SN74LVC2G06 Datasheet by Texas Instruments

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SN74LVC2G06
SCES307J –AUGUST 2001REVISED JULY 2015
SN74LVC2G06 Dual Inverter Buffer and Driver With Open-Drain Outputs
1 Features 3 Description
This dual inverter buffer and driver is designed for
1 Available in the Texas Instruments 1.65-V to 5.5-V VCC operation.
Package The output of the SN74LVC2G06 device is an open-
Supports 5-V VCC Operation drain which can be connected to other open-drain
Max tpd of 3.4 ns at 3.3 V outputs to implement active-low, wired-OR, or active-
Low Power Consumption, 10-μA Max ICC high wired-AND functions. The maximum sink current
±24-mA Output Drive at 3.3 V is 32 mA.
Typical VOLP (Output Ground Bounce) This device is fully specified for partial-power-down
<0.8 V at VCC = 3.3 V, TA= 25°C applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
Typical VOHV (Output VOH Undershoot) through the device when it is powered down.
>2 V at VCC = 3.3 V, TA= 25°C
Inputs and Open-Drain Outputs Accept NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
Voltages up to 5.5 V as the package.
• Ioff Supports Live Insertion, Partial-Power-Down
Mode and Back-Drive Protection Device Information(1)
Latch-Up Performance Exceeds 100 mA Per ORDER NUMBER PACKAGE BODY SIZE (NOM)
JESD 78, Class II SN74LVC2G06DBV SOT-23 (6) 2.90 mm × 1.60 mm
Supports Down-Translation SN74LVC2G06DCK SC70 (6) 2.00 mm × 1.25 mm
(5 V to 3.3 V and 3.3 V to 1.8 V) SN74LVC2G06DRY SON (6) 1.45 mm × 1.00 mm
ESD Protection Exceeds JESD 22 SN74LVC2G06DSF SON (6) 1.00 mm × 1.00 mm
2000-V Human Body Model (A114-A) SN74LVC2G06YZP DSBGA (6) 1.41 mm × 0.91 mm
200-V Machine Model (A115-A) (1) For all available packages, see the orderable addendum at
1000-V Charged-Device Model (C101) the end of the data sheet.
Logic Diagram
2 Applications
AV Receivers
Blu-ray Players and Home Theaters
DVD Recorders and Players
Desktop or Notebook PCs
Digital Radio or Internet Radio Players
Digital Video Cameras (DVC)
Embedded PC
GPS: Personal Navigation Devices
Mobile Internet Devices
Network Projector Front-End
Portable Media Players
Pro Audio Mixers
Smoke Detectors
Solid-State Drive (SSD): Enterprise
High-Definition (HDTV)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
l TEXAS INSTRUMENTS
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SCES307J –AUGUST 2001REVISED JULY 2015
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Table of Contents
8.1 Overview ................................................................... 9
1 Features.................................................................. 18.2 Functional Block Diagram......................................... 9
2 Applications ........................................................... 18.3 Feature Description................................................... 9
3 Description ............................................................. 18.4 Device Functional Modes.......................................... 9
4 Revision History..................................................... 29 Application and Implementation ........................ 10
5 Pin Configuration and Functions......................... 39.1 Application Information............................................ 10
6 Specifications......................................................... 49.2 Typical Application ................................................. 10
6.1 Absolute Maximum Ratings ..................................... 410 Power Supply Recommendations ..................... 11
6.2 ESD Ratings ............................................................ 411 Layout................................................................... 11
6.3 Recommended Operating Conditions ...................... 511.1 Layout Guidelines ................................................. 11
6.4 Thermal Information.................................................. 511.2 Layout Example .................................................... 11
6.5 Electrical Characteristics........................................... 612 Device and Documentation Support ................. 12
6.6 Switching Characteristics for –40°C to 85°C ............ 612.1 Community Resources.......................................... 12
6.7 Switching Characteristics for –40°C to 125°C .......... 612.2 Trademarks........................................................... 12
