TPS61040/41 Datasheet by Texas Instruments

Datasheet Feedback/Errors

l TEXAS INSTRUMENTS Efficiency vs ompm Currenl nu Cnpyvlgm @ 2015‘ rexas \nslmmems \ncmpma‘ed

0.1 1 10 100

VI= 5 V

VI= 3.6 V

VI= 2.4 V

Efficiency vs Output Current

IO− Output Current − mA

Efficiency − %

VIN SW

EN GND

10 mHD1

CFF

1mF

VOUT

VIN to 28 V

VIN

1.8 V to 6 V

CIN

4.7 mF

VO= 18 V

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

TPS6104x Low-Power DC-DC Boost Converter in SOT-23 and WSON Packages

1 Features

1• 1.8-V to 6-V Input Voltage Range

• Adjustable Output Voltage Range up to 28 V

• 400-mA (TPS61040) and 250-mA (TPS61041)

Internal Switch Current

• Up to 1-MHz Switching Frequency

• 28-μA Typical No-Load Quiescent Current

• 1-μA Typical Shutdown Current

• Internal Soft Start

• Available in SOT23-5, TSOT23-5,

and 2-mm × 2-mm × 0.8-mm WSON Packages

2 Applications

• LCD Bias Supply

• White-LED Supply for LCD Backlights

• Digital Still Camera

• PDAs, Organizers, and Handheld PCs

• Cellular Phones

• Internet Audio Players

• Standard 3.3-V or 5-V to 12-V Conversion

3 Description

The TPS6104x is a high-frequency boost converter

dedicated for small to medium LCD bias supply and

white LED backlight supplies. The device is ideal to

generate output voltages up to 28 V from a dual-cell

NiMH/NiCd or a single-cell Li-Ion battery. The part

can also be used to generate standard 3.3-V or 5-V

to 12-V power conversions.

The TPS6104x operates with a switching frequency

up to 1 MHz. This frequency allows the use of small

external components using ceramic as well as

tantalum output capacitors. Together with the thin

WSON package, the TPS6104x gives a very small

overall solution size. The TPS61040 device has an

internal 400-mA switch current limit, while the

TPS61041 device has a 250-mA switch current limit,

offering lower output voltage ripple and allows the

use of a smaller form factor inductor for lower power

applications. The low quiescent current (typically 28

μA) together with an optimized control scheme,

allows device operation at very high efficiencies over

the entire load current range.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

TPS61040

SOT-23 (5) 2.90 mm × 1.60 mm

SOT (5) 2.90 mm ×1.60 mm

WSON (6) 2.00 mm × 2.00 mm

TPS61041 SOT-23 (5) 2.90 mm ×1.60 mm

WSON (6) 2.00 mm × 2.00 mm

(1) For all available packages, see the orderable addendum at

the end of the datasheet.

Typical Application Schematic

l TEXAS INSTRUMENTS

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Typical Characteristics.............................................. 6

7 Detailed Description.............................................. 9

7.1 Overview ................................................................... 9

7.2 Functional Block Diagram......................................... 9

7.3 Feature Description................................................... 9

7.4 Device Functional Modes........................................ 10

8 Application and Implementation ........................ 11

8.1 Application Information............................................ 11

8.2 Typical Application .................................................. 11

8.3 System Examples ................................................... 16

9 Power Supply Recommendations...................... 19

10 Layout................................................................... 19

10.1 Layout Guidelines ................................................. 19

10.2 Layout Example .................................................... 19

11 Device and Documentation Support ................. 20

11.1 Third-Party Products Disclaimer ........................... 20

11.2 Related Links ........................................................ 20

11.3 Support Resources ............................................... 20

11.4 Trademarks........................................................... 20

11.5 Electrostatic Discharge Caution............................ 20

11.6 Glossary................................................................ 20

12 Mechanical, Packaging, and Orderable

Information ........................................................... 20

4 Revision History

Changes from Revision I (December 2016) to Revision J Page

• Changed DRV package pinout image to show thermal pad outline and transparent top view ............................................. 3

Changes from Revision H (October 2015) to Revision I Page

• Changed CIN from: 4.7 mF To: 4.7 µF and COFrom: 1 mF To: 1 µF in the Typical Application Schematic.......................... 1

Changes from Revision G (December 2014) to Revision H Page

• Added 500 µs/div label to X-axis of Figure 15. ................................................................................................................... 15

Changes from Revision F (December 2010) to Revision G Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

l TEXAS INSTRUMENTS ﬂ ﬂﬂ

GND SW

VIN NC

EN FB

Thermal

PAD

GND

VIN

TPS61040

TPS61041

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SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

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5 Pin Configuration and Functions

DDC Package, DBV Package

SOT 5 Pins

Top View

DRV Package

WSON 6 Pins

Transparent Top View

Pin Functions

I/O DESCRIPTION

NAME DDC,

DBV NO. DRV NO.

EN 4 3 I This is the enable pin of the device. Pulling this pin to ground forces the device into

shutdown mode reducing the supply current to less than 1 μA. This pin should not be left

floating and needs to be terminated.

FB 3 4 I This is the feedback pin of the device. Connect this pin to the external voltage divider to

program the desired output voltage.

