ARTIK 530, 530s Module Datasheet by Seeed Technology Co., Ltd

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ARTIK 530/530s Module Datasheet
2
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
MODULE OVERVIEW
The Samsung ARTIK™ 530/530s Module is a highly-integrated
System-in-Module that combines a quad-core ARM® Cortex®-
A9 processor packaged with 512MB or 1GB DRAM and Flash
memory, a Security Subsystem, and a wide range of wireless
communication options—such as 802.11a/b/g/n for Wi-Fi®,
Bluetooth® 4.2 (BLE+Classic), and 802.15.4 for Zigbee—all into
one 49×36mm footprint. The many standard digital control
interfaces support external sensors and higher performance
peripherals to expand the module’s capabilities. With the
combination of 802.11, Bluetooth® and 802.15.4, the ARTIK
530/530s Module is the perfect choice for home automation
and home hub devices, while also supporting a rich UI/UX
capability for camera and display requirements. The inclusion
of a hardware-based Secure Element provides end-to-end
security.
Processor
CPU Quad-core ARM® Cortex®-A9@1.2GHz
GPU 3D graphics accelerator
Media
Camera I/F 4-lane MIPI CSI up to 5M (1920x1080@30fps)
Display 4-lane MIPI DSI and HDMI1.4a (1920x1080p@60fps)
or LVDS (1280×720p@60fps)
Audio Two I2S audio interface
Memory
DRAM 512MB or 1GB DDR3 @ 800MHz
FLASH 4GB eMMC v4.5
Security
Secure Element Secure point to point authentication and data
transfer
Trusted Execution
Environment
Trustware
Radio
WLAN IEEE 802.11a/b/g/n, dual-band SISO
Bluetooth® 4.2 (Classic+BLE)
LR_WPAN IEEE 802.15.4
Power Management
PMIC Provides all power of the ARTIK 530/530s Module
using onboard bucks and LDOs
Interfaces
Ethernet 10/100/1000Base-T MAC (External PHY required)
Analog and Digital I/O GPIO, UART, I2C, SPI, SDIO, USB Host, USB OTG,
HSIC, ADC, PWM, I2S, JTAG
Figure 1. ARTIK™ 530/530s Module Top View
ARTIK 530
ARTIK 530s and ARTIK 530s 1G
530
533
ARTIK 530s:
ARTIK 530s 1G:
SIP-005AFS302
SIP–005AUS332
ARTIK 530s:
ARTIK 530s 1G:
0530-1.04 W34
0533-1.00 W31
ARTIK 530s:
ARTIK 530s 1G:
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
TABLE OF CONTENTS
3
Module Overview................................................................................................................................................................2
Version History .............................................................................................................................................................9
Block Diagram and Module Features............................................................................................................................... 10
ARTIK 530/530s Module Features.............................................................................................................................. 11
GPIO ..................................................................................................................................................................... 11
I2S ......................................................................................................................................................................... 11
PWM ..................................................................................................................................................................... 12
SPI ........................................................................................................................................................................ 12
UART .................................................................................................................................................................... 12
I2C ........................................................................................................................................................................ 13
ADC ...................................................................................................................................................................... 13
Power Management ............................................................................................................................................ 13
Wi-Fi® ................................................................................................................................................................... 13
Bluetooth® ........................................................................................................................................................... 14
802.15.4 for Zigbee ............................................................................................................................................. 14
USB OTG .............................................................................................................................................................. 14
USB HOST ............................................................................................................................................................ 14
HSIC ..................................................................................................................................................................... 15
MIPI CSI ............................................................................................................................................................... 15
MIPI DSI ............................................................................................................................................................... 15
HDMI .................................................................................................................................................................... 16
LVDS .................................................................................................................................................................... 16
Gigabit EMAC ...................................................................................................................................................... 16
SD/MMC ...............................................................................................................................................................17
Memory Controller ...............................................................................................................................................17
JTAG .....................................................................................................................................................................17
Security Subsystem ............................................................................................................................................ 18
Quad-Core Processor System ............................................................................................................................ 19
Timer .................................................................................................................................................................... 19
Interrupt Controller ............................................................................................................................................. 19
DMA .................................................................................................................................................................... 20
RTC ..................................................................................................................................................................... 20
Video Input Processor ........................................................................................................................................ 21
Scaler ................................................................................................................................................................... 21
Multiformat Codec .............................................................................................................................................. 21
Graphics Pipeline ................................................................................................................................................ 22
PCM ..................................................................................................................................................................... 22
Module Pads .....................................................................................................................................................................23
Ball Table Column Definitions....................................................................................................................................24
North Ball Array ...................................................................................................................................................24
South Ball Array ...................................................................................................................................................26
East Ball Array .....................................................................................................................................................28
West Ball Array ................................................................................................................................................... 30
Center Ball Array ................................................................................................................................................. 31
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Functional Interfaces........................................................................................................................................................33
ADC.............................................................................................................................................................................33
Booting .......................................................................................................................................................................33
Bluetooth PCM............................................................................................................................................................33
MIPI CSI.......................................................................................................................................................................34
MIPI DSI.......................................................................................................................................................................34
GMAC..........................................................................................................................................................................34
GPIO............................................................................................................................................................................35
HDMI ...........................................................................................................................................................................36
HSIC ............................................................................................................................................................................37
I2C ...............................................................................................................................................................................37
I2S................................................................................................................................................................................37
JTAG............................................................................................................................................................................38
AliveGPIO....................................................................................................................................................................38
LVDS ...........................................................................................................................................................................38
Miscellaneous.............................................................................................................................................................39
Power ..........................................................................................................................................................................39
PWM ............................................................................................................................................................................39
SD/MMC..................................................................................................................................................................... 40
SPI .............................................................................................................................................................................. 40
UART ........................................................................................................................................................................... 41
USB HOST/USB OTG .................................................................................................................................................. 41
802.15.4 for Zigbee .................................................................................................................................................... 41
GPIO Alternate Functions.................................................................................................................................................42
Booting Selection ............................................................................................................................................................ 46
Power Sequence...............................................................................................................................................................47
Power States .....................................................................................................................................................................48
Antenna Connections...................................................................................................................................................... 49
Electrical Specifications .................................................................................................................................................. 50
Absolute Maximum Ratings ...................................................................................................................................... 50
Recommended Operating Conditions ...................................................................................................................... 51
Power/Current Consumption .................................................................................................................................... 51
ESD Ratings ................................................................................................................................................................52
DC Electrical Characteristics .....................................................................................................................................53
AC Electrical Characteristics .....................................................................................................................................56
SD/MMC AC Electrical Characteristics ..............................................................................................................56
SPI AC Electrical Characteristics ........................................................................................................................ 57
I2C AC Electrical Characteristics ...................................................................................................................... 60
RF Electrical Characteristics ...................................................................................................................................... 61
Wi-Fi, 2.4GHz Receiver RF Specifications .......................................................................................................... 61
Wi-Fi, 2.4GHz Transmitter RF Specifications .....................................................................................................62
Wi-Fi, 5GHz Receiver RF Specifications .............................................................................................................63
Wi-Fi, 5GHz Transmitter RF Specifications ....................................................................................................... 64
Bluetooth RF Specifications ...............................................................................................................................65
802.15.4 Receiver RF Specifications ................................................................................................................. 66
Mechanical Specifications ...............................................................................................................................................67
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Certifications and Compliance ........................................................................................................................................70
Bluetooth ....................................................................................................................................................................70
CE................................................................................................................................................................................70
FCC .............................................................................................................................................................................70
IC..................................................................................................................................................................................71
KCC ..............................................................................................................................................................................71
SRRC ............................................................................................................................................................................71
HDMI Compliance .......................................................................................................................................................71
RoHS Compliance .......................................................................................................................................................71
FCC Regulatory Disclosures .......................................................................................................................................71
Industry Canada Regulatory Disclosures ..................................................................................................................73
Industry Canada Statement ................................................................................................................................73
EU Regulatory Disclosures .........................................................................................................................................73
Statement* .........................................................................................................................................................73
Ordering Information .......................................................................................................................................................74
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
LIST OF FIGURES
6
Figure 1. ARTIK™ 530/530s Module Top View...................................................................................................................2
Figure 2. ARTIK 530/530s Module Functional Block Diagram........................................................................................ 10
Figure 3. ARTIK 530/530s Module Top View Ball Organization .....................................................................................23
Figure 4. ARTIK 530/530s Module Power-On Sequence (Timing) Diagram ..................................................................47
Figure 5. ARTIK 530/530s Module Power Management State Diagram ........................................................................48
Figure 6. RF Connector for Bluetooth/Wi-Fi and Zigbee ............................................................................................... 49
Figure 7. High-Speed SD/MMC Interface Timing............................................................................................................56
Figure 8. SPI Interface Timing (CPHA = 0, CPOL = 1 (Format A)) ....................................................................................57
Figure 9. I2C Interface Timing ........................................................................................................................................ 60
Figure 10. ARTIK 530/530s Module Top View Mechanical Dimensions and Part Location...........................................67
Figure 11. ARTIK 530/530s Module Mechanical Dimensions Top View..........................................................................68
Figure 12. ARTIK 530/530s Module Mechanical Dimensions Bottom View ...................................................................68
Figure 13. L-Shaped Pad Pins (Top View)........................................................................................................................ 69
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
LIST OF TABLES
7
Table 1. Ball Table Column Definition ..............................................................................................................................24
Table 2. North Ball Array...................................................................................................................................................24
Table 3. South Ball Array ..................................................................................................................................................26
Table 4. East Ball Array .....................................................................................................................................................28
Table 5. West Ball Array................................................................................................................................................... 30
Table 6. Center Ball Array................................................................................................................................................. 31
Table 7. ADC .....................................................................................................................................................................33
Table 8. Booting................................................................................................................................................................33
Table 9. Bluetooth PCM....................................................................................................................................................33
Table 10. MIPI CSI .............................................................................................................................................................34
Table 11. MIPI DSI ..............................................................................................................................................................34
Table 12. GMAC.................................................................................................................................................................34
Table 13. GPIO...................................................................................................................................................................35
Table 14. HDMI ..................................................................................................................................................................36
Table 15. HSIC...................................................................................................................................................................37
Table 16. I2C ......................................................................................................................................................................37
Table 17. I2S.......................................................................................................................................................................37
Table 18. JTAG...................................................................................................................................................................38
Table 19. Key .....................................................................................................................................................................38
Table 20. LVDS..................................................................................................................................................................38
Table 21. Miscellaneous ....................................................................................................................................................39
Table 22. Power.................................................................................................................................................................39
Table 23. PWM ..................................................................................................................................................................39
Table 24. SD/MMC........................................................................................................................................................... 40
Table 25. SPI .................................................................................................................................................................... 40
Table 26. UART.................................................................................................................................................................. 41
Table 27. USB Host/USB OTG.......................................................................................................................................... 41
Table 28. 802.15.4 ............................................................................................................................................................ 41
Table 29. GPIO Alternate Functions—North Part............................................................................................................42
Table 30. GPIO Alternate Functions—South Part............................................................................................................43
Table 31. GPIO Alternate Functions—East Part................................................................................................................45
Table 32. GPIO Alternate Functions—West Part..............................................................................................................45
Table 33. Boot Selection Configuration ........................................................................................................................ 46
Table 34. Absolute Maximum Ratings ............................................................................................................................ 50
Table 35. Recommended Operating Conditions ............................................................................................................ 51
Table 36. ARTIK 530/530s Module Power/Current Consumption ................................................................................. 51
Table 37. ESD Ratings.......................................................................................................................................................52
Table 38. Shock and Vibration Ratings............................................................................................................................52
Table 39. I/O DC Electrical Characteristics GPIO ...........................................................................................................53
Table 40. I/O DC Electrical Characteristics 802.15.4......................................................................................................53
Table 41. I/O DC Electrical Characteristics PMIC ............................................................................................................54
Table 42. I/O DC Electrical Characteristics PCM Signals................................................................................................54
Table 43. GPIO Pull-up Resistor Current .........................................................................................................................55
Table 44. Power-on Reset Timing Specifications............................................................................................................55
Table 45. High-Speed SD/MMC Interface Transmit/Receive Timing Constants ..........................................................56
Table 46. SPI Interface Transmit/ Receive Timing Constants with 15pF Load...............................................................58
Table 47. SPI Interface Transmit/Receive Timing Constants with 30pF Load ...............................................................59
Table 48. I2C BUS Controller Module Signal Timing..................................................................................................... 60
Table 49. Wi-Fi, 2.4GHz Receiver RF Specifications ....................................................................................................... 61
Table 50. Wi-Fi, 2.4GHz Transmitter RF Specifications ..................................................................................................62
Table 51. Wi-Fi, 5GHZ Receiver RF Specifications...........................................................................................................63
Table 52. Wi-Fi, 5GHz Transmitter RF Specifications..................................................................................................... 64
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Table 53. Bluetooth Receiver RF Specifications .............................................................................................................65
Table 54. Bluetooth Transmitter RF Specifications.........................................................................................................65
Table 55. Bluetooth Low Energy (BLE) RF Specifications ...............................................................................................65
Table 56. 802.15.4 Receiver RF Specifications .............................................................................................................. 66
Table 57. 802.15.4 Transmitter RF Specifications .......................................................................................................... 66
Table 58. L-Shaped Ball Locations.................................................................................................................................. 69
TabLe 1 FunrtiomzL Interfaces GPIU ALrernare Funrtions of GPIU ALrernate Funrtions Booting SeLertion Power Sequence Power States Figure 5 Powergcurrent Consumgtinn ' 14 BanA’ Diagram and ModuLe Features security subsystem ordenng Iniormatmn ARTIK"
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Version History
Revision Date Description
V1.0 January 20, 2017 First release.
V1.01 February 07, 2017 Updated Module PAD’s section. Updated look and feel.
V1.02 April 12, 2017 Updated default behavior of GPIO pins to latest software release.
Updated Booting Sequence section. 802.15.4 RF Specifications section. Updated Tables 1–36.
Updated SD/MMC AC Electrical Characteristics section. Updated Recommended Operating
Conditions section. Updated ESD section. Updated Power management section.
V1.03 November 20, 2017 In Table 1, definition of PU/PD and I/O columns for ballout and signal-description tables more
explicitly defined.
Characteristics for LDO3 (VCC3P3_SYS) removed, as using the output to drive external ICs is highly
discouraged. Descriptions of other LDOs was removed, as they are not available externally.
In Functional Interfaces, each subsection describing an interface that has alternate functions
clarifies which are selected by hardware at power-on reset. Cross references added to the
appropriate tables in GPIO Alternate Functions.
Changed format of default functions in tables of GPIO Alternate Functions to make it easier to see
which function number is the default.
Booting Selection section rewritten for clarity.
Power Sequence section divided into Power Sequence and Power States. Simplified power
management state diagram, Figure 5.
Section, Power/Current Consumption, added..
V1.04 November 30,2017 Added ARTIK 530s and ARTIK 530s 1G features in Module Overview, Block Diagram and Module
Features, and Security Subsystem.
V1.05 November 30,2017 Ordering Information: Added ordering part numbers for ARTIK 530s 1G and its associated
development kit.
Figure 2 4 + I + ¢g¢¢¢¢¢¢¢
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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BLOCK DIAGRAM AND MODULE FEATURES
Figure 2 shows the functional block diagram of the ARTIK 530/530s Module. It consists of a quad-core ARM®
Cortex®-A9 application processor with 512MB or 1GB of DDR3 and 4GB eMMC, PMIC power management, Security
Subsystem, 802.11 for Wi-Fi®, Bluetooth®, 802.15.4 for Zigbee, and RF connectors.
Figure 2. ARTIK 530/530s Module Functional Block Diagram
ARTIK530/530sMODULE
4GB eMMC v4.5
POWER
MANAGEMENT 512MB/1GB DDR3
BLUETOOTH
802.11a/b/g/n
802.15.4
CAMERA
MIPICSI
LCD
MIPI DSI
HDMI
6×ADC
HSIC
LVDS
USBHOST
USB OTG
GPIO
(43bydefault)
AUDIO
2× PWM,
2× I
2
S
BOOTSELECT
GMAC
JTAG
2× SPI
3× UART
(2‐pin)
3× I
2
C
SD/MMC
SECURITYSUBSYSTEM
SECURE
ELEMENT
SECURITY
CONTROLLER SECUREBOOT SECUREJTAG
PROCESSORSYSTEM
1024KBL2CACHE
UNIVERSALSCALER
VIDEOINPUTPROCESSOR
MULTIFORMATCODEC
GRAPHICS
PIPELINE
RTC
TIMER
INTERRUPT
CONTROLLER
DMA
CONTROLLER
CORTEXA9@1.2GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEXA9@1.2GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEXA9@1.2GHz
32KBI‐CACHE
32KBD‐CACHE
CORTEXA9@1.2GHz
32KBI‐CACHE
32KBD‐CACHE
IN Figure 2 Figure
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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ARTIK 530/530s Module Features
The following subsections describe the functions of the various ARTIK 530/530s Module blocks depicted in Figure
2.
