voltage
tolerance to VREFIN specification ............................................................................................................................................. 7
Changed all MIN and MAX values from "15" to "12" for all test conditions for the REFOUT voltage tolerance to
VREFIN specification ................................................................................................................................................................. 7
Updated Figure 19 ............................................................................................................................................................... 12
Added REFOUT (VREF) Consideration for DDR2 Applications section................................................................................. 16
Updated Figure 28 and Table 3............................................................................................................................................ 21
Added clarity to Layout Guidelines section. ......................................................................................................................... 27
Changes from Original (February 2008) to Revision A Page
Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .............................. 1
Changed “PowerPAD” references to “thermal pad” throughout ............................................................................................. 4
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Deleted Dissipation Ratings table .......................................................................................................................................... 5
*9 TEXAS INSTRUMENTS
REFIN 1
2
3
4
5
VLDOIN
VO
PGND
VOSNS
10
9
8
7
6
VIN
PGOOD
GND
EN
REFOUT
Thermal
Pad
4
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(1) I = Input, O = Output , G = Ground
(2) Thermal pad connection. See Figure 35 in the Thermal Design Considerations section for additional information.
5 Pin Configuration and Functions
DRC Package
10-Pin VSON
Top View
Pin Functions
PIN I/O(1) DESCRIPTION
NAME NO.
EN 7 I For DDR VTT application, connect EN to SLP_S3. For any other application, use the EN pin as the ON/OFF
function.
GND 8 G Signal ground.
PGND(2) 4 G Power ground for the LDO.
PGOOD 9 O Open-drain, power-good indicator.
REFIN 1 I Reference input.
REFOUT 6 O Reference output. Connect to GND through 0.1-μF ceramic capacitor. If there is a REFOUT capacitors at DDR
side, keep total capacitance on REFOUT pin below 0.47 μF. The REFOUT pin can not be open.
VIN 10 I 2.5-V or 3.3-V power supply. A ceramic decoupling capacitor with a value between 1-μF and 4.7-μF is required.
VLDOIN 2 I Supply voltage for the LDO.
VO 3 O Power output for the LDO.
VOSNS 5 I Voltage sense input for the LDO. Connect to positive terminal of the output capacitor or the load.
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal unless otherwise noted.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage(2)
REFIN, VIN, VLDOIN, VOSNS –0.3 3.6
VEN –0.3 6.5
PGND to GND –0.3 0.3
Output voltage(2) REFOUT, VO –0.3 3.6 V
PGOOD –0.3 6.5
Operating junction temperature, TJ–40 150 °C
Storage temperature, Tstg –55 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltages VIN 2.375 3.500 V
Voltage
EN, VLDOIN, VOSNS –0.1 3.5
V
REFIN 0.5 1.8
PGOOD, VO –0.1 3.5
REFOUT –0.1 1.8
PGND –0.1 0.1
Operating free-air temperature, TA–40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1)
TPS51200
UNITDRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 55.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 84.6 °C/W
RθJB Junction-to-board thermal resistance 30.0 °C/W
ψJT Junction-to-top characterization parameter 5.5 °C/W
ψJB Junction-to-board characterization parameter 30.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 10.9 °C/W
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(1) Ensured by design. Not production tested.
6.5 Electrical Characteristics
Over recommended free-air temperature range, VVIN = 3.3 V, VVLDOIN = 1.8 V, VREFIN = 0.9 V, VVOSNS = 0.9 V, VEN = VVIN, COUT
= 3 × 10 μF and circuit shown in Figure 24. (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IIN Supply current TA= 25 °C, VEN = 3.3 V, No Load 0.7 1 mA
IIN(SDN) Shutdown current
TA= 25 °C, VEN = 0 V, VREFIN = 0,
No Load 65 80
μA
TA= 25 °C, VEN = 0 V, VREFIN > 0.4 V, No
Load 200 400
ILDOIN Supply current of VLDOIN TA= 25 °C, VEN = 3.3 V, No Load 1 50 μA
ILDOIN(SDN) Shutdown current of VLDOIN TA= 25 °C, VEN = 0 V, No Load 0.1 50 μA
INPUT CURRENT
IREFIN Input current, REFIN VEN = 3.3 V 1 μA
VO OUTPUT
VVOSNS Output DC voltage, VO
VREFOUT = 1.25 V (DDR1), IO= 0 A 1.25 V
–15 15 mV
VREFOUT = 0.9 V (DDR2), IO= 0 A 0.9 V
–15 15 mV
VREFOUT = 0.75 V (DDR3), IO= 0 A 0.75 V
–15 15 mV
VREFOUT = 0.675 V (DDR3L), IO= 0 A 0.675 V
–15 15 mV
VREFOUT = 0.6 V (DDR4), IO= 0 A 0.6 V
–15 15 mV
VVOTOL Output voltage tolerance to REFOUT –2 A < IVO < 2 A 25 25 mV
IVOSRCL VO source current Limit With reference to REFOUT,
VOSNS = 90% × VREFOUT 3 4.5 A
IVOSNCL VO sink current Limit With reference to REFOUT,
VOSNS = 110% × VREFOUT 3.5 5.5 A
IDSCHRG Discharge current, VO VREFIN = 0 V, VVO = 0.3 V, VEN = 0 V, TA
= 25°C 18 25
POWERGOOD COMPARATOR
VTH(PG) VO PGOOD threshold
PGOOD window lower threshold with
respect to REFOUT –23.5% –20% –17.5%
PGOOD window upper threshold with
respect to REFOUT 17.5% 20% 23.5%