GND 2 1 – Ground

NC – 5 – No connection

SW 1 6 I Connect the inductor and the Schottky diode to this pin. This is the switch pin and is

connected to the drain of the internal power MOSFET.

VIN 5 2 I Supply voltage pin

- ThermalPAD - Solder to ground plane for heat sink

l TEXAS INSTRUMENTS

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

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Product Folder Links: TPS61040 TPS61041

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNIT

Supply voltages on pin VIN (2) –0.3 7 V

Voltages on pins EN, FB (2) –0.3 VIN + 0.3 V

Switch voltage on pin SW (2) 30 30 V

Operating junction temperature, TJ–40 150 °C

Storage temperature, Tstg –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.

6.2 ESD Ratings

VALUE UNIT

V(ESD) Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2) ±750

(1) See application section for further information.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT

VIN Input voltage range 1.8 6 V

VOUT Output voltage range 28 V

L Inductor(1) 2.2 10 μH

f Switching frequency(1) 1 MHz

CIN Input capacitor (1) 4.7 μF

COUT Output capacitor (1) 1μF

TAOperating ambient temperature –40 85 °C

TJOperating junction temperature –40 125 °C

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

TPS61040 TPS61041

UNITDBV DDC DRV DBV DRV

5 PINS 5 PINS 6 PINS 5 PINS 6 PINS

RθJA Junction-to-ambient thermal resistance 205.2 214.7 83.0 205.2 83.0 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 118.3 38.5 57.1 118.3 57.1 °C/W

RθJB Junction-to-board thermal resistance 34.8 35.4 52.9 34.8 52.9 °C/W

ψJT Junction-to-top characterization parameter 12.2 0.4 2.4 12.2 2.4 °C/W

ψJB Junction-to-board characterization parameter 33.9 34.8 53.4 33.9 53.4 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — — 26.9 — 26.9 °C/W

l TEXAS INSTRUMENTS

TPS61040

TPS61041

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SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

Product Folder Links: TPS61040 TPS61041

(1) The line and load regulation depend on the external component selection. See the application section for further information.

6.5 Electrical Characteristics

VIN = 2.4 V, EN = VIN, TA= –40°C to 85°C, typical values are at TA= 25°C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

VIN Input voltage range 1.8 6 V

IQOperating quiescent current IOUT = 0 mA, not switching, VFB = 1.3 V 28 50 μA

ISD Shutdown current EN = GND 0.1 1 μA

VUVLO Undervoltage lockout threshold 1.5 1.7 V

ENABLE

VIH EN high level input voltage 1.3 V

VIL EN low level input voltage 0.4 V

IIEN input leakage current EN = GND or VIN 0.1 1 μA

POWER SWITCH AND CURRENT LIMIT

Vsw Maximum switch voltage 30 V

toff Minimum off time 250 400 550 ns

ton Maximum on time 4 6 7.5 μs

RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61040 600 1000 mΩ

RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61041 750 1250 mΩ

MOSFET leakage current VSW = 28 V 1 10 μA

ILIM MOSFET current limit TPS61040 350 400 450 mA

ILIM MOSFET current limit TPS61041 215 250 285 mA

OUTPUT

VOUT Adjustable output voltage range VIN 28 V

Vref Internal voltage reference 1.233 V

IFB Feedback input bias current VFB = 1.3 V 1 μA

VFB Feedback trip point voltage 1.8 V ≤VIN ≤6 V 1.208 1.233 1.258 V

Line regulation (1) 1.8 V ≤VIN ≤6 V; VOUT = 18 V; Iload = 10 mA;