GPIO
The ARTIK 530/530s Module provides a GPIO system with up to 107 GPIOs multiplexed with other I/O interface lines,
as shown in Figure 2 to support a wide variety of use-cases. The key features of the GPIO system are as follows:
Programmable pull-up control
Both edge detect and level detect functionality
Support for programmable pull-up resistors
Support for fast or normal slew operation
Drive strength can be set from a register:
Support for interrupt generation that can be triggered on one of the following:
Rising edge
Falling edge
High level detection
–Low level detection
The I/O data is clocked up to 50MHz
I2S
The ARTIK 530/530s Module provides two 5-line Inter-IC Sound (I2S) channels. I2S is one of the most popular digital
audio interfaces. The I2S bus handles audio data and other signals, such as subcoding and control. It is possible to
transmit data between two I2S buses. The key features of the I2S sub-system are
One-port stereo (1 channel) I2S-bus for audio with DMA based operation
Serial data transfer of 16/24-bit per channel in Master and Slave mode
•A variety of interface modes:
–I
2S, Left justified, Right justified, DSP mode
Value Drive Strength *
*. Assumes the reference I/O voltage is 3.3V.
All drive-strength values are approximate.
0 2.6mA approximately (default)
1 5.2mA approximately
2 10.4mA approximately
3 15.6mA approximately
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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PWM
The ARTIK 530/530s Module provides two pulse width modulation (PWM) instances with the following key features:
Two individual PWM channels with independent duty control and polarity
Two 32-bit PWM timers, one per channel
Support for static as well as dynamic setup
Support for auto-reload and one shot pulse mode
Dead zone generator
Level interrupt generation
SPI
The ARTIK 530/530s Module provides two Serial Peripheral Interface (SPI) ports that transfer serial data. SPI support
includes 8-bit/16-bit shift registers to transmit and receive data. During an SPI transfer, data is simultaneously
transmitted (shifted out serially) and received (shifted in serially). The SPI implementation adheres to the protocols
described by Texas Instruments Synchronous Serial Interface, National Semiconductor’s Microwire, and Motorola’s
Serial Peripheral Interface. The key features of the SPI sub-system are
Support for full-duplex
8-bit/16-bit shift register for Tx and Rx
Compliant with the SPI protocol described by Texas Instruments, National Semiconductor and Motorola
Support for independent 16-bit wide transmit and receive FIFOs 8 locations deep
Support for master mode and slave mode
Support for receive-without-transmit operation
Max operating frequency :
Master Mode : Supports Tx up to 50MHz, Rx up to 20MHz
Slave Mode : Supports Tx up to 8MHz, Rx up to 8MHz
UART
The ARTIK 530/530s Module provides three 2-pin universal asynchronous receiver transmitters (UARTs). The key
features of the UART sub-system are
Separate 64×8 Tx and 64×8 Rx FIFO memory buffers
Support for DMA-mode and interrupt-based mode of operation
All independent channels support IrDA 1.0
Each UART channel contains:
Programmable baud-rates
1 or 2 stop bit insertion
5-bit, 6-bit, 7-bit, or 8-bit data width
–Parity checking
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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I2C
The ARTIK 530/530s Module provides three generic I2C blocks supporting both 100kb/s and 400kb/s speed modes.
The key features of the I2C sub-system are
Support for multi-master and slave mode
7-bit addressing mode only
Serial, 8-bit oriented and bi-directional data transfer
Up to 100 kb/s in the standard mode
Up to 400 kb/s in the fast mode
Master transmit, master receive, slave transmit, and slave receive operation
Support for both interrupt and polling events
ADC
The ADC interface controls one 28nm low-power CMOS 1.8V 12-bit ADC. The key features of the ADC sub-system are
Up to six channels of analog input can be selected
Conversion of analog input into 12-bit binary code up to 1 Mega Sample Per Second (MSPS)
1.0mW power consumption when running 1MSPS
Input frequency up to 100kHz
Power Management
The ARTIK 530/530s Module power requirements are managed using a power management integrated circuit
(PMIC). This PMIC device has four fully-integrated fixed-frequency current-mode synchronous PWM step-down
converters that can achieve peak efficiencies of up to 97%.The regulators operate at a fixed high frequency,
minimizing noise in sensitive applications and allowing the use of small form factor components. These four
regulators fully satisfy the power and control requirements of the ARTIK 530/530s Module. Dynamic Voltage Scaling
(DVS) of the various core voltages is supported using I2C control.
Wi-Fi®
The ARTIK 530/530s Module has a fully integrated WLAN block covering IEEE 802.11 a/b/g/n. The most important
hardware features of the module are
802.11 a/b/g/n dual-band SISO that is 2.4GHz/5GHz-compliant
•1T1R 2.4GHz/5GHz band
Support for 20MHzand 40MHz bandwidth (72.2/150Mbps PHY rate)
Enhanced 802.11/Bluetooth coexistence control to improve transmission quality in different profiles
Use of an SDIO interface
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Bluetooth®
The ARTIK 530/530s Module has a fully integrated 4.2 block (BLE+Classic). The most important hardware features of
the module are
Bluetooth 4.2 (BLE+Classic)
Enhanced 802.11/Bluetooth Coexistence control to improve transmission quality in different profiles
802.15.4 for Zigbee
The ARTIK 530/530s Module carries fully-integrated 802.15.4 functionality. The most important hardware features
are
Fully integrated 2.4 GHz, IEEE 802.15.4-compliant transceiver
Complete system-on-chip using 32-bit ARM® Cortex®-M4 processor
•Flash and RAM memory and peripherals.
Extremely low power consumption.
Excellent RF performance.
USB OTG
The ARTIK 530/530s Module provides one USB2.0 OTG interface supporting both device and host functionality. The
key features of the USB2.0 OTG sub-system are
Compliant with the USB 2.0 on-the-go specification revision 1.3a and 2.0
High-speed (480Mbps) mode
Full-speed (12Mbps) mode
Low-speed (1.5Mbps) mode (host only)
Support for session request protocol (SRP) and host negotiation protocol (HNP)
One control endpoint 0 for control transfer
Up to 15 device-programmable endpoints:
Programmable endpoint type: Bulk, Isochronous, Interrupt
Programmable In/Out direction
•16 host channels
USB HOST
The ARTIK 530/530s Module provides one USB2.0 controller that is fully compliant with the USB 2.0 Host
specifications, and the enhanced host controller Interface (EHCI) specification. The key features of the USB2.0 OTG
sub-system are
Detecting the attachment and removal of USB devices
Collecting status and activity statistics
Controlling power supply to attached USB devices
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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In compliance with the UTMI+ Level 3 revision 1.0
Controlling the association to either the open host controller interface (OHCI) or the EHCI via a port router
Root Hub functionality to support upstream/downstream port
HSIC
The ARTIK 530/530s Module provides one high-speed inter-chip (HSIC) version 1.0 module. The key features of the
HSIC sub-system are
Support for ping and split transactions
Up to 30MHz operation for a 16-bit interface
•Up to 60MHz operation for a 8-bit interface
Support for HSIC version 1.0
MIPI CSI
The ARTIK 530/530s Module provides one 4-lane mobile industry processor interface (MIPI) interface that complies
with the MIPI camera serial interface (CSI) standard specification V1.01r06 and D-PHY standard specification v1.0.
The key features of the MIPI CSI sub-system are
1, 2, 3 or 4 data lanes
Support for the following image formats:
YUV420, YUV420 (Legacy), YUV420 (CSPS), 8-bit YUV422, 10-bit YUV422
User-defined byte-based data packet
Compatible to PPI (Protocol to PHY interface)
MIPI DSI
The ARTIK 530/530s Module provides one 4-lane MIPI interface that complies with the MIPI DSI standard
specification V1.01r11. The key features of the MIPI DSI sub-system are
Maximum resolution ranges up to WUXGA 1920 × 1200
Supports 1, 2, 3 or 4 data lanes
Supports pixel format:
16bpp, 18bpp packed, 18bpp loosely packed (3 byte), 24bpp
Supported interfaces are
Protocol-to-PHY Interface (PPI) up to 1.5Gbps, in MIPI D-PHY
RGB Interface for video image input from display controller
PMS control interface for PLL to configure byte clock frequency
Prescaler to generate escape clock from byte clock
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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HDMI
The ARTIK 530/530s Module provides one HDMI v1.4a interface. The key features of the HDMI sub-system are
•Support for v1.4a spec
Up to 1080p video resolution
•HDMI Link + HDMI PHY
Support for the following video formats:
–480p@59.94/60Hz
–576p@50Hz
–720p@50/59.94/60Hz
1080p@50/59.94/60Hz (No support for interlaced format)
Support for 4:4:4 RGB
Support for up to 8-bits per color
LVDS
The ARTIK 530/530s Module provides five low voltage differential signaling (LVDS) output channels with one clock
channel. The key features of the LVDS channel system are
Output clock range 30–125MHz
Support for 630 Mbps per channel
Up to 393.75MB/s data transport
Support for power down mode
Gigabit EMAC
The ARTIK 530/530s Module provides one Gigabit EMAC interface. The most important features of the Ethernet MAC
module are
Standard compliance
IEEE 802.3az-2010: energy efficient Ethernet (EEE)
RGMII v2.6
MAC supports the following features:
10/100/1000 Mbps data transfer rates with an RGMII interface to communicate with external Gigabit PHY
Full duplex operation
Half duplex operation
Flexible address filtering
Additional frame filtering
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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SD/MMC
The ARTIK 530/530s Module provides one SD/MMC interface. The Mobile Storage Host is an interface between the
system and the SD/MMC. The key features of mobile storage host sub-system are as follows:
SD
Support for Secure Digital I/O (SDIO – version 3.0)
Support for Secure Digital Memory (SDMEM – version 3.0)
Consumer Electronics Advanced Transport Architecture (CE-ATA-version 1.1)
Support 4-bit SDR mode up to 50MHz
Support for PIO and DMA mode data transfer
Support for 4- bit data bus width
MMC
Support for Multimedia Cards (MMC – version 4.41)
Support for Embedded Multimedia Cards (eMMC – version 4.5)
Support for 4-bit SDR mode up to 50MHz
Support for PIO and DMA mode data transfer
Support for 4- bit data bus width
Memory Controller
The ARTIK 530/530s Module has one DDR3 memory interface. The key features are
One 32-bit DDR3 memory interface
Two 256MB or two 512MB DDR3 16-bit memory chips, for a total of 512MB or 1GB
Up to 800MHz DDR3 speed with a maximum throughput of 6.4GB/s
JTAG
The JTAG core provides debug capabilities for the developer and is compliant with the IEEE 1149 standard.
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
18
Security Subsystem
In addition to the Secure Element, the main processor on the module provides additional security features. The key
features of the Security Controller sub-system are
Secure 128-bit die ID (available to the ARTIK 530s Modules only)
Secure JTAG featuring a secure 128-bit JTAG ID (available to the ARTIK 530s Modules only)
Secure boot featuring a 128-bit boot ID (available to the ARTIK 530s Modules only)
Security Controller (available to the ARTIK 530s Modules only)
Secure Element (all features in ARTIK 530s Modules; limited features in ARTIK 530 Module)
Security Controller
The Security Controller provides a Trusted Execution Environment (TEE) and hardware cryptographic accelerators as
follows:
•TEE
Register Protection Controller
Memory Protection Controller
Hardware cryptographic accelerators
–DES, Triple DES
–AES
–SHA-1
–MD5
Secure Element
The ARTIK 530/530s Module has a dedicated Secure Element to assure end-to-end authentication and
communication between nodes in an IoT setting. The most important hardware features of the Secure Element are
An ISO/IEC 7816 14443-compliant interface.
Dedicated 16-bit SecuCalm CPU core
Crypto co-processor
Modular exponential accelerator
–RSA 2080 bits
ECC 512 bits
Data security
Memory encryption for all memory
256B read-only and 256B nonerasable flash area
Selective reset operation if abnormal voltages/frequencies are detected
Embedded tamper-free memory
–32KB ROM
–264KB FLASH
2.5KB cryptographic memory
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
19
Serial interfaces:
ISO 7816-3-compliant interface
Asynchronous half-duplex character receive/transmit serial interface
Quad-Core Processor System
The processor system architecture that resides on the ARTIK 530/530s Module is a system-on-a-chip (SoC) based on
a 32-bit RISC architecture. Designed using the 28nm low power process, the processor system architecture provides
superior performance using a quad-core CPU. The key features of the ARTIK 530/530s Module are
Quad-core ARM® Cortex®-A9, 32-bit RISC architecture
•Maximum core speed 1.2GHz
32KB I-Cache per core
32KB D-Cache per core
1024KB L2-Cache shared between the four cores
Support for dynamic virtual-address mapping
Timer
The ARTIK 530/530s Module has four dedicated timer channels. The most important features of the Timer module
are
Timer or watchdog timer modes
Four dedicated Timer channels with watchdog timer
Normal interval timer mode with interrupt request
Reset on timer countdown
Level-triggered interrupt mechanism
Interrupt Controller
The ARTIK 530/530s Module has one interrupt controller module. The most important features of the interrupt
module are
Vectored interrupt controller
Support for 64 channel-interrupt sources
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
20
For each interrupt source the following properties are available:
Fixed hardware interrupt priority level
Programmable interrupt priority level
Hardware interrupt priority level masking
IRQ and FIQ generation
Software interrupt generation
Test registers
Raw interrupt status
Interrupt request status
DMA
The ARTIK 530/530s Module has one scatter-gather DMA module. The most important features of the DMA module
are
16 channels of dedicated DMA
•16 DMA request lines
Various operating modes
Single DMA mode
–Burst DMA mode
Memory-to-memory transfer
Memory-to-peripheral transfer
Peripheral-to-memory transfer
Peripheral-to-peripheral transfer
Support for 8/16/32 bit wide transactions
Big endian and little endian (default) support
RTC
The ARTIK 530/530s Module has one real time clock (RTC) module. The most important features are
Four spread-spectrum PLLs
Two external crystals: one 24MHz crystal for the PLLs and one 32.768KHz crystal for the RTC
One 32-bit RTC counter
Support for alarm interrupt using RTC
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
21
Video Input Processor
The ARTIK 530/530s Module provides one video input processor (VIP). The key features of the VIP sub-system are
Support for external 8-bit and 16-bit MIPI
Support for internal MIPI-CSI
•Support for images up to 8192×8192
Support for clipping and scale-down
Support for YUV420 memory format
Scaler
The ARTIK 530/530s Module provides one universal scaler. The key features of the scaler are
Support for different input formats:
YUV420, YUV422, YUV444
Flexible size, from 8×8 up to 1920×1080 with a granularity of 8
Upscale ratio from 8×8 to 1920×1080
Downscale ratio from 1920×1080 to 8×8
Low pass filter available after upscale or before downscale
Horizontal 5-tab filter with 64 sets of coefficients
Vertical 3-tab filter with 32 sets of coefficients
Multiformat Codec
The ARTIK 530/530s Module provides one integrated Multiformat Codec (MFC) module. The key features of the MFC
sub-system are
•Decoder:
H.264 : BP, MP, HP Level 4.2 up to 1920×1080, up to 50MBps
MPEG4 : Advanced Simple Profile (ASP) up to 1920×1080, at up to 40Mbps
H.263 : Profile 3 up to 1920×1080, up to 20Mbps
MPEG 1,2 : Main Profile, High Level up to 1920×1080, up to 80MBps
•Encoder:
H.264 : Baseline profile, Level 4.0 up to 1080p, up to 20Mbps
MPEG4 : Simple profile, Level 5.6 up to 1080p, up to 20Mbps
H.263 : Profile 3, Level 70 up to 1080p, up to 20Mbps
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
22
Graphics Pipeline
The ARTIK 530/530s Module provides one 2D and 3D graphics pipeline module. The key features of the graphics
pipeline are
Two pixel processors:
Tile oriented processing
Alpha blending
Texture support, non-power-of-2
–Cube mapping
Fast dynamic branching
Trigonometric acceleration
Full floating-point arithmetic
Line, quad, triangle and point sprites
Perspective correct texturing
Point sampling, bilinear and trilinear filtering
8-bit stencil buffering
4-level hierarchical Z and stencil operation
Geometry processor:
Programmable vertex shader
Flexible input and output formats
Autonomous operation tile list generation
Indexed and non-indexed geometry input
Primitive constructions with points, lines, triangles and quads
•Support for OpenGL ES 1.0 and 2.0
PCM
The ARTIK 530/530s Module provides one PCM channel. The PCM interface provides a bi-directional serial interface
that can be connected to an external audio codec. The key features of the PCM subsystem are
Supports both Master and Slave mode external audio codecs
Supports both short and long frame synchronization
Supports a variety of data formats with a default format of 13-bit 2’s complement, left justified, clock MSB
first
F1' are 3 TabLe 2 TabLe 6
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
23
MODULE PADS
The ARTIK 530/530s Module utilizes 292 signal and ground balls providing all the relevant signaling. Figure 3 shows
how the balls are oriented and how signal coordinates are assigned to the PADs of the ARTIK 530/530s Module.