6.8 Operating Characteristics.......................................... 612.3 Electrostatic Discharge Caution............................ 12
6.9 Typical Characteristics.............................................. 712.4 Glossary................................................................ 12
7 Parameter Measurement Information .................. 813 Mechanical, Packaging, and Orderable
8 Detailed Description.............................................. 9Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (December 2013) to Revision J Page
Added Device Information table,Pin Configuration and Functions section, ESD Ratings table, Typical
Characteristics section, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
Changes from Revision H (August 2012) to Revision I Page
Updated document to new TI data sheet format.................................................................................................................... 1
Removed Ordering Information table. .................................................................................................................................... 1
Added ESD warning .............................................................................................................................................................. 1
Updated operating temperature range. .................................................................................................................................. 5
Changes from Revision G (January 2007) to Revision H Page
Updated package views and ordering information. Added DRY & DSF packages................................................................ 1
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l TEXAS INSTRUMENTS G L G c O O G c G O O L O O
1A
GND
2A
1Y
VCC
2Y
1
2
34
5
6
1
2
34
5
6
1A
GND
2A
1Y
VCC
2Y
1A
GND
2A
1Y
VCC
2Y
1
2
34
5
6
1A
GND
2A
1Y
VCC
2Y
1
2
34
5
6
SN74LVC2G06
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SCES307J –AUGUST 2001REVISED JULY 2015
5 Pin Configuration and Functions
DBV Package DCK Package
6-Pin SOT-23 6-Pin SC70
Top View Top View
DRY Package
6-Pin SON
YZP Package Top View
6-Pin DSBGA
Bottom View
DSF Package
6-Pin SON
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO
GND 2 — Ground
1A 1 I Input 1
2A 3 I Input 2
1Y 6 I Open-drain output 1
2Y 4 O Open-drain output 2
VCC 5 Power pin
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 6.5 V
VIInput voltage(2) –0.5 6.5 V
VOVoltage applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VOVoltage applied to any output in the high or low state(2)(3) –0.5 6.5 V
IIK Input clamp current VI< 0 –50 mA
IOK Output clamp current VO< 0 –50 mA
IOContinuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage Temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) +2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- +1000
C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
Operating 1.65 5.5
VCC Supply voltage V
Data retention only 1.5
VCC = 1.65 V to 1.95 V 0.65 × VCC
VCC = 2.3 V to 2.7 V 1.7
VIH High-level input voltage V
VCC = 3 V to 3.6 V 2
VCC = 4.5 V to 5.5 V 0.7 × VCC
VCC = 1.65 V to 1.95 V 0.35 × VCC
VCC = 2.3 V to 2.7 V 0.7
VIL Low-level input voltage V
VCC = 3 V to 3.6 V 0.8
VCC = 4.5 V to 5.5 V 0.3 × VCC
VIInput voltage 0 5.5 V
VOOutput voltage 0 5.5 V
VCC = 1.65 V 4
VCC = 2.3 V 8
IOL Low-level output current 16 mA
VCC = 3 V 24
VCC = 4.5 V 32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V
VCC = 5 V ± 0.5 V 5
TAOperating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs,SCBA004.
6.4 Thermal Information
SN74LVC2G06
DBV (SOT- DCK (SC70) DRY (SON) YPZ (DSBGA) DSF (SON)
THERMAL METRIC(1) UNIT
23)
6 PINS 6 PINS 6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 165 259 234 123 300 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
–40°C to 85°C –40°C to 125°C
PARAMETER TEST CONDITIONS VCC UNIT
MIN TYP(1) MAX MIN TYP(1) MAX
IOL = 100 μA 1.65 V to 5.5 V 0.1 0.1
IOL = 4 mA 1.65 V 0.45 0.45
IOL = 8 mA 2.3 V 0.3 0.3
VOL V
IOL = 16 mA 0.4 0.4
3 V
IOL = 24 mA 0.55 0.55
IOL = 32 mA 4.5 V 0.55 0.55
IIA inputs VI= 5.5 V or GND 0 to 5.5 V ±5 ±5 μA
Ioff VIor VO= 5.5 V 0 ±10 ±10 μA
ICC VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 10 μA
One input at VCC – 0.6 V,
ΔICC 3 V to 5.5 V 500 500 μA
Other inputs at VCC or GND
CiVI= VCC or GND 3.3 V 3.5 3.5 pF
(1) All typical values are at VCC = 3.3 V, TA= 25°C.