PGOOD hysteresis 5%
tPGSTUPDLY PGOOD start-up delay Start-up rising edge, VOSNS within 15%
of REFOUT 2 ms
VPGOODLOW Output low voltage ISINK = 4 mA 0.4 V
tPBADDLY PGOOD bad delay VOSNS is outside of the ±20% PGOOD
window 10 μs
IPGOODLK Leakage current(1) VOSNS = VREFIN (PGOOD high
impedance), VPGOOD = VVIN + 0.2 V 1μA
REFIN AND REFOUT
VREFIN REFIN voltage range 0.5 1.8 V
VREFINUVLO REFIN undervoltage lockout REFIN rising 360 390 420 mV
VREFINUVHYS REFIN undervoltage lockout
hysteresis 20 mV
VREFOUT REFOUT voltage REFIN V
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Electrical Characteristics (continued)
Over recommended free-air temperature range, VVIN = 3.3 V, VVLDOIN = 1.8 V, VREFIN = 0.9 V, VVOSNS = 0.9 V, VEN = VVIN, COUT
= 3 × 10 μF and circuit shown in Figure 24. (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VREFOUTTOL REFOUT voltage tolerance to VREFIN
–1 mA < IREFOUT < 1 mA,
VREFIN = 1.25 V –12 12
mV
–1 mA < IREFOUT < 1 mA,
VREFIN = 0.9 V –12 12
–1 mA < IREFOUT < 1 mA,
VREFIN = 0.75 V –12 12
–1 mA < IREFOUT < 1 mA,
VREFIN = 0.675 V –12 12
–1 mA < IREFOUT < 1 mA,
VREFIN = 0.6 V –12 12
IREFOUTSRCL REFOUT source current limit VREFOUT = 0 V 10 40 mA
IREFOUTSNCL REFOUT sink current limit VREFOUT = 0 V 10 40 mA
UVLO AND EN LOGIC THRESHOLD
VVINUVVIN UVLO threshold Wake up, TA= 25°C 2.2 2.3 2.375 V
Hysteresis 50 mV
VENIH High-level input voltage Enable 1.7
VVENIL Low-level input voltage Enable 0.3
VENYST Hysteresis voltage Enable 0.5
IENLEAK Logic input leakage current EN, TA= 25°C –1 1 μA
THERMAL SHUTDOWN
TSON Thermal shutdown threshold(1) Shutdown temperature 150 °C
Hysteresis 25
l TEXAS INSTRUMENTS I 3 940 790 mu e70
1±2±1 0±3
Output Current (A)
550
570
590
610
630
650
670
Output Voltage (mV)
32
0°C
25°C
85°C
± 40°C
TA
1±2±1 0±3
Output Current (A)
0.9
0.95
1.05
1.1
1.2
1.25
1.3
Output Voltage (V)
32
1.15
1
0°C
25°C
85°C
± 40°C
TA
1±2±1 0±3
Output Current (A)
700
710
730
740
760
780
790
Output Voltage (mV)
32
0°C
25°C
85°C
± 40°C
TA
770
750
720
1±2±1 0±3
Output Current (A)
1.18
1.2
1.22
1.24
1.26
1.28
1.3
Output Voltage (V)
32
0°C
25°C
85°C
± 40°C
TA
1±2±1 0±3
Output Current (A)
880
890
900
910
920
930
940
Output Voltage (mV)
32
0°C
25°C
85°C
± 40°C
TA
870
8
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6.6 Typical Characteristics
3 × 10-µF MLCCs (0805) are used on the output
VVIN = 3.3 V DDR
Figure 1. Load Regulation
VVIN = 3.3 V DDR2
Figure 2. Load Regulation
VVIN = 3.3 V DDR3
Figure 3. Load Regulation
VVIN = 3.3 V DDR3L
Figure 4. Load Regulation
VVIN = 3.3 V LP DDR3 or DDR4
Figure 5. Load Regulation
VVIN = 2.5 V DDR
Figure 6. Load Regulation
l TEXAS INSTRUMENTS aoo 720 750 1 255 905
5±10 ±5 0±15
REFOUT Output Current (mA)
1.247
1.249
1.25
1.252
1.254
1.255
Output Voltage (V)
1510
1.248
1.251
1.253
25°C
85°C
± 40°C
TA
5±10 ±5 0±15
REFOUT Output Current (mA)
897
899
900
902
904
905
Output Voltage (mV)
1510
898
901
903
25°C
85°C
± 40°C
TA
1±2±1 0±3
Output Current (A)
500
550
600
650
700
750
Output Voltage (mV)
32
0°C
25°C
85°C
± 40°C
TA
Output Current (A)
±3±2±1 0 1 2
620
630
640
650
660
670
680
690
700
710
720
TA
±40°C
0°C
25°C
85°C
3
Output Voltage (mV)
1±2±1 0±3
Output Current (A)
0.8
0.75
0.8
0.85
0.95
1
Output Voltage (V)
32
0.9
0°C
25°C
85°C
± 40°C
TA
1±2±1 0±3
Output Current (A)
650
675
700
725
825
800
Output Voltage (mV)
32
750
0°C
25°C
85°C
± 40°C
TA
9
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Typical Characteristics (continued)
3 × 10-µF MLCCs (0805) are used on the output
VVIN = 2.5 V DDR2
Figure 7. Load Regulation
VVIN = 2.5 V DDR3
Figure 8. Load Regulation
VVIN = 2.5 V DDR3L
Figure 9. Load Regulation
VVIN = 2.5 V LP DDR3 or DDR4
Figure 10. Load Regulation
DDR
Figure 11. REFOUT Load Regulation
DDR2
Figure 12. REFOUT Load Regulation
l TEXAS INSTRUMENTS 755 can 605 200 200 Phase (n Gam (am
60
50
30
20
10
0
±10
±20
±30
1 k 100 k 10 M
Frequency (Hz)
Gain (dB)
Phase (°)
10 k 1 M
Gain
Phase
200
150
100
50
0
±50
±100
±150
±200
40
60
50
30
20
10
0
±10
±20
±30
1 k 100 k 10 M
Frequency (Hz)
Gain (dB)
Phase (°)
10 k 1 M
Gain
Phase
200
150
100
50
0
±50
±100
±150
±200
40
5±10 ±5 0±15
REFOUT Output Current (mA)
597
599
600
602
604
605
Output Voltage (mV)
1510
598
601
603
25°C
85°C
± 40°C
TA
2.50.5 1 20
Output Current (A)
0
0.4
0.6
1.2
1.4
DROPOUT Voltage (V)
3.53
0.2
0.8
1
1.5
0.75
0.9
1.25
VOUT (V)
0.675
0.6
5±10 ±5 0±15
REFOUT Output Current (mA)
747
749
750
752
754
755
Output Voltage (mV)
1510
25°C
85°C
± 40°C
TA
748
751
753
REFOUT Output Current (mA)
-15 -10 -5 0 5 10
672
673
674
675
676
677
678
679
680
Output Voltage (mV)
TA
±40°C
25°C
85°C
15
10
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Typical Characteristics (continued)
3 × 10-µF MLCCs (0805) are used on the output
DDR3
Figure 13. REFOUT Load Regulation
DDR3L
Figure 14. REFOUT Load Regulation
LP DDR3 or DDR4
Figure 15. REFOUT Load Regulation Figure 16. DROPOUT Voltage vs. Output Current
DDR2
Figure 17. Bode Plot
DDR3
Figure 18. Bode Plot
l TEXAS INSTRUMENTS
+
+
1REFIN
10VIN
7EN
5VOSNS
8GND
2.3 V
REFINOK
ENVTT
2 VLDOIN
6 REFOUT
4 PGND
3 VO
9 PGOOD
+
+
+
++
Start-up
Delay
DchgREF
DchgVTT
UVLO
Gm
Gm
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7 Detailed Description
7.1 Overview
The TPS51200 device is a sink and source double data rate (DDR) termination regulator specifically designed for
low input voltage, low-cost, low-noise systems where space is a key consideration.