Table 2Table 6 describe the relation between the ball coordinates and the ball signal names. These tables also
provide detailed characteristics for each ball signal name.
Figure 3. ARTIK 530/530s Module Top View Ball Organization
PA
11
PA
12
PA
13
PA
14
PA
15
PA
16
PA
17
PA
18
PA
19
PA
20
PA
21
PA
22
PA
23
PA
24
PA
25
PA
26
PA
27
PA
28
PA
29
PA
30
PA
31
PA
32
PA
33
PA
34
PA
35
PA
36
PA
37
PA
38
PA
39
PA
40
PA
41
PA
42
PA
1
PA
2
PA
3
NO
BALL
PA
5
PA
6
PA
7
PA
8
PA
9
PA
10
PB
11
PB
12
PB
13
PB
14
PB
15
PB
16
PB
17
PB
18
PB
19
PB
20
PB
21
PB
22
PB
23
PB
24
PB
25
PB
26
PB
27
PB
28
PB
29
PB
30
PB
31
PB
32
PB
33
PB
34
PB
35
PB
36
PB
37
PB
38
PB
39
PB
40
PB
41
PB
42
PB
1
PB
2
PB
3
PB
4
PB
5
PB
6
PB
7
PB
8
PB
9
PB
10
PAK
11
PAK
12
PAK
13
PAK
14
PAK
15
PAK
16
PAK
17
PAK
18
PAK
19
PAK
20
PAK
21
PAK
22
PAK
23
PAK
24
PAK
25
PAK
26
PAK
27
PAK
28
PAK
29
PAK
30
PAK
31
PAK
32
PAK
33
PAK
34
PAK
35
PAK
36
PAK
37
PAK
38
PAK
39
PAK
40
PAK
41
PAK
42
PAK
1
PAK
2
PAK
3
PAK
4
PAK
5
PAK
6
PAK
7
PAK
8
PAK
9
PAK
10
PAL
11
PAL
12
PAL
13
PAL
14
PAL
15
PAL
16
PAL
17
PAL
18
PAL
19
PAL
20
PAL
21
PAL
22
PAL
23
PAL
24
PAL
25
PAL
26
PAL
27
PAL
28
PAL
29
PAL
30
PAL
31
PAL
32
PAL
33
PAL
34
PAL
35
PAL
36
PAL
37
PAL
38
PAL
39
PAL
40
PAL
41
PAL
42
PAL
1
PAL
2
PAL
3
PAL
4
PAL
5
PAL
6
PAL
7
PAL
8
PAL
9
PAL
10
PF
1
PF
2
PG
1
NO
BALL
PH
1
NO
BALL
PJ
1
PJ
2
PK
1
PK
2
PL
1
PL
2
PM
1
PM
2
PN
1
PN
2
PP
1
NO
BALL
PR
1
PR
2
PT
1
PT
2
PU
1
NO
BALL
PV
1
NO
BALL
PW
1
PW
2
PY
1
PY
2
PAA
1
PAA
2
PAB
1
PAB
2
PAC
1
PAC
2
PAD
1
PAD
2
PAE
1
PAE
2
PAF
1
PAF
2
PAG
1
PAG
2
PAH
1
PAH
2
PAJ
1
PAJ
2
PC
1
NO
BALL
PD
1
NO
BALL
PE
1
PE
2
PF
41
PF
42
PG
41
PG
42
PH
41
PH
42
PJ
41
PJ
42
PK
41
PK
42
PL
41
PL
42
PM
41
PM
42
PN
41
PN
42
PP
41
PP
42
PR
41
PR
42
PT
41
PT
42
PU
41
PU
42
PV
41
PV
42
PW
41
PW
42
PY
41
PY
42
PAA
41
PAA
42
PAB
41
PAB
42
PAC
41
PAC
42
PAD
41
PAD
42
PAE
41
PAE
42
PAF
41
PAF
42
PAG
41
PAG
42
PAH
41
PAH
42
PAJ
41
PAJ
42
PC
41
PC
42
PD
41
PD
42
PE
41
PE
42
PAJ
39
PAJ
40
PC
39
PC
40
TP
286
TP
283
TP
284
TP
282
TP
285
TP
288
TP
295
TP
293
TP
292
TP
300
TP
296
TP
298
TP
291
TP
294
TP
297
TP
290
TP
289
TP
299
TP
301
TP
287
TabLe 2 TabLe 5 TabLe 1 :mwno ARTIK‘
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
24
Ball Table Column Definitions
The meaning of the various columns used in Table 2 - Table 6 is explained in Table 1.
North Ball Array
Table 1. Ball Table Column Definition
Column Name Column Definition
Ball Loc. Ball location on the ARTIK 530/530s Module as shown in Figure 3.
Ball Name The ball name on the ARTIK 530/530s Module.
Voltage Voltage level on the ball.
Default Default function of the main SoC at hardware power-on.
Type S: Signal ball, P: Power ball, G: GND ball.
I/O I: Input, O: Output, IO: Input/Output to/from module
PU/PD Indicates the presence of module-internal pull-up or pull-down. PU: Pull-Up, PD: Pull-Down, N: No Pull-Up/Pull-Down.
Group Nominal function group set according to pad name. For more information see the ARTIK 530/530s Module Hardware
User Guide. Usually the function of the pin can be reprogrammed.
Function Explanation on the function of the ball.
Table 2. North Ball Array
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
PA1 GMAC_TXEN 3.3V S IO N GMAC GMAC Transmit Enable
PA2 GMAC_TXD1 3.3V S IO N GMAC GMAC Transmit Data 1
PA3 GMAC_TXD3 3.3V S IO N GMAC GMAC Transmit Data 3
PA4 NO BALL NO BALL
PA5 GMAC_GTXCLK 3.3V S IO N GMAC GMAC Transmit Clock
PA6 GMAC_RXDV 3.3V S IO N GMAC GMAC Receive Enable
PA7 GMAC_RXD2 3.3V S IO N GMAC GMAC Receive Data 2
PA8 GMAC_RXD0 3.3V S IO N GMAC GMAC Receive Data 0
PA9 GND 0.0V G GND Ground
PA10 AP_MIPICSI_DNCLK 1.8V S IO N CSI MIPI CSI Data Negative Clock
PA11 AP_MIPICSI_DN0 1.8V S IO N CSI MIPI CSI Data Negative 0
PA12 AP_MIPICSI_DN1 1.8V S IO N CSI MIPI CSI Data Negative 1
PA13 AP_MIPICSI_DN2 1.8V S IO N CSI MIPI CSI Data Negative 2
PA14 AP_MIPICSI_DN3 1.8V S IO N CSI MIPI CSI Data Negative 3
PA15 GND 0.0V G GND Ground
PA16 AP_MIPIDSI_DNCLK 1.8V S IO N DSI MIPI DSI Data Negative Clock
PA17 AP_MIPIDSI_DN0 1.8V S IO N DSI MIPI DSI Data Negative 0
PA18 AP_MIPIDSI_DN1 1.8V S IO N DSI MIPI DSI Data Negative 1
PA19 AP_MIPIDSI_DN2 1.8V S IO N DSI MIPI DSI Data Negative 2
PA20 AP_MIPIDSI_DN3 1.8V S IO N DSI MIPI DSI Data Negative 3
PA21 GND 0.0V G GND Ground
PA22 AP_LVDS_TN0 1.8V S O N LVDS LVDS Transmit Channel 0 Negative
PA23 AP_LVDS_TN1 1.8V S O N LVDS LVDS Transmit Channel 1 Negative
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
25
PA24 AP_LVDS_TN2 1.8V S O N LVDS LVDS Transmit Channel 2 Negative
PA25 AP_LVDS_TNCLK 1.8V S O N LVDS LVDS Transmit Negative Clock
PA26 AP_LVDS_TN3 1.8V S O N LVDS LVDS Transmit Channel 3 Negative
PA27 AP_LVDS_TN4 1.8V S O N LVDS LVDS Transmit Channel 4 Negative
PA28 GND 0.0V G GND Ground
PA29 AP_HDMI_CEC 3.3V S IO N HDMI HDMI Consumer Electronics Control
PA30 AP_HDMI_TX2N 1.8V S O N HDMI HDMI Transmit Channel 2 Negative
PA31 AP_HDMI_TX1N 1.8V S O N HDMI HDMI Transmit Channel 1 Negative
PA32 AP_HDMI_TX0N 1.8V S O N HDMI HDMI Transmit Channel0 Negative
PA33 AP_HDMI_TXCN 1.8V S O N HDMI HDMI Transmit Negative Clock
PA34 GND 0.0V G GND Ground
PA35 AP_OTG_DM 3.3V S IO N USB OTG USB OTG Data Minus
PA36 AP_USBH_DM 3.3V S IO N USB
HOST
USB HOST Data Minus
PA37 AP_GPA13 3.3V S IO N GPIO Generic GPIO
PA38 AP_HSIC_STROBE 1.2V S IO N HSIC HSIC Strobe
PA39 AP_GPA14 3.3V S IO N GPIO Generic GPIO
PA40 AP_GPA9 3.3V S IO N GPIO Generic GPIO
PA41 AP_GPA15 3.3V S IO N GPIO Generic GPIO
PA42 AP_GPA12 3.3V S IO N GPIO Generic GPIO
PB1 GND 0.0V G GND Ground
PB2 GMAC_TXD0 3.3V S IO N GMAC GMAC Transmit Data 0
PB3 GMAC_TXD2 3.3V S IO N GMAC GMAC Transmit Data 2
PB4 GMAC_MDC 3.3V S IO N GMAC GMAC MDC
PB5 GMAC_RXCLK 3.3V S IO N GMAC GMAX Receive Clock
PB6 GMAC_RXD3 3.3V S IO N GMAC GMAC Receive Data 3
PB7 GMAC_RXD1 3.3V S IO N GMAC GMAC Receive Data 1
PB8 GMAC_MDIO 3.3V S IO N GMAC GMAC MDIO
PB9 GND 0.0V G GND Ground
PB10 AP_MIPICSI_DPCLK 1.8V S IO N CSI MIPI CSI Data Positive Clock
PB11 AP_MIPICSI_DP0 1.8V S IO N CSI MIPI CSI Data Positive 0
PB12 AP_MIPICSI_DP1 1.8V S IO N CSI MIPI CSI Data Positive 1
PB13 AP_MIPICSI_DP2 1.8V S IO N CSI MIPI CSI Data Positive 2
PB14 AP_MIPICSI_DP3 1.8V S IO N CSI MIPI CSI Data Positive 3
PB15 GND 0.0V G GND Ground
PB16 AP_MIPIDSI_DPCLK 1.8V S IO N DSI MIPI DSI Data Positive Clock
PB17 AP_MIPIDSI_DP0 1.8V S IO N DSI MIPI DSI Data Positive 0
PB18 AP_MIPIDSI_DP1 1.8V S IO N DSI MIPI DSI Data Positive 1
PB19 AP_MIPIDSI_DP2 1.8V S IO N DSI MIPI DSI Data Positive 2
PB20 AP_MIPIDSI_DP3 1.8V S IO N DSI MIPI DSI Data Positive 3
PB21 GND 0.0V G GND Ground
PB22 AP_LVDS_TP0 1.8V S O N LVDS LVDS Transmit Channel 0 Positive
PB23 AP_LVDS_TP1 1.8V S O N LVDS LVDS Transmit Channel 1 Positive
Table 2. North Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
26
South Ball Array
PB24 AP_LVDS_TP2 1.8V S O N LVDS LVDS Transmit Channel 2 Positive
PB25 AP_LVDS_TPCLK 1.8V S O N LVDS LVDS Transmit Positive Clock
PB26 AP_LVDS_TP3 1.8V S O N LVDS LVDS Transmit Channel 3 Positive
PB27 AP_LVDS_TP4 1.8V S O N LVDS LVDS Transmit Channel 4 Positive
PB28 GND 0.0V G GND Ground
PB29 AP_HDMI_HPD 3.3V S I N HDMI HDMI Hot Plug Detect
PB30 AP_HDMI_TX2P 1.8V S O N HDMI HDMI Transmit Channel 2 Positive
PB31 AP_HDMI_TX1P 1.8V S O N HDMI HDMI Transmit Channel 1 Positive
PB32 AP_HDMI_TX0P 1.8V S O N HDMI HDMI Transmit Channel 0 Positive
PB33 AP_HDMI_TXCP 1.8V S O N HDMI HDMI Transmit Positive Clock
PB34 GND 0.0V G GND Ground
PB35 AP_OTG_DP 3.3V S IO N USB OTG USB OTG Data Plus
PB36 AP_USBH_DP 3.3V S IO N USB
HOST
USB HOST Data Plus
PB37 AP_OTG_ID S I N USB
HOST
USB HOST ID
PB38 AP_HSIC_DATA 1.2V S IO N HSIC HSIC Data
PB39 AP_GPA4 3.3V S IO N GPIO Generic GPIO
PB40 AP_GPA5 3.3V S IO N GPIO Generic GPIO
PB41 AP_GPA16 3.3V S IO N GPIO Generic GPIO
PB42 AP_GPA11 3.3V S IO N GPIO Generic GPIO
Table 3. South Ball Array
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
PAK1 AP_I2S0_DOUT 3.3V S IO N I2S0 I2S 0 Data Out
PAK2 AP_I2S0_BCLK 3.3V S IO N I2S0 I2S 0 Bit Clock
PAK3 AP_GPC11_SPI2_MISO 3.3V S IO N SPI2 SPI 2 Receive Data
PAK4 AP_GPC9_SPI2_CLK 3.3V S IO N SPI2 SPI 2 Clock
PAK5 AP_SPI0_MISO 3.3V S IO N SPI0 SPI 0 Receive Data
PAK6 AP_SPI0_CLK 3.3V S IO N SPI0 SPI 0 Clock
PAK7 AP_GPC14_PWM2 3.3V S IO N PWM PWM 2
PAK8 AP_GPD6_SCL2 3.3V S IO PU I2CI
2C SCL 2
PAK9 AP_GPD4_SCL1 3.3V S IO PU I2CI
2C SCL 1
PAK10 AP_GPD2_SCL0 3.3V S IO PU I2CI
2C SCL 0
PAK11 AP_GPA23_HDMI_I2C_SCL 3.3V S IO N I2CHDMI I
2C SCL
PAK12 ZB_DEBUG_TDO_SWO 3.3V 802.15.4 802.15.4 JTAG TMS
PAK13 ZB_PTI_DATA_FRC_DOUT 3.3V 802.15.4 802.15.4 JTAG TCK
PAK14 ZB_DEBUG_TCK_SWCLK 3.3V 802.15.4 802.15.4 Control
PAK15 COMBO_ZIG_UART_TXD 3.3V S IO 802.15.4 802.15.4 UART
PAK16 GND 0.0V G GND Ground
Table 2. North Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
27
PAK17 VCC3P3_SYS 3.3V P O POWER VCC 3.3V Power: voltage reference only
PAK18 VCC3P3_SYS 3.3V P O POWER VCC 3.3V Power: voltage reference only
PAK19 AP_GPD28 3.3V S IO N GPIO Generic GPIO
PAK20 AP_GPE2 3.3V S IO N GPIO Generic GPIO
PAK21 AP_GPE1 3.3V S IO N GPIO Generic GPIO
PAK22 AP_UART_TX3 3.3V S IO N UART UART Transmit Data 3
PAK23 AP_UART_TX4 3.3V S IO N UART UART Transmit Data 4
PAK24 AP_UART_TX0 3.3V S IO N UART UART Transmit Data 0
PAK25 AP_GPB0_VID1_1_I2SLRCK1 3.3V S IO PU I2S1 I2S 1 Left Right Clock
PAK26 AP_GPA28_I2SMCLK1 3.3V S IO N I2S1 I2S 1 Master Clock
PAK27 AP_GPA30_VID1_0_I2SBCLK1 3.3V S IO PU I2S1 I2S 1 Bit Clock
PAK28 AP_SD0_CMD 3.3V S IO N SD/MMC SD Command
PAK29 AP_SD0_D1 3.3V S IO N SD/MMC SD Data 1
PAK30 AP_SD0_CLK 3.3V S IO N SD/MMC SD Clock
PAK31 NO CONNECTION NC NA
PAK32 AP_GPB13_SD0_BOOT 3.3V S I PU BOOTING Select Booting Scenario
PAK33 AP_GPC17 3.3V S IO N GPIO Generic GPIO
PAK34 AP_GPC0 3.3V S IO N GPIO Generic GPIO
PAK35 AP_GPC26 3.3V S IO PU GPIO Generic GPIO
PAK36 AP_GPB8 3.3V S IO N GPIO Generic GPIO
PAK37 AP_GPB14 3.3V S IO N GPIO Generic GPIO
PAK38 AP_GPA20 3.3V S IO N GPIO Generic GPIO
PAK39 AP_GPA18 3.3V S IO N GPIO Generic GPIO
PAK40 AP_GPA21 3.3V S IO N GPIO Generic GPIO
PAK41 AP_GPA10 3.3V S IO N GPIO Generic GPIO
PAK42 AP_GPA6 3.3V S IO N GPIO Generic GPIO
PAL1 AP_I2S0_DIN 3.3V S IO N I2S0 I2S 0 Data In
PAL2 AP_I2S0_MCLK 3.3V S IO N I2S0 I2S 0 Master Clock
PAL3 AP_GPC12_SPI2_MOSI 3.3V S IO N SPI2 SPI 2 Transmit Data
PAL4 AP_GPC10_SPI2_CS 3.3V S IO PU SPI2 SPI 2 Frame
PAL5 AP_SPI0_MOSI 3.3V S IO N SPI0 SPI 0 Transmit Data