CFF = not connected 0.05 %/V

Load regulation(1) VIN = 2.4 V; VOUT = 18 V; 0 mA ≤IOUT ≤30 mA 0.15 %/mA

l TEXAS INSTRUMENTS

1 2 3 4 5 6

IO = 10 mA

IO = 5 mA

VI − Input Voltage − V

L = 10 µH

VO = 18 V

Efficiency − %

0.1 1 10 100

L = 10 µH

L = 3.3 µH

IL − Load Current − mA

VO = 18 V

Efficiency − %

0.1 1 10 100

VI = 5 V

VI = 3.6 V

VI = 2.4 V

IO − Output Current − mA

VO = 18 V

0.1 1 10 100

TPS61040

TPS61041

IL − Load Current − mA

L = 10 µH

VO = 18 V

Efficiency − %

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

www.ti.com

Product Folder Links: TPS61040 TPS61041

6.6 Typical Characteristics

Table 1. Table of Graphs

FIGURE

ηEfficiency vs Load current Figure 1,

Figure 2,

Figure 3

vs Input voltage Figure 4

IQQuiescent current vs Input voltage and temperature Figure 5

VFB Feedback voltage vs Temperature Figure 6

ISW Switch current limit vs Temperature Figure 7

ICL Switch current limit vs Supply voltage, TPS61041 Figure 8

vs Supply voltage, TPS61040 Figure 9

RDS(on) RDS(on) vs Temperature Figure 10

vs Supply voltage Figure 11

Line transient response Figure 13

Load transient response Figure 14

Start-up behavior Figure 15

Figure 1. Efficiency vs Output Current Figure 2. Efficiency vs Load Current

Figure 3. Efficiency vs Load Current Figure 4. Efficiency vs Input Voltage

*9 TEXAS INSTRUMENTS n m as . 85%; 22mg 833%.: 2.3 . in. 1 . 2.5 2833 Vcc

380

385

390

395

400

405

410

415

420

1.8 2.4 3 3.6 4.2 4.8 5.4 6

VCC − Supply Voltage − V

TA = 27°C

I(CL) − Current Limit − mA

200

400

600

800

1000

1200

−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90

TA − Temperature − °C

TPS61041

TPS61040

rDS(on) − Static Drain-Source On-State Resistance − mΩ

230

250

270

290

310

330

350

370

390

410

430

−40 −30−20 −10 0 10 20 30 40 50 60 70 80 90

TPS61040

TPS61041

TA − Temperature − °C

I(SW) − Switch Current Limit − mA

240

242

244

246

248

250

252

254

256

258

260

1.8 2.4 3 3.6 4.2 4.8 5.4 6

VCC − Supply Voltage − V

TA = 27°C

I(CL) − Current Limit − mA

1.8 2.4 3 3.6 4.2 4.8 5.4 6

VI − Input Voltage − V

TA = 85°C

TA = 27°C

TA = −40°C

Quiescent Current − µA

1.23

1.232

1.234

1.236

1.238

1.24

−40 −20 0 20 40 60 80 100 120

VCC = 2.4 V

TA − Temperature − °C

VFB − Feedback Voltage − V

TPS61040

TPS61041

www.ti.com

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

Product Folder Links: TPS61040 TPS61041

Figure 5. TPS61040 Quiescent Current vs Input Voltage Figure 6. Feedback Voltage vs Free-Air Temperature

Figure 7. TPS6104x Switch Current Limit vs Free-Air

Temperature Figure 8. TPS61041 Current Limit vs Supply Voltage

Figure 9. TPS61040 Current Limit vs Supply Voltage Figure 10. TPS6104x Static Drain-Source On-State

Resistance vs Free-Air Temperature

*9 TEXAS INSTRUMENTS as . 2233‘ 2230 853%... 23 . EE

100

200

300

400

500

600

700

800

900

1000

1.8 2.4 3 3.6 4.2 4.8 5.4 6

VCC − Supply Voltage − V

TPS61041

TPS61040

rDS(on) − Static Drain-Source On-State Resistance − mΩ

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

www.ti.com

Product Folder Links: TPS61040 TPS61041

Figure 11. TPS6104x Static Drain-Source On-State Resistance vs Supply Voltage

Ipeak(typ) ILIM

VIN

L100 ns

Ipeak(typ) 400 mA

VIN

L100 ns for the TPS61040-Q1

Ipeak(typ) 250 mA

VIN

L100 ns for the TPS61041-Q1

RS Latch

Logic

Gate

Driver

Current Limit

Power MOSFET

N-Channel

RSENSE

Soft

Start

6 s Maxm

On Time

VREF = 1.233 V

Error Comparator

400 ns Min

Off Time

Under Voltage

Lockout

Bias Supply

VIN

GND

TPS61040

TPS61041

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SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

Product Folder Links: TPS61040 TPS61041

7 Detailed Description

7.1 Overview

The TPS6104x is a high-frequency boost converter dedicated for small to medium LCD bias supply and white

LED backlight supplies. The device is ideal to generate output voltages up to 28 V from a dual-cell NiMH/NiCd or

a single cell device Li-Ion battery.

7.2 Functional Block Diagram

7.3 Feature Description

7.3.1 Peak Current Control

The internal switch turns on until the inductor current reaches the typical dc current limit (ILIM) of 400 mA

(TPS61040) or 250 mA (TPS61041). Due to the internal propagation delay of typical 100 ns, the actual current

exceeds the dc current limit threshold by a small amount. The typical peak current limit can be calculated:

(1)

The higher the input voltage and the lower the inductor value, the greater the peak.

By selecting the TPS6104x, it is possible to tailor the design to the specific application current limit requirements.

A lower current limit supports applications requiring lower output power and allows the use of an inductor with a

lower current rating and a smaller form factor. A lower current limit usually has a lower output voltage ripple as

well.

l TEXAS INSTRUMENTS

ILIM

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

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Product Folder Links: TPS61040 TPS61041

Feature Description (continued)

7.3.2 Soft Start

All inductive step-up converters exhibit high inrush current during start-up if no special precaution is made. This

can cause voltage drops at the input rail during start up and may result in an unwanted or early system shut

down.

The TPS6104x limits this inrush current by increasing the current limit in two steps starting from for 256

cycles to for the next 256 cycles, and then full current limit (see Figure 15).

7.3.3 Enable

Pulling the enable (EN) to ground shuts down the device reducing the shutdown current to 1 μA (typical).

Because there is a conductive path from the input to the output through the inductor and Schottky diode, the

output voltage is equal to the input voltage during shutdown. The enable pin needs to be terminated and should

not be left floating. Using a small external transistor disconnects the input from the output during shutdown as

shown in Figure 17.