The device maintains a fast transient response and only requires a minimum output capacitance of 20 μF. The
device supports a remote sensing function and all power requirements for DDR, DDR2, DDR3, DDR3L, Low
Power DDR3, and DDR4 VTT bus termination.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Sink and Source Regulator (VO Pin)
The TPS51200 is a sink and source tracking termination regulator specifically designed for low input voltage,
low-cost, and low external component count systems where space is a key application parameter. The device
integrates a high-performance, low-dropout (LDO) linear regulator that is capable of both sourcing and sinking
current. The LDO regulator employs a fast feedback loop so that small ceramic capacitors can be used to
support the fast load transient response. To achieve tight regulation with minimum effect of trace resistance,
connect a remote sensing terminal, VOSNS, to the positive terminal of each output capacitor as a separate trace
from the high current path from VO.
7.3.2 Reference Input (REFIN Pin)
The output voltage, VO, is regulated to REFOUT. When REFIN is configured for standard DDR termination
applications, REFIN can be set by an external equivalent ratio voltage divider connected to the memory supply
bus (VDDQ). The TPS51200 device supports REFIN voltages from 0.5 V to 1.8 V, making it versatile and ideal
for many types of low-power LDO applications.
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Feature Description (continued)
7.3.3 Reference Output (REFOUT Pin)
When it is configured for DDR termination applications, REFOUT generates the DDR VTT reference voltage for
the memory application. It is capable of supporting both a sourcing and sinking load of 10 mA. REFOUT
becomes active when REFIN voltage rises to 0.390 V and VIN is above the UVLO threshold. When REFOUT is
less than 0.375 V, it is disabled and subsequently discharges to GND through an internal 10-kMOSFET.
REFOUT is independent of the EN pin state.
7.3.4 Soft-Start Sequencing
A current clamp implements the soft-start function of the VO pin. The current clamp allows the output capacitors
to be charged with low and constant current, providing a linear ramp-up of the output voltage. When VO is
outside of the powergood window, the current clamp level is one-half of the full overcurrent limit (OCL) level.
When VO rises or falls within the PGOOD window, the current clamp level switches to the full OCL level. The
soft-start function is completely symmetrical and the overcurrent limit works for both directions. The soft-start
function works not only from GND to the REFOUT voltage, but also from VLDOIN to the REFOUT voltage.
7.3.5 Enable Control (EN Pin)
When EN is driven high, the VO regulator begins normal operation. When the device drives EN low, VO
discharges to GND through an internal 18-MOSFET. REFOUT remains on when the device drives EN low.
Ensure that the EN pin voltage remains lower than or equal to VVIN at all times.
7.3.6 Powergood Function (PGOOD Pin)
The TPS51200 device provides an open-drain PGOOD output that goes high when the VO output is within ±20%
of REFOUT. PGOOD de-asserts within 10 μs after the output exceeds the size of the powergood window. During
initial VO start-up, PGOOD asserts high 2 ms (typ) after the VO enters power good window. Because PGOOD is
an open-drain output, a pull-up resistor with a value between 1 kand 100 k, placed between PGOOD and a
stable active supply voltage rail is required.
7.3.7 Current Protection (VO Pin)
The LDO has a constant overcurrent limit (OCL). The OCL level reduces by one-half when the output voltage is
not within the powergood window. This reduction is a non-latch protection.
7.3.8 UVLO Protection (VIN Pin)
For VIN undervoltage lockout (UVLO) protection, the TPS51200 monitors VIN voltage. When the VIN voltage is
lower than the UVLO threshold voltage, both the VO and REFOUT regulators are powered off. This shutdown is
a non-latch protection.
7.3.9 Thermal Shutdown
The TPS51200 monitors junction temperature. If the device junction temperature exceeds the threshold value,
(typically 150°C), the VO and REFOUT regulators both shut off, discharged by the internal discharge MOSFETs.
This shutdown is a non-latch protection.