PAL6 AP_SPI0_CS 3.3V S IO N SPI0 SPI 0 Frame
PAL7 AP_GPD1_PWM0 3.3V S IO N PWM PWM 0
PAL8 AP_GPD7_SDA2 3.3V S IO PU I2CI
2C SDA
PAL9 AP_GPD5_SDA1 3.3V S IO PU I2CI
2C SDA 1
PAL10 AP_GPD3_SDA0 3.3V S IO PU I2CI
2C SDA 0
PAL11 AP_GPA24_HDMI_I2C_SDA 3.3V S IO N I2CHDMI I
2C SDA
PAL12 ZB_DEBUG_TMS_SWDIO 3.3V 802.15.4 802.15.4 JTAG TDI
PAL13 ZB_PTI_SYNC_FRC_DFRAME 3.3V 802.15.4 802.15.4 JTAG TDO
PAL14 PAD_ZB_RSTn 3.3V S O N 802.15.4 802.15.4 Reset
PAL15 COMBO_ZIG_UART_RXD 3.3V S IO PU 802.15.4 802.15.4 UART
PAL16 GND 0.0V G GND Ground
Table 3. South Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
28
East Ball Array
PAL17 VCC3P3_SYS 3.3V P O POWER VCC 3V3 Power: voltage reference only
PAL18 VCC3P3_SYS 3.3V P O POWER VCC 3V3 Power: voltage reference only
PAL19 AP_VDDPWRON 3.3V S O N MISC VDD Power On
PAL20 AP_GPE3 3.3V S IO N GPIO Generic GPIO
PAL21 AP_GPE0 3.3V S IO N GPIO Generic GPIO
PAL22 AP_UART_RX3 3.3V S IO N UART UART Receive Data 3
PAL23 AP_UART_RX4 3.3V S IO N UART UART Receive Data 4
PAL24 AP_UART_RX0 3.3V S IO N UART UART Receive Data 0
PAL25 AP_GPD31 3.3V S IO N GPIO Generic GPIO
PAL26 AP_GPB9_I2SDIN1 3.3V S IO N I2S1 I2S 1 Data In
PAL27 AP_GPB6_VID1_4_I2SDOUT1 3.3V S IO PD I2S1 I2S 1 Data Out
PAL28 AP_SD0_D3 3.3V S IO N SD/MMC SD Data 3
PAL29 AP_SD0_D2 3.3V S IO N SD/MMC SD Data 2
PAL30 AP_SD0_D0 3.3V S IO N SD/MMC SD Data 0
PAL31 AP_GPB4_VID1_3_BOOT 3.3V S I PU BOOTING Select Booting Scenario
PAL32 AP_GPB15_SD1_BOOT 3.3V S I PD BOOTING Select Booting Scenario
PAL33 AP_GPD8 3.3V S IO N GPIO Generic GPIO
PAL34 AP_GPE30 3.3V S IO PU GPIO Generic GPIO
PAL35 AP_GPC27 3.3V S IO PU GPIO Generic GPIO
PAL36 AP_GPB22 3.3V S IO N GPIO Generic GPIO
PAL37 AP_GPB16 3.3V S IO N GPIO Generic GPIO
PAL38 AP_GPB23 3.3V S IO N GPIO Generic GPIO
PAL39 AP_GPA22 3.3V S IO N GPIO Generic GPIO
PAL40 AP_GPA19 3.3V S IO N GPIO Generic GPIO
PAL41 AP_GPA17 3.3V S IO N GPIO Generic GPIO
PAL42 AP_GPA3 3.3V S IO N GPIO Generic GPIO
Table 4. East Ball Array
Ball Ball Name Voltage Type I/O PU/PD Group Function
PC1 GND 0.0V G GND Ground
PC2 NO BALL NO BALL
PD1 GND 0.0V G GND Ground
PD2 NO BALL NO BALL
PE1 GND 0.0V G GND Ground
PE2 GND 0.0V G GND Ground
PF1 GND 0.0V G GND Ground
PF2 GND 0.0V G GND Ground
PG1 GND 0.0V G GND Ground
Table 3. South Ball Array (Continued)
Ball Loc. Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
29
PG2 NO BALL NO BALL
PH1 GND 0.0V G GND Ground
PH2 NO BALL NO BALL
PJ1 GND 0.0V G GND Ground
PJ2 GND 0.0V G GND Ground
PK1 GND 0.0V G GND Ground
PK2 GND 0.0V G GND Ground
PL1 GND 0.0V G GND Ground
PL2 GND 0.0V G GND Ground
PM1 GND 0.0V G GND Ground
PM2 GND 0.0V G GND Ground
PN1 GND 0.0V G GND Ground
PN2 GND 0.0V G GND Ground
PP1 GND 0.0V G GND Ground
PP2 NO BALL NO BALL
PR1 GND 0.0V G GND Ground
PR2 GND 0.0V G GND Ground
PT1 GND 0.0V G GND Ground
PT2 GND 0.0V G GND Ground
PU1 GND 0.0V G GND Ground
PU2 NO BALL NO BALL
PV1 GND 0.0V G GND Ground
PV2 NO BALL NO BALL
PW1 AP_ADC4 1.8V S I N ADC ADC Channel 4
PW2 AP_ADC5 1.8V S I N ADC ADC Channel 5
PY1 AP_ADC0 1.8V S I N ADC ADC Channel 0
PY2 AP_ADC1 1.8V S I N ADC ADC Channel 1
PAA1 AP_ADC2 1.8V S I N ADC ADC Channel 2
PAA2 AP_ADC3 1.8V S I N ADC ADC Channel 3
PAB1 GND 0.0V G GND Ground
PAB2 GND 0.0V G GND Ground
PAC1 AP_TCK 3.3V S IO PD JTAG JTAG TCK
PAC2 AP_TMS 3.3V S IO PU JTAG JTAG TMS
PAD1 AP_TDO 3.3V S IO N JTAG JTAG TDO
PAD2 AP_TDI 3.3V S IO PU JTAG JTAG TDI
PAE1 AP_NTRST 3.3V S IO PU JTAG JTAG NTRST
PAE2 AP_AGP2_RTC_INT_N 3.3V S IO N KEY/ALIVE AliveGPIO
PAF1 AP_PWRKEY 3.3V S IO N KEY/ALIVE Power Key part of AliveGPIO
PAF2 AP_AGP1 3.3V S IO N ALIVE AliveGPIO
PAG1 AP_NRESET 3.3V S I N *KEY Reset
PAG2 AP_GPA25 3.3V S IO N GPIO Generic GPIO
PAH1 AP_GPA26 3.3V S IO N GPIO Generic GPIO
Table 4. East Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
30
West Ball Array
PAH2 AP_GPA0 3.3V S IO N GPIO Generic GPIO
PAJ1 AP_I2S0_LRCLK 3.3V S IO N I2S0 I2S 0 Left Right Clock
PAJ2 AP_GPA27 3.3V S IO N I2S0 Generic GPIO
*. External 100k pull-up resistor required.
Table 5. West Ball Array
Ball Ball Name Voltage Type I/O PU/PD Group Function
PC39 GND 0.0V G GND Ground
PC40 GND 0.0V G GND Ground
PC41 GND 0.0V G GND Ground
PC42 GND 0.0V G GND Ground
PD41 VCC5P0_OTGVBUS P I POWER USB2.0 OTG BUS Power
PD42 VCC5P0_OTGVBUS P I POWER USB2.0 OTG BUS Power
PE41 NO CONNECTION NC
PE42 NO CONNECTION NC
PF41 NO CONNECTION NC
PF42 GND 0.0V G GND Ground
PG41 GND 0.0V G GND Ground
PG42 GND 0.0V G GND Ground
PH41 NO CONNECTION NC
PH42 NO CONNECTION NC
PJ41 NO CONNECTION NC
PJ42 GND 0.0V G GND Ground
PK41 GND 0.0V G GND Ground
PK42 GND 0.0V G GND Ground
PL41 GND 0.0V G GND Ground
PL42 GND 0.0V G GND Ground
PM41 GND 0.0V G GND Ground
PM42 GND 0.0V G GND Ground
PN41 GND 0.0V G GND Ground
PN42 GND 0.0V G GND Ground
PP41 AP_GPB30 3.3V S IO GPIO Generic GPIO
PP42 GND 0.0V G GND Ground
PR41 NO CONNECTION NC
PR42 NO CONNECTION NC
PT41 GND 0.0V G GND Ground
PT42 GND 0.0V G GND Ground
PU41 GND 0.0V G GND Ground
PU42 GND 0.0V G GND Ground
Table 4. East Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
31
Center Ball Array
PV41 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PV42 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PW41 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PW42 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PY41 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PY42 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PAA41 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PAA42 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PAB41 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PAB42 VIN 3.7~5.0V P I POWER Main Power Supply for Module
PAC41 GND 0.0V G GND Ground
PAC42 GND 0.0V G GND Ground
PAD41 NO CONNECTION NC
PAD42 NO CONNECTION NC
PAE41 GND 0.0V G GND Ground
PAE42 NO CONNECTION NC
PAF41 GND 0.0V G GND Ground
PAF42 GND 0.0V G GND Ground
PAG41 AP_GPB11 3.3V S IO N GPIO Generic GPIO
PAG42 AP_GPB18 3.3V S IO N GPIO Generic GPIO
PAH41 AP_GPC25 3.3V S IO PU GPIO Generic GPIO
PAH42 AP_GPE31 3.3V S IO PU GPIO Generic GPIO
PAJ39 BT_PCM_CLK 3.3V S IO N BT PCM PCM Clock
PAJ40 BT_PCM_D_IN 3.3V S I N BT PCM PCM Data In
PAJ41 BT_PCM_D_OUT 3.3V S O N BT PCM PCM Data Out
PAJ42 BT_PCM_LRCK 3.3V S IO N BT PCM PCM LR Clock
Table 6. Center Ball Array
Ball Ball Name Voltage Type I/O PU/PD Group Function
TP282 GND 0.0V NA GND Ground
TP283 GND 0.0V NA GND Ground
TP284 GND 0.0V NA GND Ground
TP285 GND 0.0V NA GND Ground
TP286 GND 0.0V NA GND Ground
TP287 GND 0.0V NA GND Ground
TP288 GND 0.0V NA GND Ground
TP289 GND 0.0V NA GND Ground
TP290 GND 0.0V NA GND Ground
TP291 GND 0.0V NA GND Ground
TP292 GND 0.0V NA GND Ground
Table 5. West Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
32
TP293 GND 0.0V NA GND Ground
TP294 GND 0.0V NA GND Ground
TP295 GND 0.0V NA GND Ground
TP296 GND 0.0V NA GND Ground
TP297 GND 0.0V NA GND Ground
TP298 GND 0.0V NA GND Ground
TP299 GND 0.0V NA GND Ground
TP300 GND 0.0V NA GND Ground
TP301 GND 0.0V NA GND Ground
Table 6. Center Ball Array (Continued)
Ball Ball Name Voltage Type I/O PU/PD Group Function
Nor: Booting SeLection xmwno ARTIK‘ TabLe 36
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
33
FUNCTIONAL INTERFACES
This section shows the functional interfaces that are available at the pads of the ARTIK 530/530s Module. The
functions provided are related to the development environment used. Depending on your project you can always
choose to reprogram some of the GPIOs that are currently assigned to the predefined functional interfaces.
ADC
Booting
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
Bluetooth PCM
Table 7. ADC
Function Ball Loc. Ball Name Voltage I/O PU/PD
ADC Channel 0 PY1 AP_ADC0 1.8V I N
ADC Channel 1 PY2 AP_ADC1 1.8V I N
ADC Channel 2 PAA1 AP_ADC2 1.8V I N
ADC Channel 3 PAA2 AP_ADC3 1.8V I N
ADC Channel 4 PW1 AP_ADC4 1.8V I N
ADC Channel 5 PW2 AP_ADC5 1.8V I N
Table 8. Booting
Function Ball Loc. Ball Name Voltage I/O PU/PD
Booting Configuration 1 PAK32 AP_GPB13_SD0_BOOT 3.3V I PU
Booting Configuration 2 PAL32 AP_GPB15_SD1_BOOT 3.3V I PD
Booting Configuration 3 PAL31 AP_GPB4_VID1_3_BOOT 3.3V I PU
If a preferred boot device fails, the above pins select whether secondary and/or tertiary boot options are
available. For details, see Booting Selection.
Table 9. Bluetooth PCM
Function Ball Loc. Ball Name Voltage I/O PU/PD
PCM Clock PAJ39 BT_PCM_CLK 3.3V IO N
PCM LR Clock PAJ42 BT_PCM_LRCK 3.3V IO N
PCM Data In PAJ40 BT_PCM_D_IN 3.3V I N
PCM Data Out PAJ41 BT_PCM_D_OUT 3.3V O N
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
34
MIPI CSI
MIPI DSI
GMAC
Table 10. MIPI CSI
Function Ball Loc. Ball Name Voltage I/O PU/PD
MIPI CSI Data Negative Clock PA10 AP_MIPICSI_DNCLK 1.8V IO N
MIPI CSI Data Negative 0 PA11 AP_MIPICSI_DN0 1.8V IO N
MIPI CSI Data Negative 1 PA12 AP_MIPICSI_DN1 1.8V IO N
MIPI CSI Data Negative 2 PA13 AP_MIPICSI_DN2 1.8V IO N
MIPI CSI Data Negative 3 PA14 AP_MIPICSI_DN3 1.8V IO N
MIPI CSI Data Positive Clock PB10 AP_MIPICSI_DPCLK 1.8V IO N
MIPI CSI Data Positive 0 PB11 AP_MIPICSI_DP0 1.8V IO N
MIPI CSI Data Positive 1 PB12 AP_MIPICSI_DP1 1.8V IO N
MIPI CSI Data Positive 2 PB13 AP_MIPICSI_DP2 1.8V IO N
MIPI CSI Data Positive 3 PB14 AP_MIPICSI_DP3 1.8V IO N
Table 11. MIPI DSI
Function Ball Loc. Ball Name Voltage I/O PU/PD
MIPI DSI Data Negative Clock PA16 AP_MIPIDSI_DNCLK 1.8V IO N
MIPI DSI Data Negative 0 PA17 AP_MIPIDSI_DN0 1.8V IO N
MIPI DSI Data Negative 1 PA18 AP_MIPIDSI_DN1 1.8V IO N
MIPI DSI Data Negative 2 PA19 AP_MIPIDSI_DN2 1.8V IO N
MIPI DSI Data Negative 3 PA20 AP_MIPIDSI_DN3 1.8V IO N
MIPI DSI Data Positive Clock PB16 AP_MIPIDSI_DPCLK 1.8V IO N
MIPI DSI Data Positive 0 PB17 AP_MIPIDSI_DP0 1.8V IO N
MIPI DSI Data Positive 1 PB18 AP_MIPIDSI_DP1 1.8V IO N
MIPI DSI Data Positive 2 PB19 AP_MIPIDSI_DP2 1.8V IO N
MIPI DSI Data Positive 3 PB20 AP_MIPIDSI_DP3 1.8V IO N
Table 12. GMAC
Function Ball Loc. Ball Name Voltage I/O PU/PD
GMAC MDC PB4 GMAC_MDC 3.3V IO N
GMAC MDIO PB8 GMAC_MDIO 3.3V IO N
GMAC Receive Clock PB5 GMAC_RXCLK 3.3V IO N
GMAC Receive Data 0 PA8 GMAC_RXD0 3.3V IO N
GMAC Receive Data 1 PB7 GMAC_RXD1 3.3V IO N
GMAC Receive Data 2 PA7 GMAC_RXD2 3.3V IO N
GMAC Receive Data 3 PB6 GMAC_RXD3 3.3V IO N
TabLe 29
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
35
The above signals can be reassigned by software to alternate functions; see Table 29 for details.