7.3.4 Undervoltage Lockout

An undervoltage lockout prevents misoperation of the device at input voltages below typical 1.5 V. When the

input voltage is below the undervoltage threshold, the main switch is turned off.

7.3.5 Thermal Shutdown

An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction

temperature of 168°C is exceeded. The thermal shutdown has a hysteresis of typically 25°C. This data is based

on statistical means and is not tested during the regular mass production of the IC.

7.4 Device Functional Modes

7.4.1 Operation

The TPS6104x operates with an input voltage range of 1.8 V to 6 V and can generate output voltages up to 28

V. The device operates in a pulse-frequency-modulation (PFM) scheme with constant peak current control. This

control scheme maintains high efficiency over the entire load current range, and with a switching frequency up to

1 MHz, the device enables the use of very small external components.

The converter monitors the output voltage, and as soon as the feedback voltage falls below the reference voltage

of typically 1.233 V, the internal switch turns on and the current ramps up. The switch turns off as soon as the

inductor current reaches the internally set peak current of typically 400 mA (TPS61040) or 250 mA (TPS61041).

See Peak Current Control for more information. The second criteria that turns off the switch is the maximum on-

time of 6 μs (typical). This is just to limit the maximum on-time of the converter to cover for extreme conditions.

As the switch is turned off the external Schottky diode is forward biased delivering the current to the output. The

switch remains off for a minimum of 400 ns (typical), or until the feedback voltage drops below the reference

voltage again. Using this PFM peak current control scheme the converter operates in discontinuous conduction

mode (DCM) where the switching frequency depends on the output current, which results in very high efficiency

over the entire load current range. This regulation scheme is inherently stable, allowing a wider selection range

for the inductor and output capacitor.

l TEXAS INSTRUMENTS L1 Copyngm Cc) 2016, Texas Instrumems Incorporated

VIN SW

EN GND

10 μH D1

2.2 MΩ

160 kΩ

CFF

22 pF

1 μF

VOUT

18 V

VIN

1.8 V to 6 V

4.7 μF L1: Sumida CR32-100

D1: Motorola MBR0530

C1: Tayo Yuden JMK212BY475MG

C2: Tayo Yuden TMK316BJ105KL

TPS61040

TPS61041

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SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPS6104x is designed for output voltages up to 28 V with an input voltage range of 1.8 V to 6 V and a

switch peak current limit of 400 mA (250 mA for the TPS61041). The device operates in a pulse-frequency-

modulation (PFM) scheme with constant peak current control. This control scheme maintains high efficiency over

the entire load current range, and with a switching frequency up to 1 MHz, the device enables the use of very

small external components. The following section provides a step-by-step design approach for configuring the

TPS61040 as a voltage regulating boost converter for LCD bias power supply, as shown in Figure 12.

8.2 Typical Application

The following section provides a step-by-step design approach for configuring the TPS611040 as a voltage

regulating boost converter for LCD bias supply, as shown in Figure 12.

Figure 12. LCD Bias Supply

8.2.1 Design Requirements

Table 2. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE

Input Voltage 1.8 V to 6 V

Output Voltage 18 V

Output Current 10 mA

8.2.2 Detailed Design Procedure

8.2.2.1 Inductor Selection, Maximum Load Current

Because the PFM peak current control scheme is inherently stable, the inductor value does not affect the stability

of the regulator. The selection of the inductor together with the nominal load current, input and output voltage of

the application determines the switching frequency of the converter. Depending on the application, inductor

values from 2.2 μH to 47 μH are recommended. The maximum inductor value is determined by the maximum on

time of the switch, typically 6 μs. The peak current limit of 400 mA/250 mA (typically) should be reached within

this 6-μs period for proper operation.

l TEXAS INSTRUMENTS PX X OUT OUT IN

P S (m a x )

lo a d(m a x )

O U T IN

I L f

I2 ( V V )

´ ´

= h

´ -

load OUT IN d

S load 2

2 I (V V V )

f (I ) I L

´ ´ - +

IN(min) OUT IN

S(max)

P OUT

V (V V )

fI L V

´ -

´ ´

TPS61040

TPS61041

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The inductor value determines the maximum switching frequency of the converter. Therefore, select the inductor

value that ensures the maximum switching frequency at the converter maximum load current is not exceeded.

The maximum switching frequency is calculated by the following formula:

where

• IP= Peak current as described in Peak Current Control

• L = Selected inductor value

• VIN(min) = The highest switching frequency occurs at the minimum input voltage (2)

If the selected inductor value does not exceed the maximum switching frequency of the converter, the next step

is to calculate the switching frequency at the nominal load current using the following formula:

where

• IP= Peak current as described in Peak Current Control

• L = Selected inductor value

• Iload = Nominal load current

• Vd = Rectifier diode forward voltage (typically 0.3 V) (3)

A smaller inductor value gives a higher converter switching frequency, but lowers the efficiency.