7.3.10 Tracking Start-up and Shutdown
The TPS51200 also supports tracking start-up and shutdown when the EN pin is tied directly to the system bus
and not used to turn on or turn off the device. During tracking start-up, VO follows REFOUT once REFIN voltage
is greater than 0.39 V. REFIN follows the rise of VDDQ rail through a voltage divider. The typical soft-start time
(tSS) for the VDDQ rail is approximately 3 ms, however it may vary depending on the system configuration. The
soft-start time of the VO output no longer depends on the OCL setting, but it is a function of the soft-start time of
the VDDQ rail. PGOOD is asserted 2 ms after VVO is within ±20% of REFOUT. During tracking shutdown, the VO
pin voltage falls following REFOUT until REFOUT reaches 0.37 V. When REFOUT falls below 0.37 V, the
internal discharge MOSFETs turn on and quickly discharge both REFOUT and VO to GND. PGOOD is
deasserted when VO is beyond the ±20% range of REFOUT. Figure 20 shows the typical timing diagram for an
application that uses tracking start-up and shutdown.
l TEXAS INSTRUMENTS
PGOOD
tSS determined
by the SS time
of VLDOIN
2 ms
VO
VVO = 0.75 V
REFOUT
(VTTREF)
REFIN
VLDOIN
3.3VIN
EN
PGOOD
2 ms
VO
REFIN
REFOUT
(VTTREF)
VLDOIN
VVDDQ = 1.5 V
3.3VIN
EN
(S3_SLP)
tSS .VVO = 0.75 V
tSS = COUT x VO
IOOCL
13
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Feature Description (continued)
Figure 19. Typical Timing Diagram for S3 and Pseudo-S5 Support
Figure 20. Typical Timing Diagram of Tracking Start-up and Shutdown
IIIII D IIII ‘HF
RS
20 W
VOUT VIN
25 W
VTT
VDDQ
Ouput
Buffer
(Driver)
Receiver
VSS
UDG-08023
Q1
Q2
DDR3 240 Pin Socket
TPS51200
10 mF 10 mF 10 mF
VO
SPD
Vtt
DQ
Vdd
Vtt
Vdd
CA
CA
Vdd
DQ
UDG-08022
14
TPS51200
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Feature Description (continued)
7.3.11 Output Tolerance Consideration for VTT DIMM Applications
The TPS51200 is specifically designed to power up the memory termination rail (as shown in Figure 21). The
DDR memory termination structure determines the main characteristics of the VTT rail, which is to be able to sink
and source current while maintaining acceptable VTT tolerance. See Figure 22 for typical characteristics for a
single memory cell.
Figure 21. Typical Application Diagram for DDR3 VTT DIMM using TPS51200
Figure 22. DDR Physical Signal System Bi-Directional SSTL Signaling
In Figure 22, when Q1 is on and Q2 is off:
Current flows from VDDQ via the termination resistor to VTT
VTT sinks current
In Figure 22, when Q2 is on and Q1 is off:
Current flows from VTT via the termination resistor to GND
VTT sources current
l TEXAS INSTRUMENTS 9M OUT fu
M
UGBW
OUT
g
ƒ2 C
=
´ p ´
15
TPS51200
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Feature Description (continued)
Because VTT accuracy has a direct impact on the memory signal integrity, it is imperative to understand the
tolerance requirement on VTT. Equation 1 applies to both DC and AC conditions and is based on JEDEC VTT
specifications for DDR and DDR2 (JEDEC standard: DDR JESD8-9B May 2002; DDR2 JESD8-15A Sept 2003).
VVTTREF – 40 mV < VVTT < VVTTREF + 40 mV (1)
The specification itself indicates that VTT must keep track of VTTREF for proper signal conditioning.
The TPS51200 ensures the regulator output voltage to be as shown in Equation 2, which applies to both DC and
AC conditions.
VVTTREF –25 mV < VVTT < VVTTREF + 25 mV
where
–2 A < IVTT < 2 A (2)
The regulator output voltage is measured at the regulator side, not the load side. The tolerance is applicable to
DDR, DDR2, DDR3, DDR3L, Low Power DDR3, and DDR4 applications (see Table 1 for detailed information).
To meet the stability requirement, a minimum output capacitance of 20 μF is needed. Considering the actual
tolerance on the MLCC capacitors, three 10-μF ceramic capacitors sufficiently meet the VTT accuracy
requirement.
Table 1. DDR, DDR2, DDR3 and LP DDR3 Termination Technology
DDR DDR2 DR3 LOW POWER DDR3
FSB Data
Rates 200, 266, 333, and 400 MHz 400, 533, 677, and 800 MHz 800, 1066, 1330, and 1600 MHz
Termination Motherboard termination to
VTT for all signals
On-die termination for data
group. VTT termination for
address, command and
control signals
On-die termination for data group. VTT termination for
address, command and control signals
Termination
Current
Demand
Maximum source/sink
transient currents of up to 2.6
A to 2.9 A
Not as demanding Not as demanding
Only 34 signals (address,
command, control) tied to
VTT Only 34 signals (address, command, control) tied to VTT
ODT handles data signals ODT handles data signals
Less than 1-A of burst
current Less than 1-A of burst current
Voltage Level 2.5-V Core and
I/O 1.25-V VTT 1.8-V Core and
I/O 0.9-V VTT 1.5-V Core and
I/O 0.75-V VTT 1.2-V Core and
I/O 0.6-V VTT
The TPS51200 uses transconductance (gM) to drive the LDO. The transconductance and output current of the
device determine the voltage droop between the reference input and the output regulator. The typical
transconductance level is 250 S at 2 A and changes with respect to the load in order to conserve the quiescent
current (that is, the transconductance is very low at no load condition). The (gM) LDO regulator is a single pole
system. Only the output capacitance determines the unity gain bandwidth for the voltage loop, as a result of the
bandwidth nature of the transconductance (see Equation 3).
where
• ƒUGBW is the unity gain bandwidth
• gMis transconductance
• COUT is the output capacitance (3)
Consider these two limitations to this type of regulator that come from the output bulk capacitor requirement. In
order to maintain stability, the zero location contributed by the ESR of the output capacitors must be greater than
the –3-dB point of the current loop. This constraint means that higher ESR capacitors should not be used in the
design. In addition, the impedance characteristics of the ceramic capacitor should be well understood in order to
prevent the gain peaking effect around the transconductance (gM) –3-dB point because of the large ESL, the
output capacitor and parasitic inductance of the VO pin voltage trace.
l TEXAS INSTRUMENTS RL‘F
RREF Q
2 × ¿V
REF
IREF
VREF
RREF
RREF
VVDDQ
DDR
16
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7.3.12 REFOUT (VREF) Consideration for DDR2 Applications
During TPS51200 tracking start-up, the REFIN voltage follows the rise of the VDDQ rail through a voltage
divider, and REFOUT (VREF) follows REFIN once the REFIN voltage is greater than 0.39 V. When the REFIN
voltage is lower than 0.39 V, VREF is 0 V.