GPIO
GMAC Receive Enable PA6 GMAC_RXDV 3.3V IO N
GMAC Transmit Clock PA5 GMAC_GTXCLK 3.3V IO N
GMAC Transmit Data 0 PB2 GMAC_TXD0 3.3V IO N
GMAC Transmit Data 1 PA2 GMAC_TXD1 3V3 IO N
GMAC Transmit Data 2 PB3 GMAC_TXD2 3.3V IO N
GMAC Transmit Data 3 PA3 GMAC_TXD3 3.3V IO N
GMAC Transmit Enable PA1 GMAC_TXEN 3.3V IO N
Table 13. GPIO
Function Ball Loc. Ball Name Voltage I/O PU/PD *
Generic GPIO PAH2 AP_GPA0 3.3V IO N
Generic GPIO PAL42 AP_GPA3 3.3V IO N
Generic GPIO PB39 AP_GPA4 3.3V IO N
Generic GPIO PB40 AP_GPA5 3.3V IO N
Generic GPIO PAK42 AP_GPA6 3.3V IO N
Generic GPIO PA40 AP_GPA9 3.3V IO N
Generic GPIO PAK41 AP_GPA10 3.3V IO N
Generic GPIO PB42 AP_GPA11 3.3V IO N
Generic GPIO PA42 AP_GPA12 3.3V IO N
Generic GPIO PA37 AP_GPA13 3.3V IO N
Generic GPIO PA39 AP_GPA14 3.3V IO N
Generic GPIO PA41 AP_GPA15 3.3V IO N
Generic GPIO PB41 AP_GPA16 3.3V IO N
Generic GPIO PAL41 AP_GPA17 3.3V IO N
Generic GPIO PAK39 AP_GPA18 3.3V IO N
Generic GPIO PAL40 AP_GPA19 3.3V IO N
Generic GPIO PAK38 AP_GPA20 3.3V IO N
Generic GPIO PAK40 AP_GPA21 3.3V IO N
Generic GPIO PAL39 AP_GPA22 3.3V IO N
Generic GPIO PAG2 AP_GPA25 3.3V IO N
Generic GPIO PAH1 AP_GPA26 3.3V IO N
Generic GPIO PAJ2 AP_GPA27 3.3V IO N
Generic GPIO PAK36 AP_GPB8 3.3V IO N
Generic GPIO PAG41 AP_GPB11 3.3V IO N
Generic GPIO PAK37 AP_GPB14 3.3V IO N
Generic GPIO PAL37 AP_GPB16 3.3V IO N
Generic GPIO PAG42 AP_GPB18 3.3V IO N
Generic GPIO PAL36 AP_GPB22 3.3V IO N
Table 12. GMAC (Continued)
Function Ball Loc. Ball Name Voltage I/O PU/PD
TabLe 297TabLe 32 CC TabLe 29 :mwno ARTIK‘
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
36
The above signals can be reassigned by software to alternate functions; see Table 29Table 32 for details.
HDMI
Generic GPIO PAL38 AP_GPB23 3.3V IO N
Generic GPIO PP41 AP_GPB30 3.3V IO
Generic GPIO PAK34 AP_GPC0 3.3V IO N
Generic GPIO PAK33 AP_GPC17 3.3V IO N
Generic GPIO PAH41 AP_GPC25 3.3V IO PU
Generic GPIO PAK35 AP_GPC26 3.3V IO PU
Generic GPIO PAL35 AP_GPC27 3.3V IO PU
Generic GPIO PAL33 AP_GPD8 3.3V IO N
Generic GPIO PAK19 AP_GPD28 3.3V IO N
Generic GPIO PAL25 AP_GPD31 3.3V IO N
Generic GPIO PAL21 AP_GPE0 3.3V IO N
Generic GPIO PAK21 AP_GPE1 3.3V IO N
Generic GPIO PAK20 AP_GPE2 3.3V IO N
Generic GPIO PAL20 AP_GPE3 3.3V IO N
Generic GPIO PAL34 AP_GPE30 3.3V IO PU
Generic GPIO PAH42 AP_GPE31 3.3V IO PU
*. The GPIO lines can be pulled up or down by 100k internal registers under register control. By default, the pull-ups and
pull-downs are disabled. For details about reconfiguring the GPIO lines, refer to the ARTIK 530/710 System Design Guide.
Table 14. HDMI
Function Ball Loc. Ball Name Voltage I/O PU/PD
HDMI Consumer Electronics Control *
*. Alternate GPIO function that can be selected by software but is not selected by hardware at power-on. See Table 29 for
details.
PA29 AP_HDMI_CEC 3.3V IO N
HDMI Hot Plug Detect PB29 AP_HDMI_HPD 3.3V I N
HDMI Transmit Channel 0 Negative PA32 AP_HDMI_TX0N 1.8V O N
HDMI Transmit Channel 0 Positive PB32 AP_HDMI_TX0P 1.8V O N
HDMI Transmit Channel 1 Negative PA31 AP_HDMI_TX1N 1.8V O N
HDMI Transmit Channel 1 Positive PB31 AP_HDMI_TX1P 1.8V O N
HDMI Transmit Channel 2 Negative PA30 AP_HDMI_TX2N 1.8V O N
HDMI Transmit Channel 2 Positive PB30 AP_HDMI_TX2P 1.8V O N
HDMI Transmit Negative Clock PA33 AP_HDMI_TXCN 1.8V O N
HDMI Transmit Positive Clock PB33 AP_HDMI_TXCP 1.8V O N
Table 13. GPIO (Continued)
Function Ball Loc. Ball Name Voltage I/O PU/PD *
TahLE 36 [ware Sec TabLe 39 [ware Sec TabLe 39 and TahLe 31 :mwno ARTIK‘
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
37
HSIC
I2C
I2S
Table 15. HSIC
Function Ball Loc. Ball Name Voltage I/O PU/PD
HSIC Data PB38 AP_HSIC_DATA 1.2V IO N
HSIC Strobe PA38 AP_HSIC_STROBE 1.2V IO N
Table 16. I2C
Function Ball Loc. Ball Name Voltage I/O PU/PD
HDMI I2C SCL *
*. Not selected by default by hardware at power-on. The signal can be reassigned by software. See Table 30 for details.
PAK11 AP_GPA23_HDMI_I2C_SCL 3.3V IO N
HDMI I2C SDA *PAL11 AP_GPA24_HDMI_I2C_SDA 3.3V IO N
I2C SCL 0 PAK10 AP_GPD2_SCL0 3.3V IO PU
I2C SDA 0 PAL10 AP_GPD3_SDA0 3.3V IO PU
I2C SCL 1 PAK9 AP_GPD4_SCL1 3.3V IO PU
I2C SDA 1 PAL9 AP_GPD5_SDA1 3.3V IO PU
I2C SCL 2
†. Selected by default by hardware at power on, but can be reassigned to an alternate function by software. See Table 30
for details.
PAK8 AP_GPD6_SCL2 3.3V IO PU
I2C SDA 2 PAL8 AP_GPD7_SDA2 3.3V IO PU
Table 17. I2S
Function Ball Loc. Ball Name Voltage I/O PU/PD
I2S 0 Bit Clock *
*. Selected by default by hardware at power on, but can be reassigned to an alternate function by software. See Table 30
and Table 31 for details.
PAK2 AP_I2S0_BCLK 3.3V IO N
I2S 0 Data In *PAL1 AP_I2S0_DIN 3.3V IO N
I2S 0 Data Out *PAK1 AP_I2S0_DOUT 3.3V IO N
I2S 0 Left Right Clock *PAJ1 AP_I2S0_LRCLK 3.3V IO N
I2S 0 Master Clock *PAL2 AP_I2S0_MCLK 3.3V IO N
I2S 1 Bit Clock PAK27 AP_GPA30_VID1_0_I2SBCLK1 3.3V IO PU
I2S 1 Data In PAL26 AP_GPB9_I2SDIN1 3.3V IO N
I2S 1 Data Out PAL27 AP_GPB6_VID1_4_I2SDOUT1 3.3V IO PD
I2S 1 Left Right Clock PAK25 AP_GPB0_VID1_1_I2SLRCK1 3.3V IO PU
I2S 1 Master Clock PAK26 AP_GPA28_I2SMCLK1 3.3V IO N
CC TabLe 39 TabLe 31 :mwno ARTIK‘
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
38
JTAG
The above signals can be reassigned by software to alternate functions; see Table 31 for details.
AliveGPIO
LVDS
†. Alternate GPIO function that can be selected by software but is not selected by hardware at power-on. See Table 30 for
details.
Table 18. JTAG
Function Ball Loc. Ball Name Voltage I/O PU/PD
JTAG NTRST PAE1 AP_NTRST 3.3V IO PD
JTAG TCK PAC1 AP_TCK 3.3V IO PD
JTAG TDI PAD2 AP_TDI 3.3V IO PU
JTAG TDO PAD1 AP_TDO 3.3V IO N
JTAG TMS PAC2 AP_TMS 3.3V IO PU
Table 19. Key
Function Ball Loc. Ball Name Voltage I/O PU/PD
AliveGPIO 1 PAF2 AP_AGP1 3.3V IO N
AliveGPIO 2 PAE2 AP_AGP2_RTC_INT_N 3.3V IO N
Power Key part of AliveGPIO PAF1 AP_PWRKEY 3.3V IO N
Reset PAG1 AP_NRESET 3.3V I N *
*. External 100k pull-up resistor required.
Table 20. LVDS
Function Ball Loc. Ball Name Voltage I/O PU/PD
LVDS Transmit Channel 0 Negative PA22 AP_LVDS_TN0 1.8V O N
LVDS Transmit Channel 0 Positive PB22 AP_LVDS_TP0 1.8V O N
LVDS Transmit Channel 1 Negative PA23 AP_LVDS_TN1 1.8V O N
LVDS Transmit Channel 1 Positive PB23 AP_LVDS_TP1 1.8V O N
LVDS Transmit Channel 2 Negative PA24 AP_LVDS_TN2 1.8V O N
LVDS Transmit Channel 2 Positive PB24 AP_LVDS_TP2 1.8V O N
LVDS Transmit Channel 3 Negative PA26 AP_LVDS_TN3 1.8V O N
LVDS Transmit Channel 3 Positive PB26 AP_LVDS_TP3 1.8V O N
LVDS Transmit Channel 4 Negative PA27 AP_LVDS_TN4 1.8V O N
LVDS Transmit Channel 4 Positive PB27 AP_LVDS_TP4 1.8V O N
LVDS Transmit Negative Clock PA25 AP_LVDS_TNCLK 1.8V O N
LVDS Transmit Positive Clock PB25 AP_LVDS_TPCLK 1.8V O N
TabLe 36
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
39
Miscellaneous
Power
PWM
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
Table 21. Miscellaneous
Function Ball Loc. Ball Name Voltage I/O PU/PD
VDD Power On PAL19 AP_VDDPWRON 3.3V O N
Table 22. Power
Function Ball Loc. Ball Name Voltage I/O PU/PD
3.3V System Power PAK[17,18]
PAL[17,18]
VCC3P3_SYS*
*. VCC3P3_SYS pads are not recommended as a current source; do not use them to drive external ICs. VCC3P3_SYS pads
turn off whenthe ARTIK 530/530s Module goes into sleep mode.
3.3V O
USB2.0 OTG Bus Power PD[41,42] VCC5P0_OTGVBUS 5.0V I
Main Power Supply for Module PV[41,42]
PW[41,42]
PY[41,42]
PAA[41,42]
PAB[41,42]
VIN 3.7–5.0V I
Table 23. PWM
Function Ball Loc. Ball Name Voltage I/O PU/PD
PWM 0 PAL7 AP_GPD1_PWM0 3.3V IO N
PWM 2 PAK7 AP_GPC14_PWM2 3.3V IO N
TabLe 36 ee TabLe 39 were See TabLe 36 ARTIK'
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
40
SD/MMC
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
SPI
Table 24. SD/MMC
Function Ball Loc. Ball Name Voltage I/O PU/PD
SD Clock PAK30 AP_SD0_CLK 3.3V IO N
SD Command PAK28 AP_SD0_CMD 3.3V IO N
SD Data 0 PAL30 AP_SD0_D0 3.3V IO N
SD Data 1 PAK29 AP_SD0_D1 3.3V IO N
SD Data 2 PAL29 AP_SD0_D2 3.3V IO N
SD Data 3 PAL28 AP_SD0_D3 3.3V IO N
Table 25. SPI
Function Ball Loc. Ball Name Voltage I/O PU/PD
SPI 0 Clock *
*. Alternate GPIO function that can be reassigned by software but is not selected by hardware at power-on; see Table 30 for
details.
PAK6 AP_SPI0_CLK 3.3V IO N
SPI 0 Frame *PAL6 AP_SPI0_CS 3.3V IO N
SPI 0 Receive Data *PAK5 AP_SPI0_MISO 3.3V IO N
SPI 0 Transmit Data *PAL5 AP_SPI0_MOSI 3.3V IO N
SPI 2 Clock
†. Selected by default by hardware at power on, but can be reassigned to an alternate function by software. See Table 30
for details.
PAK4 AP_GPC9_SPI2_CLK 3.3V IO N
SPI 2 Frame PAL4 AP_GPC10_SPI2_CS 3.3V IO PU
SPI 2 Receive Data PAK3 AP_GPC11_SPI2_MISO 3.3V IO N
SPI 2 Transmit Data PAL3 AP_GPC12_SPI2_MOSI 3.3V IO N
TabLe 36
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
41
UART
The above signals can be reassigned by software to alternate functions; see Table 30 for details.
USB HOST/USB OTG
802.15.4 for Zigbee
Table 26. UART
Function Ball Loc. Ball Name Voltage I/O PU/PD
UART Receive Data 0 PAL24 AP_UART_RX0 3.3V IO N
UART Transmit Data 0 PAK24 AP_UART_TX0 3.3V IO N
UART Receive Data 3 PAL22 AP_UART_RX3 3.3V IO N
UART Transmit Data 3 PAK22 AP_UART_TX3 3.3V IO N
UART Receive Data 4 PAL23 AP_UART_RX4 3.3V IO N
UART Transmit Data 4 PAK23 AP_UART_TX4 3.3V IO N
Table 27. USB Host/USB OTG
Function Ball Loc. Ball Name Voltage I/O PU/PD
USB HOST Data Minus PA36 AP_USBH_DM 3.3V IO N
USB HOST Data Plus PB36 AP_USBH_DP 3.3V IO N
USB HOST ID PB37 AP_OTG_ID I N
USB OTG Data Minus PA35 AP_OTG_DM 3.3V IO N
USB OTG Data Plus PB35 AP_OTG_DP 3.3V IO N
Table 28. 802.15.4
Function Ball Loc. Ball Name Voltage I/O PU/PD
802.15.4 Control PAK14 ZB_DEBUG_TCK_SWCLK 3.3V
802.15.4 JTAG TCK PAK13 ZB_PTI_DATA_FRC_DOUT 3.3V
802.15.4 JTAG TDI PAL12 ZB_DEBUG_TMS_SWDIO 3.3V
802.15.4 JTAG TDO PAL13 ZB_PTI_SYNC_FRC_DFRAME 3.3V
802.15.4 JTAG TMS PAK12 ZB_DEBUG_TDO_SWO 3.3V
802.15.4 Reset PAL14 PAD_ZB_RSTn 3.3V O N
802.15.4 UART PAK15 COMBO_ZIG_UART_TXD 3.3V IO
802.15.4 UART PAL15 COMBO_ZIG_UART_RXD 3.3V IO PU
TabLe 29 TabLe 32 Nor: :mwno ARTIK‘
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
42
GPIO ALTERNATE FUNCTIONS
A number of the GPIOs can be programmed to have alternate functions beyond their default behavior using the
GPIO API provided in the SW development environment. Table 29Table 32 provide the alternate functions of all
the GPIOs that are available on the PADs of the ARTIK 530/530s Module that can be user programmed.
In the following tables, the hardware power-up default functions are shown emboldened. Software may
subsequently select an alternate function.