The inductor value has less effect on the maximum available load current and is only of secondary order. The

best way to calculate the maximum available load current under certain operating conditions is to estimate the

expected converter efficiency at the maximum load current. This number can be taken out of the efficiency

graphs shown in Figure 1 through Figure 4. The maximum load current can then be estimated as follows:

where

• IP= Peak current as described in Peak Current Control

• L = Selected inductor value

• fSmax = Maximum switching frequency as calculated previously

•η= Expected converter efficiency. Typically 70% to 85% (4)

The maximum load current of the converter is the current at the operation point where the converter starts to

enter the continuous conduction mode. Usually the converter should always operate in discontinuous conduction

mode.

Last, the selected inductor should have a saturation current that meets the maximum peak current of the

converter (as calculated in Peak Current Control). Use the maximum value for ILIM for this calculation.

Another important inductor parameter is the dc resistance. The lower the dc resistance, the higher the efficiency

of the converter. See Table 3 and the typical applications for the inductor selection.

(1) See Third-Party Products disclaimer

Table 3. Recommended Inductor for Typical LCD Bias Supply (see Figure 23)

DEVICE INDUCTOR VALUE COMPONENT SUPPLIER(1) COMMENTS

TPS61040

10 μH Sumida CR32-100 High efficiency

10 μH Sumida CDRH3D16-100 High efficiency

10 μH Murata LQH4C100K04 High efficiency

4.7 μH Sumida CDRH3D16-4R7 Small solution size

4.7 μH Murata LQH3C4R7M24 Small solution size

TPS61041 10 μH Murata LQH3C100K24 High efficiency

Small solution size

l TEXAS INSTRUMENTS

CFF +1

2 p fS

20 R1

VOUT +1.233 V ǒ1)R1

R2Ǔ

TPS61040

TPS61041

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8.2.2.2 Setting the Output Voltage

The output voltage is calculated as:

(5)

For battery-powered applications, a high-impedance voltage divider should be used with a typical value for R2 of

≤200 kΩand a maximum value for R1 of 2.2 MΩ. Smaller values might be used to reduce the noise sensitivity of

the feedback pin.

A feedforward capacitor across the upper feedback resistor R1 is required to provide sufficient overdrive for the

error comparator. Without a feedforward capacitor, or one whose value is too small, the TPS6104x shows double

pulses or a pulse burst instead of single pulses at the switch node (SW), causing higher output voltage ripple. If

this higher output voltage ripple is acceptable, the feedforward capacitor can be left out.

The lower the switching frequency of the converter, the larger the feedforward capacitor value required. A good

starting point is to use a 10-pF feedforward capacitor. As a first estimation, the required value for the feedforward

capacitor at the operation point can also be calculated using the following formula:

where

• R1 = Upper resistor of voltage divider

• fS = Switching frequency of the converter at the nominal load current (See Inductor Selection, Maximum Load

Current for calculating the switching frequency)

• CFF = Choose a value that comes closest to the result of the calculation (6)

The larger the feedforward capacitor the worse the line regulation of the device. Therefore, when concern for line

regulation is paramount, the selected feedforward capacitor should be as small as possible. See the following

section for more information about line and load regulation.

8.2.2.3 Line and Load Regulation

The line regulation of the TPS6104x depends on the voltage ripple on the feedback pin. Usually a 50 mV peak-

to-peak voltage ripple on the feedback pin FB gives good results.

Some applications require a very tight line regulation and can only allow a small change in output voltage over a

certain input voltage range. If no feedforward capacitor CFF is used across the upper resistor of the voltage

feedback divider, the device has the best line regulation. Without the feedforward capacitor the output voltage

ripple is higher because the TPS6104x shows output voltage bursts instead of single pulses on the switch pin

(SW), increasing the output voltage ripple. Increasing the output capacitor value reduces the output voltage

ripple.

If a larger output capacitor value is not an option, a feed-forward capacitor CFF can be used as described in the

previous section. The use of a feedforward capacitor increases the amount of voltage ripple present on the

feedback pin (FB). The greater the voltage ripple on the feedback pin (≥50 mV), the worse the line regulation.

There are two ways to improve the line regulation further:

1. Use a smaller inductor value to increase the switching frequency which will lower the output voltage ripple,

as well as the voltage ripple on the feedback pin.

2. Add a small capacitor from the feedback pin (FB) to ground to reduce the voltage ripple on the feedback pin

down to 50 mV again. As a starting point, the same capacitor value as selected for the feedforward capacitor

CFF can be used.

8.2.2.4 Output Capacitor Selection

For best output voltage filtering, a low ESR output capacitor is recommended. Ceramic capacitors have a low

ESR value but tantalum capacitors can be used as well, depending on the application.

Assuming the converter does not show double pulses or pulse bursts on the switch node (SW), the output

voltage ripple can be calculated as:

l TEXAS INSTRUMENTS

DVout +

Iout

Cout ǒ1

fS(Iout) –

IP L

Vout )Vd–VinǓ)IP ESR

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

www.ti.com

Product Folder Links: TPS61040 TPS61041

(1) See Third-Party Products disclaimer.

where

• IP= Peak current as described in Peak Current Control

• L = Selected inductor value

• Iout = Nominal load current

• fS (Iout) = Switching frequency at the nominal load current as calculated previously

• Vd = Rectifier diode forward voltage (typically 0.3 V)

• Cout = Selected output capacitor

• ESR = Output capacitor ESR value (7)

See Table 4 and the Typical Application for choosing the output capacitor.