6.6 Switching Characteristics for –40°C to 85°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
FROM TO ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX
tpd A Y 1.8 7.2 1 3.9 1 3.4 1 2.9 ns
6.7 Switching Characteristics for –40°C to 125°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
FROM TO ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX
tpd A Y 1.8 8.2 1 4.4 1 3.9 1 3.4 ns
6.8 Operating Characteristics
TA= 25°C
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
PARAMETER TEST CONDITIONS UNIT
TYP TYP TYP TYP
Cpd Power dissipation capacitance f = 10 MHz 2 2 3 4 pF
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Temperature - °C
TPD - ns
-100 -50 0 50 100 150
0
0.5
1
1.5
2
2.5
D001
TPD
Vcc - V
TPD - ns
0 1 2 3 4 5 6
0
1
2
3
4
5
6
D002
TPD
SN74LVC2G06
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6.9 Typical Characteristics
Figure 1. TPD Across Temperature at 3.3-V VCC Figure 2. TPD Across VCC at 25°C
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*9 TEXAS INSTRUMENTS HL—w
th
tsu
From Output
Under TestC
(see Note A)
L
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
Data Input
Timing Input
0 V
0 V
0 V
tW
Input
0 V
Input
Output
Waveform 1
S1 at V
(see Note B)
LOAD
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
0 V
0 V
Output
Output
TEST S1
Output
Control
VM
VMVM
VM
VM
1.8 V 0.15 V±
2.5 V 0.2 V±
3.3 V 0.3 V±
5 V 0.5 V±
1 k
500
500
500
VCC RL
2 × VCC
2 × VCC
6 V
2 × VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V
3 V
VI
VCC/2
VCC/2
1.5 V
VCC/2
VM
2 ns
2 ns
2.5 ns
2.5 ns
INPUTS
RL
t /t
r f
VCC
VCC
VCC
t (see Notes E and F)
PZL VLOAD
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. C includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators have the following characteristics: PRR 10 MHz, Z = 50 .
D. The outputs are measured one at a time, with one transition per measurement.
L
O
≤ Ω
E. Because this device has open-drain outputs, t and t are the same as t .
F. t is measured at V .
G. t is measured at V + V .
H. All parameters and waveforms are not applicable to all devices.
PLZ PZL PD
PZL M
PLZ OL
VOLTAGE WAVEFORMS
PULSE DURATION VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ
tPZH
V – V
OH
V + V
OL
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH
tPHL
t (see Notes E and G)
PLZ VLOAD
t /t
PHZ PZH VLOAD
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7 Parameter Measurement Information
Figure 3. Load Circuit and Voltage Waveforms (Open Drain)
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8 Detailed Description
8.1 Overview
The SN74LVC2G06 dual open-drain inverter device contains one open-drain inverter with a maximum sink
current of 32 mA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down.
8.2 Functional Block Diagram
8.3 Feature Description
The wide operating voltage range of 1.65 V to 5.5 V allows the SN74LVC2G06 to be used in systems with many
different voltage rails. In addition, the voltage tolerance on the output allows the device to be used for inverting
up-translation or down-translation. The IOFF feature safely allows voltage on the inputs and outputs when there's
no VCC is present.
8.4 Device Functional Modes
Table 1 lists the functional modes of the SN74LVC2G06.
Table 1. Function Table
INPUT OUTPUT
A Y
L Hi-Z
H L
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VPU
From
MCU
VCC
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SN74LVC2G06 is a dual high-drive CMOS device that implements a high-output drive buffer, such as an
LED application. This device can sink 32 mA of current at 4.5 V making it ideal for high-drive applications and
high-speed applications up to 100 MHz. The inputs are 5.5-V tolerant and let it to translate up or down to VCC.
The following Typical Application shows a simple LED driver application for a single channel of the device.
9.2 Typical Application
Figure 4. Typical Application Diagram
9.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Avoid bus contention because it can drive
currents that exceed maximum limits. The high drive also creates fast edges into light loads. Consider routing
and load conditions to prevent ringing.
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions
Rise time and fall time specs. See (Δt/ΔV) in the Recommended Operating Conditions table.
Specified high and low levels. See (VIH and VIL) in the Recommended Operating Conditions table.
Inputs are overvoltage tolerant allowing them to go as high as (VImax) in the Recommended Operating
Conditions table at any valid VCC.
2. Recommend Output Conditions
Load currents should not exceed (IOmax) per output and should not exceed (Continuous current through
VCC or GND) total current for the part. These limits are located in Absolute Maximum Ratings table.
Do not pull outputs above 5.5 V.
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VCC
Unused Input
Input
Output Output
Input
Unused Input
Frequency - MHz
Icc - µA
0 20 40 60 80
0
200
400
600
800
1000
1200
1400
1600
D001
Icc 1.8V
Icc 2.5V
Icc 3.3V
Icc 5V
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Typical Application (continued)
9.2.3 Application Curve
Figure 5. ICC vs Frequency
10 Power Supply Recommendations
The power supply can be any voltage between the min and max supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC pin must have a good bypass capacitor in order to prevent power disturbance. For devices with a
single supply, a 0.1-μF capacitor is recommended and if there are multiple VCC pins then a 0.01-μF or 0.022-μF
capacitor is recommended for each power pin. It is ok to parallel multiple bypass caps to reject different
frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be
installed as close to the power pin as possible for best results.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices, inputs must never float. In many cases, functions or parts of functions of
digital logic devices are unused. Examples include when only two inputs of a triple input and gate are used or
when only three of the four buffer gates are used. Avoid leaving input pins unconnected because the undefined
voltages at the outside connections result in undefined operational states. Observe the following rules under all
circumstances. Connect all unused inputs of digital logic devices to a high or low bias to prevent them from
floating. Based on the function of the device, apply the logic level to any unused input. Based on convenience, tie
unused inputs to the GND or the VCC.