Table 29. GPIO Alternate Functions—North Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PA1 GMAC_TXEN GPIOE11 GMAC_TXEN ––GMAC
PA2 GMAC_TXD1 GPIOE8 GMAC_TXD1 ––GMAC
PA3 GMAC_TXD3 GPIOE10 GMAC_TXD3 ––GMAC
PA5 GMAC_GTXCLK GPIOE24 GMAC_GTXCLK ––GMAC
PA6 GMAC_RXDV GPIOE19 GMAC_RXDV SPITXD1 – GMAC
PA7 GMAC_RXD2 GPIOE16 GMAC_RXD2 ––GMAC
PA8 GMAC_RXD0 GPIOE14 GMAC_RXD0 SPICLK1 – GMAC
PA29 AP_HDMI_CEC SA3 GPIOC3 HDMI_CEC SDnRST0 HDMI
PA37 AP_GPA13 GPIOA13 DISD12 – GPIO
PA39 AP_GPA14 GPIOA14 DISD13 – GPIO
PA40 AP_GPA9 GPIOA9 DISD8 – GPIO
PA41 AP_GPA15 GPIOA15 DISD14 – GPIO
PA42 AP_GPA12 GPIOA12 DISD11 – GPIO
PB2 GMAC_TXD0 GPIOE7 GMAC_TXD0 VIVSYNC1 – GMAC
PB3 GMAC_TXD2 GPIOE9 GMAC_TXD2 ––GMAC
PB4 GMAC_MDC GPIOE20 GMAC_MDC ––GMAC
PB5 GMAC_RXCLK GPIOE18 GMAC_RXCLK SPIRXD1 – GMAC
PB6 GMAC_RXD3 GPIOE17 GMAC_RXD3 ––GMAC
PB7 GMAC_RXD1 GPIOE15 GMAC_RXD1 SPIFRM1 – GMAC
PB8 GMAC_MDIO GPIOE21 GMAC_MDIO ––GMAC
PB39 AP_GPA4 GPIOA4 DISD3 – GPIO
PB40 AP_GPA5 GPIOA5 DISD4 – GPIO
PB41 AP_GPA16 GPIOA16 DISD15 – GPIO
PB42 AP_GPA11 GPIOA11 DISD10 – GPIO
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
43
Table 30. GPIO Alternate Functions—South Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PAK1 AP_I2S0_DOUT GPIOD9 I2SDOUT0 AC97_DOUT – I2S0
PAK2 AP_I2S0_BCLK GPIOD10 I2SBCLK0 AC97_BCLK – I2S0
PAK3 AP_GPC11_SPI2_MISO SA11 GPIOC11 SPIRXD2 USB2.0OTG_DrvV
BUS
SPI2
PAK4 AP_GPC9_SPI2_CLK SA9 GPIOC9 SPICLK2 –SPI2
PAK5 AP_SPI0_MISO GPIOD0 SPIRXD0 PWM3 – SPI0
PAK6 AP_SPI0_CLK GPIOC29 SPICLK0 – SPI0
PAK7 AP_GPC14_PWM2 SA14 GPIOC14 PWM2 VICLK2 PWM
PAK8 AP_GPD6_SCL2 GPIOD6 SCL2 ––I
2C
PAK9 AP_GPD4_SCL1 GPIOD4 SCL1 ––I
2C
PAK10 AP_GPD2_SCL0 GPIOD2 SCL0 ISO7816 – I2C
PAK11 AP_GPA23_HDMI_I2C_SCL GPIOA23 DISD22 – I2C
PAK19 AP_GPD28 GPIOD28 VID0_0 TSIDATA1_0 SA24 GPIO
PAK20 AP_GPE2 GPIOE2 VID0_6 TSIDATA1_6 GPIO
PAK21 AP_GPE1 GPIOE1 VID0_5 TSIDATA1_5 GPIO
PAK22 AP_UART_TX3 GPIOD21 UARTTXD3 SDnCD1 – UART
PAK23 AP_UART_TX4 SD13 GPIOB29 TSIDATA0_5 UARTTXD4 UART
PAK24 AP_UART_TX0 GPIOD18 UARTTXD0 ISO7816 SDWP2 UART
PAK25 AP_GPB0_VID1_1_I2SLRCK1 GPIOB0 VID1_1 SDEX1 I2SLRCLK1 I2S1
PAK26 AP_GPA28_I2SMCLK1 GPIOA28 VICLK1 I2SMCLK2 I2SMCLK1 I2S1
PAK27 AP_GPA30_VID1_0_I2SBCLK1 GPIOA30 VID1_0 SDEX0 I2SBCLK1 I2S1
PAK28 AP_SD0_CMD GPIOA31 SDCMD0 – SD/MMC
PAK29 AP_SD0_D1 GPIOB3 SDDAT0_1 – SD/MMC
PAK30 AP_SD0_CLK GPIOA29 SDCLK0 – SD/MMC
PAK32 AP_GPB13_SD0_BOOT SD0 GPIOB13 – BOOTING
PAK33 AP_GPC17 SA17 GPIOC17 TSIDP0 VID2_0 GPIO
PAK34 AP_GPC0 SA0 GPIOC0 TSERR0 – GPIO
PAK35 AP_GPC26 RDNWR GPIOC26 ––GPIO
PAK36 AP_GPB8 GPIOB8 VID1_5 SDEX5 I2SDOUT2 GPIO
PAK37 AP_GPB14 RnB0 RnB1 GPIOB14 –GPIO
PAK38 AP_GPA20 GPIOA20 DISD19 – GPIO
PAK39 AP_GPA18 GPIOA18 DISD17 – GPIO
PAK40 AP_GPA21 GPIOA21 DISD20 – GPIO
PAK41 AP_GPA10 GPIOA10 DISD9 – GPIO
PAK42 AP_GPA6 GPIOA6 DISD5 – GPIO
PAL1 AP_I2S0_DIN GPIOD11 I2SDIN0 AC97_DIN – I2S0
PAL2 AP_I2S0_MCLK GPIOD13 I2SMCLK0 AC97_nRST – I2S0
PAL3 AP_GPC12_SPI2_MOSI SA12 GPIOC12 SPITXD2 SDnRST2 SPI2
PAL4 AP_GPC10_SPI2_CS SA10 GPIOC10 SPIFRM2 –SPI2
PAL5 AP_SPI0_MOSI GPIOC31 SPITXD0 – SPI0
PAL6 AP_SPI0_CS GPIOC30 SPIFRM0 – SPI0
PAL7 AP_GPD1_PWM0 GPIOD1 PWM0 SA25 – PWM
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
44
PAL8 AP_GPD7_SDA2 GPIOD7 SDA2 ––I
2C
PAL9 AP_GPD5_SDA1 GPIOD5 SDA1 ––I
2C
PAL10 AP_GPD3_SDA0 GPIOD3 SDA0 ISO7816 – I2C
PAL11 AP_GPA24_HDMI_I2C_SDA GPIOA24 DISD23 – I2C
PAL15 COMBO_ZIG_UART_RXD GPIOC28 NSCS1 UARTnRI1 – 802.15.4
PAL20 AP_GPE3 GPIOE3 VID0_7 TSIDATA1_7 GPIO
PAL21 AP_GPE0 GPIOE0 VID0_4 TSIDATA1_4 GPIO
PAL22 AP_UART_RX3 GPIOD17 UARTRXD3 ––UART
PAL23 AP_UART_RX4 SD12 GPIOB28 TSIDATA0_4 UARTRXD4 UART
PAL24 AP_UART_RX0 GPIOD14 UARTRXD0 ISO7816 UART
PAL25 AP_GPD31 GPIOD31 VID0_3 TSIDATA1_3 GPIO
PAL26 AP_GPB9_I2SDIN1 GPIOB9 VID1_6 SDEX6 I2SDIN1 I2S1
PAL27 AP_GPB6_VID1_4_I2SDOUT1 GPIOB6 VID1_4 SDEX4 I2SDOUT1 I2S1
PAL28 AP_SD0_D3 GPIOB7 SDDAT0_3 – SD/MMC
PAL29 AP_SD0_D2 GPIOB5 SDDAT0_2 – SD/MMC
PAL30 AP_SD0_D0 GPIOB1 SDDAT0_0 – SD/MMC
PAL31 AP_GPB4_VID1_3_BOOT GPIOB4 VID1_3 SDEX3 I2SLRCLK2 BOOTING
PAL32 AP_GPB15_SD1_BOOT SD1 GPIOB15 – BOOTING
PAL33 AP_GPD8 GPIOD8 PPM – GPIO
PAL34 AP_GPE30 NSOE GPIOE30 ––GPIO
PAL35 AP_GPC27 NSDQM GPIOC27 ––GPIO
PAL36 AP_GPB22 SD6 GPIOB22 ––GPIO
PAL37 AP_GPB16 NNFOE0 NNFOE1 GPIOB16 –GPIO
PAL38 AP_GPB23 SD7 GPIOB23 ––GPIO
PAL39 AP_GPA22 GPIOA22 DISD21 – GPIO
PAL40 AP_GPA19 GPIOA19 DISD18 – GPIO
PAL41 AP_GPA17 GPIOA17 DISD16 – GPIO
PAL42 AP_GPA3 GPIOA3 DISD2 – GPIO
Table 30. GPIO Alternate Functions—South Part (Continued)
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
45
Table 31. GPIO Alternate Functions—East Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PAC1 AP_TCK TCLK GPIOE28 – JTAG
PAC2 AP_TMS TMS GPIOE26 – JTAG
PAD1 AP_TDO TDO GPIOE29 – JTAG
PAD2 AP_TDI TDI GPIOE27 – JTAG
PAE1 AP_NTRST NTRST GPIOE25 – JTAG
PAG2 AP_GPA25 GPIOA25 DISVSYNC – GPIO
PAH1 AP_GPA26 GPIOA26 DISHSYNC – GPIO
PAH2 AP_GPA0 GPIOA0 DISCLK – GPIO
PAJ1 AP_I2S0_LRCLK GPIOD12 I2SLRCLK0 AC97_SYNC – I2S0
PAJ2 AP_GPA27 GPIOA27 DISDE – GPIO
Table 32. GPIO Alternate Functions—West Part
Ball
Loc. Ball Name Function 0 Function 1 Function 2 Function 3 Group
PP41 AP_GPIOB30 SD14 GPIOB30 TSIDATA0_6 – GPIO
PAG41 AP_GPB11 CLE0 CLE1 GPIOB11 – GPIO
PAG42 AP_GPB18 NNFWE0 nNFWE1 GPIOB18 –GPIO
PAH41 AP_GPC25 NSWAIT GPIOC25 SPDIFTX – GPIO
PAH42 AP_GPE31 NSWE GPIOE31 ––GPIO
TubLe 33
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
46
BOOTING SELECTION
The ARTIK 530/530s Module supports a variety of booting scenarios as depicted in Table 33. The table describes
the values of the boot-configuration pad signals needed to initiate the various booting scenarios. When nothing is
done, the default booting scenario is Configuration Option 1. In this case, the primary booting device is eMMC. If the
primary booting device fails, the secondary booting device (SD0) will attempt to boot the module. If the secondary
booting device fails, the tertiary booting device will boot the module.
Table 33. Boot Selection Configuration
Config.
Option
Boot Configuration Signals *
*. Internal pull-up and pull-down resistors automatically select Config Option 1 by default. External pull-up and pull-down
resistors are required to select configuration options 2 and 3. The recommended resistor value is 10k.
Primary
Booting
Device
Secondary
Booting
Device
Tertiary
Booting
Device
AP_GPB13_
SD0_BOOT
AP_GPB15_
SD1_BOOT
AP_GPB4_
VID1_3_BOOT
1 High Low High eMMC SD0 USB OTG Device
2 High Low Low SD0 USB OTG Device
3Low High XUSB OTG Device
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
47
POWER SEQUENCE
Figure 4 below shows the ARTIK 530/530s Module Power-On Sequence (Timing).
Figure 4. ARTIK 530/530s Module Power-On Sequence (Timing) Diagram
1.012s
AP_PWRKEY
VCC3P3_SYS
AP_NRESET
1.022s
10ms
1s
AP_VDDPWRON
VIN
Module Pad Name
On Detect
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
48
POWER STATES
Figure 5 shows the Power Management state diagram. In this diagram, the entry and WAKEUP conditions for each
power down mode are given.
Figure 5. ARTIK 530/530s Module Power Management State Diagram
The following Modes of operation can be distinguished:
NORMAL Mode
Everything is running, this is the normal mode of operation when applications are executed on the ARM cores
•IDLE Mode
CPU clocks are turned off
IDLE state can be initiated by CPU using Software API
The following WAKEUP sources can be used to return to NORMAL Mode:
GPIO Interrupt, RTC Interrupt, AliveGPIO Interrupt (see PAE2, PAF:[1,2]), External IRQ
•STOP Mode
PLLs are turned off, DRAM goes into self-refresh
STOP state can be initiated by CPU using Software API
Certain WAKEUP sources can be used to transition to NORMAL Mode
The following WAKEUP sources can be used to return to NORMAL Mode:
RTC Interrupt, AliveGPIO Interrupt
For more information on how to access discussed WAKEUP mechanisms like AliveGPIO interrupts, GPIO Interrupts,
RTC Interrupts and External Interrupts, refer to the Software User Guide.
Power-On
Reset
NORMAL
IDLE
CPU REQUEST
WAKEUP
STOP
CPU REQUEST
WAKEUP
GND GND SIG mm; mem... , ,‘rfiT 6 6 _\\J|\ 3 Z Ogvgf \o < 77??="" mm="" o="" m="" p="" qn="" 2.3="" figure="" 6="">
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
49
ANTENNA CONNECTIONS
Two antennas are required to use the full set of radio communication links on the ARTIK 530/530s Module. One
supports the combination of Wi-Fi/Bluetooth, and the other is dedicated to Zigbee.
Figure 6. RF Connector for Bluetooth/Wi-Fi and Zigbee
The U.FL-R-SMT Hirose connector is used for both the Bluetooth/Wi-Fi and the Zigbee antenna connectors on the
ARTIK 530/530s Module.
The mechanical size of the connector (receptacle) is described in Figure 6. For suggestions on mating the plug and
more details on the connector, contact Hirose Electric Co., LTD.
AllDimensionsareinmm
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
50
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
The ratings given in this section are associated only with stress. It does not imply any functional operation of the
device. Exposure to the absolute-maximum rated conditions for long duration affects the reliability of the device.
Table 34. Absolute Maximum Ratings
Parameter Symbol Condition Min Max Units
Main power supply VIN ––0.36.0V
DC input/output voltage PA:[1,2,3,5,6,7,8,29,37,39,40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,19,20,21,22,23,24,25,26,27,28,29,
30,32,33,34,35,36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,20,21,22,23,24,25,26,27,28,29,30,
31,32,33,34,35,36,37,38,39,40,41,42]
PP:[41]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,41,42]
PAH:[1,2,41,42]
PAJ:[1,2]
3.3V Buffer –0.5 3.8
PAK:[12,13,14]
PAL:[12,13]
5V Tolerant buffer –0.3 5.3
PAK:[15]
PAL:[15]
Non 5V Tolerant Buffer –0.3 3.6
PAL:[19]
PAF:[1]
PAG:[1]
––0.33.8
PAL:[14] Voltage at Pin –0.5 3.8 V
DC Input/output current PA:[1,2,3,5,6,7,8,29,37,39,40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,19,20,21,22,23,24,25,26,27,28,29,
30,32,33,34,35,36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,20,21,22,23,24,25,26,27,28,29,30,
31,32,33,34,35,36,37,38,39,40,41,42]
PP:[41]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,41,42]
PAH:[1,2,41,42]
PAJ:[1,2]
–20 20 mA
PAK:[12,13,14,15]
PAL:[12,13]
–50 50 mA
PAL:[14] Current at Pin –1 1 mA
Storage Temperature TA––4085°C
n TabLe 35
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
51
Recommended Operating Conditions
The recommended operation of the ARTIK 530/530s Module is based on the operating conditions listed in Table 35.
Power/Current Consumption
The values in this table are nominal. Measurements were taken on sample boards at room temperature using a 4.2V
system power supply.