Table 4. Recommended Input and Output Capacitors

DEVICE CAPACITOR VOLTAGE RATING COMPONENT SUPPLIER(1) COMMENTS

TPS6104x

4.7 μF/X5R/0805 6.3 V Tayo Yuden JMK212BY475MG CIN/COUT

10 μF/X5R/0805 6.3 V Tayo Yuden JMK212BJ106MG CIN/COUT

1μF/X7R/1206 25 V Tayo Yuden TMK316BJ105KL COUT

1μF/X5R/1206 35 V Tayo Yuden GMK316BJ105KL COUT

4.7 μF/X5R/1210 25 V Tayo Yuden TMK325BJ475MG COUT

(1) See Third-Party Products disclaimer.

8.2.2.5 Input Capacitor Selection

For good input voltage filtering, low ESR ceramic capacitors are recommended. A 4.7-μF ceramic input capacitor

is sufficient for most of the applications. For better input voltage filtering this value can be increased. See Table 4

and typical applications for input capacitor recommendations.

8.2.2.6 Diode Selection

To achieve high efficiency a Schottky diode should be used. The current rating of the diode should meet the

peak current rating of the converter as it is calculated in Peak Current Control. Use the maximum value for ILIM

for this calculation. See Table 5 and the typical applications for the selection of the Schottky diode.

Table 5. Recommended Schottky Diode for Typical LCD Bias Supply (see Figure 23)

DEVICE REVERSE VOLTAGE COMPONENT SUPPLIER(1) COMMENTS

TPS6104x

30 V ON Semiconductor MBR0530

20 V ON Semiconductor MBR0520

20 V ON Semiconductor MBRM120L High efficiency

30 V Toshiba CRS02

spacer

l TEXAS INSTRUMENTS zoou %: 4+ kh— 500 usldiv

5 V/div

1 V/div

50 mA/div

VO= 18 V

500 us/div

2.4 V to 3.4 V

100 mV/div

200 µS/div

VO = 18 V

1 mA to 10 mA

200 mS/div

100 mV/div

IO= 18 V

TPS61040

TPS61041

www.ti.com

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

Product Folder Links: TPS61040 TPS61041

8.2.3 Application Curves

Figure 13. Line Transient Response Figure 14. Load Transient Response

Figure 15. Start-Up Behavior

VIN SW

EN GND

10 μH D1

2.2 MΩ

160 kΩ

CFF

22 pF

1 μF

VOUT

18 V / 10 mA

VIN

1.8 V to 6 V

4.7 μF

200 k

BC857C

0.1 μF

(Optional)

L1: Sumida CR32-100

D1: Motorola MBR0530

C1: Tayo Yuden JMK212BY475MG

C2: Tayo Yuden TMK316BJ105KL

TPS61040

VIN SW

EN GND

10 μH D1

2.2 MΩ

160 kΩ

CFF

22 pF

1 μF

18 V

VIN

1.8 V to 6 V

4.7 μF DAC or Analog Voltage

0 V = 25 V

1.233 V = 18 V

TPS61040

L1: Sumida CR32-100

D1: Motorola MBR0530

C1: Tayo Yuden JMK212BY475MG

C2: Tayo Yuden GMK316BJ105KL

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

www.ti.com

Product Folder Links: TPS61040 TPS61041

8.3 System Examples

Figure 16. LCD Bias Supply With Adjustable Output Voltage

Figure 17. LCD Bias Supply With Load Disconnect

VIN SW

EN GND

3.3 μH D1

4.7 μF

5 V/45 mA

1.8 V to 4 V

4.7 μF

TPS61040

L1: Murata LQH4C3R3M04

D1: Motorola MBR0530

C1, C2: Tayo Yuden JMK212BY475MG

CFF

3.3 pF

620 kΩ

200 kΩ

VIN SW

EN GND

6.8 μH D1

1.8 MΩ

205 kΩ

CFF

4.7 pF

4.7 μF

VO = 12 V/35 mA

VIN 3.3 V

10 μF L1: Murata LQH4C6R8M04

D1: Motorola MBR0530

C1: Tayo Yuden JMK212BJ106MG

C2: Tayo Yuden EMK316BJ475ML

TPS61040

VIN SW

EN GND

6.8 μH D1

1.5 MΩ

210 kΩ

CFF

22 pF

1 μF

V1 = 10 V/15 mA

VIN = 2.7 V to 5 V

4.7 μF

1 μF

V2 = –10 V/15 Aμ

L1: Murata LQH4C6R8M04

D1, D2, D3: Motorola MBR0530

C1: Tayo Yuden JMK212BY475MG

C2, C3, C4: Tayo Yuden EMK316BJ105KF

TPS61040

TPS61041

www.ti.com

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

Product Folder Links: TPS61040 TPS61041

System Examples (continued)

Figure 18. Positive and Negative Output LCD Bias Supply

Figure 19. Standard 3.3-V to 12-V Supply

Figure 20. Dual Battery Cell to 5-V/50-mA Conversion

Efficiency Approximately Equals 84% at VIN = 2.4 V to Vo = 5 V/45 mA

l TEXAS INSTRUMENTS Li J/ // Cupyngmmme, Texas Insimmems Incurpuraled m JMK2|ZBY475MG Cupyngm©2me Texas \nsvumenls \ncorporated