The JEDEC DDR2 SDRAM Standard (JESD79-2E) states that VREF must track VDDQ/2 within ±0.3 V accuracy
during the start-up period. To allow the TPS51200
device to meet the JEDEC DDR2 specification, a resistor divider can be used to provide the VREF signal to the
DIMM. The resistor divider ratio is 0.5 to ensure that the VREF voltage equals VDDQ/2.
Figure 23. Resistor Divider Circuit
When selecting the resistor value, consider the impact of the leakage current from the DIMM VREF pin on the
reference voltage. Use Equation 4 to calculate resistor values.
where
• RREF is the resistor value
VREF is the VREF DC variation requirement
• IREF is the maximum total VREF leakage current from DIMMs (4)
Consider the MT47H64M16 DDR2 SDRAM component from Micron as an example. The MT47H64M16
datasheet shows the maximum VREF leakage current of each DIMM is ±2 µA, and VREF(DC) variation must be
within ±1% of VDDQ. In this DDR2 application, the VDDQ voltage is 1.8 V. Assuming one TPS51200 device
needs to power 4 DIMMs, the maximum total VREF leakage current is ±8 µA. Based on the calculations, the
resistor value should be lower than 4.5 k. To ensure sufficient margin, 100 is the suggested resistor value.
With two 100-resistors, the maximum VREF variation is 0.4 mV, and the power loss on each resistor is 8.1 mW.
l TEXAS INSTRUMENTS
17
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7.4 Device Functional Modes
7.4.1 Low Input Voltage Applications
TPS51200 can be used in an application system that offers either a 2.5-V rail or a 3.3-V rail. If only a 5-V rail is
available, consider using the TPS51100 device as an alternative. The TPS51200 device has a minimum input
voltage requirement of 2.375 V. If a 2.5-V rail is used, ensure that the absolute minimum voltage (both DC and
transient) at the device pin is be 2.375 V or greater. The voltage tolerance for a 2.5-V rail input is between –5%
and 5% accuracy, or better.
7.4.2 S3 and Pseudo-S5 Support
The TPS51200 provides S3 support by an EN function. The EN pin could be connected to an SLP_S3 signal in
the end application. Both REFOUT and VO are on when EN = high (S0 state). REFOUT is maintained while VO
is turned off and discharged via an internal discharge MOSFET when EN = low (S3 state). When EN = low and
the REFIN voltage is less than 0.390 V, TPS51200 enters pseudo-S5 state. Both VO and REFOUT outputs are
turned off and discharged to GND through internal MOSFETs when pseudo-S5 support is engaged (S4 or S5
state). Figure 19 shows a typical start-up and shutdown timing diagram for an application that uses S3 and
pseudo-S5 support.
l TEXAS INSTRUMENTS
2
3
4
5
1
9
8
7
6
10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
R3
100 kW
3.3 VIN
PGOOD
SLP_S3
C5
0.1 mF
VTTREF
VVLDOIN = VVDDQ = 1.5 V
VVTT = 0.75 V
C4
1000 pF
R1
10 kW
VVDDQ = 1.5 V
R2
10 kW
UDG-08029
C6
4.7 mF
C8
10 mF
C7
10 mF
C3
10 mF
C2
10 mF
C1
10 mF
18
TPS51200
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.2 Typical Application
This design example describes a 3.3-VIN, DDR3 configuration.
Figure 24. 3.3-VIN, DDR3 Configuration
Table 2. 3.3-VIN, DDR3 Application List of Materials
REFERENCE
DESIGNATOR DESCRIPTION SPECIFICATION PART NUMBER MANUFACTURER
R1, R2 Resistor 10 k
R3 100 k
C1, C2, C3
Capacitor
10 μF, 6.3 V GRM21BR70J106KE76L Murata
C4 1000 pF
C5 0.1 μF
C6 4.7 μF, 6.3 V GRM21BR60J475KA11L Murata
C7, C8 10 μF, 6.3 V GRM21BR70J106KE76L Murata
l TEXAS INSTRUMENTS
19
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8.2.1 Design Requirements
• VIN = 3.3 V
• VDDDQ = 1.5 V
• VVLDOIN = VVDDQ = 1.5 V
• VVTT = 0.75 V
8.2.2 Detailed Design Procedure
8.2.2.1 Input Voltage Capacitor
Add a ceramic capacitor, with a value between 1.0-μF and 4.7-μF, placed close to the VIN pin, to stabilize the
bias supply (2.5-V rail or 3.3-V rail) from any parasitic impedance from the supply.
8.2.2.2 VLDO Input Capacitor
Depending on the trace impedance between the VLDOIN bulk power supply to the device, a transient increase of
source current is supplied mostly by the charge from the VLDOIN input capacitor. Use a 10-μF (or greater)
ceramic capacitor to supply this transient charge. Provide more input capacitance as more output capacitance is
used at the VO pin. In general, use one-half of the COUT value for input.
8.2.2.3 Output Capacitor
For stable operation, the total capacitance of the VO output pin must be greater than 20 μF. Attach three, 10-μF
ceramic capacitors in parallel to minimize the effect of equivalent series resistance (ESR) and equivalent series
inductance (ESL). If the ESR is greater than 2 m, insert an RC filter between the output and the VOSNS input
to achieve loop stability. The RC filter time constant should be almost the same as or slightly lower than the time
constant of the output capacitor and its ESR.
l TEXAS INSTRUMENTS Phase m 790 , , ‘ v , mom Lmzm um mm M mm m wmrnmr _Uflv-ykr m sow Ame-www-
1±2±1 0±3
Output Current (A)
700
710
730
740
760
780
790
Output Voltage (mV)
32
0°C
25°C
85°C
± 40°C
TA
770
750
720
80
40
0
±40
±80
1 M 100 M
Frequency (Hz)
Phase (°)
100 k 10 M
±360
±270
0
Gain
Phase
±180
±90
Gain (dB)
10 k10010 10001
20
TPS51200
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8.2.3 Application Curves
Figure 25 shows the bode plot simulation for this DDR3 design example of the TPS51200 device.