11.2 Layout Example
Figure 6. Layout Recommendation
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.2 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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I TEXAS INSTRUMENTS Samples Samples Samples Samples Sample: Sample: Samples Samples
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LVC2G06DBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 (C065, C06R)
SN74LVC2G06DBVRE4 ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 (C065, C06R)
SN74LVC2G06DCKR ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 125 (CT5, CTJ, CTR)
SN74LVC2G06DCKRE4 ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 CT5
SN74LVC2G06DCKRG4 ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 CT5
SN74LVC2G06DRYR ACTIVE SON DRY 6 5000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 CT
SN74LVC2G06DSFR ACTIVE SON DSF 6 5000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 CT
SN74LVC2G06YZPR ACTIVE DSBGA YZP 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 (CT7, CTN)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC2G06 :
Automotive: SN74LVC2G06-Q1
Enhanced Product: SN74LVC2G06-EP
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I‘KO '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w Overau Wiotn ot the carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE DOODOOOD ,,,,,,,,,,, ‘ User Direcllon 0' Feed SprockeI Hoies Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC2G06DBVR SOT-23 DBV 6 3000 178.0 9.2 3.3 3.23 1.55 4.0 8.0 Q3
SN74LVC2G06DBVR SOT-23 DBV 6 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC2G06DCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC2G06DCKR SC70 DCK 6 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC2G06DCKR SC70 DCK 6 3000 180.0 8.4 2.41 2.41 1.2 4.0 8.0 Q3
SN74LVC2G06DCKRG4 SC70 DCK 6 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC2G06DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1
SN74LVC2G06DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2
SN74LVC2G06YZPR DSBGA YZP 6 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2020
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC2G06DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74LVC2G06DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0
SN74LVC2G06DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G06DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G06DCKR SC70 DCK 6 3000 202.0 201.0 28.0
SN74LVC2G06DCKRG4 SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G06DRYR SON DRY 6 5000 184.0 184.0 19.0
SN74LVC2G06DSFR SON DSF 6 5000 184.0 184.0 19.0
SN74LVC2G06YZPR DSBGA YZP 6 3000 220.0 220.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Jul-2020
Pack Materials-Page 2
3: fig,
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.45 MAX
0.15
0.00 TYP
6X 0.50
0.25
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
6
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
6X (1.1)
6X (0.6)
(2.6)
2X (0.95)
(R0.05) TYP
4214840/C 06/2021
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
2X(0.95)
6X (1.1)
6X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
6
www.ti.com
PACKAGE OUTLINE
C
0.5 MAX
0.19
0.15
1
TYP
0.5 TYP
6X 0.25
0.21
0.5
TYP
B E A
D
4219524/A 06/2014
DSBGA - 0.5 mm max heightYZP0006
DIE SIZE BALL GRID ARRAY
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFreeTM package configuration.
NanoFree Is a trademark of Texas Instruments.
BALL A1
CORNER
SEATING PLANE
BALL TYP 0.05 C
B
A
12
0.015 C A B
SYMM
SYMM
C
SCALE 9.000
D: Max =
E: Max =
1.418 mm, Min =
0.918 mm, Min =
1.358 mm
0.858 mm
www.ti.com
EXAMPLE BOARD LAYOUT
6X ( )0.225 (0.5) TYP
(0.5) TYP
()
METAL
0.225 0.05 MAX
SOLDER MASK
OPENING
METAL
UNDER
MASK
()
SOLDER MASK
OPENING
0.225
0.05 MIN
4219524/A 06/2014
DSBGA - 0.5 mm max heightYZP0006
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
12
A
B
C
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(0.5)
TYP
(0.5) TYP
6X ( 0.25) (R ) TYP0.05
METAL
TYP
4219524/A 06/2014
DSBGA - 0.5 mm max heightYZP0006
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
12
A
B
C
I TEXAS INSTRUMENTS
GENERIC PACKAGE VIEW
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
DRY 6 USON - 0.6 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
4207181/G
www.ti.com
PACKAGE OUTLINE
C
6X 0.25
0.15
4X
0.5
5X 0.35
0.25
2X
1
0.6 MAX
0.05
0.00
3X 0.6
0.4
0.3
B1.05
0.95 A
1.5
1.4
(0.05) TYP (0.127) TYP
4222894/A 01/2018
USON - 0.6 mm max heightDRY0006A
PLASTIC SMALL OUTLINE - NO LEAD
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
34
6
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05 C
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
SCALE 8.500
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
5X (0.3)
6X (0.2)
4X (0.5)
(0.6)
(R0.05) TYP
(0.35)
4222894/A 01/2018
USON - 0.6 mm max heightDRY0006A
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
1
34
6
SYMM
LAND PATTERN EXAMPLE
1:1 RATIO WITH PKG SOLDER PADS
EXPOSED METAL SHOWN
SCALE:40X
NOTES: (continued)
3. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271).