VIN SW

EN GND

10 μH

MBRM120L

100 nF

(See

Note A)

4.7 μF

110 Ω

VCC = 2.7 V to 6 V

120 kΩ

160 kΩ

Analog Brightness Control

3.3 V @ Led Off

0 V @Iled = 20 mA

24 V

(Optional)

L1: Murata LQH4C3R3M04

D1: Motorola MBR0530

C1: Tayo Yuden JMK212BY475MG

C2: Standard Ceramic Capacitor

VIN SW

EN GND

10 μH D1

1 μF

4.7 μF

82 Ω

VCC = 2.7 V to 6 V

PWM

100 Hz to 500 Hz

24 V

(Optional)

L1: Murata LQH4C100K04

D1: Motorola MBR0530

C1: Tayo Yuden JMK212BY475MG

C2: Tayo Yuden TMK316BJ105KL

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

www.ti.com

Product Folder Links: TPS61040 TPS61041

System Examples (continued)

Figure 21. White LED Supply With Adjustable Brightness Control

Using a PWM Signal on the Enable Pin, Efficiency Approximately Equals 86% at VIN =3V,ILED = 15 mA

A. A smaller output capacitor value for C2 causes a larger LED ripple.

Figure 22. White LED Supply With Adjustable Brightness Control

Using an Analog Signal on the Feedback Pin

VIN1

FB EN

TPS61040

GND

VIN

VOUT

GND

TPS61040

TPS61041

www.ti.com

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

Product Folder Links: TPS61040 TPS61041

9 Power Supply Recommendations

The device is designed to operate from an input voltage supply range between 1.8 V and 6 V. The output current

of the input power supply must be rated according to the supply voltage, output voltage and output current of

TPS6104x.

10 Layout

10.1 Layout Guidelines

Typical for all switching power supplies, the layout is an important step in the design; especially at high peak

currents and switching frequencies. If the layout is not carefully done, the regulator might show noise problems

and duty cycle jitter.

The input capacitor should be placed as close as possible to the input pin for good input voltage filtering. The

inductor and diode should be placed as close as possible to the switch pin to minimize the noise coupling into

other circuits. Because the feedback pin and network is a high-impedance circuit, the feedback network should

be routed away from the inductor. The feedback pin and feedback network should be shielded with a ground

plane or trace to minimize noise coupling into this circuit.

Wide traces should be used for connections in bold as shown in Figure 23. A star ground connection or ground

plane minimizes ground shifts and noise.

10.2 Layout Example

Figure 23. Layout Diagram

l TEXAS INSTRUMENTS

TPS61040

TPS61041

SLVS413J –OCTOBER 2002–REVISED DECEMBER 2019

www.ti.com

Product Folder Links: TPS61040 TPS61041

11 Device and Documentation Support

11.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 6. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

TPS61041 Click here Click here Click here Click here Click here

TPS61040 Click here Click here Click here Click here Click here

11.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

I TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Sample: Sample: Samples Samples Samples Samples

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2021

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

TPS61040DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 PHOI

TPS61040DBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 PHOI

TPS61040DDCR ACTIVE SOT-23-THIN DDC 5 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 QXK

TPS61040DDCT ACTIVE SOT-23-THIN DDC 5 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 QXK

TPS61040DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CCL

TPS61040DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CCL

TPS61040DRVTG4 ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CCL

TPS61041DBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 PHPI

TPS61041DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CAW

TPS61041DRVT ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CAW

TPS61041DRVTG4 ACTIVE WSON DRV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 CAW

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

www.ti.com 16-Aug-2021

Addendum-Page 2

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TPS61040, TPS61041 :

•Automotive : TPS61040-Q1, TPS61041-Q1

NOTE: Qualified Version Definitions:

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I‘KO '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width ED Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w Overau Width onhe carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE QOODOOOO ,,,,,,,,,,, ‘ User DIreCIIDn 0' Feed SprockeI Hoies Pockel Quadrams

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

TPS61040DBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS61040DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

TPS61040DDCR SOT-

23-THIN DDC 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS61040DDCT SOT-

23-THIN DDC 5 250 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS61040DRVR WSON DRV 6 3000 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2

TPS61040DRVT WSON DRV 6 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2

TPS61041DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3

TPS61041DBVR SOT-23 DBV 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3

TPS61041DRVR WSON DRV 6 3000 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2

TPS61041DRVR WSON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

TPS61041DRVT WSON DRV 6 250 178.0 8.4 2.25 2.25 1.0 4.0 8.0 Q2

TPS61041DRVT WSON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 7-Jan-2021

Pack Materials-Page 1

I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TPS61040DBVR SOT-23 DBV 5 3000 200.0 183.0 25.0