The unity-gain bandwidth is approximately 1 MHz and the phase margin is 52°. The 0-dB level is crossed, the
gain peaks because of the ESL effect. However, the peaking maintains a level well below 0 dB.
Figure 26 shows the load regulation and Figure 27 shows the transient response for a typical DDR3
configuration. When the regulator is subjected to ±1.5-A load step and release, the output voltage measurement
shows no difference between the dc and ac conditions.
VIN = 3.3 V VVLDOIN = 1.5 V VVO = 0.75 V
IIO = 2 A 3 × 10-μF capacitors ESR = 2.5 m
ESL = 800 pH
Figure 25. DDR3 Design Example Bode Plot
VVIN = 3.3 V DDR3
Figure 26. Load Regulation Figure 27. Transient Waveform
l TEXAS INSTRUMENTS
2
3
4
5
1
9
8
7
6
10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
R3
100 k:
3.3 VIN
PGOOD
SLP_S3
C5
0.1 PF
VTTREF
VVLDOIN = VVDDQ = 1.8 V
VVTT = 0.9 V
C4
1000 pF
R1
10 k:
VVDDQ = 1.8 V
R2
10 k:C6
4.7 PF
C8
10 PF
C7
10 PF
C3
10 PF
C2
10 PF
C1
10 PF
R5
100 Ÿ
VVDDQ = 1.8 V
R4
100 Ÿ
21
TPS51200
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8.3 System Examples
8.3.1 3.3-VIN, DDR2 Configuration
This section describes a 3.3-VIN, DDR2 configuration application.
Figure 28. 3.3-VIN, DDR2 Configuration
Table 3. 3.3-VIN, DDR2 Configuration List of Materials
REFERENCE
DESIGNATOR DESCRIPTION SPECIFICATION PART NUMBER MANUFACTURER
R1, R2
Resistor
10 k
R3 100 k
R4, R5 100
C1, C2, C3
Capacitor
10 μF, 6.3 V GRM21BR70J106KE76L Murata
C4 1000 pF
C5 0.1 μF
C6 4.7 μF, 6.3 V GRM21BR60J475KA11L Murata
C7, C8 10 μF, 6.3 V GRM21BR70J106KE76L Murata
l TEXAS INSTRUMENTS
2
3
4
5
1
9
8
7
6
10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
R3
100 kW
2.5 VIN
PGOOD
SLP_S3
C5
0.1 mF
VTTREF
VVLDOIN = VVDDQ = 1.5 V
VVTT = 0.75 V
C4
1000 pF
R1
10 kW
VVDDQ = 1.5 V
R2
10 kW
UDG-08030
C6
4.7 mF
C8
10 mF
C7
10 mF
C3
10 mF
C2
10 mF
C1
10 mF
22
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8.3.2 2.5-VIN, DDR3 Configuration
This design example describes a 2.5-VIN, DDR3 configuration application.
Figure 29. 2.5-VIN, DDR3 Configuration
Table 4. 2.5-VIN, DDR3 Configuration List of Materials
REFERENCE
DESIGNATOR DESCRIPTION SPECIFICATION PART NUMBER MANUFACTURER
R1, R2 Resistor 10 k
R3 100 k
C1, C2, C3
Capacitor
10 μF, 6.3 V GRM21BR70J106KE76L Murata
C4 1000 pF
C5 0.1 μF
C6 4.7 μF, 6.3 V GRM21BR60J475KA11L Murata
C7, C8 10 μF, 6.3 V GRM21BR70J106KE76L Murata
l TEXAS INSTRUMENTS
2
3
4
5
1
9
8
7
6
10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
R3
100 kW
3.3 VIN
PGOOD
SLP_S3
C5
0.1 mF
VTTREF
VVLDOIN = VVDDQ = 1.2 V
VVTT = 0.6 V
C4
1000 pF
R1
10 kW
VVDDQ = 1.2 V
R2
10 kW
UDG-08031
C6
4.7 mF
C8
10 mF
C7
10 mF
C3
10 mF
C2
10 mF
C1
10 mF
23
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8.3.3 3.3-VIN, LP DDR3 or DDR4 Configuration
This example describes a 3.3-VIN, LP DDR3 or DDR4 configuration application.
Figure 30. 3.3-VIN, LP DDR3 or DDR4 Configuration
Table 5. 3.3-VIN, LP DDR3 or DDR4 Configuration
REFERENCE
DESIGNATOR DESCRIPTION SPECIFICATION PART NUMBER MANUFACTURER
R1, R2 Resistor 10 k
R3 100 k
C1, C2, C3
Capacitor
10 μF, 6.3 V GRM21BR70J106KE76L Murata
C4 1000 pF
C5 0.1 μF
C6 4.7 μF, 6.3 V GRM21BR60J475KA11L Murata
C7, C8 10 μF, 6.3 V GRM21BR70J106KE76L Murata
l TEXAS INSTRUMENTS
2
3
4
5
1
9
8
7
6
10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
R3
100 kW
3.3 VIN
PGOOD
C5
0.1 mF
VTTREF
VVLDOIN = VVDDQ = 1.5 V
VVTT = 0.75 V
C4
1000 pF
R1
10 kW
VVDDQ = 1.5 V
R2
10 kW
UDG-08032
C6
4.7 mF
C8
10 mF
C7
10 mF
C3
10 mF
C2
10 mF
C1
10 mF
24
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8.3.4 3.3-VIN, DDR3 Tracking Configuration
This design example describes a 3.3-VIN, DDR3 tracking configuration application.