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
EXPOSED
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL
www.ti.com
EXAMPLE STENCIL DESIGN
5X (0.3)
6X (0.2)
4X (0.5)
(0.6)
(R0.05) TYP
(0.35)
4222894/A 01/2018
USON - 0.6 mm max heightDRY0006A
PLASTIC SMALL OUTLINE - NO LEAD
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.075 - 0.1 mm THICK STENCIL
SCALE:40X
SYMM
1
34
6
SYMM
www.ti.com
PACKAGE OUTLINE
C
6X 0.22
0.12
6X 0.45
0.35
2X
0.7 4X
0.35
0.4 MAX
0.05
0.00
B1.05
0.95 A
1.05
0.95
(0.11) TYP
(0.1)
PIN 1 ID
4220597/B 06/2022
X2SON - 0.4 mm max heightDSF0006A
PLASTIC SMALL OUTLINE - NO LEAD
PIN 1 INDEX AREA
SEATING PLANE
0.05 C
1
34
6
0.07 C B A
0.05 C
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MO-287, variation X2AAF.
SCALE 10.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
6X (0.6)
6X (0.17)
4X (0.35)
(0.8)
(R0.05) TYP
X2SON - 0.4 mm max heightDSF0006A
PLASTIC SMALL OUTLINE - NO LEAD
4220597/B 06/2022
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NOTES: (continued)
4. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:40X
SYMM
SYMM
1
34
6
EXPOSED METAL
METAL
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
““‘+“‘w‘
www.ti.com
EXAMPLE STENCIL DESIGN
6X (0.6)
6X (0.15)
4X (0.35)
(0.8)
(R0.05) TYP
X2SON - 0.4 mm max heightDSF0006A
PLASTIC SMALL OUTLINE - NO LEAD
4220597/B 06/2022
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.09 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:40X
SYMM
SYMM
1
34
6
MECHANICAL DATA DCK (R-PDSO-GS) PLASTIC SMALL-OUTLINE PACKAGE E 18’) 6 4 7 H Fl H ‘fi «40 1233 \ ’i’ To enugemane Seanng Mane Pm 1/ ' ‘ ' ‘ ‘ maexArea Wm H m} j; / ‘ u / Um "4L 1—]; f Scamg Mane \\ \ / 31 409555574/8 U‘ /200/ , m m hmeters AH \mec' mmens‘mrs Tm drawmq \s sumsc: 0 change wmu: nome Body mmensmns do nut mc‘ude mom flcsh m aroms'm Mom Has» and pruvuswon W m exceed 015 :2r m FuHs an JFDFC M07763 vunuhcn AB NO'FS Umm> INSrRUMEm-s www.1i.com
LAND PATTERN DATA 7PJSOiC6> PLASTC SMALL OU’LME NOTES' maop> Exc'm‘e Boc'd Luyum stem Openings Based or a stencfl hickncss uf 127mm (005mm) * 1* :E /23\\der Musk Cpen‘wg “ 2m Geometry M \meur dimensmns are m m'flhrvete's Th's drawqu is sweat (a chc'vge mm: 'vuhce Custume's shoud p‘uce a new 01 We cvcmt buurd (abr'cahun c'awmg rm :0 uHer the ce'fle' smder musk defined and, ”Jbficuhon \PC77351 is reco'n'nended (Dr uHernme designs Laser cumrg opc'mvcs mm "apczmda wuHs and mo rouncmq corners wm am bcncr aosxc recuscv mstomcrs show can thew Guard assemwy sue for gene design recommencnmons Exomme sxercu deswgw basec on a 50% vo‘umemc bad My paste M‘cr m M4523 var other new rccowmcwdatnrs. ' hams Q‘ INSTRUMENTS www.li.com
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