TPS61040DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0

TPS61040DDCR SOT-23-THIN DDC 5 3000 213.0 191.0 35.0

TPS61040DDCT SOT-23-THIN DDC 5 250 213.0 191.0 35.0

TPS61040DRVR WSON DRV 6 3000 205.0 200.0 33.0

TPS61040DRVT WSON DRV 6 250 205.0 200.0 33.0

TPS61041DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0

TPS61041DBVR SOT-23 DBV 5 3000 200.0 183.0 25.0

TPS61041DRVR WSON DRV 6 3000 205.0 200.0 33.0

TPS61041DRVR WSON DRV 6 3000 200.0 183.0 25.0

TPS61041DRVT WSON DRV 6 250 205.0 200.0 33.0

TPS61041DRVT WSON DRV 6 250 203.0 203.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 7-Jan-2021

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

0.22

0.08 TYP

0.25

3.0

2.6

2X 0.95

1.9

1.45

0.90

0.15

0.00 TYP

5X 0.5

0.3

0.6

0.3 TYP

0 TYP

1.9

3.05

2.75

1.75

1.45

(1.1)

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/F 06/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Refernce JEDEC MO-178.

4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.25 mm per side.

0.2 C A B

INDEX AREA

PIN 1

GAGE PLANE

SEATING PLANE

0.1 C

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MAX

ARROUND 0.07 MIN

ARROUND

5X (1.1)

5X (0.6)

(2.6)

(1.9)

2X (0.95)

(R0.05) TYP

4214839/F 06/2021

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

PKG

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(2.6)

(1.9)

2X(0.95)

5X (1.1)

5X (0.6)

(R0.05) TYP

SOT-23 - 1.45 mm max heightDBV0005A

SMALL OUTLINE TRANSISTOR

4214839/F 06/2021

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:15X

SYMM

PKG

MECHANICAL DATA DDC (R—PDSO—GS) PLASTIC SMALL—OUTLINE PH 1 \ncex Area '.TJO 0,70 "“3 i i ii sq Mn '6 ‘g fTi_ — _T 4—A\ ”c :7 ‘ DOW P p o o £20440} 2/[ 05/05 NO'ES' N hneur dwens'ms are w memeters Tm: druwmg is mm in charge w'hout rat'ce Body mmensms do mm mm mm Cash 0' promswon HHS wmw mm M0495 vc'chcn A5 {5 pm> Cnm> {'3 Ms INSTRUMENTS www.li.com

I TEXAS INSTRUMENTS

GENERIC PACKAGE VIEW

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

DRV 6 WSON - 0.8 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

4206925/F

% W C :1 v _ W dﬁN g}gﬁ @ DJ

www.ti.com

PACKAGE OUTLINE

6X 0.35

0.25

1.6 0.1

6X 0.3

0.2

1.3

1 0.1

4X 0.65

0.8

0.7

0.05

0.00

B2.1

1.9 A

2.1

1.9

(0.2) TYP

WSON - 0.8 mm max heightDRV0006A

PLASTIC SMALL OUTLINE - NO LEAD

4222173/B 04/2018

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

(OPTIONAL)

PIN 1 ID

0.1 C A B

0.05 C

THERMAL PAD

EXPOSED

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 5.500

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(1)

4X (0.65)

(1.95)

6X (0.3)

6X (0.45)

(1.6)

(R0.05) TYP

( 0.2) VIA

TYP

(1.1)

WSON - 0.8 mm max heightDRV0006A

PLASTIC SMALL OUTLINE - NO LEAD

4222173/B 04/2018

SYMM

LAND PATTERN EXAMPLE

SCALE:25X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

www.ti.com

EXAMPLE STENCIL DESIGN

6X (0.3)

6X (0.45)

4X (0.65)

(0.7)

(1)

(1.95)

(R0.05) TYP

(0.45)

WSON - 0.8 mm max heightDRV0006A

PLASTIC SMALL OUTLINE - NO LEAD

4222173/B 04/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD #7

88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:30X

SYMM

METAL

d; E{__ a" 71L “““ a, \i I 9}}wﬁ «g W E

www.ti.com

PACKAGE OUTLINE

6X 0.35

0.25

1.6 0.1

6X 0.3

0.2

1.3

1 0.1

4X 0.65

0.8

0.7

0.05

0.00

B2.1

1.9 A

2.1

1.9

(0.2) TYP

WSON - 0.8 mm max heightDRV0006D

PLASTIC SMALL OUTLINE - NO LEAD

4225563/A 12/2019

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

(OPTIONAL)

PIN 1 ID

0.1 C A B

0.05 C

THERMAL PAD

EXPOSED

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 5.500

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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(1)

4X (0.65)

(1.95)

6X (0.3)

6X (0.45)

(1.6)

(R0.05) TYP

( 0.2) VIA

TYP

(1.1)

WSON - 0.8 mm max heightDRV0006D

PLASTIC SMALL OUTLINE - NO LEAD

4225563/A 12/2019

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:25X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED

METAL

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EXAMPLE STENCIL DESIGN

6X (0.3)

6X (0.45)

4X (0.65)

(0.7)

(1)

(1.95)

(R0.05) TYP

(0.45)

WSON - 0.8 mm max heightDRV0006D

PLASTIC SMALL OUTLINE - NO LEAD

4225563/A 12/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD #7

88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:30X

SYMM

METAL

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TPS61040/41 Datasheet by Texas Instruments

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