Figure 31. 3.3-VIN, DDR3 Tracking Configuration
Table 6. 3.3-VIN, DDR3 Tracking Configuration List of Materials
REFERENCE
DESIGNATOR DESCRIPTION SPECIFICATION PART NUMBER MANUFACTURER
R1, R2 Resistor 10 k
R3 100 k
C1, C2, C3
Capacitor
10 μF, 6.3 V GRM21BR70J106KE76L Murata
C4 1000 pF
C5 0.1 μF
C6 4.7 μF, 6.3 V GRM21BR60J475KA11L Murata
C7, C8 10 μF, 6.3 V GRM21BR70J106KE76L Murata
l TEXAS INSTRUMENTS
2
3
4
5
1
9
8
7
6
10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
R3
100 k:
3.3 VIN
PGOOD
ENABLE
C5
0.1 PF
REFOUT
VVLDOIN = VVLDOREF = 2.5 V
VVLDO = 1.8 V
C4
1000 pF
R1
3.86 k:
2.5 V
R2
10 k:
UDG-08033
C6
4.7 PF
C8
10 PF
C7
10 PF
C3
10 PF
C2
10 PF
C1
10 PF
25
TPS51200
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8.3.5 3.3-VIN, LDO Configuration
This example describes a 3.3-VIN, LDO configuration application.
Figure 32. 3.3-VIN, LDO Configuration
Table 7. 3.3-VIN, LDO Configuration List of Materials
REFERENCE
DESIGNATOR DESCRIPTION SPECIFICATION PART NUMBER MANUFACTURER
R1
Resistor
3.86 k
R2 10 k
R3 100 k
C1, C2, C3
Capacitor
10 μF, 6.3 V GRM21BR70J106KE76L Murata
C4 1000 pF
C5 0.1 μF
C6 4.7 μF, 6.3 V GRM21BR60J475KA11L Murata
C7, C8 10 μF, 6.3 V GRM21BR70J106KE76L Murata
l TEXAS INSTRUMENTS
2
3
4
5
1
9
8
7
6
10
TPS51200
REFIN
VLDOIN
VO
PGND
VOSNS
VIN
PGOOD
GND
EN
REFOUT
R3
100 kW
3.3 VIN
PGOOD
SLP_S3
C5
0.1 mF
VTTREF
VVLDOIN = VVDDQ = 1.5 V
VVTT = 0.75 V
C4
1000 pF
R1
10 kW
VVDDQ = 1.5 V
R2
10 kW
UDG-08034
C6
4.7 mF
C8
10 mF
C7
10 mF
C3
10 mF
C2
10 mF
C1
10 mF
R4(1)
C9(1)
26
TPS51200
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Product Folder Links: TPS51200
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(1) Choose values for R4 and C9 to reduce the parasitic effect of the trace (between VO and the output MLCCs) and the output capacitors
(ESR and ESL).
8.3.6 3.3-VIN, DDR3 Configuration with LFP
This design example describes a 3.3-VIN, DDR3 configuration with LFP application.
Figure 33. 3.3-VIN, DDR3 Configuration with LFP
Table 8. 3.3-VIN, DDR3 Configuration with LFP List of Materials
REFERENCE
DESIGNATOR DESCRIPTION SPECIFICATION PART NUMBER MANUFACTURER
R1, R2
Resistor
10 k
R3 100 k
R4(1)
C1, C2, C3
Capacitor
10 μF, 6.3 V GRM21BR70J106KE76L Murata
C4 1000 pF
C5 0.1 μF
C6 4.7 μF, 6.3 V GRM21BR60J475KA11L Murata
C7, C8 10 μF, 6.3 V GRM21BR70J106KE76L Murata
C9(1)
l TEXAS INSTRUMENTS
27
TPS51200
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9 Power Supply Recommendations
This device is designed to operate from an input bias voltage from 2.375 V to 3.5 V, with LDO input from 1.1 V to
3.5 V. Refer to Figure 19 and Figure 20 for recommended power-up sequence. Maintain a EN voltage equal or
lower than VVIN at all times. VLDOIN can ramp up earlier than VIN if the sequence in Figure 19 and Figure 20
cannot be used. The input supplies should be well regulated. VLDOIN decoupling capacitance
of 2 × 10 µF is recommended, and VIN decoupling capacitance of 1 × 4.7 µF is recommended.
10 Layout
10.1 Layout Guidelines
Consider the following points before starting the TPS51200 device layout design.
Place the input capacitors as close to VDLOIN pin as possible with short and wide connection.
Place the output capacitor as close to VO pin as possible with short and wide connection. Place a ceramic
capacitor with a value of at least 10-µF as close to VO pin if the rest of output capacitors need to be placed
on the load side.
Connect the VOSNS pin to the positive node of output capacitors as a separate trace. In DDR VTT
application, connect the VO sense trace to DIMM side to ensure the VTT voltage at DIMM side is well
regulated.
Consider adding low-pass filter at VOSNS if the VO sense trace is very long.
Connect the GND pin and PGND pin to the thermal pad directly.
TPS51200 uses its thermal pad to dissipate heat. In order to effectively remove heat fromTPS51200 package,
place numerous ground vias on the thermal pad. Use large ground copper plane, especially the copper plane
on surface layer, to pour over those vias on thermal pad.
Consult the TPS51200EVM User's Guide (SLUU323) for detailed layout recommendations.
l TEXAS INSTRUMENTS v Trace 00 L; 00 OO 00 00 00 PD75RC VLDOIN V0 075% PD Vv ISNK
D _ SNK VO SNK
P V I= ´
D _ SRC VLDOIN VO O _ SRC
P (V V ) I= - ´
To
GND
Plane
GND
VLDOIN
EN Trace
VIN Trace
VTT
PGOOD Trace
VDDQ Trace
VTT Sense Trace,
terminate near the load
28
TPS51200
SLUS812D FEBRUARY 2008REVISED FEBRUARY 2020
www.ti.com
Product Folder Links: TPS51200
Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated
10.2 Layout Example
Figure 34. Layout Recommendation
10.3 Thermal Design Considerations
Because the TPS51200 is a linear regulator, the VO current flows in both source and sink directions, thereby
dissipating power from the device. When the device is sourcing current, the voltage difference shown in
Equation 5 calculates the power dissipation.
(5)
In this case, if the VLDOIN pin is connected to an alternative power supply lower than the VDDQ voltage, overall
power loss can be reduced. During the sink phase, the device applies the VO voltage across the internal LDO
regulator. Equation 6 calculates he power dissipation, PD_SNK can be calculated by .