Table 35. Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Main Power Supply VIN PV:[42,43],PW:[42,43],PY:[42,43],PAA:[42,43],PAB:[42,43] 3.7 4.2 5.0 V
Operating Temperature
(ARTIK 530/530s 512 MB)
TC–25 – 85 °C
Operating Temperature
(ARTIK 530s 1GB)
TC0–85 °C
Table 36. ARTIK 530/530s Module Power/Current Consumption
No. Category Scenario I (mA) Peak/Typ Condition
1 Boot AP boot 700 Peak Peek current during boot-up
450 Typ Average current during boot-up
2 Idle Idle 140 Typ Idle current
3 Sleep Sleep 20 Typ Sleep current
4Storage Large file transfer eMMC to SD Card 230 Typ Copying 512MB test file from eMMC to SD
5 SD Card to eMMC 270 Typ Copying 512MB test file from SD to eMMC
6
Connectivity
Bluetooth
Transmit 170 Typ Transfer test file using obexftp from the device
7Receive160 Typ
Receive test file using obexftp from the Android
phone
8Wi-Fi Transmit 430 Typ Transfer packet using iperf3 (802.11n)
9 Receive 320 Typ Receive packet using iperf3 (802.11n)
10 802.15.4 for Zigbee Transmit 150 Typ Transfer packet using ember tool
11 Receive 150 Typ Receive packet using ember tool
12
Multimedia
Audio play 150 Typ Playback audio file using mplayer (pcm, 2ch,
48000Hz)
13 Recode audio 140 Typ Record audio using arecord (pcm, 2ch, 48000Hz)
14 Display picture 180 Typ Display picture (R/G/B, 720*1280)
15 Display video 330 Typ Playback movie clip (big_buck_bunny_720p_50mb)
16 Record video 300 Typ Record video using ffmpeg (1280*720, 3072k)
17 Live streaming from Camera 310 Typ Camera preview using ffmpeg (1280x960)
18 Live streaming over Wi-Fi 320 Typ Streaming video using ffserver/ffmpeg (640*480)
19 CPU Load
Running one core at 100% load 240
Typ Running while() loop
Running two cores at 100% load 320
Running three cores at 100% load 400
Running all cores at 100% load 480
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
52
ESD Ratings
Table 37. ESD Ratings
Symbol Min. Max. Units
ESD stress voltage Human Body Model 1 kV
ESD stress voltage Charged Device Model TBD V
Table 38. Shock and Vibration Ratings
Shock and Vibration Range
Shock Packing Drop 75cm (10~19.9Kg) / 91cm (<10Kg)
Vibration Packing Vibration 0.85Grms/2~200Hz (TTL Grms)
TabLe 39 TabLe 39 :mwno ARTIK‘
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
53
DC Electrical Characteristics
The DC characteristics for the GPIO pins of the ARTIK 530/530s Module are listed in Table 39. Use the parameters
from Table 39 to determine maximum DC loading and to determine maximum transition times for a given load.
Table 39. I/O DC Electrical Characteristics GPIO
GPIO Ball
Coordinates Parameter Condition *
*. Operating conditions: VDD = 3.3V, Vext = 3.0 to 3.6 V, Tj = –40 to 125 °C (Junction Temperature), 3.3V-tolerant
Min Typ Max Units
PA:[1,2,3,5,6,7,8,29,37,39,
40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,
42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,
19,20,21,22,23,24,25,26,27,
28,29,30,32,33,34,35,
36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,
20,21,22,23,24,25,26,27,
28,29,30,31,32,33,34,35,
36,37,38,39,40,41,42]
PP:[41]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,41,42]
PAH:[1,2,41,42]
PAJ:[1,2]
VTOL Tolerant external voltage VDD Power Off & On 3.60 V
VIH High Level Input Voltage
CMOS Interface
–2.313.60V
VIL Low Level Input Voltage
CMOS Interface
VDD = 3.3V ± 10% 0.3 0.70 V
V Hysteresis Voltage 0.15 V
IIH High Level Input Current
Input Buffer VIN = VDD VDD Power On –3 3 A
VDD Power Off & SNS =
0
–5 – 5
Input Buffer with pull-down VIN = VDD VDD = 3.3V ± 10% 15 40 80
IIL Low Level Input Current
Input Buffer VIN = VSS VDD Power On & Off –3 3 A
Input Buffer with pull-up VIN = VSS VDD = 3.3V ± 10% –15 –40 –110
VOH Output High Voltage IOH = -1.8mA, -3.6mA, -7.2mA, -10.8mA 2.64 3.30 V
VOL Output Low Voltage IOH = -1.8mA, -3.6mA, -7.2mA, -10.8mA 0 0.66
IOZ Output Hi-Z current –5 5 A
CIN Input capacitance Any input and bi-directional buffers 5 pF
COUT Output capacitance Any output buffer 5 pF
Table 40. I/O DC Electrical Characteristics 802.15.4
Ball
Coordinates Symbol Parameter Condition Min Typ Max Units
PAK:[12,13,14,15]
PAL:[12,13,15]
Input Voltage Levels
VIL VIL input logic level low VDD=3.3V 0.70 V
VIH VIH input logic level high
VDD=3.3V
2.31 – V
Output Voltage Levels
VOL[3mA] VOL output logic level low
VDD=3.3V, IOL=3ma, weak driver
––0.66V
VOH[–3mA] VOH output logic level high
VDD=3.3V, IOH=–3ma, weak driver
2.64 – V
VOH[20mA] VOH output logic level high
VDD=3.3V, IOL=20ma, strong driver
––0.66V
VOH[20mA] VOH output logic level high
VDD=3.3V, IOL=–20ma, strong
driver
2.64 – V
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
54
PAL:[14] IQQuiescent Current Static Inputs and Outputs 1.00 A
VOMaximal voltage applied to PIN in
High-Impedance State
––3.30V
VIH High Level Input Voltage Logic input at VDD=3.3V 1.84 – 3.30
VIL Low Level Input Voltage Logic input at VDD=3.3V – 1.255
IIH High Level Input Current Logic input VIN=VDD=3.3V –1.00 1.00 A
IIL Low Level Input Current Logic input VIN=0V –1.00 – 1.00
VOH High Level Output Voltage Push-Pull & PMOS OD, IOL=3mA, 1×
Driver at VDD=3.3V
2.721 3.108 V
VOL Low Level Output Voltage Push-Pull, IOL=3mA, 1× Driver at
VDD=3.3V
0.175 0.257
IOH High Level Output Current Push-Pull & PMOS OD, VOH=2.4V, 1×
Driver at VDD=3.3V
5.774 11.066 mA
IOL Low Level Output Current Push-Pull, VOL=0.4V, 1× Driver at
VDD=3.3V
4.491 6.438
Table 41. I/O DC Electrical Characteristics PMIC
Ball
Coordinates Symbol Parameter Condition Min Typ Max Units
PAG:[1] VOL Open drain, IOUT=2mA – – 0.40 V
VOH Open drain, IOUT=2mA – – VIN V
PAF:[1],PAL:[19] VIL Input only : Low level input
voltage
––0.40V
VIH Input only : High level input
voltage
1.40 – VIN V
Table 42. I/O DC Electrical Characteristics PCM Signals
Ball
Coordinates Symbol Parameter Condition Min Typ Max Unit
PAJ:[39,40,41,42] VIH High-level input voltage 2.31 3.70 V
VIL Low-level input voltage –0.40 0.99
VOH Output High voltage 2.90 V
VOL Output Low voltage 0.40
Table 40. I/O DC Electrical Characteristics 802.15.4 (Continued)
Ball
Coordinates Symbol Parameter Condition Min Typ Max Units
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
55
Table 43. GPIO Pull-up Resistor Current
Ball Coordinates Pull Up Min Typ Max Unit
PA:[1,2,3,5,6,7,8,29,37,39,40,41,42]
PB:[2,3,4,5,6,7,8,39,40,41,42]
PAK:[1,2,3,4,5,6,7,8,9,10,11,19,20,21,22,23,24,25,26,27,28,29,30,32,
33,34,35,36,37,38,39,40,41,42]
PAL:[1,2,3,4,5,6,7,8,9,10,11,20,21,22,23,24,25,26,27,28,29,30,31,32,
33,34,35,36,37,38,39,40,41,42]
PP:[41]
PAC:[1,2]
PAD:[1,2]
PAE:[1]
PAG:[2,41,42]
PAH:[1,2,41,42]
PAJ:[1,2]
Enabled (where every GPIO has a 100k
internal pull-up resistor).
10 33 72 A
Disabled (default) 0.1 A
Table 44. Power-on Reset Timing Specifications
Symbol Description Min. Typ. Max. Unit
tRESW Reset assert time after clock stabilization 40 ns
”% ><>‘<§>‘< 3?=""><>
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
56
AC Electrical Characteristics
AC characteristics covered in this section are preliminary and are likely to change.
SD/MMC AC Electrical Characteristics
Figure 7. High-Speed SD/MMC Interface Timing
The following table assumes VDDINT = 1.0V ± 5%, TJ = –25 to 85°C, VDDmmc = 3.3V ± 5 %, 2.5V ± 5%, 1.8V ± 5%
Table 45. High-Speed SD/MMC Interface Transmit/Receive Timing Constants
Symbol Parameter Min Typ Max Unit
tHSDCD SD command output delay time 4.0 ns
tHSDCS SD command input setup time 4.0
tHSDCH SD command input hold time 0
tHSDDD SD data output delay time 4.0
tHSDDS SD data input setup time 4.0
tHSDDH SD data input hold time 0
HS_SDCMD
(in)
HS_SDCLK
HS_SDDATA[7:0]
(in)
t
HSDCS
t
HSDCH
t
HSDDS
t
HSDDH
t
HSDCD
t
HSDDD
HS_SDDATA[7:0]
(out)
HS_SDCMD
(out)
AP_SD0_CLK
AP_SD0_CMD (out)
AP_SD0_CMD (in)
AP_SD0_D[3:0] (out)
AP_SD0_D[3:0] (in)
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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SPI AC Electrical Characteristics
Figure 8. SPI Interface Timing (CPHA = 0, CPOL = 1 (Format A))
XspiMOSI
(MO)
SPICLK
XspiMISO
(SO)
t
SPIMOD
XspiMISO
(MI)
XspiMOSI
(SI)
XspiCS
t
SPIMIS
t
SPIMIH
t
SPISOD
t
SPISIS
t
SPICSSD
t
SPICSSS
t
SPISIH
AP_SPIO_CLK
AP_SPI0_MOSI (MO)
AP_SPI0_MOSI (SO)
AP_SPI0_MISO (MI)
AP_SPI0_MISO (SO)
AP_GPC10_SPI2_CS
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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The following table assumes VDDINT = 1.0 V ± 5%, TJ = –25 to 85 °C, VDDext = 1.8 V ± 10%, load = 15pF.
Table 46. SPI Interface Transmit/ Receive Timing Constants with 15pF Load
Parameter Symbol Min. Typ. Max. Units
Ch 0 SPI MOSI Master Output Delay time tSPIMOD –– 5ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 12 –
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 7
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 2
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –3
SPI MISO Master Input Hold time tSPIMIH 5– –
SPI MOSI Slave Input Setup time tSPISIS 2– –ns
SPI MOSI Slave Input Hold time tSPISIH 5– –
SPI MISO Slave Output Delay time tSPISOD ––17
SPI nSS Master Output Delay time tSPICSSD 7– –
SPI nSS Slave Input Setup time tSPICSSS 5– –
Ch 1 SPI MOSI Master Output Delay time tSPIMOD ––4
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 13 – ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 8
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 3
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –2
SPI MISO Master Input Hold time tSPIMIH 5– –
SPI MOSI Slave Input Setup time tSPISIS 3– –
SPI MOSI Slave Input Hold time tSPISIH 5– –ns
SPI MISO Slave Output Delay time tSPISOD ––18
SPI nSS Master Output Delay time tSPICSSD 7– –
SPI nSS Slave Input Setup time tSPICSSS 5– –
SPICLKout = 50 MHz
•t
SPIMIS,CH0 = 12 – (cycle period/4) × FB_CLK_SEL
•t
SPIMIS,CH1 = 13 – (cycle period/4) × FB_CLK_SEL
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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The following table assumes VDDINT = 1.0V ± 5%, TJ = –25 to 85°C, VDDext = 3.3V ± 10%, load = 30pF.
Table 47. SPI Interface Transmit/Receive Timing Constants with 30pF Load
Parameter Symbol Min. Typ. Max. Unit
Ch 0 SPI MOSI Master Output Delay time tSPIMOD ––6ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 13 –
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 8
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 3
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –2
SPI MISO Master Input Hold time tSPIMIH 5– –
SPI MOSI Slave Input Setup time tSPISIS 4– –ns
SPI MOSI Slave Input Hold time tSPISIH 5– –
SPI MISO Slave Output Delay time tSPISOD ––18
SPI nSS Master Output Delay time tSPICSSD 8– –
SPI nSS Slave Input Setup time tSPICSSS 6– –
Ch 1 SPI MOSI Master Output Delay time tSPIMOD ––5
SPI MISO Master Input Setup time (FB_CLK_SEL = 00) tSPIMIS 14 – ns
SPI MISO Master Input Setup time (FB_CLK_SEL = 01) 9
SPI MISO Master Input Setup time (FB_CLK_SEL = 10) 4
SPI MISO Master Input Setup time (FB_CLK_SEL = 11) –1
SPI MISO Master Input Hold time tSPIMIH 5– –
SPI MOSI Slave Input Setup time tSPISIS 4– –
SPI MOSI Slave Input Hold time tSPISIH 5– –ns
SPI MISO Slave Output Delay time tSPISOD ––19
SPI nSS Master Output Delay time tSPICSSD 8– –
SPI nSS Slave Input Setup time tSPICSSS 6– –
SPICLKout = 50 MHz
•t
SPIMIS,CH0 = 12 – (cycle period/4) × FB_CLK_SEL
•t
SPIMIS,CH1 = 13 – (cycle period/4) × FB_CLK_SEL
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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I2C AC Electrical Characteristics
Figure 9. I2C Interface Timing
The following table assumes VDDINT, VDDarm = 1.1V ± 5%, TJ = –25 to 85°C, VDDext = 3.3 V ± 10%
Table 48. I2C BUS Controller Module Signal Timing
Parameter Symbol Min. Typ. Max. Unit
SCL clock frequency FSCL ––std. 100
fast 400
kHz
SCL high level pulse width TSCLHIGH std. 4.0
fast 0.6
––s
SCL low level pulse width TSCLLOW std. 4.7
fast 1.3
––
Bus free time between STOP and START TBUF std 4.7
fast 1.3
––
START hold time TSTARTS std. 4.0
fast 0.6
––
SDA hold time TSDAH std. 0
fast 0
–std.
fast 0.9
SDA setup time TSDAS std. 250
fast 100
––ns
STOP setup time TSTOPH std. 4.0
fast 0.6
––s
Modes: std. refers to Standard Mode and fast refers to Fast Mode.
•I
2C data hold time (tSDAH) is minimum 0ns for standard/fast bus mode as defined in I2C
specification v2.1. Check whether the data hold time of your I2C device is 0ns or not.
•The I
2C controller supports I2C bus device only (standard/fast bus mode), and does not support a
C-bus device.
IICSCL
T
STOPH
IICSDA
T
BUF
T
STARTS
T
SDAS
T
SCLHIGH
T
SCLLOW
F
SCL
T
SDAH
AP_GPD2_SCLn
AP_GPD2_SDAn
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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RF Electrical Characteristics
All performance numbers related to 802.11 for Wi-Fi, Bluetooth, and 802.15.4 for Zigbee mentioned in this section are
preliminary and likely to change once module characterization has taken place.