(6)
Because the device does not sink and source current at the same time and the I/O current may vary rapidly with
time, the actual power dissipation should be the time average of the above dissipations over the thermal
relaxation duration of the system. The current used for the internal current control circuitry from the VIN supply
and the VLDOIN supply are other sources of power consumption. This power can be estimated as 5 mW or less
during normal operating conditions and must be effectively dissipated from the package.
{L} TEXAS INSTRUMENTS X +‘{‘ +‘F T_,: X TJ: 3m
1 mm
TT on top of package
TB on PCB surface
Land Pad
3 mm x 1.9 mm
Exposed Thermal
Die Pad,
2.48 mm x 1.74 mm
UDG-08018
J B JB D
T T P= + Y ´
J T JT D
T T P= + Y ´
J(max) A(max)
PKG
JA
T T
P
-
=
q
29
TPS51200
www.ti.com
SLUS812D FEBRUARY 2008REVISED FEBRUARY 2020
Product Folder Links: TPS51200
Submit Documentation FeedbackCopyright © 2008–2020, Texas Instruments Incorporated
Thermal Design Considerations (continued)
Maximum power dissipation allowed by the package is calculated by Equation 7.
where
• TJ(max) is 125°C
• TA(max) is the maximum ambient temperature in the system
θJA is the thermal resistance from junction to ambient (7)
NOTE
Because Equation 7 demonstrates the effects of heat spreading in the ground plane, use it
as a guideline only. Do not use Equation 7 to estimate actual thermal performance in real
application environments.
In an application where the device is mounted on PCB, TI strongly recommends using ψJT and ψJB, as explained
in the section pertaining to estimating junction temperature in the Semiconductor and IC Package Thermal
Metrics application report, SPRA953. Using the thermal metrics ψJT and ψJB, as shown in the Thermal
Information table, estimate the junction temperature with corresponding formulas shown in Equation 8. The older
θJC top parameter specification is listed as well for the convenience of backward compatibility.
(8)
where
• PDis the power dissipation shown in Equation 5 and Equation 6
• TTis the temperature at the center-top of the IC package
• TBis the PCB temperature measured 1-mm away from the thermal pad package on the PCB surface (see
Figure 36). (9)
NOTE
Both TTand TBcan be measured on actual application boards using a thermo-gun (an
infrared thermometer). For more information about measuring TTand TB, see the
application report Using New Thermal Metrics (SBVA025).
.
Figure 35. Recommended Land Pad Pattern Figure 36. Package Thermal Measurement
l TEXAS INSTRUMENTS
30
TPS51200
SLUS812D FEBRUARY 2008REVISED FEBRUARY 2020
www.ti.com
Product Folder Links: TPS51200
Submit Documentation Feedback Copyright © 2008–2020, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.1.2 Development Support
11.1.2.1 Evaluation Modules
An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the
TPS51200 device. The TPS51200EVM evaluation module and related user's guide (SLUU323) can be requested
at the Texas Instruments website through the product folders or purchased directly from the TI eStore.
11.1.2.2 Spice Models
Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of
analog circuits and systems. A SPICE model for the TPS51200 device is available here.
11.2 Documentation Support
11.2.1 Related Documentation
Using New Thermal Metrics,SBVA025
Semiconductor and IC Package Thermal Metrics,SPRA953
Using the TPS51200 EVM Sink/Source DDR Termination Regulator,SLUU323
For more information on the TPS51100 device, see the product folder on ti.com.
11.3 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS51200DRCR ACTIVE VSON DRC 10 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 1200
TPS51200DRCRG4 ACTIVE VSON DRC 10 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 1200
TPS51200DRCT ACTIVE VSON DRC 10 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 1200
TPS51200DRCTG4 ACTIVE VSON DRC 10 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 1200
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS51200 :
Automotive: TPS51200-Q1
Enhanced Product: TPS51200-EP
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
I TEXAS INSTRUMENTS ‘3‘ V.'
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS51200DRCR VSON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
TPS51200DRCT VSON DRC 10 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS51200DRCR VSON DRC 10 3000 367.0 367.0 35.0
TPS51200DRCT VSON DRC 10 250 210.0 185.0 35.0
Pack Materials-Page 2
www.ti.com
GENERIC PACKAGE VIEW
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
VSON - 1 mm max heightDRC 10
PLASTIC SMALL OUTLINE - NO LEAD
3 x 3, 0.5 mm pitch
4226193/A
--I vfi g C C C C C r1 C I WW‘iTiqu C A 33933
www.ti.com
PACKAGE OUTLINE
C
10X 0.30
0.18
2.4 0.1
2X
2
1.65 0.1
8X 0.5
1.0
0.8
10X 0.5
0.3
0.05
0.00
A3.1
2.9 B
3.1
2.9
(0.2) TYP
4X (0.25)
2X (0.5)
VSON - 1 mm max heightDRC0010J
PLASTIC SMALL OUTLINE - NO LEAD
4218878/B 07/2018
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
56
10
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
SYMM
SYMM
11
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
10X (0.24)
(2.4)
(2.8)
8X (0.5)
(1.65)
( 0.2) VIA
TYP
(0.575)
(0.95)
10X (0.6)
(R0.05) TYP
(3.4)
(0.25)
(0.5)
VSON - 1 mm max heightDRC0010J
PLASTIC SMALL OUTLINE - NO LEAD
4218878/B 07/2018
SYMM
1
56
10
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
11
SYMM
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(R0.05) TYP
10X (0.24)
10X (0.6)
2X (1.5)
2X
(1.06)
(2.8)
(0.63)
8X (0.5)
(0.5)
4X (0.34)
4X (0.25)
(1.53)
VSON - 1 mm max heightDRC0010J
PLASTIC SMALL OUTLINE - NO LEAD
4218878/B 07/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 11:
80% PRINTED SOLDER COVERAGE BY AREA
SCALE:25X
SYMM
1
56
10
EXPOSED METAL
TYP
11
SYMM
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