Wi-Fi, 2.4GHz Receiver RF Specifications
Table 49. Wi-Fi, 2.4GHz Receiver RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range 2400 2500 MHz
Minimum receiver sensitivity in 802.11b mode (2.4GHz)
1Mbps PER < 8%,
Packet size = 1024 bytes
––97dBm
2Mbps ––95dBm
5.5Mbps ––94dBm
11Mbps ––90dBm
Minimum receiver sensitivity in 802.11g mode (2.4GHz)
6Mbps PER < 10%,
Packet size= 1024 bytes
––91dBm
9Mbps ––90dBm
12Mbps ––89dBm
18Mbps ––87dBm
24Mbps ––84dBm
36Mbps ––81dBm
48Mbps ––76dBm
54Mbps ––75dBm
Minimum receiver sensitivity in 802.11n mode (2.4GHz)
MCS 0 PER<10%,
Packet size= 4096 bytes,
GF, 800ns GI, Non-STBC
––89dBm
MCS 1 ––88dBm
MCS 2 ––86dBm
MCS 3 ––83dBm
MCS 4 ––79dBm
MCS 5 ––75dBm
MCS 6 ––73dBm
MCS 7 ––72dBm
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Wi-Fi, 2.4GHz Transmitter RF Specifications
Table 50. Wi-Fi, 2.4GHz Transmitter RF Specifications
Parameter Conditions Min Typ Max Unit
Linear output power
Maximum output power in 802.11b mode As specified in
IEEE802.11
–15dBm
Maximum output power in 802.11g mode 15 dBm
Maximum output power in 802.11n mode 13 dBm
Transmit spectrum mask
Margin to 802.11b spectrum mask Maximum
output power
0–dBr
Margin to 802.11g spectrum mask 0 dBr
Margin to 802.11n spectrum mask 0 dBr
Transmit modulation accuracy in 802.11b mode
1Mbps As specified in
IEEE 802.11b
––35%
2Mbps ––35%
5.5Mbps ––35%
11Mbps ––35%
Transmit modulation accuracy in 802.11g mode
6Mbps As specified in
IEEE 802.11g
––5dB
9Mbps ––8dB
12Mbps ––10dB
18Mbps ––13dB
24Mbps ––16dB
36Mbps ––19dB
48Mbps ––22dB
54Mbps ––25dB
Transmit modulation accuracy in 802.11n mode
MCS7 As specified in
IEEE 802.11n
––27dB
Transmit power-on and power-down ramp time in 802.11b mode
Transmit power-on ramp time from 10% to 90% output
power
––2s
Transmit power-down ramp time from 90% to 10%
output power
––2s
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Wi-Fi, 5GHz Receiver RF Specifications
Table 51. Wi-Fi, 5GHZ Receiver RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range 4900 5845 MHz
Minimum receiver sensitivity in 802.11a mode
6Mbps PER < 10% –90 dBm
9Mbps ––89dBm
12Mbps ––88dBm
18Mbps ––87dBm
24Mbps ––84dBm
36Mbps ––80dBm
48Mbps ––76dBm
54Mbps ––75dBm
Minimum receiver sensitivity in 802.11n (HT-20) mode
MCS 0 PER < 10% –89 dBm
MCS 1 ––88dBm
MCS 2 ––85dBm
MCS 3 ––82dBm
MCS 4 ––79dBm
MCS 5 ––75dBm
MCS 6 ––72dBm
MCS 7 ––71dBm
Minimum receiver sensitivity in 802.11n (HT-40) mode
MCS 0 PER < 10% –86 dBm
MCS 1 ––85dBm
MCS 2 ––83dBm
MCS 3 ––80dBm
MCS 4 ––77dBm
MCS 5 ––73dBm
MCS 6 ––71dBm
MCS 7 ––69dBm
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Wi-Fi, 5GHz Transmitter RF Specifications
Table 52. Wi-Fi, 5GHz Transmitter RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range 4900 5845 MHz
Linear output power
Maximum output power in 802.11a mode 54M, UNII-2e 13 dBm
Maximum output power in 802.11n mode HT20, MCS7, UNII-2e 12 dBm
HT40, MCS7, UNII-2e 11 dBm
Transmit spectrum mask
Margin to 802.11a spectrum mask Maximum output power 0 dBr
Margin to 802.11n spectrum mask 0 dBr
Transmit constellation error in 802.11a mode
54Mbps As specified in IEEE
802.11n
––25dB
Transmit constellation error in 802.11n (HT-20, HT-40) mode
MCS 7 As specified in IEEE
802.11n
––27dB
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
65
Bluetooth RF Specifications
Table 53. Bluetooth Receiver RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range 2402 2480 MHz
Sensitivity (BER) GPSK, BER ≤0.1% –92 dBm
/4-DQPSK, BER ≤ 0.1% –92 dBm
BER ≤ 0.1%, 8DPSK –89 dBm
Maximum Input Level GPSK, BER ≤0.1% –20 dBm
/4-DQPSK, BER ≤ 0.1% –20 dBm
BER ≤ 0.1%, 8 DPSK –20 dBm
BDR
Intermodulation Performance 0.1 %
Rx C/I Performance 1DH1 0.1 %
1DH3 – 0.1 %
1DH5 – 0.1 %
EDR
Rx C/I Performance 2DH1 0.1 %
2DH3 – 0.1 %
2DH5 – 0.1 %
3DH1 – 0.1 %
3DH3 – 0.1 %
3DH5 – 0.1 %
Rx BER Floor Performance BER ≤ 0.001% 70 dBm
Table 54. Bluetooth Transmitter RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range 2402 2480 MHz
Output Power (Average)
BDR (QPSK) 2440 MHz 6 dBm
EDR (/4-DQPSK) 2440 MHz 2 dBm
EDR (8DPSK) 2440 MHz 2 dBm
Table 55. Bluetooth Low Energy (BLE) RF Specifications
Parameter Conditions Min Typ Max Unit
Frequency Range 2402 2480 MHz
Rx Receiver Sensitivity PER At –70dBm 30.8 %
Rx C/I and Receiver Selectivity Performance PER 30.8 %
Tx Power 6 dBm
TabLe 55 TabLe 57 mum ARTIK‘
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
66
802.15.4 Receiver RF Specifications
The typical numbers indicated in Table 56 and Table 57 are one standard deviation below the mean, measured at
room temperature 25°C. The Min and Max numbers were measured over process corners at room temperature.
Table 56. 802.15.4 Receiver RF Specifications
Parameter Test Condition Min Typ Max Unit
Operating Frequency Range 2400 2483.5 MHz
Receiver Sensitivity PER At –95dBm 1 %
Receiver Sensitivity Search At PER 1% –95 dBm
Receiver Interference Rejection PER At –2 Channel, Alternate Channel, 30dB 1 %
Receiver Interference Rejection PER At –1 Channel, Adjacent Channel, 0dB 1 %
Receiver Interference Rejection PER At +1 Channel, Adjacent Channel, 0dB 1 %
Receiver Interference Rejection PER At +2 Channel, Alternate Channel, 30dB 1 %
Error Vector Magnitude - RMS (EVM) At Target Power 30 %
Error Vector Magnitude - Offset (EVM) At Target Power 10 %
Receiver Maximum Input Level of Desired Signal At –20dBm Input 1 %
Table 57. 802.15.4 Transmitter RF Specifications
Parameter Test Condition Min Typ Max Unit
Maximum output power At highest normal mode power setting 6/16*
*. The ARTIK 530/530s Module default setting is 6dBm for CE. You can change the setting to 16dBm for FCC testing.
–dBm
Minimum output power At lowest power setting –27 dBm
Error vector magnitude (Offset-EVM) As defined by IEEE 802.15.4-2003, which sets a
35% maximum
–– 10 %
Carrier frequency error –40 +40 ppm
PSD mask relative 3.5 MHz away (Normal) –20 dBm
PSD mask absolute 100 KHz BW –30 dBm
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Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
67
MECHANICAL SPECIFICATIONS
The ARTIK 530/530s Module supports PAD Balls and two RF connectors on a 49mm × 36mm footprint as shown in
Figure 10. Refer to section Antenna Connections for RF connector details. In addition the top view, side view and
bottom view with its dimensions can be seen in Figure 11 and Figure 12.
Figure 10. ARTIK 530/530s Module Top View Mechanical Dimensions and Part Location
802.15.4 (for Zigbee) Antenna Bluetooth and 802.11 (for Wi-Fi) Antenna
13mm 570330000 am 10100 2840010380 0000012000000 :0100 36mm 12 200:0 080 f 63‘“ 0 “‘ E] a aamm 0; 15 25010080 13 37010080 134mm 12 0010080 , 2400:0080 100010 100 LUSmm agoooooooooooood oooooooooooooooo 0000 o oo JOOOOOOOOOOOOOOODOODOOOO oaoooooooooooooaooaooooo 000 can 00. oo 00 on oo oo oo oo 00 oo oo 00 (4L) 3 3 ARTIK" Bull Size = @065 300 Htch =113 OODOODOOD OOOOOODOODOO‘OO 000000000 ooooooooooooooo o o 00 1‘22mm oo ' 3 ' \ , o oo PAl BQU 0 00 o 00 co on E o 00 a w o d 1‘EEmm o (a -— oo o - on 003 °° €:- 00 g 00 U7 0° I 00 (\4 on C) no ,4 oo 00oooooooooooooooooooooooo cooooooooooooooooooooooooo
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
68
Figure 11. ARTIK 530/530s Module Mechanical Dimensions Top View
Figure 12. ARTIK 530/530s Module Mechanical Dimensions Bottom View
All Dimensions
are in [mm]
Top View
TabLe 58 Figure 13 ‘ Figure 13 A ARTIK" e Figure 12 TabLe 58 v mu ‘rmzs ‘ "=19: ‘ Inez mum IFZSA 19297 rms YPZSB \ rpm \ V ‘ mus ‘ mas nan ">231 ">235 mm ">231 \ rmo \ tens rues (0,0) —) x
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
69
The inner pin locations on the pad, positioned in an L-shaped form, as depicted in Figure 13, are described in
Table 58.
For exact dimensions on ball locations, see Figure 12. The locations given in Table 58 are the absolute coordinates
measured from the edge of the ARTIK 530/530s Module to the center of each ball. All inner pads are ground (GND)
balls.
The inner pads are on a different grid from the outer pads as indicated with the dashed blue lines in
Figure 13.
The inner pads are not horizontally centered in the module
Table 58. L-Shaped Ball Locations
Ball Name X-Location (mm) Y-Location (mm)
TP296 11.09 10.25
TP297 11.09 11.38
TP294 11.09 12.51
TP300 11.09 23.49
TP292 11.09 24.62
TP288 11.09 25.75
TP298 12.22 10.25
TP295 12.22 25.75
TP291 13.35 10.25
TP293 13.35 25.75
TP290 34.52 10.25
TP286 34.52 25.75
TP289 35.65 10.25
TP283 35.65 25.75
TP299 36.78 10.25
TP287 36.78 11.38
TP301 36.78 12.51
TP285 36.78 23.49
TP282 36.78 24.62
TP284 36.78 25.75
Figure 13. L-Shaped Pad Pins (Top View)
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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CERTIFICATIONS AND COMPLIANCE
Bluetooth
The ARTIK 530/530s Module is recognized as a qualified design as set out by the Bluetooth SIG.
Declaration ID: D032725
Qualified Design ID: 88390
CE
The ARTIK 530/530s Module is in compliance with the essential requirements and other relevant provisions of Article
3 of the Radio Equipment Directive 2014/53/EU. Compliance with the following standards was confirmed:
Article 3.1a (Health and Safety) EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2001 + A2:2013
EN62311:2008
Article 3.1.b (EMC) EN 301 489-1 V2.1.1
EN 301 489-17 V3.1.1
Article 3.2 (Radio spectrum use) EN 300 328 V2.1.1
EN 301 893 V1.8.1 and EN 301 893 V2.1.1 (partial)
EN 300 440 V2.1.1
•Certificate number: AN17C10983-2
For a formal notified body statement of opinion contact your sales representative.
FCC
The ARTIK 530/530s Module complies with the following two sections (15C and 15E) of Part 15 of the FCC rules
namely:
Spread spectrum transmitter (SST) compliance (15C):
2402–2480MHz frequency range, output power 0.0049W
Digital transmission system (DTS) compliance (15C):
2402–2480MHz frequency range, output power 0.004W
2405–2475MHz frequency range, output power 0.0412W
2412–2462MHz frequency range, output power 0.0308W
Unlicensed national information infrastructure TX compliance (15E) in the:
5180-5240MHz frequency range, output power 0.0206W
5260-5320MHz frequency range, output power 0.0221W
5500-5720MHz frequency range, output power 0.0222W
5745-5825MHz frequency range, output power 0.01W
FCC Identifier: A3LSIP005AFS30
Modular Type: Limited Single Modular
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
71
IC
The ARTIK 530/530s Module complies with the IC license–exempt RSS standard.
Radio certification number: 649E-SIP005AFS30
KCC
The ARTIK 530/530s Module complies with the standards set by the Korean communications commission (KCC).
ARTIK 530/530s Module KCC Identifier: MSIP-CRM-SEC-SIP005AFS30
SRRC
Both the ARTIK 530/530s Module and the ARTIK 530/530s Development Kit comply with the standards set by the
People’s Republic of China.
CMIIT ID: 2017AJ3123 (M)(ARTIK 530/530s Module)
CMIIT ID: 2017AJ2921 (ARTIK 530/530s Development Kit)
HDMI Compliance
The ARTIK 530/530s Module passed the self-test, HDMI CTS version 1.4b on 8/26/2016 provided by HDMI Licensing
LLC.
RoHS Compliance
The ARTIK 530/530s Module complies with the hazardous substance limits of directive 2011/65/EU and the
conformity assessment procedure as outlined in Decision 768/2008/EC, Annex II, Module A, Point 2, as well as RoHS
harmonized standard EN 50581.
Report reference number: F690101/LF-CTSAYGU16-06911
FCC Regulatory Disclosures
This device complies with Part 15 of the FCC`s Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) This device must accept any interference received, including
interference that may cause undesirable operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15
of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off and on, the user
is encouraged to try to correct the interference by one or more of the following measures:
Reorient or relocate the receiving antenna.
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/ TV technician for help.
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with a minimum distance of 20cm between the transmitter’s radiating
structure(s) and the body of the user or nearby persons.
This module is intended for OEM integration. The OEM integrator is responsible for FCC compliance and compliance
with all applicable regulations including those for modular transmitters 47 C.F.R. 15.212. The OEM product must
comply with all applicable labeling requirements including those contained in 15 C.F.R. 15.19. The OEM is solely
responsible for certification and testing and labeling of its own products. In addition to any independently required
labels, the OEM shall also affix to the outside of a device into which the module is installed a label referring to the
enclosed module. This exterior label should be prepared in a legible font and permanently affixed and using the
wording “Contains Transmitter Module FCCID: A3LSIP005AFS30”
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
The OEM shall require that the end user of its product be informed that the FCC radio frequency exposure guidelines
for an uncontrolled environment can be satisfied. The OEM shall further inform its end user that any change or
modifications to this module not expressly approved by the manufacturer will void the warranty and the users’
authority to operate the equipment.
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
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Industry Canada Regulatory Disclosures
Industry Canada Statement
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Cet appareil est conforme avec Industrie Canada exempts de licence standard RSS (s). L'opération est soumise aux
deux conditions suivantes:(1) cet appareil ne peut causer d'interférences, et (2) cet appareil doit accepter toute
interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil.
Industry Canada Radiation Exposure Statement and Limitations on Use
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.
This equipment should be installed and must not be co-located or operating in conjunction with any other antenna
or transmitter.
This equipment is restricted to indoor use in the 5.15-5.25 GHz range. This equipment is not able to be operated at
5600-5650. In the United States and Canada, only Channel 1~11 can be operated and these channel assignments
deal only with the 2.4 GHz range.
The end product must be labeled to display the Industry Canada certification number of the module.
“Contains transmitter module IC: 649E-SIP005AFS30”
Le dispositif d'accueil doivent être étiques pour afficher le numéro de certification d'Industrie Canada du module.
“Contient module émetteur IC : 649E-SIP005AFS30”
EU Regulatory Disclosures
Statement*
The following statement must be supplied with each product but can be printed in the user manual, the packaging, or
provided as a separated leaflet.
Hereby, Samsung declares that this IoT Module is in compliance with the essential requirements and other
relevant provisions of Article 3 of the Radio Equipment Directive 2014/53/EU and RoHS directive 2011/65/EU.
“The declaration of conformity may be consulted at [www.artik.io/certification]”
The 5150 - 5350 MHz and 5470 - 5725 MHz bands are for indoor use only.
The OEM is required to ensure that the end product integrates this module so as to maintain a minimum distance of
20 cm between the equipment’s radiating structure(s) and the body of the user or nearby persons. The OEM shall
also advise its end user of this requirement as required by applicable rules.
salesflar‘tikJo
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
74
ORDERING INFORMATION
For volume ordering of evaluation kits, contact a sales representative in your area or email sales@artik.io.
Item Order Number Description
ARTIK 530 Module SIP-005AFS301
ARTIK 530s Module SIP-005AFS302 Includes 512MB DRAM
ARTIK 530s 1G Module SIP-005AUS332 Includes 1GB DRAM
ARTIK 530 Development Kit SIP-KITNXD001 ARTIK 530 Development Module
ARTIK 530/530s Interposer Board
Platform Board
Interface Board
Two Antennas (one 802.15.4, one BT/Wi-Fi)
ARTIK 530s Development Kit SIP-KITNXD002 ARTIK 530s Development Module
ARTIK 530/530s Interposer Board
Platform Board
Interface Board
Two Antennas (one 802.15.4, one BT/Wi-Fi)
ARTIK 530s 1G Development Kit SIP-KITNXG002 ARTIK 530s 1G Development Module
ARTIK 530/530s Interposer Board
Platform Board
Interface Board
Two Antennas (one 802.15.4, one BT/Wi-Fi)
Samsung Semiconductor, Inc. ARTIK 530/530s Module Datasheet
LEGAL INFORMATION
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK™ DEVELOPMENT KIT
AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER "SAMSUNG PRODUCTS"). NO
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. THE LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE
SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT
THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT
AS PROVIDED IN THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND
ITS AFFILIATES (COLLECTIVELY, "SAMSUNG") ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT
LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS
INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS
WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR
NOTICE. THIS DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION
DISCUSSED HEREIN IS PROVIDED ON AN "AS IS" BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES
NO RESPONSIBILITY FOR POSSIBLE ERRORS OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM THE USE OF THE
DOCUMENTATION CONTAINED HEREIN.
Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar
applications where product failure could result in loss of life or personal or physical harm, or any military or defense
application, or any governmental procurement to which special terms or provisions may apply.
This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand
names, trademarks and registered trademarks belong to their respective owners. For updates or additional
information about Samsung ARTIK™, contact the Samsung ARTIK™ team via the Samsung ARTIK™ website at
www.artik.io.
Copyright © 2017 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any
form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written
consent of Samsung Electronics.
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis,
without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the
other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life support, critical
care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional
information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong
to their respective owners.
75

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